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WO/2019/034318A1 |
An apparatus for determining a characteristic of a feature of an object comprises: a measurement radiation source; a measurement radiation delivery system; a measurement system; a pump radiation source; and a pump radiation delivery syst...
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WO/2019/015899A1 |
The present disclosure describes an apparatus (160) for determining information relating to at least one target alignment mark (114) in a semiconductor device substrate (110). The target alignment mark (114) is initially at least partial...
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WO/2019/011608A1 |
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - an substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an are...
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WO/2019/012495A1 |
[Problem] To improve the throughput performance and/or economy of a measurement apparatus. [Solution] This measurement apparatus is equipped with a first determination device, a second determination device, a first substrate stage config...
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WO/2019/011606A1 |
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - a substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an area...
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WO/2019/012499A1 |
A photomask alignment method for a manufacturing process of an integrated circuit in a semiconductor material wafer (20), the method envisaging: at a first level, defining, by means of a single photolithography process, at least one alig...
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WO/2019/011531A1 |
The present invention provides a method to obtain a height map of a substrate having alignment marks, the method comprising the steps: determining a height of one or more locations or areas of the substrate, and determining the height ma...
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WO/2019/007590A1 |
The invention relates to a method for revealing sensor targets on a substrate covered with a layer, said method comprising the following steps: determining locations of first areas on the substrate with yielding target portions and of se...
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WO/2019/001871A1 |
A method for determining substrate deformation has the steps: (a) obtaining (402) first measurement data (X i ) associated with mark position, from measurements of a plurality of substrates; (b) obtaining (404) second measurement data (X...
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WO/2019/005542A1 |
Methods and apparatuses are provided that determine an offset between actual feature/mark locations and the designed feature/mark locations in a maskless lithography system. For example, in one embodiment, a method is provided that inclu...
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WO/2019/001412A1 |
An optical path compensation device, comprising a wedge plate group (100), a driving mechanism (200) and a pre-tightening unit, wherein the wedge plate group includes a movable wedge plate (120) and a fixed wedge plate (100); the movable...
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WO/2018/224293A1 |
A system comprises a topography measurement system configured to determine a respective height for each of a plurality of locations on a substrate; and a processor configured to: determine a height map for the substrate based on the dete...
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WO/2018/226198A1 |
Apparatus (1600, 2900) and method (500, 2100) for aligning a rotatable substrate to a support mechanism (102, 1702) such as a turntable. The substrate has a circumferentially extending timing pattern (200, 1300, 1400, 1800, 1900, 2000, 2...
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WO/2018/224251A1 |
A method for determining a characteristic of a feature in an object, the feature being disposed below a surface of the object is disclosed. The surface of the object is irradiated with a pulsed pump radiation beam so as to produce an aco...
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WO/2018/219944A1 |
The invention relates to a method for aligning a second film (3) using a first code (1), which first code (1) is applied to an object (13), wherein the position of the first code (1) is defined by at least one detectable first code point...
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WO/2018/218214A1 |
Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second we...
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WO/2018/215703A1 |
The invention relates generally to a method for nanoimprint lithography making it possible to achieve high-precision alignment by automatically controlling all or some of the patterns of a structured mould (6) and a structured substrate ...
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WO/2018/215173A1 |
An alignment mark for determining a two-dimensional alignment position of a substrate is discussed. The alignment mark includes an array of patterns. The array of patterns includes a first set of patterns and a second set of patterns arr...
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WO/2018/210557A1 |
Methods and apparatus for measuring a target formed on a substrate are disclosed. The target comprises an alignment structure and a metrology structure. In one method, a first measurement process is performed that comprises illuminating ...
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WO/2018/210505A1 |
Disclosed is a metrology sensor apparatus comprising: an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation; an optical collection system configured to collect scattered radiation, foll...
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WO/2018/206227A1 |
An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target struct...
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WO/2018/206177A1 |
Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarizati...
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WO/2018/202394A1 |
Methods and apparatus for measuring a parameter of interest of a target structure formed on substrate are disclosed. In one arrangement, the target structure comprises a first sub-target and a second sub-target. The first sub-target comp...
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WO/2018/202414A1 |
A method including illuminating a product test substrate with radiation from a component, wherein the product test substrate does not have a device pattern etched therein and yields a non-zero sensitivity when illuminated, the non-zero s...
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WO/2018/196838A1 |
Disclosed is a silicon wafer processing device; a pre-aligned optical assembly (3) and an edge exposure assembly (5) are provided on a synchronous bi-directional motion module (4), reducing the occupied space of the device and saving the...
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WO/2018/192723A1 |
A metrology system includes a radiation source configured to generate measurement radiation having a plurality of temporally separated different wavelengths, an optical system configured to direct the measurement radiation towards a subs...
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WO/2018/172036A1 |
The invention relates to a metrology target. The invention further relates to a method and to a device for characterizing a structured element in the form of a wafer, a mask, or a CGH. According to one aspect, a metrology target has a pe...
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WO/2018/166738A1 |
A sensor mark (17) comprising: a substrate (200) having: a first deep ultra violet (DUV) absorbing layer (310, 320, 330) comprising a first material which substantially absorbs DUV radiation; a first protecting layer (600) comprising a s...
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WO/2018/169201A1 |
The present invention relates to an imprint device and an imprint method. The imprint device comprises: a transfer part for transferring a film-shaped mold in one or another direction, the film-shaped mold having a pattern formed on the ...
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WO/2018/166717A1 |
Disclosed is a method and control system for determining stress in a substrate. The method comprises determining a measured position difference between a measured position of at least one first feature and a measured position of at least...
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WO/2018/166462A1 |
A vertical control method for use in a lithography machine, comprising the following steps: step 1: before scanning exposure, controlling a vertical measurement sensor (5) to measure a material (6) to acquire data of the overall shape of...
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WO/2018/166444A1 |
Disclosed are a photoetching apparatus and method. The photoetching apparatus comprises at least two sets of exposure apparatus and one set of substrate apparatus, wherein the substrate apparatus comprises a substrate table (10) and a su...
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WO/2018/160778A1 |
A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for...
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WO/2018/153711A1 |
A method, involving determining a first distribution of a first parameter associated with an error or residual in performing a device manufacturing process; determining a second distribution of a second parameter associated with an error...
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WO/2018/153671A1 |
Methods of measuring variation across multiple instances of a pattern on a substrate or substrates after a step in a device manufacturing process are disclosed. In one arrangement, data representing a set of images is received. Each imag...
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WO/2018/149777A1 |
The invention concerns a lithography process on a sample (2) comprising at least one structure (1) and covered by at least a lower layer (3) of resist and a upper layer (4) of resist the process comprising: thanks to an optical device (8...
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WO/2018/149779A1 |
The invention concerns a lithography process on a sample (2) comprising at least one emitter (1), said process comprising : putting at least one layer (3, 4) of resist above the sample (2), exciting one selected emitter (1) with light (1...
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WO/2018/149553A1 |
Disclosed is a method for monitoring a lithographic process, and associated lithographic apparatus. The method comprises obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression th...
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WO/2018/145972A1 |
The invention relates to a processing system, in particular an optical processing system, for a substrate body, comprising an exposure system having an exposure unit or a plurality of exposure units, a calibration system having at least ...
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WO/2018/145837A1 |
Target structures such as overlay gratings (Ta and Tb) are formed on a substrate (W) by a lithographic process. The first target is illuminated with a spot of first radiation (456a, Sa) and simultaneously the second target is illuminated...
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WO/2018/145803A1 |
A method of controlling a lithographic apparatus to manufacture a plurality of devices on a substrate, the method comprising: obtaining a parameter map representing a parameter variation across the substrate by measuring the parameter at...
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WO/2018/141713A1 |
There is provided an exposure apparatus comprising a first substrate holder, a second substrate holder, a sensor holder, a projection system, a measurement device and a further measurement device. The first substrate holder is configured...
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WO/2018/144959A1 |
A multi-column assembly for a scanning electron microscopy (SEM) system is disclosed. The multi-column assembly includes a plurality of electron-optical columns arranged in an array defined by one or more spacings. Each electron-optical ...
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WO/2018/137925A1 |
A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. As increasing numbers of layers, using increasing numbers of specific materials, are deposited on subs...
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WO/2018/131742A1 |
Disclosed are a method for assembling an LM guide using a half division method and a computer-readable recording medium for performing the same method. The disclosed method for assembling an LM guide using a half division method, which a...
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WO/2018/121921A1 |
Disclosed is a lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus comprises a controller configured to define a control grid associated with positioning of a substrate within th...
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WO/2018/121987A1 |
A method including: subsequent to a first device lithographic step of a device patterning process, measuring a degraded metrology mark on an object and/or a device pattern feature associated with the degraded metrology mark, the degraded...
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WO/2018/114246A2 |
A method of topography determination, the method including: obtaining a first focus value derived from a computational lithography model modeling patterning of an unpatterned substrate or derived from measurements of a patterned layer on...
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WO/2018/114152A1 |
Disclosed is a metrology sensor system, such as a position sensor. The system comprises an optical collection system configured to collect diffracted or scattered radiation from a metrology mark on a substrate, said collected radiation c...
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WO/2018/114246A3 |
A method of topography determination, the method including: obtaining a first focus value derived from a computational lithography model modeling patterning of an unpatterned substrate or derived from measurements of a patterned layer on...
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