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Document Title |
JP4258439B2 |
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JP4231062B2 |
A micro-electro-mechanical system (MEMS) includes a first electrode interposed between a first fixed end and a second fixed end, the first electrode being movable by an actuator element. The MEMS also includes a substrate on which the fi...
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JP2009021227A |
To provide an electromechanical switch capable of being compatible with both low-voltage driving and high isolation.The electromechanical switch has a first beam 106 organizing a driving section, a second beam 107 as a contact section li...
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JP4216392B2 |
The invention relates to an antenna-switching device between the output of a transmitting stage and the input of a receiving stage, which includes a piezoelectric actuator formed by two fixed plates (21, 22) which form a capacitor and a ...
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JP2008545542A |
Microelectromechanical system (MEMS) devices may have a substrate and at least one moving part supported by the substrate. The at least one movable portion may have a superlattice each having a plurality of groups composed of a plurality...
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JP2008258670A |
To provide an antenna device that realizes transmission and reception, in a frequency band having a wide bandwidth.The antenna device is equipped with a variable capacitance capacitor C2 using a dielectric material, a capacitor C1 connec...
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JP2008253058A |
To decrease possibility that a jointed portion to a wiring board peels off, when mounting on the wiring board is performed and decrease the possibility of a lead wire being cut, when an electrode is electrically connected through a wire ...
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JP2008238330A |
To provide a MEMS (Micro-Electro-Mechanical System) device having low operation voltage and strong pressure contact force and separating force.This MEMS device has a substrate 1, a supporting part 2 provided on the substrate 1, a fixed e...
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JP2008166111A |
To provide a switch capable of switching operation without causing a sticking.The switch is provided with a substrate 2, a signal line conductor 1 arranged on the substrate 2, and a movable electrode part moving on the signal line conduc...
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JP2008159327A |
To provide a contact switching device capable of preventing adhesion of a surplus conductive fluid, in the surrounding of an injection port.The contact switching device is provided with the body part 1 which has a housing chamber 1d in w...
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JP2008159322A |
To provide a contact switching device capable of preventing flow out of a conductive fluid from an injection port.The contact switching device is provided with the body 1d which has a housing chamber 1d, in which a conductive fluid L is ...
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JP2008159323A |
To provide a contact switching device capable of preventing adhesion of a surplus conductive fluid, in the surrounding of an injection port.The contact switching device is provided with the body part 1 which has a housing chamber 1d in w...
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JP2008159324A |
To provide a contact-switching device capable of preventing flowing out of a conductive fluid from an injection port.The contact-switching device is provided with the body 1d which has a housing chamber 1d in which a conductive fluid L i...
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JP2008159326A |
To provide a contact switching device capable of preventing flowing out of a conductive fluid from an injection port.The contact switching device has the body part 1 which has a housing chamber 1d in which a conductive fluid L is stored ...
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JP2008159325A |
To provide a contact switching device capable of preventing flowing out of a conductive fluid from an injection port.The contact switching device has the body part 1 which has a housing chamber 1d in which a conductive fluid L is stored ...
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JP2008091204A |
To provide a relay capable of reducing the manufacturing costs, reducing the manufacturing time, and reducing its size.The relay comprises first and second fixed contacts F1, F2; a movable contact M for electrically disconnecting the fix...
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JP2008091167A |
To provide a micromechanical device having a piezo-electric drive actuator which does not use a lead system material for a piezo-electric film, is easy to manufacture and can eliminate sticking even if it happens.The micromechanical devi...
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JP2008082069A |
To provide a door handle for a vehicle which can detect with accuracy the approach and contact of a user's hand associated with operation of the door handle provided to a door for a vehicle.The door handle for the vehicle is provided to ...
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JP2008053077A |
To provide a MEMS (Micro electro-mechanical system) switch capable of maintaining contact pressure at low and having a long lifetime.In the MEMS switch, at least one of a fixed electrode 3 or a lower electrode 5 is constructed of Au, and...
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JP4045274B2 |
A micro-electromechanical (MEM) RF switch provided with a deflectable membrane ( 60 ) activates a switch contact or plunger ( 40 ). The membrane incorporates interdigitated metal electrodes ( 70 ) which cause a stress gradient in the mem...
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JP4044864B2 |
In accordance with the invention, a piezoelectrically actuated relay that switches and latches by means of a liquid metal is disclosed. The relay operates by means of a plurality of shear mode piezoelectric elements used to cause a press...
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JP4039744B2 |
A piezoelectric actuator includes a main driver electrode 4 and a sensor electrode 5. A feedback signal is generated from the sensor electrode 5 in order to eliminate a primary vibration mode due to a primary resonance frequency. The mai...
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JP4037394B2 |
A piezoelectric actuator includes a first beam including a first bottom electrode, a first piezoelectric film on the first bottom electrode, and a first top electrode on the first piezoelectric film, a fixed end assigned at an end of the...
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JP2007318712A |
To provide a device including a piezoelectric thin film capable of suppressing a spurious radiation by preventing the occurrence of unnecessary vibration in a lateral mode, and capable of avoiding degradation of reliability by stress con...
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JP2007299630A |
To provide a contact switching device capable of suppressing flow-out of a conductive fluid from a fluid inlet for the conductive fluid. The contact switching device 1 is formed by using a semiconductor board 3 and an insulating board 6,...
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JP2007299633A |
To provide a contact switching device in which cracks of a glass board to seal a groove to become a flow passage of a fluid are prevented. The contact switching device is provided with a silicon board 1 in which a groove part 2 that beco...
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JP2007299634A |
To provide a contact switching device of which the structure is simple and which becomes usable as a constantly open contact, a constantly closed contact, and a transfer contact. A conductive fluid 6a is injected into one part of a chamb...
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JP2007299631A |
To provide a contact switching device capable of carrying out switching operation smoothly. The contact switching device 1 is provided with a body part 2 having a first fluid housing room 2a which is formed by using a semiconductor board...
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JP2007299632A |
To provide a contact switching device which is easy to manufacture and in which electric power saving is achieved. The electric contact switching device 1 is provided with a body part 2 having a semiconductor board 3 in which a housing r...
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JP2007299629A |
To provide a contact switching device in which a position of a contact face of a conductive fluid and an insulating fluid in a fluid housing room can be set at a prescribed position at non-action of an actuator. The contact switching dev...
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JP2007299628A |
To enable to easily control a position of a conductive fluid to be injected into a housing part. By reducing wettability by making the inner wall face of a groove part 2b a rough face, and accordingly by suppressing adhesion of the condu...
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JP2007294326A |
To provide a high-reliability switch; and to provide a power inverter using it. This switch is provided with a board 1, a signal wire 2, a support base 3, a fixing member 4, a drive part 5 and a contact electrode 6. The signal wire 2 and...
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JP2007273451A |
To provide a piezoelectric MEMS switch eliminating the process of enforcing the etching of the back side of a substrate as conventionally performed, and also eliminating process constraints, by improving the structure as a piezoelectric ...
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JP2007259669A |
To provide a piezoelectric actuator that is capable of controlling the amount of piezoelectric drive displacement with proper reproducibility and in a wide range, while suppressing warpages due to the residual strain of a piezoelectric f...
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JP2007250217A |
To provide a relay usable without malfunction even under a high magnetic field environment. A movable contact 2 of the relay 1 is formed of an elongated plate shaped ion conductive polymer/noble metal assembly which is formed by joining ...
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JP2007207498A |
To provide a mechanism device capable of preventing malfunction of an upper electrode sticking to a lower electrode due to Coulomb force, by widening a gap between the both electrodes in a method other than thickening of a sacrifice laye...
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JP2007522609A |
The device improved according to the invention comprises a micro-electromechanical switch (MEMS) with a piezoelectric element connected to a mechanical support on both sides at the edges. The electrode design of this piezoelectric elemen...
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JP2007188866A |
To provide a MEMS switch in which contact resistance is reduced by improving a contact structure for a signal line, and insertion loss can be reduced thereby, and which can be driven with a low voltage.This MEMS switch includes a substra...
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JP2007515306A |
The microelectromechanical system (MEMS) element ( 101 ) comprises a first electrode ( 31 ) that is present on a surface of substrate ( 30 ) and a movable element ( 40 ). This overlies at least partially the first electrode ( 31 ) and co...
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JP3904240B2 |
A ceramic element comprises a main actuator element 26 having an anti-ferroelectric film 22 and a pair of electrodes 24a, 24b formed on a first principal surface (front surface) of the anti-ferroelectric film 22, a vibrating section 18 f...
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JP2007066729A |
To reduce an operating time for switching electric contacts in comparison to a thermally driven device for switching electric contacts.A device for switching contacts comprises: a semiconductor substrate 1 which has a container 2 for con...
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JP2007066737A |
To provide a normally closed electric contact switching device with high responsiveness.The electric contact switching device is provided with a silicon substrate 1, a glass substrate 7 attached to the silicon substrate 1 while covering ...
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JP2007066727A |
To reduce an opeating time for switching electric contacts in comparison to a thermally driven device for switching electric contacts.A device for switching electric contacts comprises: a semiconductor substrate 1 which has a container 2...
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JP2007066733A |
To provide an electric contact switching device in which a conductive fluid is easily contained in a container.A container 2 comprises: a cavity 2a, a volume of which is reduced by deformation of a diaphragm 1b; a groove 2b, a cross-sect...
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JP2007035620A |
To provide a method for reducing or eliminating formation of an oxide which becomes hindrance in manufacturing or operation, in regard to a fluid switch.This method comprises (i) a step providing a switching fluid on a first substrate un...
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JP2007026804A |
To provide a micromachine switch that can be manufactured easily with improved yields, and can reduce voltage required for operating the switch, and to provide a manufacturing method of the micromachine switch.The manufacturing method of...
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JP2007005635A |
To provide a semiconductor device comprising an actuator capable of laterally generating a large displacement.The semiconductor device comprises a beam part 11 extending in a first direction with its one end fixed by a supporting part 13...
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JP2006331742A |
To provide an electromechanical switch capable of responding to switching at a high speed with a low drive voltage.An electromechanical switch body 10, which is a MEMS switch has a first movable electrode 14 and a second movable electrod...
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JP2006326834A |
To provide an improved in-site cap for an integrated circuit device including a micro machine device, a method for manufacturing the in-site cap, and provide such a cap and a method of using a basic IC circuit manufacturing process for m...
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JP2006526871A |
Nanoelecttomechanical switch systems (NEMSS) that are structured around the mechanical manipulation of nanotubes are provided. Such NEMSS can realize the functionality of, for example, automatic switches, adjustable diodes, amplifiers, i...
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