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WO/2024/078813A1 |
An optical arrangement for aberration correction, comprising: a beam dispersing element for spatially dispersing a broadband radiation beam in a first transverse direction; a focusing lens for focusing the broadband radiation beam subseq...
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WO/2024/078818A1 |
An inspection system includes an integrated optical system with a substrate, waveguide system, and first and second grating couplers disposed on the substrate, first and second detectors, and a micro-structured illumination adjuster. The...
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WO/2024/074286A1 |
Systems and methods for providing variable spot size and variable focus at a substrate are described. Sets of variable focal length lenses can be added to an alignment system to allow for adjustment of the spot size and focus. A variable...
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WO/2024/068297A1 |
Systems and methods for providing variable spot size and variable focus at a substrate are described. Sets of variable focal length lenses can be added to an alignment system to allow for adjustment of the spot size and focus. A variable...
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WO/2024/061572A1 |
An optical alignment system comprising an illumination system configured to condition a radiation beam to form a first off-axis monopole, a marker configured to diffract the first off-axis monopole to form zeroth and first diffraction or...
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WO/2024/063968A1 |
Systems and methods disclosed herein relate to a digital lithography system and method for alignment resolution with the digital lithography system. The digital lithography system includes a metrology system configured to improve overlay...
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WO/2024/055712A1 |
The present invention provides a double-sided superlens processing method. The method comprises: providing a first structural layer on a first surface of a substrate, and performing a first photolithography operation on the first structu...
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WO/2024/052061A1 |
A method can include directing radiation toward at least two targets using an optical scanning system so as to generate first and second portions of scattered radiation. A first target can include a plurality of first grating line struct...
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WO/2024/045204A1 |
A method and apparatus for locating a production monitoring point of a photomask, and an electronic device. The method for locating a production monitoring point of a photomask comprises: determining coordinates of one or more target det...
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WO/2024/028327A1 |
A method of determining contamination of an optical sensor in a lithographic apparatus, the method comprising illuminating a pattern on a patterning device using EUV radiation, projecting patterned reflected EUV radiation towards the opt...
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WO/2024/022773A1 |
A method of determining contamination of an optical sensor of a sensing system in a lithographic apparatus, the method comprising directing EUV radiation through an opening in a reticle masking blade (26) and onto a patterning device, pr...
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WO/2024/017765A1 |
This discloses apparatus and methods for obtaining topographical information about a sample surface. In one arrangement, a sensing system comprises a group of proximal sensors for measuring positions of respective portions of a sample su...
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WO/2024/017649A1 |
Disclosed is a metrology apparatus in which some of the measurement radiation that has interacted with a mark is split into channels or arms and then each channel or arm is spatially separated. In some versions the alignment information ...
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WO/2024/017807A1 |
Systems, methods, and computer software are disclosed for optimizing a metrology mark. One method includes simulating an etch process based on one or more of a pattern density, a microloading effect induced intra-mark variation, or a sen...
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WO/2024/005011A1 |
The present disclosure provides a reflection structure comprising a frequency-selective reflection plate that reflects a specific frequency band of electromagnetic waves in a different direction than a regular reflection direction. The r...
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WO/2024/000632A1 |
The present disclosure relates to a method and apparatus for monitoring the measurement accuracy of a semiconductor, a device, and a medium. The method comprises: obtaining real-time measurement data and scanned image measurement data of...
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WO/2024/002546A1 |
Disclosed is a wedge arrangement comprising a plurality of wedge elements, arranged around an optical axis, the plurality of wedge elements comprising at least a first wedge element, a second wedge element and a third wedge element; wher...
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WO/2023/247125A1 |
A method of determining a physical quantity is disclosed. The method uses a sensor system configured to sample a plurality of positions in parallel, wherein sampling each position uses radiation incident on an object plane patterning dev...
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WO/2023/247178A1 |
A novel approach for an alignment system by using glass plates to create off-axis illumination beams is described. A pair of glass plates is inserted into an alignment system to create a pair of off-axis illumination beams. The off-axis ...
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WO/2023/241867A1 |
A method for calibrating a height measuring optical sensor for a substrate in a lithographic apparatus. The method comprises determining, using the height measuring optical sensor, a first height of a surface of the substrate within a re...
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WO/2023/242012A1 |
An inspection system includes a radiation source, an integrated optical system, and first and second detectors. The radiation source generates radiation to irradiate a target. The integrated optical system includes: a substrate; first, s...
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WO/2023/241850A1 |
Method of spatially aligning a patterning device and a substrate, wherein the patterning device and the substrate are separated by an optical path comprising one or more moveable optical components, the method comprising: - projecting a ...
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WO/2023/236069A1 |
An alignment calibration system and a method therefor. After an image sensing device (3) and an image capturing apparatus (4) respectively acquire alignment information, positioning information is obtained through computation so as to ac...
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WO/2023/208487A1 |
Disclosed is a source selection module for selecting spectral characteristics of a broadband illumination beam to obtain a modulated illumination beam. The source selection module comprises a first beam dispersing element for dispersing ...
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WO/2023/198382A1 |
A method of spatially aligning a patterning device and a substrate, wherein the patterning device and the substrate are separated by an optical path comprising one or more moveable optical components is described, the method comprising: ...
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WO/2023/198466A1 |
An apparatus includes an illumination system, a projection system, and an inspection system. The illumination system illuminates a pattern of a patterning device. The projection system projects an image of the pattern onto a substrate. T...
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WO/2023/198444A1 |
Disclosed herein are embodiments that relate to a metrology apparatus and associated methods for imaging a plurality of targets (e.g., alignment marks) disposed on of a substrate (550, 650) in parallel using a fixed sensor (510, 530, 610...
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WO/2023/196783A1 |
Disclosed herein are examples of a photolithography machine with fast alignment. The machine may include a stage to hold and move a substrate and a projection system to project images on a plurality of exposure regions of the substrate. ...
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WO/2023/189283A1 |
This semiconductor substrate comprises a main surface, a reference mark, and an epitaxial growth-inhibiting film. The reference mark is composed of a recess formed on the main surface, and serves as a reference for in-plane coordinates. ...
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WO/2023/186440A1 |
Disclosed is a method for determining a spatial distribution of a parameter of interest over at least one substrate or portion thereof, the at least one substrate having been subject to a semiconductor manufacturing process, the method c...
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WO/2023/189435A1 |
This analysis system comprises: a first measurement unit for measuring first information items that are pattern information items of a first pattern on a first substrate; a storage unit for storing the first information items measured by...
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WO/2023/190110A1 |
Provided is a transport device (20) comprising an alignment mechanism (22) which positions each of a plurality of substrates (P) arranged on a holding unit (21) with respect to the holding unit (21), a suction mechanism (23) which causes...
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WO/2023/190400A1 |
The present invention forms a reference mark 22 formed in a first process of a photolithography process of semiconductor device manufacturing and a reference mark 24 formed in a second process following the first process as concentric do...
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WO/2023/183245A1 |
A device for determining coplanarity of two surfaces includes an illumination system for providing first light to a first surface and providing second light to a second surface. The first surface redirects at least a portion of the first...
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WO/2023/174648A1 |
Disclosed is an illumination arrangement for providing at least one radiation beam for use as an illumination beam and/or reference beam in a metrology device. The illumination arrangement comprises at least one radiation beam modifier m...
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WO/2023/170692A1 |
A control system and method are presented for use in optical measurements on patterned samples. The control system comprises a computer system configured for data communication with a measured data provider and comprising a data processo...
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WO/2023/165823A1 |
An inspection apparatus includes a radiation source, an optical system, and a detector. The radiation source is configured to generate a beam of radiation. The optical system is configured to receive and direct the beam along an optical ...
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WO/2023/160972A1 |
A height measurement sensor comprising projection and detection units. The projection unit comprises a radiation source and a projection grating comprising a projection grating spot having a plurality of grating lines, the projection gra...
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WO/2023/157888A1 |
This exposure method includes: using an exposure device that uses a mask, to form a first exposure pattern in a first region in each of a plurality of pattern formation regions on a substrate, using exposure light via a first mask, and t...
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WO/2023/147951A1 |
A system includes an imaging system, a spatial filter, and a detector. The system is configured to receive a plurality of diffraction orders. The spatial filter is configured to block one or more undesired diffraction orders of the plura...
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WO/2023/147986A1 |
Disclosed is a method of determining a value for a parameter of interest from a target on a substrate. The method comprises obtaining metrology data comprising single-wavelength parameter of interest values which were obtained using a re...
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WO/2023/144548A1 |
Broadly speaking, embodiments of the present techniques provide an optically- or machine-readable fiducial marker for use in nanoscale applications and a method for automatic detection of a marker. Advantageously, the fiducial marker of ...
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WO/2023/138892A1 |
Systems and methods provide the ability to mitigate linear and/or offset coma present in an objective of a metrology tool. A method of reducing an effect of offset coma in a metrology apparatus includes rotating an objective lens element...
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WO/2023/134957A1 |
Disclosed is a method of performing a lithographic performance qualification test. The method comprises: obtaining one or more exposure layouts, each relating to exposure of multiple exposure fields on a substrate; performing a dummy exp...
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WO/2023/130805A1 |
A semiconductor device and a preparation method therefor. The preparation method comprises: providing a substrate (1), comprising an alignment region (A) and a connection region (B); forming a first conductive layer (2) on the substrate ...
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WO/2023/131589A1 |
A fast and dynamic waveplate is described. The present systems and methods utilize the stress birefringence that generates inside a plate when force is applied on sides of the plate. The force is applied using a set of piezoelectric actu...
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WO/2023/126174A1 |
Disclosed is an apparatus for and method of using local alignment position deviation parameters for alignment marks on a semiconductor wafer wherein the parameters are used to generate one or more values indicating a condition of the ali...
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WO/2023/126173A1 |
A system includes optical devices, reflective devices, a movable reflective device, and a detector. The optical devices are disposed at a first plane and around a axis of the system and receive scattered radiation from targets. The refle...
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WO/2023/117610A1 |
Generating an alignment signal for alignment of features in a layer of a substrate as part of a semiconductor manufacturing process is described. The present systems and methods are faster and generate more information than typical metho...
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WO/2023/117611A1 |
Spots of illumination directed at a target are described. Spots of illumination are generated from a single illumination source. Ghost reflections often prevalent in wafer alignment sensors are reduced or eliminated. First, second, and t...
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