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WO/2023/198376A1 |
Disclosed is a method of updating of a first model by training a second model, the first model relating to a first process range and trained using a first set of measurement signals relating to a first set of structures. The method compr...
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WO/2023/198444A1 |
Disclosed herein are embodiments that relate to a metrology apparatus and associated methods for imaging a plurality of targets (e.g., alignment marks) disposed on of a substrate (550, 650) in parallel using a fixed sensor (510, 530, 610...
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WO/2023/199881A1 |
The present invention provides: a method for producing a semiconductor substrate, the method using a resist underlayer film forming composition that is capable of forming a resist underlayer film having excellent pattern rectangularity; ...
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WO/2023/201047A1 |
A device for modelling physiological and pathophysiological states of the brain is provided. The device comprises a hydrogel with micropattern channels having a length, width and depth. The micropattern channels comprise cells selected f...
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WO/2023/200027A1 |
A method or removing photoresist particles according to an embodiment of the present invention is a method for removing photoresist particles in a development step for forming a pattern on an exposed semiconductor wafer, the development ...
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WO/2023/197551A1 |
A lithography apparatus and a lithography system. The lithography apparatus comprises: a signal generation module (110), the signal generation module (110) being configured to generate one or more mask patterns according to a layout, and...
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WO/2023/200045A1 |
The present invention pertains to a photosensitive resin composition, a photosensitive resin layer prepared using same, and a color filter. An embodiment of the present invention provides a photosensitive resin composition comprising (A)...
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WO/2023/198381A1 |
Disclosed is a method of inferring second metrology data relating to patterned substrate on which patterns have been exposed and on which processing step has been performed, from first metrology data measured on the patterned substrate p...
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WO/2023/199851A1 |
Provided are: a semiconductor substrate manufacturing method using a resist underlayer film-forming composition from which it is possible to form a film having excellent etching resistance, heat resistance, and bending resistance; a comp...
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WO/2023/199659A1 |
For the purpose of providing a photoresist material having strong resistance to dry etching, this photoresist material according to one embodiment of the present invention is for use in extreme-ultraviolet lithography and comprises a met...
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WO/2023/199672A1 |
The present invention provides: a photosensitive composition which exhibits excellent pattern forming properties and low stress properties; a photosensitive film and a cured product, each of which uses this photosensitive composition; a ...
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WO/2023/198359A1 |
Disclosed is a method of determining a correction for control of at least one first component of a lithographic or metrology apparatus, and associated apparatuses. The method comprises obtaining a trained artificial intelligence model wh...
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WO/2023/196059A1 |
Methods described herein address the chuck degradation challenge that can result in wafer distortion upon wafer coupling, leading to downstream fabrication issues. Techniques include actively monitoring wear of a chuck and counteracting ...
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WO/2023/195800A1 |
The present invention relates to a device for preventing fine particles generated in a vacuum system from being adsorbed by a semiconductor substrate and a sample or a mask in a lithography device using the vacuum system, and, more speci...
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WO/2023/194374A1 |
The invention relates to an arrangement (100), a method and a computer program product for system-integrated calibration of the facet mirrors (18, 19) of a microlithographic illumination system (20). Beam paths (103) between a radiation ...
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WO/2023/195202A1 |
This hybrid bonding insulation film-forming material contains a thermosetting polyamide having a phenolic hydroxyl group in each molecule, and a solvent.
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WO/2023/194503A1 |
A terminated hollow-core optical fiber (100) includes an outer capillary (140) having an end-face (140F), a hollow-core optical fiber (110) having a fiber-end (110E) located inside the outer capillary (140) a non-zero distance away from ...
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WO/2023/194146A1 |
The invention relates to an optical assembly for an imaging device for microlithography, in particular for the use of light in the extreme UV range (EUV), comprising an optical element (108.1), in particular a facet element, a passive su...
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WO/2023/194220A1 |
The invention relates to a method for aligning two components (31, 33) of a projection exposure apparatus (1, 101) for semiconductor lithography, comprising the following method steps: - inserting at least one mandrel (30, 50) of a first...
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WO/2023/194145A1 |
The present invention relates to an optical arrangement for microlithography, in particular for using light in the extreme UV (EUV) range, having an optical element (108.1), in particular a facet element, a passive support device (108.2)...
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WO/2023/195818A1 |
A comprehensive inspection device for an EUV exposure process is provided. The comprehensive inspection device for an EUV exposure process may comprise: a light generation unit for generating EUV light; a splitter for receiving the EUV l...
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WO/2023/195546A1 |
This compound is represented by formula (1): (in the formula: RG is a group that includes at least one cyclic structure; I is an iodine atom; R1 moieties may be the same as, or different from, each other, and are each a monovalent functi...
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WO/2023/195319A1 |
The purpose of the present invention is to provide a positive photosensitive pigment composition having high long-term storage stability with respect to halftone processability, with which an organic EL display device having excellent li...
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WO/2023/194017A1 |
An apparatus comprising a multilayer structure configured to reflect electromagnetic radiation. The apparatus comprises a sensor configured to detect an angular distribution of the electromagnetic radiation after reflection from the mult...
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WO/2023/028249A9 |
A method of microfabrication includes providing a substrate having an existing pattern, wherein the existing pattern includes features formed within a base layer such that a top surface of the substrate has features uncovered and the bas...
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WO/2023/195799A1 |
The present invention relates to a device for preventing the adsorption of fine particles onto a mask in a lithography device using a vacuum system and, more specifically, to an extreme ultraviolet lithography device that does not use a ...
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WO/2023/196087A1 |
An apparatus for and method of reducing the effects of vibrations on components in modules of a deep ultraviolet light source. The components are provided with sensors (325,335) to sense vibration waveforms and actuators (320,330) for ap...
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WO/2023/195407A1 |
The present invention provides a resist composition which contains a resin component (A1) that has a constituent unit (a0) derived from a compound represented by general formula (a0-1), and a compound (B0) that is represented by general ...
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WO/2023/193995A1 |
A pellicle for EUV lithography comprises a core layer comprising silicon and having at least one non- oxidised surface, and a cap layer at at least one major surface of the core layer. The cap layer comprises carbon and/or boron. The cap...
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WO/2023/194036A1 |
Disclosed is an imaging method comprising obtaining a set of primary deconvolution kernels or a set of impulse responses relating to an optical system used to capture said image; obtaining said image signal, said image signal being subje...
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WO/2023/194014A1 |
Systems, non-transitory computer readable medium, and methods for determining one or more parameters used by an e-beam for an overlay measurement are disclosed. In some embodiments, the method comprises determining an acquisition time fo...
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WO/2023/195015A1 |
A system and methods for OCD metrology are provided including receiving training data for training an OCD machine learning (ML) model, the training data measured from multiple wafers and including multiple pairs of corresponding input an...
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WO/2023/194387A1 |
A method for imaging a mask layer, comprising the steps: reading imaging data for a sequence of at least (C1+C2) pixels, at a first moment, using a group of C1 first imaging beams for imaging substantially simultaneously a first group of...
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WO/2023/195255A1 |
This radiation-sensitive resin composition comprises a first polymer and a compound. The first polymer has a first structural unit that contains a substructure in which a hydrogen atom in a carboxy group, phenolic hydroxyl group, or amid...
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WO/2023/196359A1 |
An optical metrology system may include an overlay metrology tool for characterizing an overlay target on a sample, where the overlay target includes first-direction periodic features in a first set of layers of the sample, and second-di...
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WO/2023/194237A1 |
The present invention relates to a curable composition, which comprises: (A) at least one component containing an ethylenically unsaturated group, wherein component (A) comprises a component (A1) containing a structure (K) selected from ...
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WO/2023/195636A1 |
The present invention relates to a spin-on carbon hard mask composition with higher planarization performance, which is useful in semiconductor lithography processes, and a patterning method using same. The composition according to the p...
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WO/2023/186508A1 |
An end-effector is disclosed for handling a substrate, comprising: a base; a clamping body comprising an actuator configured to switch between a first position, wherein the substrate is fixed in position with respect to the clamping body...
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WO/2023/187148A1 |
A drive device (100) for driving and measuring an actuator for actuating (200) an optical element (310) of an optical system (300), comprising a drive unit (110) having a frequency-dependent first transfer function (G1) which is configur...
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WO/2023/190063A1 |
Provided are: a production method for a cured product including a film-forming step for using a resin composition including a solvent and a polyimide precursor which includes a repeating unit represented by formula (1) on a base material...
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WO/2023/190800A1 |
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine...
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WO/2023/184568A1 |
A photoresist and a display device. A colorant of the photoresist comprises a blue pigment and a purple dye having an electron withdrawing group; electron transition is promoted by means of the electron withdrawing group, resulting in a ...
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WO/2023/186960A1 |
The invention relates to a control device (100) for controlling and for measuring an actuator (200) for actuating an optical element (310) of an optical system (300), the device having: a voltage measuring unit (130) for providing a meas...
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WO/2023/189502A1 |
This radiation-sensitive composition contains a polymer having an acid-dissociable group and a compound represented by formula (1). In formula (1), A1 represents a (m+n+2)-valent aromatic ring group. In formula (1), "-OH" and "-COO-" are...
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WO/2023/189126A1 |
Provided are: a resin composition able to yield a cured product having excellent resistance to wet heat; a cured product obtained by curing the resin composition; a layered product that includes the cured product; a method for producing ...
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WO/2023/190810A1 |
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine...
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WO/2023/189799A1 |
Provided is a polymer resin material capable of forming a thermally cured film at a lower temperature without a cross-linking agent or cross-linking catalyst. A self-cross-linkable polymer comprising unit structures A that have an arom...
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WO/2023/189803A1 |
The present invention provides: a resist underlayer film forming composition which exhibits excellent filling properties and planarization properties with respect to a substrate with level difference, while having high storage stability ...
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WO/2023/190801A1 |
The present invention relates to a photosensitive multilayer resin film having a first resin composition layer and a second resin composition layer, the first resin composition layer and the second resin composition layer each containing...
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WO/2023/186569A1 |
A substrate warpage determination system comprises at least three first supporting devices and at least three second supporting devices, forming first and second substrate support areas configured to carry a substrate, an actuator config...
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