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JP2008153265 |
To prevent generation of high-frequency noise from a chip-type solid electrolytic capacitor for use in various electronic apparatus.An anode electrode portion 3 and a cathode electrode portion 4 provided on a planar element 1 are bonded,...
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JP2008140851 |
To enable to rapidly cause blowout of a temperature fuse, by transmitting heat generated in capacitor element due to fault to a cathode terminal, by solving the problem wherein it takes time to blow out a temperature fuse, because it is ...
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JP2008141079 |
To provide an electrolytic capacitor capable of improving adhesive strength to a substrate.An electrolytic capacitor comprises a positive electrode lead wire 8, a negative electrode lead wire 9, and a washer 13. The washer 13 comprises s...
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JP2008135420 |
To provide an enclosed capacitor capable of reducing a required amount of heat for soldering as compared with before and capable of performing improved soldering work.In the enclosed capacitor, an electrode thin plate 5 connected to a ca...
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JP2008130653 |
To provide an electronic component, an electrooptical device, and electronic equipment which certainly prevent the effect of external noises caused by static electricity, etc., while reducing costs.A circuit constituent element placed on...
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JP2008130774 |
To provide an electronic component that facilitates mounting between a capacitor body and an insulating board, improves a manufacturing yield, and is more excellent in vibration resistance than the conventional capacitor.When the insulat...
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JP2008124231 |
To provide a ladder-like electronic component-link using a micro rectangular chip electronic component, and to provide a method for manufacturing the electronic component-link.The electronic component-link 1 is the ladder-like electronic...
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JP2008124414 |
To provide a capacitor layer forming material stable in heat treatment, difficult in inter-layer exfoliation, high in insulation, and large in electrostatic capacity, and provide its manufacturing method and a printed wiring board.A meta...
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JP2008124244 |
To provide a highly reliable electronic component capable of board mounting by press fitting a compliant pin.The electronic component includes an electrolytic capacitor body 21 with lead wires 22 taken out; a holder 28 for holding to fix...
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JP2008117990 |
To provide an economical multilayer capacitor of which flexibility in design is high, wherein structural defect is less likely to occur, for lower ESL.Lead-out parts 52 and 53 of first and second internal electrodes 42 and 43 as well as ...
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JP2008112896 |
To provide a multilayer capacitor which can be markedly reduced in ESL (equivalent series inductance) and to provide its manufacturing method.The multilayer capacitor 10 is equipped with a dielectric assembly 12 composed of laminated die...
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JP2008091521 |
To provide a stacked capacitor having low manufacturing cost and capable of remarkably reducing ESL without employing a multi-terminal electrode, and to provide a manufacturing method thereof.The stacked capacitor 10 has a dielectric bla...
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JP2008091403 |
To provide a highly reliable electronic part that can be mounted to a substrate by press-fitting and engaging a compliant pin.The electronic part is provided with its body 21 from which a lead wire 22 is led out and a compliant pin 34 th...
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JP2008084894 |
To provide a multilayer capacitor that can be manufactured at low costs and can reduce ESL greatly without forming any multi-terminal electrodes.The multilayer capacitor comprises: a dielectric element body nearly in a rectangular parall...
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JP2008079479 |
To provide a power converter of which the inductance between a capacitor and an electronic circuit unit does not increase.The power converter comprises a capacitor 11 having a tubular terminal part 13 consisting of two terminals arranged...
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JP2008078633 |
To provide an electronic component assembly capable of effectively dealing with unwanted charge accumulated in a capacitor even when general-purpose components are used.An assembly 10 includes an electrolytic capacitor 1, a coil lead 4 a...
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JP2008078541 |
To suppress thermal deterioration in a capacitor element formed by a polymer film, and to restrain a resultant increase in working hours in a manufacturing process.The capacitor element 2 is stored in a ceiled cylindrical, heat-resistant...
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JP2008072133 |
To achieve miniaturization and a low inductance of a multilayer wiring board with a built-in capacitor element.The multilayer wiring board 11 with a built-in capacitor element comprises: a multilayer wiring board which has a laminate obt...
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JP2008066424 |
To ensure vibration resistance of a film capacitor containing a capacitor element in a case.The film capacitor improves the vibration resistance by containing a capacitor element 2 in a topped tubular case 1, attaching a sealing body 8 t...
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JP2008060300 |
To provide a terminal connection structure of a capacitor which can readily reduce current density of a terminal by a simple constitution and thereby restrain heat generation.In the terminal connection structure of a capacitor, a plurali...
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JP2008060427 |
To provide a passive component which can be mounted to a substrate, by satisfying both of the short height and high density, and to provide an electronic component module that has the passive component mounted on the substrate.The passiv...
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JP2008060518 |
To provide a part for built-in in a substrate which allows efficient built-in in a substrate and which is adaptable to down-sizing/thinning of a substrate, and to provide a substrate in which the part is built-in and a method of fabricat...
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JP2008034516 |
To provide a method for assembling and fixing capacitors capable of highly reliably and flexibly mounting a plurality of standard capacitors with high density.The outer peripheries of columns in the plurality of columnar shape capacitors...
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JP2008021797 |
To provide a laminated capacitor array in which an equivalent series resistance can be controlled.The laminated capacitor array CA1 is equipped with a first capacitor C1 formed of first and second internal electrodes 21 to 24 and 41 to 4...
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JP2008021752 |
To provide a laminated electronic component and a laminated array electronic component whose direction recognition mark is hardly specified by mistake.The laminated array electronic component 1 is constituted of a spiral coil formed by l...
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JP2008010507 |
To provide a capacitor of which characteristic values can be seen even from its upper face side, and which can suppress the manufacturing cost for indicating the characteristic values on the upper face of a case.In the electrolytic capac...
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JP2007189050 |
To provide a constitution capable of increasing the soldering strength to a substrate in an electronic component, enabling a surface mounting by superposing an insulating plate on the end face of a lead-wire electronic body.A chip-type e...
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JP2007180155 |
To provide a condenser device for improving cooling capability with a simple structure.The condenser device 110 is provided with a condenser body 111 that has protrusions 112, 113 at the area near the center area 1101 of the ends 1111, 1...
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JP2007173311 |
To obtain a high rigidity and inexpensive capacitor holder exhibiting high vibration-proof work efficiency, and to obtain a vibration-proof structure of a capacitor in which heat dissipation effect is enhanced and maintenance is facilita...
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JP2007173651 |
To provide a laminated ceramic capacitor, or a multilayer wiring board with built-in capacitor which serves as a relay board with built-in capacitor that is small in size and large in capacity, and that suppresses the propagation delay a...
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JP2007165801 |
To apply a multilayer capacitor for a filter circuit to improve damping characteristics in a high-frequency region.A multilayer capacitor 11 has two capacitor elements 14 and 15 with different capacity which are attached in parallel insi...
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JP2007165546 |
To achieve a reduction of the number of work processes of attaching a film capacitor and an enhancement of a heat radiation effect.In a capacitor element, an electrode lead-out is formed by winding a pair of metallized films and metal-sp...
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JP2007165814 |
To provide a member for a capacitor embedded in a substrate with which the capacitor can be efficiently embedded in the substrate, to provide a substrate with the embedded capacitor using it, and to provide a method for manufacturing the...
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JP2007157746 |
To enhance reliability by making it possible to fix a pressure switch for protecting a capacitor after the capacitor is manufactured, and protecting the pressure switch against the environment of vacuum, high temperature, or the like, wh...
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JP2007150347 |
To obtain a ceramic capacitor mounting structure which can reduce inductance in a wiring path between a ceramic capacitor and the other electronic part electrically connected thereto, and has a high cooling effect.The ceramic capacitor m...
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JP2007149719 |
To provide a via array capacitor to be built in a wiring board which can be prevent damage even if the thickness is reduced by improving its strength.This via array capacitor 101 to be built in a wiring board is built in a build-up layer...
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JP2007150014 |
To provide an electric storage device capable of sufficiently radiating heat generated by capacitor electrodes and bus bars in rapid charging with a large current.The electric storage device includes a capacitor unit 100 where the electr...
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JP3960288 |
To provide a highly reliable maintenance-free capacitor unit having a long lifetime in which a plurality of capacitors are utilized as an emergency power supply of an electronic control brake system, or the like. The capacitor unit compr...
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JP2007123572 |
To provide a heat radiation structure of a capacitor which blacks the thermal conduction from an external apparatus to the capacitor to suppress the temperature rise of the capacitor, whereas it a simple structure.The heat radiation stru...
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JP2007123795 |
To provide a digital signal processing board that achieves miniaturization, thickness-reduction, and cost-reduction, while reducing digital noise by solving the problem, wherein the miniaturization, thickness-reduction, and cost-reductio...
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JP3953155 |
To out a lead wire positively as needed for a capacitor where the lead wire is cut due to the inflation deformation of an upper lid with a pressure increase in a closed case. A capacitor has a security device for cutting the connection b...
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JP3948321 |
To provide a mounting structure of a capacitor whose mounting space is small, cost is low, and equivalent series inductance is small. The surface of a circuit board 30 comprises a hot-side conductor pattern 31 for electrically connecting...
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JP2007109859 |
To provide a method for manufacturing an electronic parts which can reduce voids in a solder and can melt the solder certainly.The method is for manufacturing the electronic parts which contains a member (substrate 1) having a joint (ele...
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JP2007110037 |
To provide a safe electricity storage system having good heat dissipation efficiency.The electricity storage system 10 is configured so that a plurality of capacitor cells 151 are connected in series, and charging current to be applied t...
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JP2007103575 |
To provide a solid electrolytic capacitor capable of facilitating heat dissipation.The solid electrolytic capacitor A1 includes a porous sintered body 1 of metal having a valve function, a dielectric layer formed on the surface of the bo...
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JP2007103496 |
To provide a capacitor capable of reducing a noisemaking phenomenon fully.The capacitor comprises a capacitor body section 10 in a rectangular parallelepiped shape, where internal electrodes 11, 12 are laminated alternately via a dielect...
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JP2007103497 |
To provide a capacitor capable of reducing a noise-making phenomenon fully.A capacitor body section 20 comprises external electrodes 31, 32, and addition electrodes 41, 42. The capacitor body section 20 is in a rectangular parallelepiped...
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JP3943783 |
To provide a circuit board, incorporating a high-capacitance solid electrolytic capacitor which is reduced in size and thickness by constituting the capacitor to obtain the same capacitance as that of an electrolytic capacitor, having a ...
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JP2007095727 |
To provide a highly reliable ceramic substrate where peeling and a crack are difficult to occur when a wiring layer and the like are formed on a substrate.The ceramic substrate is provided with a single ceramic layer 1 which is constitut...
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JP2007097038 |
To obtain a display method for simplifying recognition and clear indication of the type, frequency and serial number of a piezoelectric component such as a piezoelectric vibrator, a piezoelectric oscillator, a surface acoustic wave eleme...
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