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JP3920604 |
To manufacture a multilayer capacitor having excellent electric characteristics by punching stripe aluminum foils into comb shape, where a plurality of multilayer capacitor electrode foils are continuous at one end in the short side dire...
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JP3918126 |
To manufacture a laminated ceramic electronic component which is characteristically superior by preventing a step due to the thickness of an internal electrode which causes an internal structure defect. Conductive paste E is printed on a...
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JP3919105 |
To separate a green sheet cut into chip shape in safety without causing any damage on individual chip components while sustaining the separation rate, and to automate the operation and to save the labor. The green sheet 80 cut into chip ...
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JP3919715 |
To provide a method for accurately evaluating polarization characteristics inherent to a ferroelectric capacitor without being affected by the variation of processing dimensions of electrodes constituting the ferroelectric capacitor. The...
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JP3921123 |
To make a switching device compact for raising the utilization rate of a sealed chamber (space) in a switching device for a pass box connecting between sealed chambers. The device is equipped with a clamp 24 having a claw 24b extruding a...
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JP3918085 |
To provide a gravure printing plate, for which the dispersion of the transfer amount at a pattern end part is suppressed. On the printing plate 1, a plurality of rectangular recessed parts 11 are formed on the inner side of a prescribed ...
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JP3919633 |
To dispense with the complicated process of washing each item after dismantlement, to shorten the treatment time to a remarkable degree, and to reduce the treatment costs, in the treatment of appliances which are contaminated with an org...
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JP3918086 |
To provide a pressing apparatus for a multilayer ceramic electronic component which has only a little deformation in a punch and can easily obtain a constant surface pressure at a pressing face. The pressing apparatus 1 comprises a rigid...
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JP3918083 |
To provide an apparatus for manufacturing electronic components and a method for manufacturing electronic components, by which the size of coating of paste hardly varies and the electronic components hardly include air bubbles. An extern...
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JP2007045597 |
To provide a chip component carrying device capable of picking out carried chip components in a stable attitude.The chip component carrying device 12 comprises a carrying table 30 and a disc-like turntable 32. The turntable 32 has a plur...
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JP2007048844 |
To provide a ceramic electronic component with a recess formed on one principal surface of a ceramic substrate, comprising an external electrode that extends from one principal surface into the recess, and to provide its manufacturing me...
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JP2007042961 |
To reduce cracks of package bodies 5 by heat screening during manufacture of solid electrolytic capacitors which are formed by sealing parts of capacitor elements 1 with package bodies 5 formed of synthetic resin.A shaft 6 extending to t...
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JP2007043144 |
To provide a highly reliable electronic component which does not cause a lowering in insulating resistance even under high-temperature and high-humidity conditions, and is also excellent in solderability to an external electrode, and to ...
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JP2007042692 |
To simultaneously achieve the improvement on capacity density and the reduction in leakage current density of a barium titanate strontium thin film.A method of manufacturing the thin-film capacitor 10 includes a bottom electrode formatio...
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JP3914479 |
To provide a jig for frequency characteristics measurement wherein the convenience of frequency measurement is increased, without damaging the capacitor to be measured, a measuring jig, etc., while measurement precision is increased prom...
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JP3912082 |
To provide a method for manufacturing a laminated ceramic electronic component which is constituted of a dense ceramic sintered body free from structural defects such as delamination, and can suppress formation of undesirable steps on an...
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JP2007035943 |
To provide a method for high-reliability determination of the presence of a structural defect, concerning a laminated capacitor provided with an internal electrode having a plurality of drawers.A plurality of external terminal electrodes...
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JP2007035888 |
To provide an applying method of a masking material wherein a masking layer is formed uniformly so as to be stabilized with time while making the frequent inspection and trucking of the device unnecessary.The solid state electrolytic cap...
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JP2007036146 |
To provide a manufacturing method to improve the electrical characteristics of electronic components including conductive paste materials, specifically to improve the variation (variance) and average value of the ESR (Equivalent Series R...
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JP2007035715 |
To provide a method of manufacturing a multilayer electronic component which can mitigate a cutting load of a sheet-laminated material.A plurality of internal electrode patterns 20 are formed in the constant direction with an interval ke...
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JP2007035353 |
To provide metal paste capable of forming a metal film excelling in soldering heat resistance on a base electrode.This metal paste contains: (A) silver particles wherein the average particle diameter of primary particles is 100-2,000 nm;...
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JP2007035820 |
To provide a method of manufacturing a laminated ceramic electronic component with few short circuit defects of an inner electrode due to baking, and with superior performance even in thin multilayers.A laminated ceramic green chip is fo...
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JP2007035970 |
To provide a paste coating device that eliminates the need for using a complex and large facility, and prevents a conductive paste from being coated unequally regardless of a paste viscosity change due to solvent vaporization to ensure t...
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JP2007027580 |
To provide a positioning method and a positioning device capable of highly reliably and accurately positioning a clayey sheet material (a plate material) without deforming the sheet material.A work piece to be worked (a sheet material) i...
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JP2007027605 |
To provide a method for manufacturing a stacked electronic component capable of shortening time for a stacking process and using a thinned internal structure as a continuously stacking method, and to provide its device.The manufacturing ...
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JP2007022828 |
To provide a ceramic paint which contains a reaction-curable resin, prevents the gelation in the state of a paint, is suitable for obtaining a green sheet having high sheet strength and moderate flexibility, and can effectively prevent t...
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JP2007021987 |
To provide a method and an apparatus for the manufacture of a ceramic green sheet enabling the improvement in the rate of operation.A slurry containing a ceramic material is applied to one side of a carrier film 82, while the carrier fil...
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JP2007027606 |
To provide a working apparatus of an aluminum wire capable of preventing the aluminum wire from reducing in size or from changing in a holding position.The working apparatus of the aluminum wire is constituted of a conveyance table 3 for...
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JP2007022740 |
To provide a winding shaft, having simple structure, in which total manhours in a winding process can be reduced.This winding shaft for winding a strip member is provided with two blade members having rectangular plate-shaped blades of w...
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JP2007027607 |
To provide a separation method with high separation efficiency free from cracks or deformation of a laminate, instead of a separation method for applying shocks from any directions to adhered laminates, and an apparatus therefor.Laminate...
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JP2007026780 |
To provide a conductor paste capable of forming a homogeneous plating membrane in forming the plating film on a surface of an obtained outer terminal electrode, and capable of retaining well an adhesive strength and electric characterist...
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JP2007022829 |
To provide a ceramic paint having a comparatively short setting time and being suitable for obtaining a green sheet having high sheet strength and moderate flexibility, and a method for manufacturing a multilayered electronic component w...
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JP2007019180 |
To provide an electric double layer capacitor which utilizes a carbon nanotube suitable for the electric double layer capacitor with much larger-scaled capacity owing to large surface area contacted with an electrolyte, and to provide a ...
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JP2007016290 |
To prevent the flow out of articles to be plated from a plating vessel; and to form a desired plated film on the article to be plated in high-efficiency.This plating device has a plating bath 3 in which a plating liquid 1 is stored and a...
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JP2007015344 |
To provide a sheet laminate cutting device capable of efficiently preventing the cut surfaces of a cut green sheet laminate from sticking to each other.This green sheet laminate cutting device 1 comprises a loading plate 14, a cutting bl...
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JP2007015870 |
To provide an activated carbon manufacturing apparatus which can obtain activated carbon homogenously activated and specially, capable of obtaining an electric double layer capacitor having high capacitance and high durability, when it i...
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JP2007019253 |
To provide the manufacturing method of a laminated electronic component avoiding a stress generated in a conductor as much as possible, in a process for obtaining a laminate by sequentially superposing a ceramic green sheet with the cond...
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JP3903757 |
To solve the problem of a chip electronic component where an end face electrode is formed on each end face of a component body to have an extension extending to a part of the side face, and a side face electrode is formed to surround the...
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JP2007012649 |
To provide a method of manufacturing a chip-like capacitor that has a superior element storage bulk ratio, can be reduced in size, and can increase capacity.The chip-like capacitor comprises a capacitor element having a positive electrod...
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JP2007007640 |
To obtain an apparatus for applying paste, by which paste can be prevented from being stuck/solidified on the side face of a peripheral part of a paste applying wheel and can be applied stably to a chip type electronic component and to p...
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JP2007013214 |
To provide a manufacturing apparatus and method for electronic components capable of precisely coating a paste on side faces of the electronic components.The manufacturing apparatus is provided with a slit board 51 in which a recess 52 h...
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JP2007012825 |
To provide a new structure of a chip part of which the manufacturing step is simple and convenient and by which an influence of a parasitic device can be removed, and to provide its manufacturing method for the same.A chip part A is prov...
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JP2007012836 |
To provide a method of manufacturing a solid-state electrolytic capacitor suitable for realizing low ESR.The method of manufacturing a solid-state electrolytic capacitor has a process of forming a dielectric layer 2 on the surface of a p...
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JP3900876 |
To provide an inspection device for an electronic part, capable of performing inspection and classification required for electronic parts without any increase in size of a turntable for conveying electronic parts and lowering of throughp...
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JP3899728 |
To provide a simplified capacitor manufacture device whose maintenance is easy. A transfer part 15 holding and transferring installed capacitor constitution parts 11, a material supply part 2 cutting a linear material 1 in a prescribed s...
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JP3900212 |
To detect and reject the foil splice part of an electrode foil securely when an electrolytic capacitor is manufactured. 1st and 2nd foil splice part detection sensors are provide at a position immediately before a foil cutting position A...
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JP3900916 |
To provide a method and apparatus capable of easily cutting a ceramic block body with high accuracy. The ceramic block body 11 is arranged on a support table 12 and cut by a cutting blade 14. Respective air suction holes 13 are connected...
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JP3900366 |
To provide a method and a device for calculating two kinds of leakage current useful for manufacturing process management of an electric double layer capacitor. Two kinds of leakage current, i.e. a Faraday leakage current and an ohmic le...
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JP2007001824 |
To provide a method of producing a dielectric ceramic composition using a sintering aid, which is dense without damaging various electric properties even if burned at a low temperature and by which the size of dielectric particle can be ...
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JP3896610 |
To lower the cost of firing of an electronic component and to improve the efficiency of the firing by a method wherein ceramic is sprayed thermally on the surface on the base side or both surfaces of a sprayed coating obtained by releasi...
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