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WO/2024/079814A1 |
This coil component comprises a core having a through-hole, and a coil part that passes through the through-hole and is wound onto the core. The coil part includes a first conductor part and a second conductor part. The first conductor p...
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WO/2024/078278A1 |
The present application discloses a magnetic integrated inductor and an inverter. The magnetic integrated inductor comprises: a first winding, a second winding, a third winding, a center column magnetic core, an upper magnetic core, a lo...
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WO/2024/075404A1 |
Provided is a chip-type electronic component that is less likely to cause separation of a spacer and a mounting substrate. A chip-type electronic component 1 of the present invention comprises a multilayered ceramic capacitor 1A and spac...
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WO/2024/076789A2 |
Wafer-bonded inductors, transformers, and related electronic components can be used in power electronics and provide low conduction loss in the MHz - GHz frequency range. The wafer bonding fabrication process and its thermal requirements...
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WO/2024/069926A1 |
This spin inductor comprises: a first inductor layer; a first terminal; and a second terminal. The first inductor layer is provided with a first wiring layer and a first ferromagnetic layer that adjoins the first wiring layer. The first ...
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WO/2024/065390A1 |
Methods and apparatus to manufacture a coupled inductor are disclosed. An example coupled inductor includes a base of a magnetic core including a first channel and a second channel extending between first and second sides of the base, th...
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WO/2024/070426A1 |
The present invention comprises: an element body 10 having a plurality of dielectric layers 11 and a plurality of internal electrode layers 12; an external electrode 20a provided above the element body 10 and connected to part of the plu...
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WO/2024/068181A1 |
The invention relates to an inductor (ID0) having at least one core (CRE), wherein the core (CRE) has an at least partially concave shape and at least partially encloses a volume of space (CVT), and the inductor has current terminals (TR...
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WO/2024/073393A1 |
Described herein are improved electromagnetic components and methods of fabricating such components that suitable for use in a wireless power transfer system (e.g., as a wireless power transfer coil). Electromagnetic components described...
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WO/2024/070406A1 |
[Problem] To reduce connection resistance between a coil part and a terminal electrode. [Solution] A coil component 100 comprises: a coil part C1 in which a coil shaft is embedded in a base body so as to lie parallel to terminal formatio...
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WO/2024/071722A1 |
Disclosed is a multilayered common mode filter exhibiting wide band characteristics as well as allowing uniform resistance and inductance in the coil patterns that form the channels. The disclosed multilayered common mode filter comprise...
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WO/2024/071719A1 |
Disclosed is a multilayered common mode filter having first and second capacitance layers arranged on the top and bottom surfaces, respectively, of an electrode layer provided with a plurality of coil patterns that form two channels. The...
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WO/2024/057897A1 |
Provided is an inductor component which makes it possible to easily perform a wire member assembly operation. An inductor component equipped with a coil which includes a plurality of wire members, wherein: a first end section of a first ...
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WO/2024/052222A1 |
The invention relates to a magnetic-field-sensitive assembly, comprising: - at least a first magnetic-field-sensitive component, a second magnetic-field-sensitive component and a coupling magnet element arranged in a housing; - wherein e...
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WO/2024/053425A1 |
This printed wiring board comprises: a base film having a main surface; and first and second wirings disposed on the main surface. The first and second wirings are each spirally wound in a plan view. The second wiring is disposed inward ...
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WO/2024/048718A1 |
This RF-ID module comprises: a board; first and second lands that are electrodes placed on the side of a first main surface of the board; an RF-ID chip one terminal of which is connected to the second land and the other terminal of which...
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WO/2024/049072A1 |
A multilayer common mode filter of the present disclosure is a filter comprising a plurality of coils configuring mutually different channels, wherein a plurality of coil patterns, and a plurality of via conductors connecting the coil pa...
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WO/2024/047926A1 |
[Problem] To enhance insulation between a conductor post, and a terminal electrode and a magnetic element body in a coil component in which a coil pattern and the conductor post are embedded in the magnetic element body. [Solution] A coi...
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WO/2024/049071A1 |
A multilayer common mode filter of the present disclosure has a filter stack configured by stacking, underneath a coil stack comprising a plurality of coils configuring mutually different channels, a stack provided with a capacitor patte...
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WO/2024/048110A1 |
Provided are: a structural body having a high Q value and a small size; and a structural body manufacturing method. The structural body comprises a planar inductor disposed on a substrate, and further comprises: a first magnetic body tha...
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WO/2024/048715A1 |
This RFID module comprises: a board that has a first main surface and a second main surface opposed to each other; an RFIC chip that is disposed on the first main surface of the board; a coil conductor that is disposed on the first main ...
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WO/2024/040517A1 |
The present disclosure provides a filter and a preparation method therefor, and an electronic device. The filter comprises a first substrate (100) and a second substrate (200) that are arranged opposite each other, and a connecting subst...
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WO/2024/041996A1 |
The invention relates to a passive electrotechnical component for attenuating common-mode interference and differential-mode interference on at least two electrical lines leading to the component, comprising two toroidal cores, wherein: ...
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WO/2024/042800A1 |
An inductor (100) comprises: a magnetic core (10); a coil (20); a first electrode (31); and a second electrode (32). The magnetic core (10) has a bottom surface (16), a top surface (17), a first lateral surface (11), a second lateral sur...
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WO/2024/043105A1 |
In the present invention, a transformer chip includes: an insulating body that is provided on a substrate; an isolation transformer; a first connection electrode and a second connection electrode; a first capacitor; a second capacitor; a...
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WO/2024/042904A1 |
This air-core coil has a toroidal core 10a of a non-magnetic material or a weakly magnetic material and a conductor wire wound around the core 10a. The core 10a is an extended toroidal core.
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WO/2024/038742A1 |
This transformer comprises an outer coil conductor wiring and an inner coil conductor wiring that are disposed in an insulator. The outer coil conductor wiring includes a first outer coil and a second outer coil. A second end of the firs...
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WO/2024/038743A1 |
This transformer includes: a substrate having a substrate upper surface and a substrate lower surface; a first insulator which is in contact with the substrate upper surface; a second insulator which is in contact with the substrate lowe...
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WO/2024/034455A1 |
Provided is an inductor component with which deterioration in performance can be suppressed, and a high inductance value can be obtained while realizing increased thinness. This inductor component comprises: an element including a magnet...
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WO/2024/034181A1 |
Provided are an inductor component manufacturing method and an inductor component product that can improve variations in product dimensions or magnetic characteristics. An inductor component manufacturing method of the present disclosure...
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WO/2024/035892A1 |
An electronic module includes a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including a resin body...
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WO/2024/034818A1 |
An electronic device comprising a coil device may be provided. Specifically, the electronic device comprises: a source for receiving electrical energy from the outside of the electronic device; a control circuit board for receiving the e...
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WO/2024/034205A1 |
[Problem] To reduce the influence of coupling between a plurality of inductors in an electronic component which has a structure in which the inductors are provided on a substrate. [Solution] An electronic component 100 comprises: a circu...
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WO/2024/034551A1 |
An electronic device (10) comprises: a common terminal (16A) provided on a dielectric substrate (24); an inductor (14) formed in the dielectric substrate; a first filter (12L) formed in the dielectric substrate; and a second filter (12H)...
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WO/2024/029834A1 |
A flat coil, according to one embodiment, may comprise: a substrate; and a conductor layer disposed on a first surface of the substrate and a second surface of the substrate. In one embodiment, the conductor layer may include multiple co...
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WO/2024/029835A1 |
The present specification relates to a planar coil. The planar coil according to an embodiment may comprise: a substrate; and a conductor layer disposed at at least one of a first surface and a second surface of the substrate and includi...
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WO/2024/029798A1 |
The present invention relates to an inductor and a method for manufacturing same and, specifically, to an inductor capable of minimizing eddy current losses and a method for manufacturing same.
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WO/2024/027002A1 |
Embodiments of the present application provide a filter assembly, an inverter, a motor driving system, and a vehicle. The filter assembly comprises a number N of alternating-current metal strips, a boost metal strip, and a magnetic ring;...
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WO/2024/024160A1 |
[Problem] To enhance freedom of design and prevent the joining of two coil patterns, in a composite electronic component having a structure in which an electronic component is embedded. [Solution] A composite electronic component 1 compr...
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WO/2024/024027A1 |
Provided is a core substrate (601) for constituting an interposer (700) on which a semiconductor element (811) is mounted, an inductor being built into the core substrate (601) . The core substrate (601) comprises a ceramic substrate (10...
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WO/2024/023999A1 |
The present invention provides a split type annular magnetic body for noise control, the annular magnetic body having been difficult to be produced with an Fe-based nanocrystalline alloy, and achieves an excellent noise reduction effect....
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WO/2024/026243A1 |
Inductor packages employing wire-bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods. The inductor package includes one or more integrated inductors each formed fro...
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WO/2024/024355A1 |
[Problem] To provide: a common mode coil that is capable of efficiently and without hindrance removing noise that is caused by a common mode electric current that flows out from a motor and a housing, suppressing variation between a plur...
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WO/2024/020351A1 |
This disclosure provides a gapless medium voltage inductor. The inductor includes a magnetic core having an aperture extending therethrough, a bobbin comprising a first plate and a second plate, a spacer disposed within the aperture of t...
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WO/2024/018727A1 |
This coil device (10) comprises: a core (20) having a first base part (21), a second base part (22), a first leg part (23) provided between the first base part (21) and the second base part (22), a second leg part (24) provided to one si...
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WO/2024/014099A1 |
A ceramic electronic component according to the present invention has a substantially rectangular parallelepiped shape laminate including internal electrode layers and dielectric layers that are alternately stacked, and a pair of externa...
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WO/2024/015697A1 |
One or more aspects include apparatuses, systems including co-spiral inductors and methods for fabricating the same. In at least one aspect, a co-spiral inductor includes a plurality of turns, each of the plurality of turns being displac...
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WO/2024/014212A1 |
An electronic component (101) according to the present invention is provided with: a substrate (1); an insulator layer (2) which expands along a surface of the substrate (1); a planar conductor (4) which is formed on the substrate (1) or...
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WO/2024/010792A1 |
Disclosed is a multiphase coupled inductor structure fabricated without using magnetic materials. The 3D structure of the multiphase inductor creates an enclosed magnetic flux path and ensures close and symmetric coupling of multiple win...
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WO/2024/009405A1 |
A gap material (40) is disposed between a first core (10) and a second core (20), and separates the first core (10) and the second core (20) from each other. An adhesive (50) is applied between the first core (10) and the second core (20...
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