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WO/2014/022099A1 |
This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace ove...
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WO/2014/015431A1 |
An air core, dry type, power reactor (10) of the type having multiple concentrically positioned winding layers (12) extending along a central axis and above arms (24) of a first spider unit (16) when the reactor is horizontally positione...
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WO/2014/013896A1 |
This manufacturing method includes: a laminate block fabrication process wherein a laminate block, that is, a collective body of multiple laminates, is fabricated by alternately layering a magnetic body layer, which has a magnetic metal ...
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WO/2013/187777A2 |
A magnetically permeable core for use in wireless power transfer systems. The core includes a base with first and second portions that extend away from the base. The first portion extends further from the base than the second portion in ...
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WO/2013/183452A1 |
The present invention provides an electronic component that makes it possible to minimize the incidence of a laminated article being improperly filled with an insulating material. In an electronic component (10), a laminated article (12)...
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WO/2013/183183A1 |
Provided are a compressed powder molded inductor member production device capable of being more compact, a production method for a compressed powder molded inductor member, and the compressed powder molded inductor member. The compressed...
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WO/2013/183107A1 |
Provided are a compressed powder molded inductor member production device capable of being more compact, a production method for a compressed powder molded inductor member, and a compressed powder molded inductor member The compressed ...
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WO/2013/175655A1 |
Provided are: a laminated inductor element whereby parasitic inductance is reduced, while eliminating an increase of an element-mounting area and complication of a wiring pattern; and a method for manufacturing the laminated inductor ele...
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WO/2013/171923A1 |
In the present invention, a laminate body (12) results from laminating: non-magnetic body sheets (SH1a, SH1b) each having an upper surface to which a plurality of linear conductors (16, 16,…) have been formed; a magnetic body sheet (SH...
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WO/2013/168919A1 |
An apparatus and a method for wirelessly receiving power, and an apparatus and a method for wirelessly transmitting power, are provided. A wireless power receiver includes a receiving unit configured to wirelessly receive a power, and a ...
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WO/2013/168558A1 |
A stack (12) is obtained by stacking non-magnetic body sheets (SH1a-SH2b) and magnetic body sheets (SH2a-SH2c). A coil conductor (14) is provided to the stack (12) so that a part of the magnetic body forms a magnetic core and the winding...
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WO/2013/166619A1 |
A laminated inductor having a high self-resonant frequency and a high quality factor. A laminated body is a structure of at least two types of insulator sheets which are laminated into a whole body, one type is a first type of insulator ...
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WO/2013/166016A1 |
This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spa...
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WO/2013/164952A1 |
Provided is an electronic component that can reduce the effects of external electrodes on element characteristics and that has a high degree of design freedom for impedance. A laminate (12) is obtained by laminating a plurality of insula...
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WO/2013/164929A1 |
Provided is a laminated high frequency module wherein a Q value of a built-in inductor is not deteriorated even the high frequency module is reduced in size. A plurality of layers constituting the intermediate layer of a laminated body (...
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WO/2013/165699A1 |
This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a seco...
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WO/2013/157161A1 |
Provided is an inductor array chip that is not prone to structural defects during firing, and is easily manufactured in a stable manner. The inductance array chip (40) is provided with a magnetic layered laminate (41), and a plurality of...
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WO/2013/156397A1 |
The invention relates to a soft magnetic core in which the permeabilities that occur differ in at least two different positions of the core.
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WO/2013/152981A1 |
The invention relates to a common mode inductor device (10). The inductor device is comprising a magnetic core (11) forming a continuous loop, a first winding (21) wound around the magnetic core (11) and a second winding (22) wound aroun...
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WO/2013/150784A1 |
Provided is a coil unit with which the proximity effect between lines is suppressed and resistance loss is inhibited, with which magnetic flux directivity is improved and coil inductance is increased, and with which coil Q value is incre...
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WO/2013/150103A1 |
The invention relates to a damping element (1) for damping common-mode electromagnetic interference, made from a core (2) having a passage (3), via which the core (2) can be applied to a module of a control device (20), and having a magn...
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WO/2013/151065A1 |
[Problem] To provide: an inductor capable of maintaining a greater inductance value (Q factor; sharpness of resonance) than according to conventional inductors, and obtain a greater inductance value (L) (Q factor; sharpness of resonance)...
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WO/2013/149995A1 |
An inductor layout (200, 300, 400) comprising a first inductor (210, 310, 410) and a second inductor (220, 320, 420). The first and second inductors (210, 310, 410; 220, 320, 420) are electrically and magnetically independent inductors c...
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WO/2013/147786A1 |
Semiconductor die packaged with air core inductors (ACIs) and magnetic core inductors (MCIs), or with multiple MCIs, are described. In a first example, a semiconductor package includes a semiconductor die, one or more air core inductors ...
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WO/2013/146568A1 |
Provided is a highly reliable electronic component having no peeling or cracking of any of the insulating layers and comprising a helical coil having excellent coil characteristics. In comparison to conventional configurations in which c...
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WO/2013/136936A1 |
In the present invention, the electrodes of input/output terminals (P1-P4) are formed at the bottom surface of a bottommost layer (0). First linear conductors (L1a-L1n) and second linear conductors (L2a-L2n) are formed at substrate layer...
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WO/2013/128702A1 |
Provided is a laminated inductor having excellent properties. A laminated inductor (100) is provided with a laminate body comprising laminated magnetic-body layers (101-108). The magnetic-body layers (102-107) have loop-shaped conductive...
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WO/2013/126308A1 |
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a ...
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WO/2013/125169A1 |
Provided is a choke coil capable of applying an optimal magnetic bias even for increased amounts of current and capable of achieving a reduction in size and weight and a lower cost. This choke coil is provided with a coil (6) and a core ...
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WO/2013/117393A1 |
The invention relates to an electronic component in the form of a multi-layered induction component or a chip bead having a rectangular-shaped body that has two long and two short side faces which are opposite each other. The two long si...
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WO/2013/115064A1 |
Provided are: a ferritic magnetic body material that has a high Q in a high-frequency band, and can be favorably used for example as an inductor-core-configuring material used in a VHF-H band or the like; and a wound coil component provi...
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WO/2013/110726A1 |
The invention relates to a band attenuation/elimination filter for the electromagnetic emissions of a DC motor with brushes, comprising at least a first capacitive electrical impedance element (C1) and a second capacitive electrical impe...
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WO/2013/108651A1 |
Provided is an interrupt device for RF signal with a novel configuration which has a function capable of reliably cutting off an RF signal in the prescribed frequency range after an RF signal having an RF power value greater than or equa...
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WO/2013/108862A1 |
Provided is a coil component having a high inductance value and increased coil-pattern connection reliability, and also able to ensure high common-mode attenuation when constituting a common mode choke coil. This coil component is provid...
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WO/2013/104757A1 |
The invention relates to an inductive energy transfer device having at least one primary coil (P1) which generates a magnetic alternating field parallel to a longitudinally extending holding apparatus (5). At least one secondary coil (S1...
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WO/2013/105397A1 |
Provided is a technology that enables an impact of a radiated noise from an RFIC, which is an electronic component for handling a high-frequency signal, on other electronic component to be reduced, and a module to be made smaller. Becaus...
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WO/2013/103044A1 |
Provided is an electronic component having a structure in which the positional relationship between an external electrode and a coil is unlikely to be displaced from a predetermined positional relationship and in which arbitrary electric...
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WO/2013/101131A1 |
A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on...
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WO/2013/099297A1 |
The purpose of the present invention is to provide a laminate inductor which uses a soft magnetic alloy as the magnetic material, has a high magnetic permeability, and which is highly reliable and has reduced conduction failures. This la...
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WO/2013/101294A1 |
A toroidal magnet includes a toroidal surface geometry to define placement of windings for an electromagnet, and an interior space of the toroidal surface adapted to pass a beam of ions on a specified curved path defined by the toroidal ...
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WO/2013/101102A1 |
Techniques are disclosed for enhancing performance of integrated or on-chip inductors by implementing a schema of conductive metal dummies in the design thereof. In some cases, a metal dummy schema may be disposed in a layer proximate an...
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WO/2013/099540A1 |
First annular conductors (L1a, L1b, L1c, L1d) are helically formed from the bottom layer to the top layer, and first annular conductors (L1e, L1f, L1g, L1h) are helically formed from the top layer to the bottom layer. In addition, second...
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WO/2013/095326A1 |
Multi-pair differential lines printed circuit board common mode filters are generally described. In one embodiment, the apparatus includes a multi-layer printed circuit board, a first signal line and a second signal line forming a first ...
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WO/2013/073408A1 |
An inductor is provided with a magnetic core and a coil. The magnetic core has a winding having a wound coil, and a peripheral part. The magnetic core is formed from two or more preforms pressure molded with the coil having been wound ar...
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WO/2013/073314A1 |
To improve the degrees of freedom in the set-up of the antenna coil and to enable forming a hot spot at the desired location, an antenna device (4a) is provided with a main coil antenna (15) and a sub-coil antenna (16) connected to the m...
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WO/2013/074298A1 |
A spiral inductor (300) is formed on a semiconductor substrate (102). One or more insulating layers (104, 303) are disposed on a first surface of the semiconductor substrate. A spiral structure (106) is formed of a first conductive mater...
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WO/2013/070371A1 |
A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrifici...
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WO/2013/064516A1 |
The invention essentially relates to an EMC filtering device (1), characterized in that said filtering device comprises a printed circuit (5) comprising at least two parallel layers (25, 26) of a high-permittivity material, which are pos...
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WO/2013/065716A1 |
The purpose of the present invention is, in a common mode choke coil, to reduce loss in normal mode signals and enhance the ability to remove common mode noise in the high-frequency bands. A common mode choke coil is provided with a prim...
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WO/2013/058144A1 |
Provided is a built-in coil-type composite electronic component that can be provided at a low price and the insulation reliability of which can be effectively improved, and that has an electrostatic protection function. A composite elect...
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