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WO/2019/129720A1 |
The field of the invention is that of RF-MEMS switches including a flexible membrane (1) positioned above a control electrode (2). The membrane and the control electrode of the switch according to the invention are made of ferromagnetic ...
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WO/2019/122896A1 |
A micro or nano electromechanical relay device (10) comprising a source electrode (204) an electrically conductive beam (202) comprising an arcuate portion (12a) coupled to the source electrode by an arm portion, first and second drain e...
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WO/2018/160732A1 |
Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to ...
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WO/2018/115226A1 |
Disclosed are systems and methods of operation for capacitive radio frequency micro-electromechanical switches, such as CMUT cells for use in an ultrasound system. An RFMEMS may include substrate, a first electrode connected to the subst...
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WO/2018/063814A1 |
The present disclosure generally relates to the design of a MEMS ohmic switch which provides for a low-impact landing of the MEMS device movable plate on the RF contact and a high restoring force for breaking the contacts to improve the ...
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WO/2018/028947A1 |
The invention relates to a switch cell comprising a semiconductor switch element (6), a micro-electromechanical switch element (8) (MEMS), and an electronic actuation circuit (10), the semiconductor switch element (6) and the micro-elect...
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WO/2017/203141A1 |
The subject of the invention is a micro-electromechanical-system (MEMS) switch (1) formed in a substrate (2) and comprising a first RF signal line (3) and a second RF signal line (4), a deformable membrane (5), an activating means (7) co...
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WO/2017/198943A1 |
The present invention relates to a radio frequency micro-electromechanical switch (generally referred to using the acronyms RF MEMS) as well as to a method allowing such a switch to be produced.
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WO/2017/189806A1 |
A microelectromechanical resonant switch ("resoswitch") converts received radio frequency (RF) energy into a clock output. The resoswitch first accepts incoming amplitude- or frequency- shift keyed clock-modulated RF energy at a carrier ...
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WO/2017/153773A1 |
A electromechanical relay device (100) comprising a source electrode (102), a beam (104) mounted on the source electrode at a first end and electrically coupled to the source electrode; a first drain electrode (112) located adjacent a se...
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WO/2017/145175A3 |
Embodiments herein provide a method of varying resonant frequency in a capacitance type radio frequency (RF) Micro-Electro-Mechanical System (MEMS) switch. The method includes encapsulating a dielectric layer in the MEMS switch with a fl...
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WO/2017/134518A1 |
Microelectromechanical systems (MEMS) switches are described. The MEMS switches can be actively opened and closed. The switch can include a beam coupled to an anchor on a substrate by one or more hinges. The beam, the hinges and the anch...
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WO/2017/123816A1 |
Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively. Such a system, apparatus, and method may include article components placed on a platform...
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WO/2017/087340A1 |
The present invention generally relates to a mechanism for making the anchor of the MEMS switch more robust for current handling.
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WO/2017/087336A1 |
The present disclosure generally relates to a mechanism for making a MEMS switch that can switch large electrical powers. Extra landing electrodes are employed that provide added electrical contact along the MEMS device so that when in c...
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WO/2017/087342A1 |
A MEMS switch contains an RF electrode 102, pull-down electrodes 104 and anchor electrodes 108 located on a substrate 101. A plurality of islands 226 are provided in the pull-down electrode and electrically isolated therefrom. On top of ...
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WO/2017/087338A1 |
The present disclosure generally relates to the combination of MEMS intrinsic technology with specifically designed solid state ESD protection circuits in state of the art solid state technology for RF applications. Using ESD protection ...
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WO/2017/087341A1 |
The present disclosure generally relates to a MEMS device for reducing ESD. A contacting switch is used to ensure that there is a closed electrical contact between two electrodes even if there is no applied bias voltage.
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WO/2017/069861A1 |
A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit. An auxiliary circuit is coupled in parallel with the MEMS switching circuit, the auxiliary circuit comprising first and second connections th...
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WO/2017/070103A1 |
A switching system includes a control circuit that receives On-Off signals indicative of a desired operating state of a switch. The control circuit includes an oscillator that generates a first electrical pulse responsive having a first ...
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WO/2017/070086A1 |
A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit, and an auxiliary circuit coupled in parallel with the MEMS switching circuit that comprises solid state switching circuitry. A control circui...
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WO/2017/066436A2 |
A zero power sensor node includes a sensor suite including two or more different types of zero power sensors, particularly including at least two of a zero power PZT-bimorph accelerometer, a zero power PZT-bimorph rotation sensor, a zero...
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WO/2017/066436A3 |
A zero power sensor node includes a sensor suite including two or more different types of zero power sensors, particularly including at least two of a zero power PZT-bimorph accelerometer, a zero power PZT-bimorph rotation sensor, a zero...
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WO/2016/207834A1 |
Embodiments in accordance of a torsional resonant sensor disclosure is configured to actuate a beam structure using electrostatic actuation with an AC harmonic load (e.g., AC and DC voltage sources) that is activated upon detecting a par...
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WO/2016/203369A1 |
A microelectromechanical system (MEMS) switch with liquid dielectric and a method of fabrication thereof are provided. In the context of the MEMS switch, a MEMS switch is provided including a cantilevered source switch, a first actuation...
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WO/2016/185808A1 |
[Problem] To provide a contact structure for electronic devices, which is capable of maintaining stable impact resistance. [Solution] Provided is a contact structure which is provided with: a semiconductor substrate serving as a base par...
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WO/2016/140752A1 |
A MEMS switch includes a substrate and a switch structure formed on the substrate, with the switch structure further including a conductive contact formed on the substrate, a self-compensating anchor structure coupled to the substrate, a...
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WO/2016/126517A1 |
The present disclosure generally relates to a MEMS DVC utilizing one or more MIM capacitors located in the anchor of the DVC and an Ohmic contact located on the RF-electrode. The MIM capacitor in combination with the ohmic MEMS device en...
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WO/2016/121214A1 |
This electrostatic actuator is provided with: a base section; a movable electrode, which is configured by including a semiconductor, and is supported to the base section such that the movable electrode can be displaced in the first direc...
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WO/2016/102827A1 |
The invention relates to a microelectromechanical or nanoelectromechanical device (1A) which includes a membrane (3), supported above a substrate (2), separated from same, and at least one electrostatic actuating electrode (5 or 5'), for...
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WO/2016/089504A1 |
An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or...
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WO/2016/086998A1 |
A MEMS switch comprises a first and a second contact arrangement having a side facing each other, the first and the second contact arrangement movable with respect to each other and configured for providing an electric contact in a first...
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WO/2016/086997A1 |
A MEMS comprises a stack comprising a first layer and a second layer having sides facing each other. The first layer and the second layer are attached to each other by a contact material at opposing contact regions of the sides of the fi...
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WO/2016/062956A1 |
The present invention relates to a switch (1) of a microelectromechanical system, said switch including: - a signal input line (4); - a signal output line (5); - a conductive membrane (2) that is capable of changing shape when conductive...
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WO/2016/047011A1 |
To make it possible to quickly perform switching operations of a switch. According to one embodiment of the present technology of a switch device, a movable electrode has a first movable electrode piece, a second movable electrode piece,...
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WO/2016/038794A1 |
[Problem] To provide an electrostatic device in which device characteristics can be improved. [Solution] The electrostatic device according to an embodiment of the present art is provided with an electroconductive substrate, a first cond...
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WO/2015/200307A2 |
A system includes a plurality of micro-electromechanical switches including a plurality of gates, coupled to each other. Each micro-electromechanical switch includes a beam electrode disposed on a substrate. A beam includes an anchor por...
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WO/2015/200307A3 |
A system includes a plurality of micro-electromechanical switches including a plurality of gates, coupled to each other. Each micro-electromechanical switch includes a beam electrode disposed on a substrate. A beam includes an anchor por...
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WO/2015/183841A1 |
A switchable capacitor (100) including a first electrode (104), a dielectric layer (110) on the first electrode (104), a second electrode (106) configured to be suspended in an undeflected position over the dielectric layer (110) in a de...
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WO/2015/161026A1 |
Microelectromechanical systems (MEMS) having contaminant control features. In some embodiments, a MEMS die can include a substrate and an electromechanical assembly implemented on the substrate. The MEMS die can further include a contami...
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WO/2015/153781A1 |
The present subject matter relates to systems, devices, and methods for reducing surface dielectric charging in a RF MEMS actuator element. In particular, a micro-electro-mechanical systems (MEMS) can comprise a fixed electrode positione...
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WO/2015/094184A1 |
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectrome...
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WO/2015/095164A2 |
This disclosure provides systems, methods, and apparatus for providing a crosspoint switch used in an optical fiber data network. The crosspoint switch can switch optical signals received from any of a plurality of input optical fibers t...
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WO/2015/050761A1 |
The present invention generally relates to a MEMS device and a method of manufacture thereof. The RF electrode, and hence, the dielectric layer thereover, has a curved upper surface that substantially matches the contact area of the bott...
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WO/2015/038873A1 |
A Microelectromechanical systems (MEMS)-based N x M cross-point switch, a MEMS-based system, and a method provide MEMS-based cross-point electrical switching for a Layer 0 flow- based switch. The N x M cross-point switch includes N input...
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WO/2015/031473A1 |
The present invention generally relates to an RF MEMS DVC and a method for manufacture thereof. To ensure that undesired grain growth does not occur and contribute to an uneven RF electrode, a multilayer stack comprising an AlCu layer an...
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WO/2015/030898A3 |
A circuit of N micromechanical resonant switches (resoswitches) is presented, which mimics a Dickson charge pump to amplify an input voltage to an output voltage of N plus 1 times the input voltage, while avoiding the diode voltage drop ...
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WO/2015/030898A2 |
A circuit of N micromechanical resonant switches (resoswitches) is presented, which mimics a Dickson charge pump to amplify an input voltage to an output voltage of N plus 1 times the input voltage, while avoiding the diode voltage drop ...
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WO/2015/017743A1 |
The present invention generally relates to a MEMS DVC utilizing one or more MIM capacitors. The MIM capacitor may be disposed between the MEMS device and the RF pad or the MIM capacitor may be integrated into the MEMS device itself. The ...
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WO/2015/009360A1 |
The present invention generally relates to a MEMS DVC. The MEMS DVC has an RF electrode and is formed above a CMOS substrate. To reduce noise in the RF signal, a poly-resistor that is connected between a waveform controller and the elect...
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