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WO/2001/084566A1 |
A magnetic ferrite powder which comprises a hexagonal ferrite whose Z phase (M¿3?Me¿2?Fe¿24?O¿41?, wherein M is one or more alkaline earth metals and Me is one or more of cobalt, nickel, manganese, zinc, magnesium, and copper) in X-r...
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WO/2001/082317A1 |
A method, apparatus, and article of manufacture for a multi-layer transformer (132) includes a plurality of layers (168-174) having a magnetic core area (114) disposed on each of the layers forming a magnetic core of the transformer havi...
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WO/2001/067470A1 |
A noise filter comprises a magnetic member (32) formed of a laminated magnetic sheets (24, 28, 30, 31), a first impedance element (21) formed in the magnetic body (32), and a second impedance element (25) formed above the first impedance...
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WO/2001/063669A1 |
Disclosed is a microwave element which comprises a silicon substrate, a porous silicon dioxide column formed on the silicon substrate, a silicon column supported by the silicon substrate and having a height identical with that of the por...
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WO/2001/056044A1 |
The invention provides an electronic part and an electronic device in order to realize their compact size without any shield electrode. The inventive part and device comprise two low-pass filters LPF1, LPF2 and one high-pass filter HPF u...
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WO/2001/054148A1 |
The invention relates to a coil (20) and a coil system to be integrated in a microelectronic circuit (10) and to a corresponding microelectronic circuit (10). According to the invention, the coil (20) is placed inside an oxide layer (13)...
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WO/2001/046971A1 |
An inductor (200) and transformer (402) comprise a plurality of interleaved conductive layers (202) and insulation layers fabricated on a monolithic semiconductor integrated circuit die. The conductive layers are shaped into coil turns o...
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WO2000042659A9 |
An integrated circuit ESD protection system comprises: a local power supply bus, a local ground bus, a first local ESD clamp, and ESD ground bus disposed between local power supply and ground busses and coupled to the local power supply ...
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WO/2001/045118A1 |
Disclosed are a gapped magnetic core which may be coated or uncoated with an insulating layer or housed in an insulting box (1) having a physical gap (10) whose dimension is close to that of the gapped magnetic core and automated or semi...
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WO/2001/037045A1 |
The invention relates to a flat coil and to a lithographic method for producing microcomponents with metal component structures in the sub-millimeter range. According to the inventive method, a resist material is structured by means of s...
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WO/2001/022443A1 |
A multilayer inductor (1) for high frequency use and adapted to microminiaturization is provided. Electrically insulating layers and conductive patterns are alternately stacked. The edges of the conductive patterns are connected in serie...
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WO/2001/022446A1 |
An inductor configuration (50) comprising a three-legged inductor core (20) with a first leg (22), second leg (24), and third leg (26) integrally extending from a base (28). The first leg (22) and second leg (24) are predisposed and spac...
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WO/2001/020622A1 |
A transformer for low frequency applications of from 50Hz to 1000Hz is described. The transformer comprises a core having a cylindrical symmetry around a main revolution axis. The core is formed of a soft isotropic magnetic composite mat...
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WO/2001/017823A1 |
The invention relates to a device for triggering an airbag comprising a control device, a triggering means for triggering the airbag and comprising electric lines that connect the control device to the triggering means, whereby a coil fo...
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WO/2001/013384A1 |
An inductor element having good characteristics is formed on a substrate. An inductor element (100) includes two spiral conductors (120, 122) formed on the surface of a semiconductor substrate (110). The upper conductor (120) and the low...
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WO/2001/008290A1 |
An LC oscillator capable of oscillating even if it is fabricated on a substrate comprises a transistor, capacitor, and an inductor element (30). The inductor element (30) has two spiral conductors (120, 122) having almost the same shape ...
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WO/2001/006818A1 |
Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated into electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substr...
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WO/2001/004918A1 |
An inductor element capable of functioning properly on a substrate is provided. An inductor element (100) includes two spiral conductors (120, 122) formed on the surface of a semiconductor substrate (110). The upper conductor (120) and t...
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WO/2001/004956A1 |
The invention relates to a semiconductor device (100) with a semiconductor body (10) comprising at least one semiconductor element (H) with an active area (A) and a coil (20) coupled to said element (H). The coil (20) and a further coil ...
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WO/2000/076938A1 |
A maltilayered LC multiple component being composed of a glass ceramics composition, which is excellent in packaging reliability especially in relation to a resin substrate and in electric properties at a high frequency and can be produc...
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WO/2000/074142A1 |
Spiral inductors (111-113) are provided on multiple internal layers (102-104) of a printed circuit (PC) board and configured to form a filter. An external end (131-133) of each of the spiral inductors can be coupled by a via (141-143) to...
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WO/2000/074233A1 |
An IF VGA utilizes distorsion cancellation achieved with cross coupled differential pair amplifiers having their VDs dynamically modified in conjunction with current steering of the differential pairs sources.
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WO/2000/072446A1 |
An integrated VCO (4532) having an improved tuning range over process and temperature variations. There is therefore provided in a present embodiment of the invention an integrated VCO. The VCO comprises, a substrate, a VCO tuning contro...
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WO/2000/070629A1 |
An inductor element (10) effectively functions even when formed on a substrate and comprises two upper and lower conductors (1, 2) spirally formed on the front side of a semiconductor substrate (3). The conductors (1, 2) have almost the ...
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WO/2000/065655A1 |
A semiconductor device (1) with an operating frequency above 50 MHz comprises a body (2) composed of a soft ferrite material, which body (2) has a surface (3) to which a semiconductor element (4), a pattern of conductors (5, 6) and a pas...
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WO/2000/062420A1 |
The RF transformer (17) of the present invention couples a transmission line (23) between a magnetic transformer (19) and a balun (25). The location and function of the transmission line improves frequency response across a wide operatio...
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WO/2000/062419A2 |
An integrated receiver with channel selection and image rejection is substantially implemented on a single CMOS integrated circuit. A receiver front end provides programable attenuation and a programable gain low noise amplifier. LC filt...
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WO/2000/062314A1 |
A photosensitive material is applied to an insulating material (13) deposited on a substrate (1) (Figure 16A). The photosensitive material is exposed to light using a mask having an annular light-shielding film so devised that the amount...
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WO/2000/060619A1 |
A multi-layer transformer includes a plurality of tapes having a magnetic core area disposed on at least one of the layers forming a magnetic core of the transformer. A primary winding is disposed on at least one of the layers. A seconda...
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WO/2000/057437A1 |
A balanced inductor formed on lossy substrate material having adjacent strips leading current in opposite directions and being arranged in such a way that substrate currents relating to individual strips (1) induced in the lossy substrat...
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WO/2000/057547A1 |
The invention relates to an arrangement of two cascaded transformers, i.e. an impedance transformer (24) and a balance-unbalance transformer, also referred to as balun transformer (26). A relatively simple, inexpensive, small and efficie...
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WO2000026027A9 |
Disclosed is a method of producing gapped ferrite toroids without the necessity of machining. This allows for the highly efficient production of tightly controlled energy storage magnetic components and stable inductors. Composite toroid...
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WO/2000/055873A1 |
A high current, low profile inductor includes a conductor coil surrounded by magnetic material to form an inductor body. The inductor coil is formed from a flat plate which is cut into a sine-shaped configuration and then is folded in ac...
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WO2000021101A9 |
Large value embedded inductors are made by screen printing an inductor coil (16) onto one or more ferrite tapes (14, 18), and covering the ferrite tapes with one or more ferrite tape layer or layers (14, 18). Low firing temperature green...
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WO/2000/051146A1 |
A toroidal tape core is produced from magnetic sheets (1) which may have slits (4). In order to improve the behavior of the toroidal cores (3) at high frequencies, the magnetic sheets (1) have a high surface roughness. The surface roughn...
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WO/2000/048772A2 |
This invention relates to a transformer and more particularly, to a system and method for making a transformer utilizing dynamic magnetic compaction. A coil is placed in a conductive container, and a conductive powder material, such as f...
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WO/2000/045399A1 |
An integrated circuit inductor comprises a spiral pattern disposed upon a substrate. The track of the spiral designed is divided into multiple tracks to form a multi-track-inductor. The individual tracks are disposed side by side and in ...
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WO/2000/044008A2 |
The method for producing inductive-type components, especially components of inductance coils, transformers or antennae, consists in micro-machining a plurality of first parts(1) that are joined to each other by connecting elements (2) o...
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WO/2000/041446A1 |
A method for fabricating circuit board conductors (24A & 24B) generally entails forming a metal layer (24) on a positive-acting photodielectric layer (22), and etching the metal layer to form at least two conductor traces (24A & 24B) tha...
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WO/2000/039853A1 |
The invention relates to a vertically integrated semiconductor arrangement with a first semiconductor chip and at least a second semiconductor chip which are arranged on top of each other. At least one semiconductor chip is provided with...
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WO/2000/031759A1 |
The present invention relates to an inductive component comprising a planar conductive structure as well as to a method for producing such a component. The inductive component includes a substrate (10) and at least one planar conductive ...
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WO/2000/031760A1 |
The present invention relates to an inductive component having a planar conductive structure (20) as well as to a method for producing said component. The inductive component comprises a substrate (10) made of ferrite and at least one pl...
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WO/2000/031778A1 |
The invention relates to an integrated inductive resistor and a method for producing a high quality integrated inductive resistor. The aim of the invention is to provide an integrated inductive resistor and a method for high quality inte...
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WO/2000/028664A2 |
An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programable attenuation and a programable gain low noise amplifie...
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WO/2000/025329A1 |
A reactance coil (1) has an annular core (2) on which reactance coils are wound. Said reactance coils (3) are divided up into coil sectors (4) that are separated from each other by means of gaps (5) in the windings. The gaps (5) in the w...
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WO/2000/021102A1 |
High dielectric constant capacitors are made from a dielectric ink (30, 32, 34) of lead-magnesium-niobate and lead oxide powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capaci...
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WO/2000/017915A1 |
The invention relates to a method of manufacturing a semiconductor device comprising a semiconductor body (1) having a coil (3) with a magnetic core (4). By means of this method, the surface is provided with a first metallization layer (...
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WO/2000/016349A1 |
An inductive component includes a substrate (12) on the surface of which is a lower insulation layer (32) having a shallow concavity (34) or trench, a first plurality of conductive elements (16) formed in the trench, a magnetic core (14)...
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WO/2000/010736A1 |
Methods are disclosed for printing (2-7) multilayer electronic components, and circuits on a surface (2), where at least one of the layers is formed by a redox reaction (6) occurring in a deposited solution (4, 5). Electronic components ...
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WO/2000/010179A1 |
A vertical bonding wire inductor having a high quality (Q) factor and tunability, which can be manufactured using an existing wire bonding technology which is widely used for packaging integrated circuits, without an additional mask manu...
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