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WO/2004/072335A2 |
Electro-mechanical switches and memory cells using vertically-disposed nanofabric articles and methods of making the same are described. An electro-mechanical device, includes a structure having a major horizontal surface and a channel f...
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WO/2004/064096A1 |
The invention concerns a micro-mechanical switch comprising a deformable bridge (1), attached by its ends to a substrate (2), and actuating means (3) for deforming the deformable bridge so as to establish an electrical contact between a ...
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WO/2004/061882A1 |
In a switching scheme mechanical MEMs switches are connected in parallel with solid state switches. This parallel MEMs/solid-state switch arrangement takes advantage of the fast switching speeds of the solid state switches as well advant...
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WO/2004/059378A2 |
A backplane for an electro-optic display comprises a pixel electrode (104), a voltage supply line (C) arranged to supply a voltage to the pixel electrode (104), and a micromechanical switch (106, 112) disposed between the voltage supply ...
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WO/2004/059680A1 |
A capacitive type MEMS switch (10) having a conductor arrangement comprised of first and second RF conductors (12, 13) deposited on a substrate (14). A bridge member (21) having a central enlarged portion (16) is positioned over the cond...
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WO/2004/059679A1 |
A MEMS switch with a bridge having three symmetric arms each having one end connected to a support arrangement and another end integral with a common central bridge portion. First and second conductors are deposited on a substrate, with ...
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WO/2004/054088A2 |
Method for driving an array of micro-electro mechanical system (MEMS) devices, said array providing a plurality of logical or memory states at it output, wherein the MEMS devices are given a characteristic hysteresis curve differing from...
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WO/2004/051687A1 |
The invention relates to an electrostatic microswitch which is intended to connect electrically two strip conductors which are disposed on an insulating support (21). According to the invention, the two strip conductors are connected ele...
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WO/2004/051688A1 |
The invention relates to an electrostatic microswitch which is intended to connect two strip conductors (4, 5) which are disposed on a support. According to the invention, the two strip conductors are connected by means of a contact pad ...
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WO/2004/046807A1 |
The invention relates to a miniature electro-optic device comprising: a first zone which is disposed face-to-face with a second zone; a first capacitor plate; a second capacitor plate which is disposed in the second zone and which is sma...
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WO/2004/047216A2 |
A broadband multiple input, multiple output switch matrix. The switch matrix comprises multiple crosspoint switch element tiles. Each tile comprises RF MEMS switches disposed on a substrate to provide a crosspoint switching capability. T...
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WO/2004/046019A1 |
The invention relates to a miniature relay comprising: a first zone which is disposed face-to-face with a second zone; a first capacitor plate (3); a second capacitor plate (9) which is disposed in the second zone and which is smaller th...
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WO/2004/038819A2 |
A piezoelectric switch for tunable electronic components comprises piezoelectric layers (110, 111), metal electrodes (112, 113, 114, 115) alternated with the layers and contact pads.(119, 120) Cross voltages are applied to the electrodes...
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WO/2004/038751A1 |
A micromechanical relay is made by surface micromachining techniques. It includes a metallic cantilever beam deflectable by an electrostatic field and a beam contact connected to the beam and electrically insulated from the beam by an in...
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WO/2004/030005A1 |
The invention relates to micro-systems micro-electromechanical systems (MEMS), i.e. electrostatically actuated micro-switches used in electronics in order to carry out switching functions or commutating functions, especially in relation ...
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WO2002073673A9 |
A micro-electro-mechanical switch (10(1)) including at least one portion of a conductive line (16(1-2)) in the chamber (12), a beam (18) with an imbedded charge, and control electrodes (22(1-2)). The beam (18) has a conductive section (2...
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WO2002067293A9 |
The microelectromechanical system (MEMS) analog isolator (10) or digital isolator (210) may be created in which an actuator (12, 212) such as an electrostatic motor (66, 68) drives a beam (20, 220) against an opposing force set or predef...
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WO/2004/025676A2 |
A micromechanical switch formed on the top of a fabrication substrate, by deposition of a stressed material which flexes either toward or away from the substrate surface in order to relieve the stress in the material. The switch operates...
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WO/2004/021383A2 |
A switch structure having multiple contact surfaces that may contact each other. One or more of the contact surfaces may be coated with a resilient material such as diamond.
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WO/2004/021382A2 |
In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control e...
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WO/2004/019362A1 |
A micro-electromechanical (MEM) RF switch provided with a deflectable membrane (60) activates a switch contact or plunger (40). The membrane incorporates interdigitated metal electrodes (70) which cause a stress gradient in the membrane ...
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WO/2004/017350A1 |
A microelectromechanical system (MEMS) switch that includes a signal contact (78), an actuation electrode (76) and a beam (80) that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact inclu...
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WO/2004/015728A1 |
This invention is a new type of relay that incorporates the functional combination of multimorph actuator elements with electrostatic state holding mechanisms in the development of a micromachined switching device. This combination of el...
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WO/2004/015729A1 |
This invention is a new type of relay that incorporates the functional combination of multimorph actuator elements with electrostatic state holding mechanisms in the development of a micromachined switching device. This combination of el...
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WO/2004/013039A2 |
A method is provided for making a MEMS structure (69). In accordance with the method, a CMOS substrate (51) is provided which has interconnect metal (53) deposited thereon. A MEMS structure is created on the substrate through the plasma ...
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WO/2004/013898A2 |
A MEMS switch includes a micro-machined monolithic layer (122) having, a seesaw (52), a pair of torsion bars (66a, 66b), and a frame (64). The frame (64) supports the seesaw (52) for rotation about an axis (68) established by the torsion...
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WO/2004/006295A2 |
A MEMS switch assembly comprising a substrate (110) and a resilient switching member (106) is provided. The resilient switching member comprises a transverse torsion member (126) having a flexible portion, and a leaf spring and cantileve...
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WO/2003/107372A1 |
A micro-electromechanical switch (MEMS) having a deformable elastomeric element (1) which exhibits a large change in conductivity with a small amount of displacement. The deformable elastomeric element (1) is displaced by an electrostati...
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WO/2003/105174A1 |
An adjustable impedance matching network comprising passive elements (2, 4, 10, 12) and at least a pair of micro-electromechanical switch-assemblies (6, 8, 14, 16), said switch-assemblies (6, 8, 14, 16) being connected to the passive ele...
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WO/2003/105175A1 |
A high isolation switch capable of responding at a high rate at a lower DC potential. The switch employs a microstructure group (103) consisting of microstructures (102a, 102b, 102c) and moves each microstructure (102a, 102b, 102c) sligh...
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WO/2003/102989A1 |
A MEMS switch having spaced-apart RF conductors on a substrate with a bridge structure disposedabove the substrate. In one embodiment the bridge structure has two flexible arms supported by twosupport members and in another embodiment th...
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WO/2003/096368A1 |
A micro-electro-mechanical (MEMS) switch (10, 110) has an electrode (22, 122) covered by a dielectric layer (23, 123), and has a flexible conductive membrane (31, 131) which moves between positions spaced from and engaging the dielectric...
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WO/2003/095356A2 |
A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) ...
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WO/2003/091486A1 |
Methods of Using Preformed Nanotubes to Make Carbon Nanotube films, Layers, Fabrics, Ribbons, elements and Articles are disclosed. To make various articles, certain embodiments provide a substrate (12). Preformed nanotubes are applied to...
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WO/2003/083886A1 |
The present invention relates to a switch device (10) comprising a first actuation electrode (11) and a second actuation electrode (12) and a first contact electrode (16) and a second contact electrode (17), the first actuation electrode...
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WO/2003/078299A1 |
The invention concerns a process for manufacturing a Micro-Electro-Mechanical-System (MEMS) comprising the use of a sacrificial layer, the process being characterized by the fact that the sacrificial layer is made of silicon.The inventio...
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WO/2003/078305A1 |
The present invention relates to a nanotube device ( 100,600), comprising a nanotube with a longitudinal and a lateral extension, a structure for supporting at least a first part of the nanotube, and first means for exerting a force upon...
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WO/2003/079384A2 |
An actuator (100) taking advantage of ponderomotive forces to enhance its electromechanical performance as a function of input energy. An actuator (100) may include a first conductive layer (102) residing on a first electret layer (101)....
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WO/2003/069645A1 |
The invention relates to a method for producing a microswitch-type micro component, according to which the following steps are carried out on top of a signal propagation track and two co-planar ground tracks which are applied on a substr...
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WO/2003/069646A1 |
Microswitch, comprising a base element (G) with a contact surface (KG) and an electrode (EG), and a switching element (S) with a contact surface (KS) and an electrode (ES) disposed opposite the electrode (EG) of the base element (G) at a...
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WO/2003/061107A2 |
Disclosed is a capacitor-type actuator including two conductive plates (10, 10’) defining a space between them where one conductive plate (10’) is moveable and the other is not. A dielectric (12) is disposed in the space between the ...
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WO/2003/059805A2 |
Resonators 4 and 5 are able to oscillate horizontally and vertically to substrate 1. Resonator 4 is primarily composed of a supporting portion in stationary contact with substrate 1, a movable portion including a contact surface making c...
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WO/2003/060940A1 |
The invention relates to a micro-electromechanical system comprising a substrate (S) and at least two micro-elements (1, 2), of which a first one is a switchable bistable. The micro-elements (1, 2) comprise surfaces (3a, 4a) facing each ...
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WO/2003/058730A1 |
Methods of producing an electromechanical circuit element are described. A lower structure (103) having lower support structures and a lower electrically conductive element is provided. A nanotube ribbon (10) (or other electromechanicall...
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WO/2003/058652A2 |
Three trace electromechanical circuits and methods of using same are described. A circuit includes first and second electrically conductive elements with a nanotube ribbon (or other electromechanical elements) disposed therebetween. The ...
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WO/2003/054938A1 |
A method of fabricating micro-electromechanical switches (MEMS) using a process starting with a copper damascene interconnect layer, made of metal conductors inlaid in a dielectric (150). All, or portions, of the interconnects are recess...
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WO/2003/043044A1 |
A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from...
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WO/2003/043038A2 |
According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap...
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WO/2003/042721A2 |
A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conducti...
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WO/2003/043095A2 |
An anchor system for securing a MEMS device (10) to a substrate comprising multiple anchors (30). A MEMS structure, built in accordance with the one embodiment of the invention, comprises a flexible beam (15) suspended over a substrate (...
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