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JP2004327868 |
To provide a capacity variable thin film capacitor element which enlarges a usable frequency range and restrains characteristic defect and deterioration of reliability, and a high frequency component using it.First to Nth variable capaci...
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JP2004327983 |
To provide a multilayer electronic component for a plated termination for a multilayer electronic component, for example, for a capacitor, for a resistor, for an inductor, or for an integrated passive element.In a plated termination, a p...
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JP2004319665 |
To provide a surface-mounted component of versatility which can maintain sufficiently curing shrinkage force of adhesive agent after curing, and maintain stably connection reliability, and to provide the packaging method of the surface-m...
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JP2004312023 |
To provide a termination feature for a multilayer electronic component.The plated termination in question is guided and fixed by an exposed internal electrode tab that can be selectively extended on a cover layer of the multilayer compon...
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JP2004304101 |
To provide a condenser in a substrate mounted type metal case which can be easily manufactured, and in which an arbitrary fixing method to a substrate to be used and positioning are easy.The condenser in the case is provided with project...
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JP2004303946 |
To improve a mounting property upon mounting a composite electronic component by attracting correctly with an attracting nozzle and mounting the same while recognizing the direction of the same.A laminate 1 having an inductor unit 22 and...
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JP2004303947 |
To improve a mounting property upon mounting a composite electronic component by attracting correctly by an attracting nozzle and mounting the same while recognizing the direction of the same.A laminate has an inductor unit 22 and first ...
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JP2004277216 |
To provide a composition for forming a dielectric substance from which a dielectric layer having low dielectric loss and a high dielectric constant can be obtained by low temperature firing, and further, a pattern can be formed at a high...
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JP2004273875 |
To provide ceramic electronic parts capable of preventing the generation of any damage or crack in the manufacturing process and its embedding process into a circuit board.This ceramic substrate 1 is provided with an internal electrode a...
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JP2004259988 |
To provide a capacitor element to be embedded in a substrate for a semiconductor device, which enhances thickness reduction and productivity of the element.The capacitor element 20 is a piece of a sheet made of an epoxy resin wherein a s...
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JP2004253661 |
To provide a capacitor that can be reduced in weight, thickness, and size.This capacitor is constituted of a plurality of continuity pattern electrodes 18 and 22 electrically separated from each other by a separating groove 19, a capacit...
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JP2004247594 |
To provide a chip type capacitor, the manufacturing method thereof, and a molding die wherein the necessary and indispensable fillets for stabilizing its mounting attitude can be formed without such additional manufacturing processes as ...
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JP2004235471 |
To provide a capacitor excellent in insulating capability and high in heat radiating effect.The insulating cap 11 of the capacitor comprises a lower-stage insulating cover 20, a middle-stage insulating plate 30, and an upper-stage insula...
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JP2004221182 |
To provide a small size capacitor and a method of manufacturing the same by solving the problems that the height becomes large because the capacitor is fixed to a holder vertically and that the inductance becomes large because the connec...
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JP2004221534 |
To provide an electrolytic capacitor in which connection resistance of an anode is low and connection reliability is improved in the case of connection using conductive adhesives in a miniaturized solid-state electrolytic capacitor suite...
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JP2004221551 |
To provide a new method for incorporating two anodes and feed-throughs connected to them into one capacitor.This dual anode capacitor has an interconnection structure in which a plurality of feed-through wires can be separately positione...
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JP2004214257 |
To provide a stacked ceramic capacitor which can be set at prescribed capacitance by combining a capacitor which is equipped with a latticed grid electrode and possesses small capacitance, and the other capacitor which is equipped with a...
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JP2004214639 |
To provide a structure for connecting at least two capacitors in series.The capacitors, connected in series, give wide flexibility in the number of capacitors, installed in an apparatus and the configuration of a capacitor assembly for m...
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JP2004200698 |
To provide a transmission capacitor which is equipped with at least two separated capacitance devices in a single monolithic structure.A substrate 12 is a printed circuit board where a signal line 14 is located to transmit a signal. A tr...
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JP2004200556 |
To provide a method for measuring the withstand voltage by using the roll state of a layered material for a long capacitor layer, manufactured by a continuous lamination method and wound on a core tube.A laminated material for the long c...
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JP2004200239 |
To suppress occurrence of a whisker and a crack sufficiently through a simple plating structure when a conductive layer for connection is formed on the surface of an external terminal by Pb free Sn based alloy plating, and to manage the ...
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JP2004193352 |
To provide a layered capacitor which can reduce the extension and contraction due to the piezoelectric effect as much as possible.A part 12a which is constituted of only dielectric material exists between a first capacitor C11 and a seco...
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JP2004186232 |
To suppress the occurrence of unnecessary stress in a plurality of storage elements due to other end side linkage structures of a plurality of the storage elements, and to make assembly property of respective excessive temperature rising...
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JP2004186640 |
To provide a metallized film capacitor which has a small-sized capacitor, large capacity, small number of parts and small inductance.The metallized film is wound or laminated, and the capacitor is provided with a plurality of capacitor e...
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JP2004179388 |
To provide a ceramic green sheet having a metal thin film that can prevent separation between an internal electrode and an insulating layer, that between upper and lower insulating layers, an internal crack in the insulating layer, or th...
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JP3565519 |
PURPOSE: To improve vibration strength by heightening adhesive strength at the time of soldering a chip type electrolytic capacitor to a printed board together with fixing a capacitor main body so as not to come off from the exterior fra...
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JP2004172602 |
To provide a capacitor of low ESL and high capacity in a simple inexpensive method.The capacitor 10 comprises a first capacitor 11 and a second capacitor 12 integrated each other in the direction of layers. The first capacitor 11 compris...
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JP2004172305 |
To provide an multilayer wiring board free from cracking in the vicinity of a capacitor element, excellent in conductivity reliability in wiring conductor layers, and excellent in connection reliability between the capacitor element and ...
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JP2004172412 |
To solve such a problem that a connection failure occurs between an extraction electrode of a capacitor and a penetrating conductor formed in an insulation layer in a conventional capacitor built-in multilayer wiring board.The capacitor ...
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JP2004172371 |
To suppress a temperature rise of a capacitor and to realize high density mounting.Heat sinks 3 are arranged on confronted sides of the square capacitor 1 having terminals 2 at a lower part. The heat sinks 3 have upper radiation parts 3a...
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JP3563201 |
To prevent the leads of a cylindrical capacitor from bending and capacitor characteristic from deteriorating when the leads inserted along slits of a mounting plate and pressing the leads to the most interior of the slits to weld them to...
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JP3563202 |
To raise the connection strength of metal plate terminals to printed board conductors and that of the metal plating terminals to a mounting plate when the insulator-made mounting plate having the metal plate terminals bonded thereto by t...
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JP3563200 |
To prevent an excessive force from being cupplied onto a lead, by forming a protruding edge portion along a peripheral edge portion on an end surface of an electronic component body, at least on a half portion opposite to a lateral edge ...
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JP2004158600 |
To provide chip type electronic components ensuring excellent mountability and also to provide a method of manufacturing the same.The component is provided with a substrate 11, a circuit element provided on the upper surface of the subst...
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JP2004158541 |
To provide a laminated electronic part of a ceramic base having a structure of a mark material not peeling from a chip and to provide a method for manufacturing the same.The surface of a mark 3 showing at least one of the direction, a pa...
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JP2004153097 |
To allow an electrolytic capacitor to be replaced simply and easily.Electrode lead wires 3A, 3B of each of capacitors 1 are soldered to land patterns of an insulative attachment plate 10. Spacers 2A, 2B with a flexible structure comprisi...
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JP3551263 |
PURPOSE: To stabilize the operation and also, drop the internal pressure in a short time, in a safety device which discharges the inner gas by breaking a pressure discharge board when the inner pressure of a sealed container goes up abno...
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JP2004140403 |
To provide a manufacturing method of electronic components that can arrange a capacitor in the vicinity of a semiconductor chip, while reducing increase in packaging area.By repeatedly laminating dielectric thin films with an opening at ...
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JP2004134430 |
To provide an electronic component which can reduce noise by suppressing the propagation of vibration.One interposer substrate 20 is disposed on a lower part of a capacitor element 2 as a body part of a laminated capacitor 1. A pair of t...
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JP2004134561 |
To provide a metallized film capacitor which is intended to improve dielectric strength by reducing generation of heat due to a fuse when the power is supplied and by controlling temperature rise of the capacitor.A pair of evaporated ele...
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JP2004128326 |
To ease fitting of an aluminum electrolytic capacitor used for an electric power convertor or the like and to reduce the housing space of a jig for fitting the same.The jig is provided with a first fitting jig 11 that is like a thin and ...
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JP2004128221 |
To provide a method of manufacturing a chip ceramic electronic component which has stable electrical characteristics and excellent mechanical strength.In the regions including positions 2 to be cut on ceramic green sheets 1a, 1b, a ceram...
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JP3544569 |
PURPOSE: To prevent the entrance of plating solution in the case of forming a metallic plating film into a capacitor body by bending the end faces of an inner electrode and a dielectric ceramic layer in the vertical direction. CONSTITUTI...
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JP3543955 |
To provide a chip-type solid electrolytic capacitor which enables reduction of outside dimensions size and increase of capacity. The chip-type solid electrolytic capacitor is provided with a printed circuit board 12, which has an anode c...
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JP2004111495 |
To provide a chip capacitor, which can be improved in yield by joining a reinforcing member to a dielectric ceramic substrate, is inexpensive and small-sized, and has a large capacity value, and a method for manufacturing the same.The ch...
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JP3538693 |
To allow an insulation cover to be formed on only leads of an electronic component. An electronic component 1 having leads is positioned so as to bury specified lengths of the leads 3 in an unhardened resin 7 stored in a coating tank 13 ...
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JP3538854 |
PURPOSE: To provide a structure ensuring the suction force of a suction nozzle and conducting a suction and capable of performing automatic mounting by burying and flattening a section disturbing the suction and eliminating the need for ...
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JP2004103981 |
To simplify plating in an operation for manufacturing a chip solid electrolytic capacitor.With respect to the method for manufacturing the chip solid electrolytic capacitor, a frame 1 for manufacture has a pair of side frame members 11 w...
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JP2004087717 |
To constitute an electronic part which can wire bond the terminal electrodes to the circuit electrodes of a circuit substrate while the part is formed in substantially the same as the part to be solder connected.Terminal electrodes 2a, 2...
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JP2004087892 |
To provide an aluminum electrolytic capacitor having superior reliability by solving the problem that a defective connection is easy to occur, in the connection parts of an internal lead and an external terminal.A through hole provided i...
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