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WO/2017/169737A1 |
A coil component of the present invention has: an annular core; a coil wound around the core; and electrode terminals for mounting, said electrode terminals being connected to the coil and including mounting surfaces, respectively. The c...
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WO/2017/169044A1 |
This coil component comprises: terminals for external connections that are connected to a plurality of secondary-side windings; and a consolidation member that consolidates the plurality of windings near the ends thereof.
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WO/2017/170492A1 |
Provided is an inductor adhesive with which it is possible to increase humidity resistance and to suppress reduction in adhesion even when exposed to high humidity. An inductor adhesive according to the present invention includes a therm...
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WO/2017/169621A1 |
A common mode choke coil comprises a ring-shaped core, and a first coil and a second coil which are wound on the core so as to oppose each other. The core has a square shape or a rectangular shape having a major axis and a minor axis, as...
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WO/2017/159282A1 |
This ESD protection device (101D) is provided with: a first terminal (T1) and a second terminal (T2) which constitute first balanced ports; a third terminal (T3) and a fourth terminal (T4) which constitute second balanced ports; and a gr...
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WO/2017/159390A1 |
[Problem] To provide an inductor carrier with which noise can be suppressed. [Solution] An inductor carrier 1 is provided with: a plate shaped main body part 3; a core latching part 5 standing on a first surface 27 of the main body part ...
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WO/2017/159599A1 |
Provided is a magnetic element in which, despite being of a hybrid type combining a central core having a higher relative permeability than an outer peripheral core, magnetic saturation of the outer peripheral core having lower relative ...
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WO/2017/160032A1 |
The present invention presents a coil pattern and a formation method therefor, and a chip element having the same, and the coil pattern formed on at least one surface of a substrate comprises: a first plating film formed on the substrate...
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WO/2017/160564A3 |
In an electronic device that employs high-speed differential signaling on one or more pairs of conductors (510, 610) in a flexible printed circuit (215), RF chokes are placed in the differential signal path (120, 125) and mounted directl...
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WO/2017/160564A2 |
In an electronic device that employs high-speed differential signaling on one or more pairs of conductors in a flexible printed circuit, RF chokes are placed in the differential signal path and mounted directly on the flexible printed ci...
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WO/2017/159391A1 |
[Problem] To provide a method for manufacturing an inductor carrier that can suppress pins being falling off from a main body part. [Solution] Provided is a method for manufacturing an inductor carrier 1 provided with a plate shaped main...
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WO/2017/159284A1 |
In this multilayer substrate, a plurality of coil conductors consists of three or more coil conductors that are obtained through a pattern formation performed independently on different surfaces among a first principal surface (11) of a ...
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WO/2017/159437A1 |
A circuit board (10) is provided with a laminate body (100) comprising a plurality of insulated substrates (101 to 108), a first auxiliary insulated substrate (111), and a second auxiliary insulated substrate (112). A plurality of coil c...
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WO/2017/150611A1 |
This module component (1) is provided with: a ceramic multiplayer substrate (11) which has a coil (31) incorporated therein and which has a first terminal electrode (142) and a second terminal electrode (143) that are connected to one ma...
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WO/2017/149649A1 |
An electronic circuit board 1 of the present invention is provided with: a plurality of conductive lines 2a that are covered with insulating films, respectively; a core 3 having a magnetic body; a coil section 2 wherein the conductive li...
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WO/2017/141481A1 |
Provided is a compact inductor component having excellent characteristics. This inductor component 1a comprises a resin layer 3, and an inductor electrode 6 having an inner winding portion 6a and an outer winding portion 6b. The inner wi...
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WO/2017/141505A1 |
To suppress lowering of inductance of an inductor in a plurality of semiconductor chips laminated to each other. A semiconductor device of the present invention is provided with first and second semiconductor chips laminated to each othe...
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WO/2017/141681A1 |
A voltage detection apparatus (1) is provided with: a primary coil (10) that is configured by connecting a first coil (11) and a second coil (12) in series; and a secondary coil (20) that is magnetic-field coupled to the primary coil (10...
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WO/2017/141838A1 |
Provided is a coil part that has an annular core 30, and a first coil 40A and second coil 40B wound about the core 30. The first coil 40A and second coil 40B comprise a plurality of first wire members 41 and a plurality of second wire me...
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WO/2017/138241A1 |
Provided is a laminated transformer in which the primary coil and the secondary coil are strongly coupled. The laminated transformer (1) includes magnetic material layers (15-1, 15-2) and a coil layer (10). The coil layer (10) is laminat...
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WO/2017/135057A1 |
A coil component having: an element body comprising a composite material of a metal powder and a resin material; a coil conductor provided in the element body, an end part of the coil conductor being exposed from an end surface of the el...
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WO/2017/135058A1 |
An electronic component has an element assembly comprising a composite material of a resin material and a metal powder. On an outer surface of the element assembly, a plurality of particles of the metal powder are exposed from the resin ...
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WO/2017/135034A1 |
In this multilayered resin substrate, which is formed by laminating a plurality of resin layers (2) that have a thermoplastic resin as the main material: at least one of the resin layers (2) is included in the multilayered resin substrat...
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WO/2017/134993A1 |
The surface mount type coil component according to a first aspect is provided with: an element body which has a first surface, a second surface opposed to the first surface, and a third surface connecting the first surface to the second ...
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WO/2017/131017A1 |
The purpose of the present invention is to improve the characteristics of an inductor component by decreasing the resistance of an inductor electrode. An inductor component 1a is provided with a resin layer 3 and an inductor electrode 6,...
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WO/2017/130462A1 |
The present invention improves the characteristics of an inductor component by lowering the resistance of an inductor electrode. An inductor component 1a comprises a resin layer 3 and an inductor electrode 6, wherein the inductor electro...
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WO/2017/130719A1 |
Provided is a surface-mount-type coil component capable of improving handleability. Provided are: an element body, which is a molded body containing magnetic substance particles; a coil embedded in all of the element body but the end par...
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WO/2017/131011A1 |
The present invention improves the characteristics of an inductor component by lowering the resistance of an inductor electrode. An inductor component 1a comprises a resin layer 3 and an inductor electrode 6, wherein the inductor electro...
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WO/2017/130720A1 |
Provided are a coil component manufacturing method by which a plurality of coil components can be manufactured in a shorter time, and a coil component. The coil component manufacturing method according to the present invention comprises:...
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WO/2017/122416A1 |
A semiconductor device provided with an electromagnetic shield, wherein electromagnetic noise is decreased while a decrease in inductance is limited. The semiconductor device is provided with a substrate, an inductor, and a shield with u...
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WO/2017/124103A1 |
In some embodiments, the instant invention provides a drive filter that includes: a plurality of input contacts configured for receiving an initial three-phase alternative current from a three-phase alternative current power source; a pl...
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WO/2017/119423A1 |
Provided is an inductor component wherein, using a metal plate for wiring, an inductor electrode is constituted from the metal plate and metal pins, thereby lowering the resistance, facilitating joining between the metal plate and the me...
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WO/2017/119938A1 |
A skewed, co-spiral inductor structure includes a first trace (410) arranged in a first spiral pattern that is supported by a substrate. The skewed, co-spiral inductor structure also includes a second trace (420) arranged in a second spi...
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WO/2017/119787A1 |
An Fe-based soft magnetic alloy is provided. According to one embodiment of the present invention, the Fe-based soft magnetic alloy is represented by empirical formula FeaBbCcCud, and in the empirical formula, a, b, c and d are at% (atom...
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WO/2017/119215A1 |
A composite antenna (101) is provided with: a first coil antenna (L1) having a first coil conductor (10); and a second coil antenna (L2) having a second coil conductor (20) and a second loop-shaped adjustment conductor (21). The first co...
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WO/2017/115603A1 |
A surface mount inductor according to the present disclosure comprises: a resin molded body which contains a metal magnetic powder and has a quadrangular shape in a top view, and which has incision parts that are formed in at least two c...
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WO/2017/110460A1 |
Provided is a low-height inductor measuring 0.5 mm or less in thickness, in which there is minimal hindrance of magnetic field formation by surface electrodes. The present invention is provided with a rectangular thin-plate element assem...
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WO/2017/111910A1 |
Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed o...
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WO/2017/110952A1 |
A first coil element (10) comprises a first coil pattern (11) and a second coil pattern (12); and a second coil element (20) comprises a third coil pattern (13) and a fourth coil pattern (14). The first coil pattern (11) and the third co...
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WO/2017/107038A1 |
A surface mount power inductor component for a circuit board including multi-phase power supply circuitry includes a single piece, integrally fabricated magnetic core piece formed with vertically extending interior passageways provided w...
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WO/2017/107039A1 |
A surface mount, power inductor component assembly (100) includes only two different shapes of modular core pieces (120, 122) and a set of windings (104, 106) having the same shape that can be assembled and arranged to have any desired n...
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WO/2017/108218A1 |
The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then...
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WO/2017/104309A1 |
A laminated coil (10) laminate (20) comprises a first section (201) and a second section (202), in the lamination direction, from a first surface (11) towards a second surface (12). The number of turns of coil conductor patterns (31, 32,...
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WO/2017/104561A1 |
Provided is a coil assembly to be mounted on a circuit board, the coil assembly comprising: a coil that includes a winding part that is made of a rectangular wire and is formed by winding the rectangular wire edgewise, an extending porti...
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WO/2017/103075A1 |
The invention relates to an inductance core comprising: a magnetic body (400) comprising an exposed surface (406) and forming a median magnetic path (401a, 401b); and a heat sink (410) comprised in the magnetic body (400). The heat sink ...
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WO/2017/105789A1 |
Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectri...
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WO/2017/105661A1 |
Apparatus and methods are provided for a wire based inductor component. In an example, an inductor apparatus can include a wire and a plurality of individual layers of magnetic material surrounding the wire.
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WO/2017/098896A1 |
The purpose of the present invention is to provide a common mode choke coil and an electronic device, wherein a plurality of attenuation poles can be formed and transmission loss can be reduced. A common mode choke coil according to the ...
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WO/2017/099578A1 |
Balun circuit which is configured in an on-chip design, and multi-port antenna switch circuit comprising such a balun circuit. The balun circuit has a transceiver loop (3), as well as a first antenna loop (1) and at least one further ant...
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WO/2017/094367A1 |
A power transmission coil device is provided with: a first spiral coil which includes a first lead wire spiraling around an axis; and a second spiral coil which includes a second lead wire spiraling around the axis, wherein the first spi...
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