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WO/2019/197111A1 |
The invention provides a level sensor to measure a position of a surface of a substrate, comprising a projection unit arranged to direct a beam of radiation to the surface of the substrate and a detection unit. The detection unit compris...
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WO/2019/192681A1 |
An apparatus (100) for processing a substrate (10) in a vacuum chamber (101) is described. The apparatus includes a first carrier transport system (31) for transporting a first carrier (11) along a first transport path in a first directi...
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WO/2019/185230A1 |
Disclosed is a method for controlling a scanning exposure apparatus configured for scanning an illumination profile over a substrate to form functional areas thereon. The method comprises determining a control profile for dynamic control...
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WO/2019/190566A1 |
A method for optical proximity correction (OPC) comprises creating a semi-physical model of a mask for a current layer in an IC design layout using physical parameters of a lithography process used to create the mask, the semi-physical m...
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WO/2019/174710A1 |
A system for an optical inspection of a substrate is provided. The system comprises at least a first processing and a second processing chamber. The system comprises at least a transfer chamber for receiving the substrate from the first ...
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WO/2019/166078A1 |
The invention relates to a mark field (4), comprising at least two location marks (2) having information about the location of the location mark (2) in question and at least one position mark (3), which is or can be associated with one o...
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WO/2019/166201A1 |
Methods and apparatus for determining a position of an alignment mark applied to a region of a first layer on a substrate using a lithographic process by: obtaining an expected position of the alignment mark; obtaining a geometrical defo...
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WO/2019/157615A1 |
A method for re-processing after printing: first forming a basic pattern on a product to be processed; then obtaining an electronic image of the basic pattern by means of an image acquisition unit; correcting absolute position informatio...
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WO/2019/160548A1 |
A gas recycle system includes a gas purifier system; a gas analysis system; a gas blending system that prepares a recycled gas mixture; and a control system configured to: determine whether a measured amount of at least one intended gas ...
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WO/2019/155886A1 |
A proximity exposure device comprises: a non-exposure light illumination means (100), arranged closer to a lamp unit (60) than to a flat mirror (68), for irradiating non-exposure light coaxially with the optical axis of light from the la...
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WO/2019/149586A1 |
A method of patterning of at least a layer in a semiconductor device, comprising a patterning step by patterning means wherein the patterned layer comprises sensing-light transmissive portions (702x) and sensing-light blocking portions (...
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WO/2019/149423A1 |
A measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more features o...
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WO/2019/145101A1 |
A sensor is disclosed, wherein a transducer generates acoustic waves, which are received by a lens assembly. The lens assembly transmits and directs at least a part of the acoustic waves to a target. The lens assembly then receives at le...
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WO/2019/142443A1 |
The present invention allows a stable pairing process for a marker that is required when generating correction information used for correcting drawing data for an image drawn on a substrate. A step (d) of mapping a measurement position t...
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WO/2019/141481A1 |
A system for and method of processing a wafer in which a scan signal is analyzed locally to extract information about alignment, overlay, mark quality, wafer quality, and the like.
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WO/2019/067809A3 |
A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the r...
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WO/2019/139772A1 |
Two pairs of alignment targets (one aligned, one misaligned by a bias distance) are formed on different masks to produce a first pair of conjugated interference patterns. Other pairs of alignment targets are also formed on the masks to p...
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WO/2019/129465A1 |
A metrology apparatus for determining a characteristic of interest of a structure on a substrate, the structure having diffractive properties, the apparatus comprising: focusing optics configured to focus illumination radiation comprisin...
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WO/2019/129109A1 |
A method for fabricating a black matrix (33b), comprising the following steps: providing a substrate (31), the substrate (31) being provided thereon with an alignment mark (32); coating a black matrix thin film (33a) onto the substrate (...
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WO/2019/132489A1 |
The present invention relates to an ultraviolet curable ink composition comprising a colorant, an epoxy monomer, an oxetane monomer, a cationic photo-polymerization initiator, and a polymerization inhibitor, wherein the weight ratio of e...
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WO/2019/115426A1 |
A method including: obtaining a value of a characteristic of a physical item instance of a physical system or object, using a non-probabilistic model; obtaining an attribute of a distribution of a residue of the non-probabilistic model w...
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WO/2019/105098A1 |
An alignment mark, substrate and fabrication method therefor, and exposure alignment method. The alignment mark comprises an alignment area (1), a peripheral area (2) and a shielding area (3). The alignment area (1) is provided with an o...
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WO/2019/105410A1 |
Provided is a signal processing device having phase compensation, comprising: a signal capturing module (401) used for capturing an actual work signal; a signal emulating module used for emulating a work signal having a certain frequency...
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WO/2019/103284A1 |
The apparatus for securing a printing screen frame according to the present invention is structured so that, when a piston rod moves backward due to a supply of air pressure, the tension between a coupling protrusion of a tension member ...
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WO/2019/085932A1 |
Disclosed are a substrate alignment method and device, and a mask aligner. The substrate alignment method comprises: selecting a reference substrate, and obtaining an image of the reference substrate; selecting an image of the a to-be-al...
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WO/2019/086334A1 |
A lithographic cluster includes a track unit and a lithographic apparatus. The lithographic apparatus includes an alignment sensor and at least one controller. The track unit is configured to process a first lot and a second lot. The lit...
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WO/2019/081091A1 |
A resonant amplitude grating mark has a periodic structure configured to scatter radiation (502) of wavelength λ incident (500) on a surface plane (506) of the alignment mark. The scattering is mainly by excitation of a resonant mode (5...
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WO/2019/084237A1 |
A method of focusing includes irradiating an object by directing radiation output by a radiating source through an objective lens, measuring a first intensity of reflected radiation that is reflected from the object, adjusting a distance...
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WO/2019/072727A1 |
The invention relates to a method for exposing at least one stored representation (21) on a light-sensitive recording medium (14), comprising: an exposure device (11), which receives at least one recording medium (14) on a support (12); ...
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WO/2019/069649A1 |
A feedback control device for accepting information relating to control deviation between the measured value and the target value of a controlled object as input and outputting a manipulated variable for the controlled object. The feedba...
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WO/2019/063193A1 |
A supercontinuum radiation source comprises: a radiation source, an optical amplifier and a non-linear optical medium. The radiation source is operable to produce a pulsed radiation beam. The optical amplifier is configured to receive th...
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WO/2019/063245A1 |
A method for determining one or more optimized values of an operational parameter of a sensor system configured for measuring a property of a substrate is disclosed the method comprising: determining a quality parameter for a plurality o...
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WO/2019/061714A1 |
A manufacturing method of a TFT array substrate comprises: providing a substrate; sequentially depositing, on a surface of the substrate, a gate metal layer, an insulation layer and a metal oxidation layer; forming a first metal layer on...
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WO/2019/012499A8 |
A photomask alignment method for a manufacturing process of an integrated circuit in a semiconductor material wafer (20), the method envisaging: at a first level, defining, by means of a single photolithography process, at least one alig...
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WO/2019/060276A1 |
Aspects of the disclosure relate to augmented reality devices for generating a composite scene including a real-world test environment and an augmented reality overlay visually representing a test area of the environment. Some devices ca...
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WO/2019/059102A1 |
In the present invention, a silicon carbide semiconductor substrate (10) that is formed of silicon carbide monocrystals having a main surface in which an off-angle is disposed at the (0001) plane and having an off-direction of <11-20> is...
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WO/2019/060275A1 |
Aspects of the disclosure relate to demarcation templates for demarcating a test area on a test surface and for providing visual guidance to a user to precisely and accurately swab the test surface in order to determine the presence and/...
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WO/2019/052746A1 |
Methods and associated apparatus for reconstructing a free-form geometry of a substrate, the method comprising: positioning the substrate on a substrate holder configured to retain the substrate under a retaining force that deforms the s...
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WO/2019/048198A1 |
A lithographic apparatus comprising an illumination system for providing a beam of radiation, a support structure for supporting a patterning device, the patterning device serving to impart the radiation beam with a pattern in its cross-...
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WO/2019/048216A1 |
Disclosed herein is a target formed on a substrate, the target comprising: an alignment structure; and a metrology structure; wherein the alignment structure comprises structures that are arranged to generate a beat pattern when the alig...
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WO/2019/040299A1 |
Methods are provided that, in some embodiments that provide alignment of a first layer of a printing plate on a chuck. For example, in one embodiment, images of reference marks on a chuck are captured to determine the initial positions o...
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WO/2019/038400A1 |
A method for mounting one or more printing plate segments (402-407) on a carrier sheet (302). The method comprises importing a file into a computer (528) associated with a mounting unit (305, 350). For each printing plate segment (402-40...
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WO/2019/037672A1 |
A mask transfer system and transfer method, comprising an inner mask store (1) used for storing masks, a rotating mechanical arm used for moving the masks, and a mask fork (3) connected to the rotating mechanical arm and used for picking...
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WO/2019/039173A1 |
The present invention simplifies manufacture of an alignment mark of a semiconductor device. Provided is a semiconductor device that is provided with a semiconductor substrate, an epitaxial layer, and an alignment mark. The epitaxial lay...
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WO/2019/040582A1 |
In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material hav...
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WO/2019/034318A1 |
An apparatus for determining a characteristic of a feature of an object comprises: a measurement radiation source; a measurement radiation delivery system; a measurement system; a pump radiation source; and a pump radiation delivery syst...
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WO/2019/015899A1 |
The present disclosure describes an apparatus (160) for determining information relating to at least one target alignment mark (114) in a semiconductor device substrate (110). The target alignment mark (114) is initially at least partial...
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WO/2019/011608A1 |
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - an substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an are...
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WO/2019/012495A1 |
[Problem] To improve the throughput performance and/or economy of a measurement apparatus. [Solution] This measurement apparatus is equipped with a first determination device, a second determination device, a first substrate stage config...
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WO/2019/011606A1 |
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - a substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an area...
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