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WO/2018/111043A1 |
The present invention relates to a photopolymerizable composition for forming a bezel pattern comprising a colorant, an epoxy compound, an oxetane compound, a photopolymerization initiator, and a solvent having a boiling point of 190 to ...
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WO/2018/110237A1 |
A positioning device in which a measurement unit includes an illumination unit that illuminates a first original-plate-side mark that is for rough measurement and is arranged on an original plate or on an original plate holding part, a s...
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WO/2018/108499A1 |
A method for monitoring a characteristic of illumination from a metrology apparatus, the method comprising: using the metrology apparatus to acquire a pupil image at different focus settings of the metrology apparatus; and calculating an...
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WO/2018/105658A1 |
A proximity exposure apparatus is provided with: a plane mirror (68) having a mirror transformation unit (70) capable of correcting the curvature thereof; a CCD camera (30) capable of capturing images of a mask M-side alignment mark (Ma)...
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WO/2018/104039A1 |
An overlay measurement (OV) is based on asymmetry in a diffraction spectrum of target structures formed by a lithographic process. Stack difference between target structures can be perceived as grating imbalance (GI), and the accuracy of...
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WO/2018/099348A1 |
A focusing and leveling device for calculating the defocusing amount and/or tilt amount of a substrate (60), comprising a lighting unit, a projection marking plate (10) with a projection slit marker, a projection imaging group (20), a re...
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WO/2018/086852A1 |
A measurement system is disclosed in which a first optical system splits an input radiation beam into a plurality of components. A modulator receives the plurality of components and applies a modulation to at least one of the components ...
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WO/2018/086825A1 |
A method of determining an optimal operational parameter setting of a metrology system is described. Free-form wafer shape measurements are performed (304). A model is applied (306), transforming the measured warp to modeled warp scaling...
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WO/2018/082892A1 |
A lithographic apparatus (LA) applies a pattern to a substrate (W). The lithographic apparatus includes a height sensor (LS), a substrate positioning subsystem, and a controller configured for causing the height sensor to measure the hei...
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WO/2018/077587A1 |
A scanning exposure of a plurality of target regions on a substrate is performed such that an image of each of a plurality of markers is formed on each of the plurality of target regions. Each of the plurality of markers is of a form suc...
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WO/2018/069015A1 |
A method for selecting an optimal set of locations for a measurement or feature on a substrate includes: (302): Defining constraints, and optionally cost function(s). (306): Defining a first candidate solution of locations. (308): Defini...
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WO/2018/065167A1 |
Method of measuring a height profile of one or more substrates is provided comprising measuring a first height profile of one or more fields on a substrate using a first sensor arrangement, the first height profile being the sum of a fir...
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WO/2018/065222A1 |
A method of performing a lithographic exposure of a substrate, the substrate being held on a substrate table, the substrate table comprising a cooling system operative to cool the substrate table, the method comprising performing an alig...
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WO/2018/065157A1 |
An alignment system configured to be substantially insensitive to thermal variations in its system during alignment measurements. The alignment system includes a sensor system, a support structure, a sensing element, a position measureme...
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WO/2018/061945A1 |
A measuring system (5001) to be used on the production line of a micro device is independently provided from an exposure apparatus. The measuring system (5001) is provided with: a plurality of measuring apparatuses (1001-1003), which res...
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WO/2018/062491A1 |
This movable body device for moving a substrate (P) is provided with: a substrate holder (32) which holds the substrate (P) and which can move in the X axis and the Y axis directions; a Y coarse movement stage (24) which can move in the ...
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WO/2018/062487A1 |
This movable body device is provided with: a substrate holder (32) which holds a substrate (P) and which can move in the X axis and the Y axis directions; a Y coarse movement stage (24) which can move in the Y axis direction; a first mea...
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WO/2018/059824A1 |
A method including evaluating a plurality of substrate measurement recipes for measurement of a metrology target processed using a patterning process, against stack sensitivity and overlay sensitivity, and selecting one or more substrate...
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WO/2018/051744A1 |
The present invention pertains to a detection device (25) for detecting the positions of marks on movable objects (3, 4a). The detection device (25) has: a control unit (24) that has a function as a specifying means for specifying the ti...
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WO/2018/046279A1 |
A method, including printing an apparatus mark onto a structure while at least partly within an apparatus. The structure is part of, or is located on, a substrate table, but is separate from a substrate to be held by the apparatus. Measu...
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WO/2018/041550A1 |
A method including performing a first simulation for each of a plurality of different metrology target measurement recipes using a first model, selecting a first group of metrology target measurement recipes from the plurality of metrolo...
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WO/2018/041440A1 |
An alignment sensor in a lithographic apparatus comprises an optical system (500; 600) configured to deliver, collect and process radiation selectively in a first waveband (e.g. 500-900 nm) and/or in a second waveband (e.g. 1500-2500 nm)...
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WO/2018/038612A1 |
A distance sensor (1) for estimating a distance to a surface (OS) of an object (O), the distance sensor including a micro electric mechanical system (MEMS) (5), a detection means (30) and a processing device (40). The MEMS comprises a ME...
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WO/2018/038071A1 |
A measuring system (500) to be used on a micro device manufacturing line is provided with: a plurality of measuring devices (1001-1003) which measure substrates, respectively; and a control device (530) capable of controlling the measuri...
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WO/2018/034380A1 |
The present invention relates to a high-performance mask aligner stage levelling apparatus having improved levelling maintenance force and, specifically, to an advanced concept technology for preventing the crookedness of levelling by se...
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WO/2018/033499A1 |
A method of determining the position of an alignment mark (29) on a substrate, the alignment mark (29) comprising a first segment (29a) and a second segment (29b), the method comprising illuminating the alignment mark with radiation, det...
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WO/2018/028880A1 |
The invention relates to a method for recovering alignment marks in a mark layer of a substrate, comprising the steps of: a) providing a substrate with a mark layer covered by a resist layer; b) forming alignment marks in the mark layer,...
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WO/2018/026378A1 |
A method of patterning with imprint lithography, a stamp for imprint lithography, an imprint roller of a roll-to-roll substrate processing apparatus, and a substrate processing apparatus are described. The method includes providing a lay...
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WO/2018/025515A1 |
Provided is a measuring device that measures the surface height distribution of a substrate having a surface whereon the height variation along one direction is greater than the height variation along the other direction in mutually diff...
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WO/2018/019265A1 |
An apparatus and a method for measuring an amplitude of a scanning reflector are provided. The apparatus for measuring an amplitude of a scanning reflector comprises: a light source (20) configured to output an optical signal, an apertur...
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WO/2018/019496A1 |
A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which...
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WO/2018/015500A1 |
A process for mounting a printing plate on a carrier sheet, including disposing registration indicia on the plate, placing the carrier sheet on a cutting table of a cutting system, mounting the plate to the carrier sheet, detecting absol...
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WO/2018/015113A1 |
An exposure apparatus is described, the apparatus comprising: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device comp...
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WO/2018/010887A1 |
The invention relates to a method for microlithographic production of microstructured components and a microlithographic projection exposure apparatus. In a method for microlithographic production of microstructured components, used stru...
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WO/2018/001972A1 |
A method of applying a measurement correction includes calculating a first correction value based on a first coefficient and the measurement; calculating a second correction value based on a second coefficient, greater than the first coe...
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WO/2017/222919A1 |
An extreme ultraviolet lithography system (10) that creates a new pattern (330) having a plurality of densely packed parallel lines (332) on a workpiece (22), the system (10) includes a patterning element (16); an EUV illumination system...
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WO/2017/215924A1 |
A target structure (402) such as an alignment mark on a semiconductor substrate (400) becomes obscured by an opaque layer (408) so that it cannot be located by an alignment sensor (AS). A position for the mark is determined using an edge...
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WO/2017/211694A1 |
A supercontinuum radiation source for an alignment mark measurement system comprises: a radiation source; illumination optics; a plurality of waveguides; and collection optics. The radiation source is operable to produce a pulsed radiati...
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WO/2017/207512A3 |
A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured...
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WO/2017/209132A1 |
This mark detection device for detecting a mark M formed in a mark region of an object (41) is provided with: a first optical system (52a) that outputs measuring light toward the mark region; a second optical system (53a) that irradiates...
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WO/2017/206755A1 |
A focusing and leveling measurement device and method. The device is provided with a measurement optical path and a first monitoring optical path. After a silicon wafer (108) is measured by using a measurement beam generated by the measu...
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WO/2017/207512A2 |
A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured...
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WO/2017/207269A1 |
An alignment system obtains the characteristics of the light coming back from a wafer stack. A beam analyzer measures changes in wavelength, polarization, and beam profile. This measured information allows for in-line process variation c...
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WO/2017/204101A1 |
The present invention is provided with: a sliding table 120 having, formed thereon, a plurality of areas 110, 111 in which workpieces are placed; a first loader 310 and a second loader 311 which are capable of loading and unloading the w...
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WO/2017/204100A1 |
The present invention is provided with: a turntable 120 which has, formed thereon, a plurality of areas 110, 111 in which workpieces are placed, said turntable being configured so as to be capable of rotating and being temporarily stoppe...
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WO/2017/199728A1 |
This semiconductor device is provided with: first and second inspection mark regions (51a, 51b) having same patterns, each of which includes a plurality of superposition inspection marks (61a, 61b); a first element region (52) having a p...
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WO/2017/198422A1 |
A method including obtaining a measurement result from a target on a substrate, by using a substrate measurement recipe; determining, by a hardware computer system, a parameter from the measurement result, wherein the parameter character...
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WO/2017/200159A1 |
The present invention relates to an overlay mark, and an overlay measurement method and a semiconductor device manufacturing method using the same. The present invention provides an overlay mark for determining the relative shift between...
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WO/2017/194289A1 |
Measurements are obtained from locations across a substrate (W') before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and ...
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WO/2017/190905A1 |
A lithographic method for measuring a position of a target grating with a mask sensor apparatus which comprises a plurality of detector modules each comprising a diffraction grating located at a mask side of a projection system of a lith...
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