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WO/2019/074665A1 |
Disclosed is a set screw for connecting conductors with electrical terminals. The screw includes a screw body and a screw face. The screw face fits inside the screw body and is movable along the axis of the screw body. An elastically def...
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WO/2019/074428A1 |
An adjustable antenna mounting system (1) for installation of antennas (2) on a vehicle, the system comprising at least one beam segment(10)adapted to receive at least one antenna (2) for mounting thereon, and at least two leg members (2...
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WO/2019/072445A1 |
The invention relates to a method for producing an electrically conductive connection between a conductor track (2) arranged on a substrate element (1) and an electrical conductor (3), in which the electrically conductive connection is m...
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WO/2019/073850A1 |
This fuel cell system (100) is provided with: fuel gas supply paths (3-1 to 3-N) which connect fuel gas supply units (2-1 to 2-N) and fuel cell stacks (10-1 to 10-N) with each other; and unreacted fuel gas circulation paths (5-1 to 5-N) ...
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WO/2019/072812A1 |
The invention relates to a steering column switching device (10) for arranging on a steering column of a vehicle, with a main housing (12), a bearing (14) formed in the main housing (12), a steering column switching lever (16), which is ...
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WO/2019/073701A1 |
This dual optical frequency comb generating optical system comprises: an amplification unit for emitting laser amplification light in the circumferential direction of a first optical fiber loop and in the reverse-oriented direction along...
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WO/2019/074561A1 |
This invention refers to a lamp, which contains lamp base, lamp head, lamp cover and wick rod. The lamp head is linked to Samp base and the wick rod lies between lamp base and lamp cover. The wick rod is sheathed with a shield, which is ...
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WO/2019/036081A3 |
A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposi...
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WO/2019/073411A1 |
A method for forming a semiconductor device having a heterojunction of a first III- nitride ternary alloy layer arranged on a second III-nitride ternary alloy layer is provided. A range of concentrations of III-nitride elements for the f...
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WO/2019/075241A2 |
Wideband phased mobile antenna array devices, systems, and methods include antenna elements arranged in a substantially linear array and positioned and adjusted on a substrate to achieve an aggregate radiation pattern in an end-fire dire...
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WO/2019/075075A1 |
A shape sensing apparatus for tissue and surgical procedures comprising a processing means and a tunable light source. At least one shape sensing fiber can be used with the shape sensing fiber having a plurality of individual sensing fib...
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WO/2019/072734A1 |
A power supply arrangement is provided. The power supply arrangement may include a power supply, an electrically controllable relay, a first path arranged to allow heat transfer between said power supply and the electrically controllable...
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WO/2019/072529A1 |
A positioning device configured to position an object, the positioning device comprising: - an object table configured to hold the object; - an electromagnetic motor configured to displace the object table, the electromagnetic motor comp...
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WO/2019/002457A3 |
The invention relates to a technique for manufacturing battery modules for the travel drive of electric vehicles. A joining device (35, 50) is designed to manufacture a battery module (12, 12a, 12b) from a plurality of module parts (2, 3...
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WO/2019/073099A1 |
The present invention relates to a dual-frequency antenna for transmission (Tx) and reception (Rx), which comprises a signal distribution network formed by a bed of nails that allows signals to be distributed by means of same at two freq...
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WO/2019/074774A1 |
A beamsplitter includes a substrate formed from a material transparent to wavelengths of light at least above a selected cutoff wavelength and reflective structures distributed across a surface of the substrate. The reflective structures...
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WO/2019/074278A1 |
Disclosed is an LED module assembly for a display, comprising a first LED module and a second LED module. In connection with the LED module assembly, the first LED module and the second LED module comprise a substrate comprising a first ...
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WO/2019/073687A1 |
Provided is a semiconductor wafer evaluation method comprising the steps of: acquiring a cross-sectional image of a semiconductor wafer intended for evaluation, the cross-sectional image including a boundary portion between a beveled sur...
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WO/2019/072565A1 |
Method for producing a spark plug, in particular according to claims 1 to 3, comprising the steps of: - providing an insulator, - filling the insulator with a material mixture designed to form a resistance member, wherein the material mi...
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WO/2019/073678A1 |
A display device that has: a first substrate; a display region that is on the first substrate and has provided thereto a plurality of pixels that have a light-emitting element; a drive circuit that is on the first substrate and is provid...
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WO/2019/072377A1 |
The invention relates to a magnet arrangement (1), as is used, for instance, for measuring angle of rotation and torque, comprising a plastic-bonded permanent magnet (4) with a metal support sleeve (2) connected in such a manner that the...
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WO/2019/073690A1 |
The main purpose of the present invention is to provide a boron nitride powder having excellent conductivity and high particle strength. A boron nitride powder which has the characteristic properties (A) to (C) mentioned below and contai...
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WO/2019/074857A1 |
Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposit...
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WO/2019/073801A1 |
This art relates to: a semiconductor device such that it is possible to improve the reliability of a glass substrate on which a wiring layer is formed, is able to be improved; and a method for producing this semiconductor device. The sem...
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WO/2019/075205A1 |
High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are opera...
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WO/2019/071675A1 |
Provided are a thin-film transistor and method for fabrication thereof. The method comprises: forming in sequence on a substrate (100) a gate (111), a first sub-dielectric layer (121) located on the substrate (100), a second sub-dielectr...
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WO/2019/074661A1 |
The present disclosure relates to an electrostatic chuck, including: a base having a dielectric first surface to support a substrate thereon during processing; and an electrode disposed within the base proximate the dielectric first surf...
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WO/2019/072894A1 |
The invention relates to a cooling unit (1, 10) having a heat sink (2, 20) which is formed from a first material with a first thermal conductivity, wherein the heat sink (2, 20) comprises at least one refrigerant duct, and having at leas...
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WO/2019/074198A1 |
An embodiment of the present invention relates to a secondary battery, wherein a technical problem to be solved is to provide a secondary battery which has low resistance and can output high power without loss of capacity, and can preven...
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WO/2019/075000A1 |
Provided herein are high throughput continuous or semi-continuous reactors and processes for manufacturing graphenic materials, such as graphene oxide. Such processes are suitable for manufacturing graphenic materials at rates that are u...
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WO/2019/074093A1 |
Provided is an excellent polycyclic aromatic dimeric compound which is composed of two partial structures represented by general formula (1) and a linking group L1 that binds the two partial structures to each other, and which is able to...
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WO/2019/074075A1 |
The present invention provides a binder composition for an all-solid-state secondary cell, the binder composition containing polymer particles (A) and a non-aqueous dispersion medium (B), wherein the polymer particles (A) are a graft pol...
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WO/2019/075421A2 |
According to an embodiment, an antenna includes a conductive antenna element, a voltage-bias conductor, and a polarization-compensation conductor. The conductive antenna element is configured to radiate a first signal having a first pola...
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WO/2019/071814A1 |
Provided are an array substrate and a display panel using same. The array substrate comprises: a substrate, comprising a display area and a wiring area around the periphery of same, a plurality of active switches, a plurality of pixel un...
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WO/2019/073766A1 |
This power-generating element production method comprises: a first step of providing, in a substrate having a vibrating part capable of vibrating, a supporting part for supporting the vibrating part at one end section in one direction of...
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WO/2019/074212A1 |
The present invention provides a method enabling a quantitative analysis of a polymer by MALDI mass spectrometry, and a method for manufacturing a sample for MALDI mass spectrometry for a quantitative analysis of a polymer. To that end, ...
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WO/2019/073499A1 |
On load Sectioning Assembly, comprising a Contact Group (100) comprising an electric contact blade (117) connected to a drive shaft (119); a support pole (309) resting on a ground base (350); and a Maneuvering Group (200) for operating a...
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WO/2019/075409A1 |
Methods and devices for single cell analysis using fluorescence lifetime imaging microscopy (FLIM) are disclosed. The methods utilize microfluidic devices which use traps to immobilize cells for FLIM analysis. The analysed cells may be s...
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WO/2019/075246A1 |
A sensor for measuring current flow includes a power generation circuit, a current measurement circuit and a microcontroller. The power generation circuit includes a current transformer that harvests energy from a load applied to the con...
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WO/2019/073506A1 |
This semiconductor device is provided with: a module substrate; first input wiring comprising a first portion which is provided on the top surface of the module substrate and which extends along a first side of the module substrate, and ...
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WO/2019/073797A1 |
A film formation method according to one embodiment of the present invention is executed while a substrate is in a state of having been placed on a support base. This film formation method includes: a step in which a precursor gas includ...
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WO/2019/071301A1 |
The invention relates to connector hardware for carrying electrical energy from an electrical power supply to a vehicle battery in need to charging, such as in an electrically cranked internal combustion engine of a motor vehicle. The in...
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WO/2019/071725A1 |
Provided in the invention are a top gate self-alignment metal oxide semiconductor TFT and a manufacturing method therefor. According to the manufacturing method of the top gate self-alignment metal oxide semiconductor TFT, a light shield...
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WO/2019/073223A1 |
The present invention provides a remote controllable switch which can be turned on or off manually and remotely. The remote controllable switch comprises a member configured to be positioned in a first position, wherein the remote contro...
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WO/2019/074580A1 |
A beam former module includes a package base and an interconnect structure formed within the package base. The beam former module also includes a first true time delay (TTD) module attached to the package base. The first TTD module inclu...
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WO/2019/072153A1 |
The present invention provides a bonding head device, a bonding method and a bonding machine; a first dynamic assembly and a bonding assembly are independent from each other, achieving a light weight of the whole bonding head device, inc...
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WO/2019/073152A1 |
The aim of the present invention is a method for synchronising the acquisition of a value of an analogue signal with a signal for reading a status of an electrical contact of a motor vehicle using a computer mounted on board said motor v...
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WO/2019/071742A1 |
A module based on a nano silver solder paste double-sided interconnected silicon carbide metal oxide semiconductor (MOS) device and an encapsulation method; the module consists of a power terminal (1), an upper direct bonded copper (DBC)...
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WO/2019/072662A1 |
Provided is a sleeve tool including a tubular body adapted to be fitted over a slotted round nut of a product. A protrusion is formed on an inner wall of a front end portion of the tubular body and adapted to engage with a groove formed ...
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WO/2019/075190A1 |
Antenna systems, devices, and methods for providing both end-fire mm-wave high-frequency signals and low-frequency RF signals from a collocated antenna array in which at least one high-frequency antenna element and a low-frequency antenn...
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