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Matches 401 - 450 out of 3,804,835

Document Document Title
WO/2020/103147A1
Embodiments of the present application relate to a chip heat dissipation structure, a chip structure, a circuit board and a supercomputing device. The chip heat dissipation structure comprises: a metal layer, wherein the metal layer cove...  
WO/2020/105976A1
A jig pressing-type pressing short-circuiting inspection method of the present invention comprises the steps of: pre-aging battery cells, each of which is manufactured by inserting an electrode assembly in a battery container, injecting ...  
WO/2020/103081A1
Methods for forming a three-dimensional (3D) memory device and a three-dimensional (3D) memory device are proposed. One of the methods includes the following operations. First, an initial channel hole (203) can be formed in a structure (...  
WO/2020/105181A1
A flexible substrate (1) is bent at a bend portion (2). A dielectric plate (3) has first and second main surfaces on opposite sides to each other. A high-frequency signal line (4) is disposed on the first main surface of the dielectric p...  
WO/2020/103277A1
A high-speed EML coaxial transmitting module, comprising a TO base (1), a TEC (2), a ceramic substrate (3), an EML chip (4) and a thermistor (5); a first side of the TEC (2) is arranged on the TO base (1); the ceramic substrate (3) is ar...  
WO/2020/106033A1
A method for manufacturing a cylindrical battery according to an embodiment of the present invention comprises the steps of: manufacturing an electrode assembly having a jelly-roll structure by preparing a positive electrode plate, a neg...  
WO/2020/106811A1
An illustrative example fuel cell device includes a cell stack assembly of a plurality of fuel cells that each include an anode and a cathode. A pressure plate is situated near one end of the cell stack assembly. An intermediate componen...  
WO/2020/105136A1
A reservoir element according to one aspect of the present invention is provided with: a plurality of ferromagnetic layers that are stacked in a first direction and that are separated from one another; spin orbital torque wiring that fac...  
WO/2020/103655A1
The present application relates to a semiconductor device, comprising a substrate (200), with a body region (221) being formed on the substrate (200), and a well region (222) being formed in the body region (221); and further comprising ...  
WO/2020/105602A1
In this power storage device, a binding plate (17) has a plurality of rib parts (38) and a plurality of thin wall parts (39). A plurality of first rib parts (41) are inclined with respect to the extending direction of a first edge (31a) ...  
WO/2020/104232A1
In one embodiment, the method serves for producing semiconductor lasers (1) and includes the following steps in the order indicated: A) applying a multiplicity of edge emitting laser diodes (2) on a mounting substrate (3), B) applying an...  
WO/2020/103131A1
Provided in some of the embodiments of the present application are an image sensor and a manufacturing method therefor. The image sensor comprises a substrate (400) and at least one pixel unit, the pixel unit comprising a photoelectric d...  
WO/2020/105848A1
An apparatus for applying an adhesive according to an embodiment of the present invention for solving the above problem, comprises: a side portion including a support surface for supporting one surface of an upright secondary battery; an...  
WO/2020/106053A1
Disclosed are a molding apparatus for manufacturing a semiconductor package and a semiconductor package manufactured therethrough. According to an embodiment of the present invention, since electromagnetic wave shielding efficiency of a ...  
WO/2020/103951A1
A lithium ion battery and a ceramic cover plate (100) thereof. The ceramic cover plate (100) comprises a ceramic substrate (10) penetrated along the thickness direction thereof to form a channel (11); and a metal terminal (20), at least ...  
WO/2020/105736A1
Provided are: a sulfide solid electrolyte with an average grain diameter, measured by the laser diffraction grain size distribution measurement method, of at least 3 ┬Ám and a specific surface area, measured by the BET method, of at leas...  
WO/2020/056281A9
In some aspects, a monochromatic x-ray component for producing monochromatic x-ray radiation from broadband x-ray radiation is provided. The monochromatic x-ray component comprises a housing configured to be positioned proximate a broadb...  
WO/2020/107030A1
Methods and system to provide high power and brightness display and illumination systems and methods. In embodiments multi-wavelength laser beams in the wavelength range of 300 nm to 700 nm, including high power beams in these wavelength...  
WO/2020/103082A1
A method for forming a gate structure of a 3D memory device is provided. The method comprises: forming an alternating layer stack on a substrate; forming a plurality of channel holes in the alternating layer stack, each penetrating verti...  
WO/2020/104639A1
An end effector for clamping a slab formed substrate (2) having a rim section (5) that is arranged at least approximately and at least partially in a substrate main plane comprises at least a pressing device (10) providing at least a pre...  
WO/2020/105687A1
The present invention relates to implementation of rapid and nondestructive analysis of an electrolytic solution, without subjecting the electrolytic solution to a pretreatment, and includes: a secondary light detecting step of radiating...  
WO/2020/104890A1
Provided is a semiconductor device with reduced power consumption. This semiconductor device includes a node ND1, a node ND2, resistors, capacitors, and a comparison circuit. The resistors are electrically connected in series between the...  
WO/2020/105975A1
The present invention relates to an anode active material, comprising: an active material core capable of occluding lithium ions thereto or discharging lithium ions therefrom; a conductive material positioned on the surface of the active...  
WO/2020/103327A1
A display panel (100), comprising: an array metal layer (A), used for providing wiring to transmit a display signal to a display area (101); and a touch control metal layer (B), used for providing wiring to transmit a touch control signa...  
WO/2020/105695A1
The present invention provides an active material for all-solid-state batteries with which an all-solid-state battery having excellent battery characteristics can be manufactured. The present invention also provides: an electrode for all...  
WO/2020/104881A1
Provided is a positive electrode active material for a lithium ion secondary battery having high capacity and excellent charge-discharge cycle characteristics. The positive electrode active material contains lithium, cobalt, and oxygen, ...  
WO/2020/106649A1
Provided herein are low resistance metallization stack structures for logic and memory applications and related methods of fabrication, The methods involve forming bulk conductive films on thin low resistivity transition metal layers tha...  
WO/2020/104193A1
A power electric module comprising a casing with electrical components mounted therein and having at least two electric conductors for conducting electric current at differing electrical potentials between an outside of the casing and th...  
WO/2020/105801A1
The present invention relates to a multi-demagnitizer electronic chip hopper and, particularly, to a multi-demagnitizer electronic chip hopper which causes demagnetization to occur, with respect to fine residual magnetism generated durin...  
WO/2020/106784A1
Using measurements from a metrology tool, combinations of tool settings on the metrology tool can be determined. Candidates can then be determined and a response surface model can be generated for each of the candidates. A list of the ca...  
WO/2020/106086A1
A DC power supply device according to the present invention comprises: an outlet case having a continuous plane configured to surround an electrical connection surface contacting an electric plug and a lower portion of the electrical con...  
WO/2020/102862A1
Aircraft components, e.g., wing leading edge modules, are provided with an electrical energy harvester so as to generate electrical power that can be stored by on-board batteries. In preferred forms, the aircraft component is a wing lead...  
WO/2020/102990A1
A formation method and an annealing device for an epitaxial layer and a 3D NAND memory are disclosed. The formation method of the epitaxial layer comprises: performing a first annealing to eliminate the stress generated in a stacked stru...  
WO/2020/103708A1
A copper pillar bump structure on a copper pillar on a metal pad of a semiconductor device and a method of fabricating thereof are disclosed. The copper pillar bump structure includes: a metal barrier layer formed on the copper pillar. T...  
WO/2020/103672A1
An LDMOS, comprising a semiconductor substrate (100) and a drift region (110) formed on a surface layer of the semiconductor substrate (100); a gate structure (200) is provided on the surface of the semiconductor substrate (100) and cove...  
WO/2020/106368A2
A photovoltaic device and method of manufacturing the device are described.  
WO/2020/104891A1
Provided is a semiconductor device that inspects and/or monitors each cell of a battery pack. The semiconductor device comprises a hysteresis comparator and a circuit. The circuit has a function to set a high level-side threshold voltage...  
WO/2020/033004A3
In embodiments, an apparatus includes a beamformer including a plurality of inputs and a plurality of outputs, a plurality of input vias, and a plurality of output vias. Each input of the plurality of inputs electrically couples to a res...  
WO/2020/104372A1
The invention relates to a use of a high-voltage HBC fuse for protecting a direct-current transmission, the direct-current voltage of the direct current and/or the rated voltage of the high-voltage HBC fuse (1) being greater 4 kV.  
WO/2020/103038A1
Provided by the present application is a method for detecting a defect of a thin film transistor array substrate, comprising the following steps: providing a thin film transistor array substrate to be tested, the thin film transistor arr...  
WO/2020/105920A1
The present invention provides a novel polymer and an organic light emitting diode using same.  
WO/2020/105212A1
This device for manufacturing a silicon carbide epitaxial substrate comprises: a quartz tube; an induction heating coil; a heat-generating body that is inductively heated by the induction heating coil; and a heat insulating member. The q...  
WO/2020/103801A1
An organic light emitting display device manufacturing method, comprising: S1, manufacturing on a drive substrate (100) a first electrode (110) and a pixel definition layer (120), disposed at an interval, such that the first electrode (1...  
WO/2020/105605A1
The present invention relates to an etchant capable of selectively etching copper and a copper alloy while suppressing dissolution of nickel, tin, gold, and an alloy thereof. This etchant is characterized by including: (A) 5-10.5% by mas...  
WO/2020/105981A1
The present invention relates to an electrolyte for a lithium-sulfur battery and a lithium-sulfur battery comprising same, wherein the electrolyte comprises a lithium salt, an organic solvent, and an additive. The additive includes a het...  
WO/2020/106002A1
The present invention relates to a polyamic acid composition for packaging electronic components, and a method for packaging electronic components by using same. The polyamic acid composition comprises, in a high ratio, a dianhydride mai...  
WO/2020/105893A1
The present invention pertains to: a polyamic acid composition for packaging electronic components; and a method for packaging electronic components using same. The polyamic acid composition comprises: a high proportion of a dianhydride ...  
WO/2020/103335A1
An ultra-high frequency radio frequency identification microstrip comprises a medium substrate (1); a conductor (2) formed on a surface of the medium substrate (1); and a metal ground (3) formed on another surface of the medium substrate...  
WO/2020/105393A1
According to the present invention, a first bus bar 33 is provided with: a first electrical connection part 39 which is electrically connected to a main relay 12; a first heat transferring connection part 40 which is connected to an insu...  
WO/2020/106723A1
Systems and methods of undersea optical communication are provided. An undersea optical amplifier assembly can include a water-tight housing and a photonic integrated circuit disposed within the housing. The photonic integrated circuit i...  

Matches 401 - 450 out of 3,804,835