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WO/2009/047886 |
A case mold type capacitor is provided with a capacitor element, a pair of terminals and a molding resin. The pair of terminals are connected to a first electrode and a second electrode of the capacitor element, respectively. The molding...
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WO/2009/043370 |
A capacitive device (100, 200) comprising first (110) and second (130) layers of electrically conductive material, each of which has a first and a second main surface. The device also comprises a third layer (120) of a paraelectric phase...
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WO/2009/043826 |
An electrical multilayer component is provided, having a stack (1) of dielectric layers (2) and electrode layers (3) disposed one on top of another, electrically homopolar electrode layers being contacted jointly with an external contact...
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WO/2009/044961 |
Disclosed is a method of manufacturing electronic components, particularly, a method of manufacturing electronic components through a printing process, including simultaneously printing ceramic dielectric regions and conductive regions o...
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WO/2009/046341 |
A method is provided for making a high permittivity dielectric material for use in capacitors. Several high permittivity materials in an organic nonconductive media with enhanced properties and methods for making the same are disclosed. ...
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WO/2009/043847 |
A joint sealant, a method of making the joint sealant and a method of sealing gaps between materials by applying a joint sealant are disclosed. The joint sealant comprises a bituminous material or a clear synthetic binder material, and c...
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WO/2009/041160 |
This invention provides a dielectric ceramic material for use in a laminated ceramic capacitor, which can provide a dielectric ceramic having a high permittivity even when a DC bias of about 1.25 kV/mm is applied. The dielectric ceramic ...
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WO/2009/041142 |
Provided is a laminated ceramic capacitor, which has a smoothed surface, and furthermore, an internal electrode which can surely eliminate electrode interruption. A conductive paste, a nickel powder or an alloy powder having nickel as a ...
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WO/2009/041304 |
A first wiring layer, and a plurality of second wiring layers thinner than the first wiring layer are formed in lamination on a semiconductor substrate. An inductor is constituted of the plurality of second wiring layers. The inductor os...
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WO/2009/042537 |
A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening...
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WO/2009/041304 |
A first wiring layer, and a plurality of second wiring layers thinner than the first wiring layer are formed in lamination on a semiconductor substrate. An inductor is constituted of the plurality of second wiring layers. The inductor os...
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WO/2009/037922 |
This invention provides a dielectric ceramic composed mainly of a BaTiO3-based compound and is represented by general formula [100AmBO3 + aNiO + bROn + cMOV + dMgO + eXOW] wherein R represents a rare earth element such as Dy; M represent...
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WO/2009/037346 |
The invention relates to an electric multilayer component, comprising a stack (1) of dielectric layers (2) and electrode layers (3), which are disposed next to each other, and differently polarized outer contacts (4a, 4b) which are dispo...
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WO/2009/037346 |
The invention relates to an electric multilayer component, comprising a stack (1) of dielectric layers (2) and electrode layers (3), which are disposed next to each other, and differently polarized outer contacts (4a, 4b) which are dispo...
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WO/2009/039006 |
A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which ...
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WO/2009/037292 |
The invention relates to an electrical multilayer component comprising a stack (1) of dielectric layers (2) and electrode layers (3) lying on top of each other, wherein an electrically insulating stiffening element (5) is disposed at a d...
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WO/2009/034571 |
This invention is directed to selenophene compounds, selenophene-based polymers (polyselenophene), processes for the preparation of the same and uses thereof. The polyselenophenes of this invention have high conductivity and can be used ...
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WO/2009/034082 |
The invention relates to a method for producing a multi-layer component (1), in which a stack of green foils is sintered, to which inner electrodes (2) comprising palladium oxide are applied. The sintered stack is provided with a silver ...
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WO/2009/034163 |
The invention relates to a module comprising at least two electrical energy storage assemblies (20), each storage assembly (20) comprising a first face topped by a cover (30) electrically connected to said energy storage assembly (20) an...
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WO/2009/034082 |
The invention relates to a method for producing a multi-layer component (1), in which a stack of green foils is sintered, to which inner electrodes (2) comprising palladium oxide are applied. The sintered stack is provided with a silver ...
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WO/2009/034571 |
This invention is directed to selenophene compounds, selenophene-based polymers (polyselenophene), processes for the preparation of the same and uses thereof. The polyselenophenes of this invention have high conductivity and can be used ...
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WO/2009/035478 |
Apparatus and methods according to various aspects of the present invention may operate in conjunction with composite matrix material and reinforcement material, such as nanostructures. The nanostructures may be evenly dispersed and/or a...
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WO/2009/034571 |
This invention is directed to selenophene compounds, selenophene-based polymers (polyselenophene), processes for the preparation of the same and uses thereof. The polyselenophenes of this invention have high conductivity and can be used ...
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WO/2009/035488 |
A method including printing a layer of an electrode on a substrate is described. Printing the layer may include ejecting a first coating composition and a second coating composition from a nozzle. The first coating composition may compri...
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WO/2009/034571 |
This invention is directed to selenophene compounds, selenophene-based polymers (polyselenophene), processes for the preparation of the same and uses thereof. The polyselenophenes of this invention have high conductivity and can be used ...
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WO/2009/028596 |
A passive element built-in substrate hard to get damaged, inexpensive and easy to manufacture, and its manufacturing method. The substrate includes a mounting substrate (1) having a connection pad (2) formed, a passive element chip havin...
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WO/2009/023061 |
A dielectric material is disclosed comprising a plurality of substantially longitudinally oriented wires which are coupled together, wherein each of the wires includes a conductive core comprising a first material and one or more insulat...
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WO/2009/023467 |
Methods and systems of dielectric film materials to be used in capacitors. At least some of the illustrative embodiments are dielectric materials in the form of polymer film comprising a blend of polyvinylidene fluoride (PVDF) and at lea...
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WO/2009/016860 |
[PROBLEMS] To provide a dielectric ceramic, which has high permittivity, has specific permittivity which varies depending upon temperature so as to satisfy X5R characteristics in EIA specifications, and can realize high insulation resist...
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WO/2009/016775 |
A crystal constituting a dielectric porcelain, comprised of a first crystal group composed of crystal grains of 0.2 atomic% or less calcium concentration and a second crystal group composed of crystal grains of 0.4 atomic% or more calciu...
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WO/2009/017109 |
Disclosed is a highly dielectric film which can be formed thin, while having excellent winding properties (flexibility) and low dielectric loss. This highly dielectric film contains a vinylidene fluoride polymer (A) and a complex oxide p...
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WO/2009/015533 |
Active carbon for capacitor and a method for preparing the same are provided. The active carbon is obtained by charring bamboo as raw material, activating, water-washing, and drying. The method comprises following steps: selecting raw ma...
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WO/2009/013533 |
A device comprises a substrate (22); a first MiM capacitor (10, 20, 11) disposed over the substrate; and a second MiM capacitor (10', 20', 11') disposed over the first MiM capacitor. The first MiM capacitor and the second MiM capacitor a...
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WO/2009/011096 |
Disclosed is a lead wire having a lead electrode made of a metal and a cap. The cap covers the front end portion of the lead electrode and is made of a metal harder than that of the lead electrode. Also disclosed is an electronic compone...
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WO/2009/010235 |
The present invention relates to a capacitor module (100) having at least two capacitor cells (11-14) each having a top side (11a, 12a, 13a,.14a) and a bottom side (11b, 12b, 13b, 14b) and being arranged adjacent to each other to form a ...
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WO/2009/010235 |
The present invention relates to a capacitor module (100) having at least two capacitor cells (11-14) each having a top side (11a, 12a, 13a,.14a) and a bottom side (11b, 12b, 13b, 14b) and being arranged adjacent to each other to form a ...
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WO/2009/010235 |
The present invention relates to a capacitor module (100) having at least two capacitor cells (11-14) each having a top side (11a, 12a, 13a,.14a) and a bottom side (11b, 12b, 13b, 14b) and being arranged adjacent to each other to form a ...
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WO/2009/007303 |
The invention discloses a multilayer electrical component comprised of at least one base element (1) which is composed of a stack of dielectric layers (2) and electrode layers (3) positioned one upon the other, wherein the multilayer com...
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WO/2009/007303 |
The invention discloses a multilayer electrical component comprised of at least one base element (1) which is composed of a stack of dielectric layers (2) and electrode layers (3) positioned one upon the other, wherein the multilayer com...
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WO/2009/005555 |
A multilayer film useful for capacitive applications comprises a high energy density layer and a dielectric blocking layer. In some embodiments, a conducting film is located between the high energy density layer and the blocking layer. T...
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WO/2009/005555 |
A multilayer film useful for capacitive applications comprises a high energy density layer and a dielectric blocking layer. In some embodiments, a conducting film is located between the high energy density layer and the blocking layer. T...
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WO/2009/000833 |
The invention relates to, amongst other things, an electric memory module (100) provided with at least two capacitors (20, 30, 40) that are interconnected by an electrically conductive connection device. The memory module comprises an el...
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WO/2009/001842 |
Provided is a multilayer ceramic electronic component wherein deterioration due to migration of a metal contained in a conductive adhesive is not easily generated even the conductive adhesive is used for mounting. A multilayer ceramic el...
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WO/2009/001597 |
[MEANS FOR SOLVING PROBLEMS] A dielectric ceramic comprising crystal particles composed mainly of barium titanate and a grain boundary phase provided between the crystal particles. A dielectric ceramic, which undergoes a smaller change i...
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WO/2009/001690 |
This invention provides an SrTiO3-based grain boundary insulated semiconductor ceramic. In this semiconductor ceramic, a donor element is dissolved as a solid solution in crystal grains, and an acceptor element is present in at least cry...
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WO/2009/000833 |
The invention relates to, amongst other things, an electric memory module (100) provided with at least two capacitors (20, 30, 40) that are interconnected by an electrically conductive connection device. The memory module comprises an el...
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WO/2008/155945 |
Disclosed is a dielectric ceramic material which is intended to be used in a laminated ceramic capacitor. Specifically disclosed is a dielectric ceramic composition which can be co-fired with an internal electrode mainly composed of Ni a...
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WO/2008/156210 |
Disclosed is an insulating film having high dielectric breakdown voltage, which is excellent in heat resistance and handling property. Specifically disclosed is a biaxially stretched insulating film which contains (i) a styrene polymer h...
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WO/2008/154159 |
Capacitive structures in integrated circuits are disclosed. The capacitive structures are formed on a substrate. Each capacitive structure includes a first conductive finger and a second conductive finger. The first and second conductive...
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WO/2008/149869 |
Disclosed is a biaxially oriented polyester film which exhibits high withstand voltage characteristics over a temperature range from room temperature to high temperature and is capable of maintaining the high withstand voltage characteri...
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