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Matches 1 - 50 out of 15,213

Document Document Title
WO/2019/034318A1
An apparatus for determining a characteristic of a feature of an object comprises: a measurement radiation source; a measurement radiation delivery system; a measurement system; a pump radiation source; and a pump radiation delivery syst...  
WO/2019/015899A1
The present disclosure describes an apparatus (160) for determining information relating to at least one target alignment mark (114) in a semiconductor device substrate (110). The target alignment mark (114) is initially at least partial...  
WO/2019/011608A1
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - an substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an are...  
WO/2019/012495A1
[Problem] To improve the throughput performance and/or economy of a measurement apparatus. [Solution] This measurement apparatus is equipped with a first determination device, a second determination device, a first substrate stage config...  
WO/2019/011606A1
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - a substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an area...  
WO/2019/012499A1
A photomask alignment method for a manufacturing process of an integrated circuit in a semiconductor material wafer (20), the method envisaging: at a first level, defining, by means of a single photolithography process, at least one alig...  
WO/2019/011531A1
The present invention provides a method to obtain a height map of a substrate having alignment marks, the method comprising the steps: determining a height of one or more locations or areas of the substrate, and determining the height ma...  
WO/2019/007590A1
The invention relates to a method for revealing sensor targets on a substrate covered with a layer, said method comprising the following steps: determining locations of first areas on the substrate with yielding target portions and of se...  
WO/2019/001871A1
A method for determining substrate deformation has the steps: (a) obtaining (402) first measurement data (X i ) associated with mark position, from measurements of a plurality of substrates; (b) obtaining (404) second measurement data (X...  
WO/2019/005542A1
Methods and apparatuses are provided that determine an offset between actual feature/mark locations and the designed feature/mark locations in a maskless lithography system. For example, in one embodiment, a method is provided that inclu...  
WO/2019/001412A1
An optical path compensation device, comprising a wedge plate group (100), a driving mechanism (200) and a pre-tightening unit, wherein the wedge plate group includes a movable wedge plate (120) and a fixed wedge plate (100); the movable...  
WO/2018/224293A1
A system comprises a topography measurement system configured to determine a respective height for each of a plurality of locations on a substrate; and a processor configured to: determine a height map for the substrate based on the dete...  
WO/2018/226198A1
Apparatus (1600, 2900) and method (500, 2100) for aligning a rotatable substrate to a support mechanism (102, 1702) such as a turntable. The substrate has a circumferentially extending timing pattern (200, 1300, 1400, 1800, 1900, 2000, 2...  
WO/2018/224251A1
A method for determining a characteristic of a feature in an object, the feature being disposed below a surface of the object is disclosed. The surface of the object is irradiated with a pulsed pump radiation beam so as to produce an aco...  
WO/2018/219944A1
The invention relates to a method for aligning a second film (3) using a first code (1), which first code (1) is applied to an object (13), wherein the position of the first code (1) is defined by at least one detectable first code point...  
WO/2018/218214A1
Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second we...  
WO/2018/215703A1
The invention relates generally to a method for nanoimprint lithography making it possible to achieve high-precision alignment by automatically controlling all or some of the patterns of a structured mould (6) and a structured substrate ...  
WO/2018/215173A1
An alignment mark for determining a two-dimensional alignment position of a substrate is discussed. The alignment mark includes an array of patterns. The array of patterns includes a first set of patterns and a second set of patterns arr...  
WO/2018/210557A1
Methods and apparatus for measuring a target formed on a substrate are disclosed. The target comprises an alignment structure and a metrology structure. In one method, a first measurement process is performed that comprises illuminating ...  
WO/2018/210505A1
Disclosed is a metrology sensor apparatus comprising: an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation; an optical collection system configured to collect scattered radiation, foll...  
WO/2018/206227A1
An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target struct...  
WO/2018/206177A1
Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarizati...  
WO/2018/202394A1
Methods and apparatus for measuring a parameter of interest of a target structure formed on substrate are disclosed. In one arrangement, the target structure comprises a first sub-target and a second sub-target. The first sub-target comp...  
WO/2018/202414A1
A method including illuminating a product test substrate with radiation from a component, wherein the product test substrate does not have a device pattern etched therein and yields a non-zero sensitivity when illuminated, the non-zero s...  
WO/2018/196838A1
Disclosed is a silicon wafer processing device; a pre-aligned optical assembly (3) and an edge exposure assembly (5) are provided on a synchronous bi-directional motion module (4), reducing the occupied space of the device and saving the...  
WO/2018/192723A1
A metrology system includes a radiation source configured to generate measurement radiation having a plurality of temporally separated different wavelengths, an optical system configured to direct the measurement radiation towards a subs...  
WO/2018/172036A1
The invention relates to a metrology target. The invention further relates to a method and to a device for characterizing a structured element in the form of a wafer, a mask, or a CGH. According to one aspect, a metrology target has a pe...  
WO/2018/166738A1
A sensor mark (17) comprising: a substrate (200) having: a first deep ultra violet (DUV) absorbing layer (310, 320, 330) comprising a first material which substantially absorbs DUV radiation; a first protecting layer (600) comprising a s...  
WO/2018/169201A1
The present invention relates to an imprint device and an imprint method. The imprint device comprises: a transfer part for transferring a film-shaped mold in one or another direction, the film-shaped mold having a pattern formed on the ...  
WO/2018/166717A1
Disclosed is a method and control system for determining stress in a substrate. The method comprises determining a measured position difference between a measured position of at least one first feature and a measured position of at least...  
WO/2018/166462A1
A vertical control method for use in a lithography machine, comprising the following steps: step 1: before scanning exposure, controlling a vertical measurement sensor (5) to measure a material (6) to acquire data of the overall shape of...  
WO/2018/166444A1
Disclosed are a photoetching apparatus and method. The photoetching apparatus comprises at least two sets of exposure apparatus and one set of substrate apparatus, wherein the substrate apparatus comprises a substrate table (10) and a su...  
WO/2018/160778A1
A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for...  
WO/2018/153711A1
A method, involving determining a first distribution of a first parameter associated with an error or residual in performing a device manufacturing process; determining a second distribution of a second parameter associated with an error...  
WO/2018/153671A1
Methods of measuring variation across multiple instances of a pattern on a substrate or substrates after a step in a device manufacturing process are disclosed. In one arrangement, data representing a set of images is received. Each imag...  
WO/2018/149777A1
The invention concerns a lithography process on a sample (2) comprising at least one structure (1) and covered by at least a lower layer (3) of resist and a upper layer (4) of resist the process comprising: thanks to an optical device (8...  
WO/2018/149779A1
The invention concerns a lithography process on a sample (2) comprising at least one emitter (1), said process comprising : putting at least one layer (3, 4) of resist above the sample (2), exciting one selected emitter (1) with light (1...  
WO/2018/149553A1
Disclosed is a method for monitoring a lithographic process, and associated lithographic apparatus. The method comprises obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression th...  
WO/2018/145972A1
The invention relates to a processing system, in particular an optical processing system, for a substrate body, comprising an exposure system having an exposure unit or a plurality of exposure units, a calibration system having at least ...  
WO/2018/145837A1
Target structures such as overlay gratings (Ta and Tb) are formed on a substrate (W) by a lithographic process. The first target is illuminated with a spot of first radiation (456a, Sa) and simultaneously the second target is illuminated...  
WO/2018/145803A1
A method of controlling a lithographic apparatus to manufacture a plurality of devices on a substrate, the method comprising: obtaining a parameter map representing a parameter variation across the substrate by measuring the parameter at...  
WO/2018/141713A1
There is provided an exposure apparatus comprising a first substrate holder, a second substrate holder, a sensor holder, a projection system, a measurement device and a further measurement device. The first substrate holder is configured...  
WO/2018/144959A1
A multi-column assembly for a scanning electron microscopy (SEM) system is disclosed. The multi-column assembly includes a plurality of electron-optical columns arranged in an array defined by one or more spacings. Each electron-optical ...  
WO/2018/137925A1
A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. As increasing numbers of layers, using increasing numbers of specific materials, are deposited on subs...  
WO/2018/131742A1
Disclosed are a method for assembling an LM guide using a half division method and a computer-readable recording medium for performing the same method. The disclosed method for assembling an LM guide using a half division method, which a...  
WO/2018/121921A1
Disclosed is a lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus comprises a controller configured to define a control grid associated with positioning of a substrate within th...  
WO/2018/121987A1
A method including: subsequent to a first device lithographic step of a device patterning process, measuring a degraded metrology mark on an object and/or a device pattern feature associated with the degraded metrology mark, the degraded...  
WO/2018/114246A2
A method of topography determination, the method including: obtaining a first focus value derived from a computational lithography model modeling patterning of an unpatterned substrate or derived from measurements of a patterned layer on...  
WO/2018/114152A1
Disclosed is a metrology sensor system, such as a position sensor. The system comprises an optical collection system configured to collect diffracted or scattered radiation from a metrology mark on a substrate, said collected radiation c...  
WO/2018/114246A3
A method of topography determination, the method including: obtaining a first focus value derived from a computational lithography model modeling patterning of an unpatterned substrate or derived from measurements of a patterned layer on...  

Matches 1 - 50 out of 15,213