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WO/2022/181323A1 |
[Problem] To prevent separation between a capacitor lower electrode and a dielectric film of an electronic component having a capacitor built-in. [Solution] An electronic component 1 comprises: a conductor layer M1 formed on a substrate ...
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WO/2022/181606A1 |
This filter circuit comprises a resonance circuit, the resonance circuit including an inductance element and a capacitor. The capacitor comprises an element stack, an exterior body, a first external electrode and a second external electr...
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WO/2022/181651A1 |
The present invention provides a laminated LC filter that facilitates jump coupling of LC parallel resonators that are distant from each other. In the present invention, a plurality of LC parallel resonators, in each of which an induct...
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WO/2022/181201A1 |
[Problem] To provide an electronic component incorporating a plurality of capacitors with different breakdown voltages. [Solution] An electronic component 1 comprises a first capacitor formed of conductor patterns 25, 31 and a dielectric...
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WO/2022/179966A1 |
An apparatus is described comprising: a conductor structure (such as a busbar) comprising a first electrical connection and a second electrical connection; a first capacitor pair comprising a first capacitor and a second capacitor mounte...
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WO/2022/176401A1 |
Provided are capacitors that can reduce switching loss, etc. in the manufacturing process and can improve productivity. The capacitors (first capacitor, second capacitor) each comprise: a capacitor element having an electrode; a busbar c...
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WO/2022/174559A1 |
Provided is a capacitor element. The capacitor element is formed by continuously winding a polished film as an outer wrapping film after winding a stacked film as an inner thin film around a mandrel for a set number of times, wherein the...
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WO/2022/176447A1 |
This electric device has: a first power supply part (330) provided with a first conductive part (310) that electrically connects a power source (200) and an electric component (800), and a second conductive part (320) integrally connecte...
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WO/2022/177750A1 |
Embodiments of the present disclosure generally relate to methods of forming a capacitor for DRAM. The method begins by preparing a substrate for forming the capacitor. A bottom electrode is formed on the top surface of the substrate. A ...
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WO/2022/176296A1 |
The present invention suppresses variation in the quality of a plurality of ceramic electronic components manufactured at the same time. This method for manufacturing ceramic electronic components comprises: a chip-like ceramic element...
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WO/2022/176297A1 |
Provided is a jig capable of easily and properly housing one work in one chip housing unit. An unprocessed work to be housed in a chip housing unit 8 has a rectangular parallelepiped shape having a length L1, a width W1, and a thicknes...
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WO/2022/178288A1 |
Disclosed herein are thin films and methods of forming thin films. An example thin film may comprise Ba-Ti-O configured to exhibit a structure where a distance of one or more neighboring Ti-Ti atoms is less than 3 Å.
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WO/2022/176188A1 |
This capacitor (1) connects to external electrical-wiring and consists of a pair of opposing layered electrodes (10_1, 10_2). The layered electrodes (10_1, 10_2) each comprise: a plurality of wiring layers （１１＿１、１１＿２...
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WO/2022/170674A1 |
Disclosed is a highly reliable multilayer ceramic feedthrough capacitor, comprising a multilayer ceramic feedthrough capacitor body, wherein the multilayer ceramic feedthrough capacitor body is provided with at least one inner hole for a...
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WO/2022/168768A1 |
A method for manufacturing an electronic component 1 according to the present invention comprises: a step for preparing electronic component element bodies 9 in each of which an inner electrode 3 is provided and the inner electrode 3 is ...
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WO/2022/167111A1 |
The invention relates to a high-current capacitor comprising: - a first film made of metal (1a) having a first microstructured and nanostructured surface produced by laser methods, - a first electron storage layer (3), also known as nano...
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WO/2022/168445A1 |
The present invention provides: a composite structure including structures that contain an aliphatic polycarbonate and inorganic particles, wherein a structure that includes an aliphatic polycarbonate and inorganic particles, and another...
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WO/2022/168446A1 |
Provided are: an inorganic particle-containing paste that yields an inorganic particle-containing film that, when laminated, resists the generation, due to the action of, e.g., shear force, of interlayer separation from another layer; an...
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WO/2022/168658A1 |
Provided is a polypropylene film with which it is possible not only to obtain a capacitor provided with a given level of processing suitability and a given level of capacitance stability with respect to long-term use, but also to obtain ...
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WO/2022/168802A1 |
An electronic component (11) comprises: a first insulator layer (S1), on which a first conductor pattern (CL11) for forming an inductor and a first electrode pattern (EC11) for forming a capacitor are formed; and a second insulator layer...
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WO/2022/168769A1 |
An electrolytic capacitor 1 according to the present invention comprises: a resin molded body 9 provided with a laminated body 30 including a capacitor element 20 and a seal resin 8 for sealing the periphery of the laminated body 30; and...
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WO/2022/168485A1 |
A capacitor component according to one embodiment of the present invention is provided with: a porous main body which has a plurality of through holes that extend in a first direction; a first internal electrode; and a second internal el...
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WO/2022/168770A1 |
An electrolytic capacitor 1 according to the present invention is provided with: a resin molded body 9 which is provided with a multilayer body 30 that comprises a capacitor element 20 and a sealing resin 8 that seals the periphery of th...
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WO/2022/164233A1 |
The present invention provides a capacitor wherein the hexahedral shape of a capacitor can be maintained while high dielectric properties of dielectrics are retained. The capacitor comprises: a body made of an anodized film; a first elec...
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WO/2022/163193A1 |
A ceramic electronic component (101) is provided with: a ceramic element (1) having a first surface (1a); an external electrode (3) disposed on at least the first surface (1a); an internal electrode (4) disposed in the ceramic element (1...
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WO/2022/164240A1 |
The present invention provides a capacitor having one or more electrodes formed in a three-dimensional grid shape to increase capacitance, a manufacturing method therefor, and a capacitor electrode.
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WO/2022/163278A1 |
A film capacitor according to the present invention is provided with: a capacitor element; a first busbar and a second busbar; a case having one surface (upper surface) that opens; and a filling resin. The first busbar includes a first p...
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WO/2022/164242A1 |
The present invention provides a capacitor having a capacitance that is improved by increasing the surface area of an electrode constituting the capacitor, and a method for manufacturing same. The capacitor comprises: an anodized oxide f...
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WO/2022/163504A1 |
This light emitting device (101) is provided with the following, each of which is formed on a substrate (1): a solid-state light-emitting element (LD1), drive capacitors (C1, C2), and a switching element (Q1). By being turned on, the swi...
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WO/2022/163645A1 |
This electrolytic capacitor is provided with: a capacitor element that is provided with a positive electrode part and a negative electrode part; an outer case that seals the capacitor element; a first external electrode that is electrica...
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WO/2022/158340A1 |
[Problem] The purpose of the present disclosure is to improve a heat-dissipating characteristic of a circuit board having a thin-film capacitor. [Solution] A circuit board 1 is provided with a board 10 comprising a ceramics plate 11 as a...
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WO/2022/156120A1 |
The present application relates to the technical field of semiconductor processes, and in particular to a capacitor structure preparation method, a capacitor structure, and a memory. The present application solves the technical problem o...
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WO/2022/158267A1 |
Provided is a capacitor in which the ability to dissipate heat from a capacitor element can be improved. A film capacitor comprising: a capacitor element; first and second bus bars connected to respective electrodes provided on opposite ...
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WO/2022/154510A1 |
Proposed is a multilayer ceramic condenser which can easily be mounted on a power module and minimize the generation of parasitic components by forming a top electrode and a bottom electrode on a ceramic condenser. The proposed multilaye...
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WO/2022/150275A1 |
A broadband multilayer ceramic capacitor may include a first external terminal and a second external terminal. A bottom portion of the first external terminal may be spaced apart from a bottom portion of the second external terminal by a...
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WO/2022/150274A1 |
A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base p...
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WO/2022/138862A1 |
Provided is a sensing fiber member which can be processed in long lengths, which excels in mass production, which is supple and has an excellent texture, and which is much less costly than a contact sensing fiber member (a piezoelectric ...
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WO/2022/138105A1 |
The present invention provides a multilayer body which has good water vapor barrier properties, while exhibiting excellent adhesion between a base material layer and a clay layer. A multilayer body 30 comprises a base material layer 33, ...
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WO/2022/138744A1 |
Provided are an electronic component, an electronic component manufacturing method, and a circuit module, all of which which make it possible to facilitate designing for improving the performance of an electronic component by increasing ...
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WO/2022/131072A1 |
This electronic component package (101) comprises: a resin part (6) having a first surface (6f); one or more electronic components (31, 32, 33) having a plurality of external electrodes (31a, 32a, 33a); and a plurality of lead-out electr...
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WO/2022/128378A1 |
The invention relates to a conductor assembly (1), in particular for use in electric vehicles or hybrid vehicles, comprising at least one planar first current-conducting component (10) having a first outer face (12) and a first inner fac...
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WO/2022/131113A1 |
[Problem] To reduce the chip size of a chip-type electronic component that includes a capacitor and an inductor. [Solution] A chip-type electronic component 1 comprises: a capacitor C2 configured from a lower electrode pattern 36, an upp...
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WO/2022/126647A1 |
The present invention provides a high-temperature energy storage hybrid polyetherimide dielectric thin film, a preparation method therefor and the use thereof, belonging to the technical field of polymer capacitor thin films. The prepara...
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WO/2022/131298A1 |
The manufacturing method according to the present disclosure is for manufacturing a dielectric layer provided to a reflective electromagnetic wave absorber, the method including: a step for preparing a resin composition that contains at ...
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WO/2022/131048A1 |
This method for manufacturing a capacitor 1 includes: a groove forming step; a masking layer forming step; a porous section forming step; a dielectric layer forming step; and a conductor layer forming step. A silicon substrate 2 having a...
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WO/2022/123034A1 |
A choke module (1) comprises a choke (2) comprising a magnetic core (4) and at least one winding (5, 6) and a support (18) comprising a capacitor plate (3) comprising at least one first electrode layer (29), at least one second electrode...
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WO/2022/124011A1 |
This laminate capacitor is provided with a laminate body, a first external electrode and a second external electrode. The laminate body includes multiple lamination parts and multiple insulation layers arranged alternately in the z direc...
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WO/2022/124505A1 |
The present invention relates to a case molding capacitor having improved filling surface levelness, the capacitor being characterized by comprising: a plastic case (10) which forms a built-in chamber having a capacitor module built ther...
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WO/2022/124612A1 |
The present invention relates to a method for simultaneously sintering multilayer ceramic capacitors (MLCCs) at high speed by using a microwave induction-heating device, comprising the steps of: inserting one or more MLCCs into the trans...
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WO/2022/117327A1 |
The invention relates to a module (1) comprising: - a capacitor (10), in particular an intermediate circuit capacitor for a multi-phase system having at least one first pole terminal (11) for electrically contacting the capacitor (10) an...
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