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Matches 1 - 50 out of 14,894

Document Document Title
WO/2018/010887A1
The invention relates to a method for microlithographic production of microstructured components and a microlithographic projection exposure apparatus. In a method for microlithographic production of microstructured components, used stru...  
WO/2018/001972A1
A method of applying a measurement correction includes calculating a first correction value based on a first coefficient and the measurement; calculating a second correction value based on a second coefficient, greater than the first coe...  
WO/2017/222919A1
An extreme ultraviolet lithography system (10) that creates a new pattern (330) having a plurality of densely packed parallel lines (332) on a workpiece (22), the system (10) includes a patterning element (16); an EUV illumination system...  
WO/2017/215924A1
A target structure (402) such as an alignment mark on a semiconductor substrate (400) becomes obscured by an opaque layer (408) so that it cannot be located by an alignment sensor (AS). A position for the mark is determined using an edge...  
WO/2017/211694A1
A supercontinuum radiation source for an alignment mark measurement system comprises: a radiation source; illumination optics; a plurality of waveguides; and collection optics. The radiation source is operable to produce a pulsed radiati...  
WO/2017/209132A1
This mark detection device for detecting a mark M formed in a mark region of an object (41) is provided with: a first optical system (52a) that outputs measuring light toward the mark region; a second optical system (53a) that irradiates...  
WO/2017/206755A1
A focusing and leveling measurement device and method. The device is provided with a measurement optical path and a first monitoring optical path. After a silicon wafer (108) is measured by using a measurement beam generated by the measu...  
WO/2017/207512A2
A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured...  
WO/2017/207269A1
An alignment system obtains the characteristics of the light coming back from a wafer stack. A beam analyzer measures changes in wavelength, polarization, and beam profile. This measured information allows for in-line process variation c...  
WO/2017/204101A1
The present invention is provided with: a sliding table 120 having, formed thereon, a plurality of areas 110, 111 in which workpieces are placed; a first loader 310 and a second loader 311 which are capable of loading and unloading the w...  
WO/2017/204100A1
The present invention is provided with: a turntable 120 which has, formed thereon, a plurality of areas 110, 111 in which workpieces are placed, said turntable being configured so as to be capable of rotating and being temporarily stoppe...  
WO/2017/199728A1
This semiconductor device is provided with: first and second inspection mark regions (51a, 51b) having same patterns, each of which includes a plurality of superposition inspection marks (61a, 61b); a first element region (52) having a p...  
WO/2017/198422A1
A method including obtaining a measurement result from a target on a substrate, by using a substrate measurement recipe; determining, by a hardware computer system, a parameter from the measurement result, wherein the parameter character...  
WO/2017/200159A1
The present invention relates to an overlay mark, and an overlay measurement method and a semiconductor device manufacturing method using the same. The present invention provides an overlay mark for determining the relative shift between...  
WO/2017/194289A1
Measurements are obtained from locations across a substrate (W') before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and ...  
WO/2017/190905A1
A lithographic method for measuring a position of a target grating with a mask sensor apparatus which comprises a plurality of detector modules each comprising a diffraction grating located at a mask side of a projection system of a lith...  
WO/2017/186170A1
A dual-layer alignment device comprises a fixing frame (40); a first measurement device (50) and a marking board (41) disposed on the fixing frame (40), wherein a fixed frame mark (20) is configured on the marking board (41); and a movab...  
WO/2017/186458A1
The invention relates to a measurement system for a projection system of a lithographic apparatus, comprising: - a sensor plate; - a detector comprising an array of detector areas; - a randomly ordered optical fiber bundle; - a positione...  
WO/2017/186447A1
A method of controlling alignment in a lithographic apparatus configured to expose a substrate (702) held by a substrate table (704) to an image of a pattern on a patterning device (708) via a projection system (706). The method comprise...  
WO/2017/182204A1
A measurement apparatus, including: a tapered optical fiber, the tapered optical fiber having an input to receive radiation and having an output to provide spectrally broadened output radiation toward a measurement target, the tapered op...  
WO/2017/179955A1
A method for manufacturing a three-dimensional structure using a nanoimprint method, according to an embodiment of the present invention, comprises: a stamp preparation step of preparing a stamp having a processed convex-concave part; a ...  
WO/2017/178133A1
A method of determining positions of marks on a substrate, the marks comprising structures arranged periodically in at least a first direction, at least some of the structures comprising periodic sub-structures, the sub-structures having...  
WO/2017/178285A1
A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A functional relationship between local height deviations across a substrate and focus information, su...  
WO/2017/167258A1
Disclosed is a projection exposure apparatus; a focal plane measurement system (8) and an alignment measurement system (9) are arranged between a mask platform (3) and a working platform (4), the alignment measurement system (9) having a...  
WO/2017/167260A1
A coaxial mask alignment device, photolithography apparatus and alignment method. The coaxial mask alignment device comprises: illumination modules (A, B) providing alignment beams; a projection objective (8) located below a mask (5); a ...  
WO/2017/161701A1
An overlay detection apparatus for display devices, and an exposure process system. The overlay detection apparatus comprises a carrier (4) for carrying display devices, a control means (1), a detection means (2), and an analysis means (...  
WO/2017/153069A1
A level sensor senses a local height of a portion of a surface of a semiconductor substrate. The level sensor comprises an optical system that has a projection grating and a detector. In operational use when the substrate is present, the...  
WO/2017/148665A1
Disclosed is a metrology apparatus and method for measuring a structure formed on a substrate by a lithographic process. The metrology apparatus comprises an illumination system operable to provide measurement radiation comprising a plur...  
WO/2017/148322A1
Disclosed is a device and method for measuring an overlay error. A measuring light adjustment assembly for adjusting measuring light to be centrosymmetric relative to the optical axis of a microobjective (46) is added to the device, so t...  
WO/2017/140532A1
A lithographic process includes clamping (CL) a substrate (W) onto a substrate support (WT), measuring (AS) positions of marks across the clamped substrate, and applying a pattern to the clamped using the positions measured. A correction...  
WO/2017/140034A1
An overlay key, a method for forming an overlay key and a method for measuring overlay accuracy. The overlay key comprises at least two overlay markers (201, 201'; 202, 202'; 203, 203'), wherein each of the overlay markers (201, 201'; 20...  
WO/2017/130304A1
The present invention addresses the problem of, in an overlay measurement method that uses a reference image, calculating the amount of overlay without an ideal reference image. A measurement device described in a specific embodiment of ...  
WO/2017/125044A1
A light-spot distribution structure, a surface shape measurement method, and a method for calculating an exposure field-of-view control value. The light-spot distribution structure comprises multiple measurement light-spots (100) at leas...  
WO/2017/125352A1
In an alignment sensor (AS) of a lithographic apparatus (LA), position sensing radiation (222) is delivered to a target (P1). After reflection or diffraction from the target, position sensing radiation (226) is processed (228, 336, 338) ...  
WO/2017/123085A1
The present invention is in the field of a semiconductor product having lithographic defined lateral wiring, a process fo making such a product, use of said process, and a chip or a chip in package having such wiring. In semiconductor pr...  
WO/2017/114662A1
Provided is a process of selecting a measurement location, the process including: obtaining pattern data describing a pattern to be applied to substrates in a patterning process; obtaining a process characteristic measured during or foll...  
WO/2017/108336A1
A height measurement apparatus comprising an array of differential pressure sensors, each differential pressure sensor comprising a reference outlet and a measurement outlet, the reference outlet being a predetermined distance from a ref...  
WO/2017/108453A1
Performance measurement targets are used to measure performance of a lithographic process after processing a number of substrates. In a set-up phase, the method selects an alignment mark type and alignment recipe from among a plurality o...  
WO/2017/108411A1
A method, involving illuminating at least a first periodic structure (1010) of a metrology target (T) with a first radiation beam (940) having a first polarization, illuminating at least a second periodic structure (1000) of the metrolog...  
WO/2017/102428A1
A focus monitoring arrangement (1000) is provided for a scatterometer or other optical system. A first focus sensor (510) provides a first focus signal (S1-S2) indicating focus relative to a first reference distance (zl). A second focus ...  
WO/2017/106054A1
Adaptive alignment methods and systems are disclosed. An adaptive alignment system may include a scanner configured to align a wafer and an analyzer in communication with the scanner. The analyzer may be configured to: recognize at least...  
WO/2017/102237A1
Combination of a stage and a level sensor configured to sense a height level at a target location (T) on an object is described, the stage comprising an object table configured to hold the object and a positioning device for displacing t...  
WO/2017/099087A1
An exposure device (100) comprises: an irradiation device (30) that irradiates a target (W) with an electron beam; a stage (26) that retains the target; a stage drive system including an electromagnetic motor that drives the stage; and a...  
WO/2017/093256A1
Disclosed is a method of measuring positions of at least one alignment target on a substrate using an optical system. The method comprises measuring at least one sub-segmented target by illuminating said sub-segmented target with radiati...  
WO/2017/092957A1
A measurement method comprising using multiple radiation poles to illuminate a diffraction grating on a mask at a mask side of a projection system of a lithographic apparatus, coupling at least two different resulting diffraction orders ...  
WO/2017/092986A1
A method of controlling a lithographic apparatus having an exposure mode configured to expose a wafer held by a substrate table to an image of a pattern on a production reticle via a projection system, wherein in the exposure mode the pr...  
WO/2017/092936A1
A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or ...  
WO/2017/082725A1
An alignment system (100) and method for positioning and/or keeping a first object (1) at a controlled distanced (D1) with respect to a second object (2). An object stage (11) is configured to hold a surface (1a) of the first object (1) ...  
WO/2017/071925A1
A metrology system includes a radiation source that generates light, an optical modulation unit, a reflector, an interferometer, and a detector. The optical modulating unit temporally separates a first polarization mode of the light from...  
WO/2017/071382A1
A search method for searching for an alignment marker on a substrate, wherein, a first positioning line segment (31) is formed on a virtual region of a substrate, and a straight line on which the first positioning line segment is located...  

Matches 1 - 50 out of 14,894