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WO/2016/093153A1 |
In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent th...
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WO/2016/089539A1 |
An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be f...
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WO/2016/088460A1 |
A dual-mode choke coil (1) comprises the following: a lower core (4) that has a first through fourth columnar body (5a-5d); a first upper core (6a) and a second upper core (6b); a first coil (3a) in which two coil conductors are respecti...
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WO/2016/084658A1 |
In the present invention, an RFIC chip 16 has a first input/output terminal 16a and a second input/output terminal 16b, and is built into a multilayered substrate. A feeder circuit 18 includes coil conductors 20a to 20c, and is built int...
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WO/2016/080108A1 |
The ESD protection element of the present invention is provided with: a laminated body (80) formed by laminating a plurality of substrate layers; a cavity part (21) formed inside the laminated body (80); a ground electrode (31) exposed i...
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WO/2016/080332A1 |
The purpose of the present invention is to facilitate decrease in the resistance and improvement in the heat dissipation characteristics of a coil electrode in a coil component provided with: an insulating layer having an annular coil co...
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WO/2016/079903A1 |
This common mode noise filter has: a first coil formed on a plurality of insulating layers and configured with first and second spiral coil conductors; and a second coil formed on a plurality of insulating layers and configured with thir...
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WO/2016/080034A1 |
A signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the ...
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WO/2016/079784A1 |
[Problem] To accurately and efficiently carry out an inductance inspection of coil patterns which are respectively formed in a plurality of product regions. [Solution] Provided is a multi-part printed circuit 1A, comprising: an insulator...
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WO/2016/081318A2 |
Some novel features pertain to an integrated device package that includes a die, an electromagnetic (EM) passive device, an encapsulation layer covering the die and the EM passive device, and a redistribution portion coupling the die and...
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WO/2016/071885A1 |
The emitter is designed for creation of the contactless communication channel (mainly RFID/NFC) in the miniature build space. The emitter has oblong, at least partially ferrite core (1); the conductor (4) with at least three threads (2) ...
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WO/2016/072427A1 |
The present invention provides a laminated coil component having a magnetic section comprising a ferritic material, a non-magnetic section comprising a non-magnetic ferritic material, and a coil-shaped conductor section embedded inside t...
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WO/2016/072078A1 |
Disclosed is a common mode noise filter wherein a first coil (12) is configured from a spiral first coil conductor (16) and a spiral second coil conductor (17). A second coil (13) is configured from a spiral third coil conductor (18) and...
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WO/2016/072403A1 |
A connector module (1) equipped with: a substrate (11) formed by laminating magnetic body layers and having a first main surface and a second main surface opposing one another; a surface-mounted connector (10) mounted on mounting electro...
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WO/2016/072428A1 |
The present invention provides a laminated coil component having a magnetic section containing Fe, Zn, V and Ni and optionally containing Mn and/or Cu, and also having a coil-shaped conductor section containing copper, the laminated coil...
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WO/2016/070274A1 |
The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includ...
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WO/2016/067746A1 |
The purpose of the present invention is to provide a component in which inductors and capacitors necessary for a low-pass filter and the like can be mounted at high density, and to in turn reduce the size of an electronic control unit in...
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WO/2016/068067A1 |
Provided is a coil component capable of easily increasing the number of turns of a coil electrode wound around a coil core. A coil component 1a comprises: an insulation layer 2 in which an annular coil core 3 is embedded; and a coil elec...
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WO/2016/063762A1 |
Provided is a small coil component which has high reliability on external connection. This coil component 1a is provided with: an insulating layer 2 in which a magnetic cure 3 is buried; coil electrodes 4a, 4b that are wound around the m...
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WO/2016/059918A1 |
The purpose of the present invention is to provide an electronic component whereby a high inductance value can be obtained, said electronic component using electrical connection made by pins. An electronic component 1 is provided with a ...
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WO/2016/061289A1 |
In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the polymer matrix in an amount and of a type effective to provide a magneto-dielectric substra...
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WO/2016/052257A1 |
Provided is a magnetic core component with which it is possible to suppress leakage flux while controlling the number of dies required during molding. Also provided is a chip inductor in which the component is used. A magnetic core compo...
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WO/2016/052378A1 |
The purpose of the present invention is to provide an output noise reduction device in which an output terminal can be more reliably fixed. In a conductive bar (11) of a noise filter module (1), a bent section (15) bent upwards so as to ...
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WO/2016/052377A1 |
The purpose of the present invention is to provide an output noise reduction device in which a member moulded by way of insert moulding can be suitably protected. In a noise filter module (an output noise reduction device), a moudled par...
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WO/2016/047654A1 |
The purpose of the present invention is to improve inductor coil characteristics, and reduce variation in said inductor coil characteristics, in an inductor component in which an inductor is provided in a resin layer. This inductor compo...
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WO/2016/047316A1 |
The purpose of the present invention is to achieve a reduction in size and an improvement in inductor characteristics, in a high-frequency component provided with an inductor and an electronic component. This high-frequency component (1a...
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WO/2016/047653A1 |
The purpose of the present invention is to improve reliability, and reduce variation in the characteristics of an inductor electrode, in an inductor component in which the inductor electrode is integrated into a resin layer. This inducto...
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WO/2016/043306A1 |
Provided is a technique with which it is possible to reduce resistance in an inductor electrode. A second conductor 6 is formed from a underlayer 11 formed using an electroconductive paste, and a plating layer 12 formed by covering the u...
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WO/2016/041766A1 |
The invention relates to an inductive component having a high electrical quality and a good resistance to heat. According to the invention, a component, in particular an inductive component, is produced from a ceramic green body (10). Th...
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WO/2016/043310A1 |
Provided is an inductor with which it is possible to form an efficient magnetic circuit for a magnetic flux generated on the inside part of a winding wire, and to suppress the generation of noise due to leakage of the magnetic flux to th...
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WO/2016/040518A1 |
A package substrate (or printed circuit board) that includes at least one dielectric layer, a first inductor structure is at least partially located in the dielectric layer, a third interconnect, and a second inductor structure. The firs...
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WO/2016/037597A1 |
The invention relates to a sensor element (10) of an inductive proximity sensor or distance sensor (12), said element containing a coil arrangement (26) with at least one excitation coil (T, C) and at least one receiving coil (R+, R-) an...
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WO/2016/039518A1 |
Provided in the present invention are a power inductor and a method for manufacturing same, the power inductor comprising: a body; a substrate provided inside the body; a coil formed on top of the substrate; first external electrodes whi...
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WO/2016/039516A1 |
Provided in the present invention is a power inductor comprising: a body; at least two substrates provided inside the body; a plurality of coil patterns, which are provided on at least one surface of each of the at least two substrates; ...
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WO/2016/037776A1 |
The invention relates to a magnetic core for an inductive component, said magnetic core being produced using thin-film technology and being made of at least two different magnetic materials.
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WO/2016/039517A1 |
The present invention provides a power inductor comprising: a body; at least two substrates provided inside the body; a plurality of coil patterns, which are provided on at least one surface of each of the at least two substrates; and co...
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WO/2016/039414A1 |
The purpose of the present invention is to provide an output-noise reduction device that can prevent noise from an electronic apparatus that is housed in a metal casing from being transmitted by electromagnetic coupling. A conductive bar...
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WO/2016/038759A1 |
A wireless electronic device includes a multi-layer flexible printed circuit board with two or more openings. A ferrite extends through the two or more openings such that a portion of the ferrite is on a top surface of the multi-layer fl...
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WO/2016/036854A1 |
Precision fabrication of 3D objects is used for fabricating passive electrical components. A 3D scaffold is fabricated and then electrically conductive and/or insulating layers are deposited on the scaffold to form the electrical component.
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WO/2016/037025A1 |
According to some aspects, a laminate panel is provided. The laminate panel comprises at least one laminate layer including at least one non-conductive layer and at least one conductive layer patterned to form at least a portion of a B0 ...
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WO/2016/036758A1 |
An inductor coil (42) includes a wire (28) which is wound in alternating layers such that the surface area of the wire in each winding viewed from above or below the coil is substantially equal in each half of the coil defined by a line ...
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WO/2016/035482A1 |
Provided is a ceramic electronic component which is suppressed in precipitation of a glass component on an outer electrode surface, and which is suppressed in the occurrence of formation failure of a plating layer. A ceramic electronic c...
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WO/2016/035818A1 |
A magnetic structure (2) is provided with: a first magnetic layer (101); first slits (SL1) that divide the first magnetic layer (101) into a plurality of parts; a first insulating layer (12) that is disposed on the first slits (SL1) and ...
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WO/2016/031999A1 |
Multilayer bodies formed from ferrite easily assume magnetic saturation when a high current is inputted. Moreover, inductor damage is severe, and the characteristics degrade. When a multilayer body is formed of a metallic magnetic materi...
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WO/2016/026476A1 |
The invention relates to a front end for an inductive proximity sensor, comprising a coil for detecting an approaching metal object and comprising a circuit board (105), wherein the coil is designed as a circuit board coil disposed in th...
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WO/2016/026642A1 |
The present invention relates to an arrangement comprising a housing (2) and at least one busbar (4) for connecting a printed circuit board, which is arranged in the housing (2), to a power supply which is present outside the housing (2)...
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WO/2016/022124A1 |
Described is an apparatus which comprises: a substrate; a plurality of holes formed as vias (e.g., through-silicon-vias (TSVs)) in the substrate; and a metal loop formed in a metal layer positioned above the plurality of holes such that ...
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WO/2016/021818A1 |
The present invention suggests a power inductor comprising: a body; at least one substrate provided on the inside of the body; at least one coil pattern provided on at least one surface of the substrate; and an insulating layer formed be...
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WO/2016/021807A1 |
The present invention suggests a power inductor in which copper foil is bonded on both surfaces of a metal plate, the power inductor comprising: a body; a substrate provided on the inside of the body; and a coil pattern provided on at le...
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WO/2016/021938A1 |
The present invention suggests a power inductor comprising: a body; at least one substrate provided on the inside of the body; at least one coil pattern provided on at least one surface of the substrate; and an insulating layer formed be...
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