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WO/2021/059993A1 |
This capacitor is provided with a capacitor body in which dielectric layers and internal electrode layers are alternately layered in multiple layers. The dielectric layers are primarily composed of multiple crystal particles made of bari...
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WO/2021/060540A1 |
Provided, inter alia, is an electroconductive composition that exhibits an excellent dispersibility. The electroconductive composition contains electroconductive powder and a dispersant wherein the dispersant comprises a first acidic dis...
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WO/2021/060219A1 |
This power storage module comprises: a plurality of power storage devices 100 each having a positive electrode terminal 110 at one end and a negative electrode terminal 120 at the other end; a holder unit 200 that holds the plurality of ...
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WO/2021/060431A1 |
The purpose of the present invention is to suppress a force that is exerted on an electronic component, such as a capacitor body, or a holder when, for example, an electronic component unit is being mounted on a substrate. The electron...
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WO/2021/060552A1 |
Provided is a capacitor that makes it possible to set a failure mode to an open mode even when a short caused by dielectric breakdown in a dielectric layer occurs. The capacitor 1 is provided with: a substrate 10; a MIM structure 20 that...
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WO/2021/059569A1 |
Provided is a capacitor (100), wherein each of a plurality of first conductive columnar portions (112) has a nano-size outer diameter. Each of a plurality of second conductive columnar portions (122) has a nano-size outer diameter. A con...
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WO/2021/060502A1 |
The present invention provides an electroconductive paste which leaves little undissolved fine substance if dissolved into an organic solvent and is thus easily filtered, while having excellent printability and exhibiting excellent surfa...
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WO/2021/060499A1 |
The present invention provides a polyvinyl acetal resin: which leaves few fine undissolved substances when dissolved in an organic solvent; by which the productivity can be improved when used particularly as a binder for a ceramic green ...
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WO/2021/058577A1 |
Capacitor assembly (20), comprising a printed circuit board (200) comprising a first conductive trace (220) and a second conductive trace (230), and a first row of capacitors (151) comprising a plurality of surface mounted capacitor elem...
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WO/2021/059948A1 |
An electrical storage device (10) is provided with: an electrical storage element (200); a substrate (500) having a through-hole (514) formed therein and penetrating through a major surface (510a) thereof; a through-member (busbar (440))...
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WO/2021/059570A1 |
The purpose of the present invention is to provide a nanostructure aggregate (100) comprising a supporting part (110) and a plurality of nano-sized pillar parts (120), wherein separation of the pillar parts from the supporting part is pr...
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WO/2021/059925A1 |
The present invention provides an electroconductive paste for use in gravure printing, the paste containing an electroconductive powder, a dielectric powder, a binder resin, a solvent, and a dispersant. The dispersant included in this el...
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WO/2021/054024A1 |
Busbars (500), (600) include busbar body members (510), (610) and terminal forming members (520), (620) which are overlaid on and secured to terminal forming portions (540), (640) of the busbar body members (510), (610). The terminal for...
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WO/2021/053867A1 |
The objective of the present invention is to provide a more reliable semiconductor device. The semiconductor device of the present invention includes: a semiconductor substrate having a first main surface and a second main surface facing...
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WO/2021/053013A1 |
A nanowire structure (5) is manufactured by forming islands (30a, 30b) of conductive material on a substrate (10-20), and a conductive sacrificial layer (40) in the space (35) between conductive islands. The conductive islands (30a,30b) ...
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WO/2021/054207A1 |
Provided is a semiconductor device in which a decrease in dielectric breakdown strength of a dielectric film (deterioration of withstand voltage resistance of the dielectric film) is suppressed. The semiconductor device comprises: a semi...
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WO/2021/049056A1 |
An electrolytic capacitor according to the present invention is provided with: a rectangular parallelepiped resin molded body provided with a layered product including a capacitor element that includes an positive electrode having a diel...
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WO/2021/050791A1 |
Among the various aspects of the present disclosure are provisions for methods and compositions for making nanostructured conducting polymer particles and layers (e.g., films, mats) using vapor polymerization methods, as well as electric...
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WO/2021/049380A1 |
The present invention provides a multilayer film capacitor element which is reduced in capacitance loss. A film capacitor element according to the present invention comprises: a film laminate wherein metal layers having continuous direct...
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WO/2021/049618A1 |
The present invention provides: a sintered body which contains a further dense metal oxynitride; and a method for producing this sintered body. A sintered body which contains polycrystalline grains of a metal oxynitride containing at l...
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WO/2021/044630A1 |
This method for manufacturing an encased film capacitor is for manufacturing an encased film capacitor provided with: a case; a film capacitor element that is accommodated in the case; and a sealing resin for sealing the film capacitor e...
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WO/2021/044848A1 |
A first coil (L1) and a second coil (L2) have a winding axis in the lamination direction of a base layer and are magnetically coupled together. A first capacitor (C1) and a second capacitor (C2) are disposed in the lamination direction o...
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WO/2021/039053A1 |
This capacitor (20) is provided inside a laminated substrate (10) having an electroconductive pattern (11) on the surface thereof, wherein: the capacitor (20) is provided with a positive electrode part (3) including a first electroconduc...
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WO/2021/038973A1 |
A film capacitor 1 according to the present invention is provided with: a multilayer body 10 wherein films including a metallized film that is obtained by arranging a metal layer on a main surface of a dielectric film are stacked in a st...
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WO/2021/039550A1 |
This electrical storage module is provided with: an insulating substrate which opposes an electrical storage group comprising a plurality of electrical storage devices and has a plurality of through-holes; a plurality of current collecti...
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WO/2021/038962A1 |
This film capacitor 1 comprises a laminate 10 in which dielectric films and metal layers are laminated in a lamination direction T, and external electrodes connected to the metal layers. The dielectric film includes a first dielectric fi...
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WO/2021/039246A1 |
Provided is a laminated LC filter which improves return loss and suppresses a narrowing of the passband. A multilayered substrate 1 is configured in a manner such that: a via electrode 2q, which is the end section of a first inductor L...
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WO/2021/038963A1 |
This film capacitor 1 is provided with: a laminate 10, in which films each including a metalized film 21 in which a metal layer 41 is provided on at least one main surface of a dielectric film 31, are laminated in a lamination direction ...
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WO/2021/039761A1 |
A film capacitor 1 of the present invention comprises: a capacitor element 5 including a stack 10 and a pair of external electrodes (a first external electrode 51 and a second external electrode 52) provided on both end surfaces, in a wi...
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WO/2021/038970A1 |
A film capacitor (1) of the present invention is provided with a capacitor element (10) provided with a metalized film (11, 12) comprising a resin film (13, 14) with a metal layer (15, 16) provided on a surface thereof; an exterior case ...
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WO/2021/037626A2 |
The invention relates to a film capacitor for power electronics, which comprises a first electrically conductive layer, which is arranged on a first end side face of the film capacitor, wherein the surface normal of the first electricall...
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WO/2021/033387A1 |
The present invention provides a novel electronic component which is provided with a ceramic element and an external electrode, wherein: the external electrode comprises a base layer and a plating layer; and the base layer is able to be ...
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WO/2021/033786A1 |
Provided is a high-dielectric film. The high-dielectric film may comprise: a dielectric film containing a polymer; a first foil structure, which is disposed on the top surface of the dielectric film and in which a first resin layer conta...
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WO/2021/024565A1 |
A film capacitor (1) of the present invention is characterized by comprising: a first dielectric film (10) having a first major surface (11) and a second major surface (12) and made of resin; a first electrode layer (30) opposing the fir...
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WO/2021/024557A1 |
An electricity storage device 100 according to the present invention has a first main surface, a second main surface, a first lateral surface, a second lateral surface, a first end surface and a second end surface, while being provided w...
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WO/2021/024564A1 |
This film capacitor (1) comprises: a first dielectric film (10) made of a resin and having a first principal surface (11) and a second principal surface (12); a first electrode layer (30) provided on the first principal surface (11) of t...
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WO/2021/024558A1 |
A film capacitor 1 comprises: a capacitor element 10 having a metallized film 11 in which a metal layer 15 is provided on the surface of a resin film 13; an exterior case 20 that houses the capacitor element 10 therein; and a filling res...
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WO/2021/020557A1 |
Provided is a conductive paste for gravure printing in which separation of a conductive powder and a ceramic powder is extremely suppressed. This conductive paste for gravure printing contains a conductive powder, a ceramic powder, an ad...
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WO/2021/019028A1 |
Electronic component (1), comprising: - a first electrically conductive layer (17) at a first electrical potential - a second electrically conductive layer (18) at a second electrical potential, - a first capacitor (11) having a first te...
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WO/2021/020322A1 |
Provided is a trench capacitor which facilitates the supply of a film formation material into a trench, while ensuring the mechanical strength of wall portions defining the trench. The trench capacitor 1 is provided with a base material ...
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WO/2021/019867A1 |
A chip component (1) is provided with: an electronic component (10) including a first electrode (11) and a second electrode (12) disposed at an interval from the first electrode in a first direction (A); a first bonding portion (21) bond...
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WO/2021/014927A1 |
Provided is a capacitor in which the metal plate does not easily come off the outside of the case when a configuration is adopted in which a metal plate is insert molded to a case. A film capacitor, according to the present invention, co...
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WO/2021/015019A1 |
Provided are a capacitor-forming system and capacitor-forming method for increasing surface area. The capacitor-forming system comprises: a lower electrode-forming device for forming a lower electrode on a substrate; a dielectric film-...
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WO/2021/009386A1 |
A method for manufacturing a metallized film is provided, comprising the steps: a) Deposition of at least one pre-nucleation layer (1) on at least one main surface (2´) of a polymer based substrate (2) by magnetron sputtering, b) Deposi...
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WO/2021/008802A1 |
The present invention concerns a capacitor, comprising a winding element arranged in a case (1), a mounting plate (11) which comprises a non-conductive material and which is fixed to the case (1), and a metal element (7) which is arrange...
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WO/2021/005911A1 |
This circuit element (101) comprises: a laminate (1) formed by lamination of base layers; an internal element provided inside the laminate (1); and first external electrodes (E12, E13, E14) and second external electrodes (E21, E22, E23, ...
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WO/2021/005822A1 |
This film capacitor is provided with a dielectric resin film and a metal layer disposed on one surface of the dielectric resin film. The dielectric resin film has a glass transition temperature of 160°C or higher and a density at 25°C ...
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WO/2021/005928A1 |
The present invention improves the accuracy of adjustment of LC filter characteristics. A first electrode (131) is connected to a first via conductor (V1) between both ends of the first via conductor (V1). A second electrode (132) is con...
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WO/2021/005927A1 |
The present invention facilitates adjustment of the passing characteristic of an LC filter. A first capacitor electrode (121) is connected to one end of a first via conductor (V1), and faces a first ground electrode (111) in a stacking d...
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WO/2021/005823A1 |
The film capacitor according to the present invention is provided with: a dielectric resin film having a first face and a second face facing each other in the thickness direction; and a metal layer disposed on the first face of the diele...
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