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JP2008072133 |
To achieve miniaturization and a low inductance of a multilayer wiring board with a built-in capacitor element.The multilayer wiring board 11 with a built-in capacitor element comprises: a multilayer wiring board which has a laminate obt...
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JP2008066424 |
To ensure vibration resistance of a film capacitor containing a capacitor element in a case.The film capacitor improves the vibration resistance by containing a capacitor element 2 in a topped tubular case 1, attaching a sealing body 8 t...
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JP2008060300 |
To provide a terminal connection structure of a capacitor which can readily reduce current density of a terminal by a simple constitution and thereby restrain heat generation.In the terminal connection structure of a capacitor, a plurali...
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JP2008060427 |
To provide a passive component which can be mounted to a substrate, by satisfying both of the short height and high density, and to provide an electronic component module that has the passive component mounted on the substrate.The passiv...
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JP2008060518 |
To provide a part for built-in in a substrate which allows efficient built-in in a substrate and which is adaptable to down-sizing/thinning of a substrate, and to provide a substrate in which the part is built-in and a method of fabricat...
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JP2008034516 |
To provide a method for assembling and fixing capacitors capable of highly reliably and flexibly mounting a plurality of standard capacitors with high density.The outer peripheries of columns in the plurality of columnar shape capacitors...
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JP2008021797 |
To provide a laminated capacitor array in which an equivalent series resistance can be controlled.The laminated capacitor array CA1 is equipped with a first capacitor C1 formed of first and second internal electrodes 21 to 24 and 41 to 4...
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JP2008021752 |
To provide a laminated electronic component and a laminated array electronic component whose direction recognition mark is hardly specified by mistake.The laminated array electronic component 1 is constituted of a spiral coil formed by l...
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JP2008010507 |
To provide a capacitor of which characteristic values can be seen even from its upper face side, and which can suppress the manufacturing cost for indicating the characteristic values on the upper face of a case.In the electrolytic capac...
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JP2007189050 |
To provide a constitution capable of increasing the soldering strength to a substrate in an electronic component, enabling a surface mounting by superposing an insulating plate on the end face of a lead-wire electronic body.A chip-type e...
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JP2007180155 |
To provide a condenser device for improving cooling capability with a simple structure.The condenser device 110 is provided with a condenser body 111 that has protrusions 112, 113 at the area near the center area 1101 of the ends 1111, 1...
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JP2007173311 |
To obtain a high rigidity and inexpensive capacitor holder exhibiting high vibration-proof work efficiency, and to obtain a vibration-proof structure of a capacitor in which heat dissipation effect is enhanced and maintenance is facilita...
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JP2007173651 |
To provide a laminated ceramic capacitor, or a multilayer wiring board with built-in capacitor which serves as a relay board with built-in capacitor that is small in size and large in capacity, and that suppresses the propagation delay a...
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JP2007165801 |
To apply a multilayer capacitor for a filter circuit to improve damping characteristics in a high-frequency region.A multilayer capacitor 11 has two capacitor elements 14 and 15 with different capacity which are attached in parallel insi...
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JP2007165546 |
To achieve a reduction of the number of work processes of attaching a film capacitor and an enhancement of a heat radiation effect.In a capacitor element, an electrode lead-out is formed by winding a pair of metallized films and metal-sp...
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JP2007165814 |
To provide a member for a capacitor embedded in a substrate with which the capacitor can be efficiently embedded in the substrate, to provide a substrate with the embedded capacitor using it, and to provide a method for manufacturing the...
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JP2007157746 |
To enhance reliability by making it possible to fix a pressure switch for protecting a capacitor after the capacitor is manufactured, and protecting the pressure switch against the environment of vacuum, high temperature, or the like, wh...
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JP2007150347 |
To obtain a ceramic capacitor mounting structure which can reduce inductance in a wiring path between a ceramic capacitor and the other electronic part electrically connected thereto, and has a high cooling effect.The ceramic capacitor m...
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JP2007149719 |
To provide a via array capacitor to be built in a wiring board which can be prevent damage even if the thickness is reduced by improving its strength.This via array capacitor 101 to be built in a wiring board is built in a build-up layer...
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JP2007150014 |
To provide an electric storage device capable of sufficiently radiating heat generated by capacitor electrodes and bus bars in rapid charging with a large current.The electric storage device includes a capacitor unit 100 where the electr...
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JP3960288 |
To provide a highly reliable maintenance-free capacitor unit having a long lifetime in which a plurality of capacitors are utilized as an emergency power supply of an electronic control brake system, or the like. The capacitor unit compr...
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JP2007123572 |
To provide a heat radiation structure of a capacitor which blacks the thermal conduction from an external apparatus to the capacitor to suppress the temperature rise of the capacitor, whereas it a simple structure.The heat radiation stru...
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JP2007123795 |
To provide a digital signal processing board that achieves miniaturization, thickness-reduction, and cost-reduction, while reducing digital noise by solving the problem, wherein the miniaturization, thickness-reduction, and cost-reductio...
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JP3953155 |
To out a lead wire positively as needed for a capacitor where the lead wire is cut due to the inflation deformation of an upper lid with a pressure increase in a closed case. A capacitor has a security device for cutting the connection b...
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JP3948321 |
To provide a mounting structure of a capacitor whose mounting space is small, cost is low, and equivalent series inductance is small. The surface of a circuit board 30 comprises a hot-side conductor pattern 31 for electrically connecting...
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JP2007109859 |
To provide a method for manufacturing an electronic parts which can reduce voids in a solder and can melt the solder certainly.The method is for manufacturing the electronic parts which contains a member (substrate 1) having a joint (ele...
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JP2007110037 |
To provide a safe electricity storage system having good heat dissipation efficiency.The electricity storage system 10 is configured so that a plurality of capacitor cells 151 are connected in series, and charging current to be applied t...
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JP2007103575 |
To provide a solid electrolytic capacitor capable of facilitating heat dissipation.The solid electrolytic capacitor A1 includes a porous sintered body 1 of metal having a valve function, a dielectric layer formed on the surface of the bo...
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JP2007103496 |
To provide a capacitor capable of reducing a noisemaking phenomenon fully.The capacitor comprises a capacitor body section 10 in a rectangular parallelepiped shape, where internal electrodes 11, 12 are laminated alternately via a dielect...
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JP2007103497 |
To provide a capacitor capable of reducing a noise-making phenomenon fully.A capacitor body section 20 comprises external electrodes 31, 32, and addition electrodes 41, 42. The capacitor body section 20 is in a rectangular parallelepiped...
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JP3943783 |
To provide a circuit board, incorporating a high-capacitance solid electrolytic capacitor which is reduced in size and thickness by constituting the capacitor to obtain the same capacitance as that of an electrolytic capacitor, having a ...
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JP2007095727 |
To provide a highly reliable ceramic substrate where peeling and a crack are difficult to occur when a wiring layer and the like are formed on a substrate.The ceramic substrate is provided with a single ceramic layer 1 which is constitut...
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JP2007097038 |
To obtain a display method for simplifying recognition and clear indication of the type, frequency and serial number of a piezoelectric component such as a piezoelectric vibrator, a piezoelectric oscillator, a surface acoustic wave eleme...
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JP2007096265 |
To provide an integrated capacitor for a wiring board capable of reducing continuity failures when the capacitor is integrated in the wiring board; and also to provide a wiring board equipped with the capacitor.This integrated capacitor ...
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JP2007097037 |
To obtain a display method for simplifying recognition and clear indication of the type, frequency and serial number of a piezoelectric component such as a piezoelectric vibrator, a piezoelectric oscillator, a surface acoustic wave eleme...
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JP2007088461 |
To achieve a long wiring path between an IC and an external capacitor.An embedded capacitor core includes a first set of capacitors, a second set of capacitors, and an interlayer dielectric film between the first set of capacitors and th...
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JP2007088330 |
To provide a cased capacitor that surely provides an insulating distance, reduces restrictions on mount directions, and improves the ease of mounting.A buffering material 7 is provided to an opening of a case 1 in a way that it projects ...
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JP2007081250 |
To provide a face mounted component to be manufactured from a radial lead type component.A face mounted electronic component 1 is provided with a radial lead type electronic component 3 and a case 2. The radio lead type electronic compon...
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JP2007081002 |
To provide an electronic component in which the whole of electronic component is hardly slanted even if the amount of solder is uneven upon mounting the same on a substrate, in the electronic component mounted on the substrate employing ...
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JP2007081238 |
To provide a surface mount type electronic component with lead terminals which can be easily surface-mounted on a circuit board and whose surface mount area can be reduced simultaneously, and its carrier tape.A pair of lead terminals 21 ...
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JP2007081005 |
To improve the junction reliability of a coil component that allows the visual recognition of polarity.The coil component includes a body 4, a terminal 5 disposed under the body 4, and a terminal 6 disposed under the body 4. The surface ...
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JP2007067370 |
To provide a wiring board having an excellent adhesion strength between an interlayer insulation layer constituting a build-up layer and a ceramic chip for embedment.A wiring board 10 comprises a board core 11, a ceramic chip 101 for emb...
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JP2007059839 |
To provide an LC composite component which can be formed without using a special jig or a forming method and can efficiently dissipate heat generated in a winding portion to the outside.The LC composite component is provided with a plura...
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JP2007059477 |
To provide a solid electrolytic capacitor wherein the visibility of indication of printed character and polarity is appropriate and the reliability of a product is high.An anode lead-out lead terminal and a cathode lead-out lead terminal...
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JP3920670 |
To provide a solid electrolytic capacitor that is small and low in profile and that its equivalent series resistance is not affected by the resistance of leads. In a solid electrolytic capacitor, wound capacitor elements 1 are covered wi...
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JP2007049130 |
To provide a capacitor for being built in a wiring board which can eliminate any cracking of a filler, when the capacitor for being built in a wiring board is built into a wiring board and the filler is filled in a clearance gap between ...
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JP3915317 |
To provide a method for mounting electronic parts by which mounted parts can be removed easily and, accordingly, the effective utilization of parts can be contrived. In a method for mounting electronic parts in which chips 4 are mounted ...
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JP2007042677 |
To reduce the connection resistance between internal electrode layers in the stacking direction via a through-hole without reducing the area of individual internal electrode layers while keeping a low ESL (equivalent series inductance).T...
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JP3914854 |
To provide a metallized film capacitor which is intended to improve dielectric strength by reducing generation of heat due to a fuse when the power is supplied and by controlling temperature rise of the capacitor. A pair of evaporated el...
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JP3914865 |
To provide a metallized film capacitor which has a small-sized capacitor, large capacity, small number of parts and small inductance. The metallized film is wound or laminated, and the capacitor is provided with a plurality of capacitor ...
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