Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 1,017,126

Document Document Title
WO/2018/221090A1
To address the problem of preventing workpiece damage and resin flash, this resin molding mold (10) is for resin-molding a workpiece (W) in which a plurality of second members (Wb) have been mounted on a single first member (Wa), the res...  
WO/2018/220920A1
The present invention provides a technology which is capable of suppressing noise charges. According to the present invention, each unit pixel (10) is provided with: a photodiode unit (130); a first charge transfer unit (103A); a charge ...  
WO/2018/222404A1
Embodiments of methods for creating small via polymer openings on a substrate are provided herein. In some embodiments, methods of processing a substrate include depositing a polymer layer atop the substrate to cover an exposed conductiv...  
WO/2018/218849A1
Disclosed is a rotational eutectic soldering station for chips, the soldering station comprising a base plate (30), wherein a nozzle movable platform and a soldering station movable platform are fixed on the base plate, the nozzle movabl...  
WO/2018/222614A1
Embodiments of the disclosure generally relate to a method of processing a semiconductor substrate at a temperature less than 250 degrees Celsius. In one embodiment, the method includes loading the substrate with the deposited film into ...  
WO/2018/220269A1
The invention concerns a method of manufacturing a modulated optically diffractive grating and a corresponding grating. The method comprises providing a substrate and manufacturing a plurality of temporary elements onto the substrate, th...  
WO/2018/219138A1
An array substrate and a preparation method therefor, and a display device, which relate to the technical field of display, and are used for reducing the probability of a signal line located at a top layer being broken at a climbing posi...  
WO/2018/221260A1
Provided is a magnetic sensor having enhanced accuracy or reliability. The magnetic sensor is equipped with a first magnetism detection element that outputs a first detection signal, a second magnetism resistance detection element that o...  
WO/2018/222613A1
Methods and systems for estimating values of process parameters, structural parameters, or both, based on x-ray scatterometry measurements of high aspect ratio semiconductor structures are presented herein. X-ray scatterometry measuremen...  
WO/2018/218373A1
A method of depositing a lateral pattern of a deposition material onto a substrate. The method comprises fabricating a laterally patterned deposition surface on the substrate having one or more deposition regions and one or more non-depo...  
WO/2018/218986A1
A thin film transistor manufacturing method, a thin film transistor and a display substrate. The manufacturing method comprises: sequentially forming, on a base substrate (31), a polycrystalline silicon pattern layer (34) and a protectio...  
WO/2018/219034A1
A thin film transistor, a manufacturing method therefor, an array substrate, and a display device. The thin film transistor comprises: a first electrode (6), a gate electrode (3), an active layer (10), a source/drain electrode (4), and a...  
WO/2018/222680A1
Embodiments of the disclosure relate to methods of selectively depositing or etching conductive materials from a substrate comprising conductive materials and nonconductive materials. More particularly, embodiments of the disclosure are ...  
WO/2018/221054A1
A crystal laminate comprising: a crystal substrate that comprises a single crystal of a group III nitride indicated by compositional formula InxAlyGa1–x–yN (0 ≤ x ≤ 1, 0 ≤ y ≤ 1, and 0 ≤ x + y ≤ 1), said crystal substrate...  
WO/2018/220796A1
In order to reduce the dimensions of an electrode pattern while suppressing the occurrence of defects and the like, this method of manufacturing a semiconductor device is provided with: a step for applying a resist on an upper surface (1...  
WO/2018/222430A2
A substrate processing system includes a processing chamber. A pedestal is arranged in the processing chamber. An edge coupling ring is arranged adjacent to the pedestal and around a radially outer edge of the substrate. An actuator is c...  
WO/2018/222771A1
Embodiments of the disclosure generally relate to a method for dry stripping a boron carbide layer deposited on a semiconductor substrate. In one embodiment, the method includes loading the substrate with the boron carbide layer into a p...  
WO/2018/219101A1
A back metal capacitor structure of a compound semiconductor and a manufacturing method therefor. The MIM capacitor is manufactured in a heat dissipation connecting port, penetrating through the front and back surfaces, of a substrate. A...  
WO/2018/222915A1
A method of producing a micro-device or a nano-device having at least one layer with a sub-lithographic two-dimensional pattern is described herein. The method includes providing a substrate comprising a substructure and a hard mask laye...  
WO/2018/219545A1
The invention relates to a device for drying a semiconductor wafer (1), wherein the device has at least one generation unit (3) for generating surface acoustic waves, the generation unit (3) has at least one application unit (4) for appl...  
WO/2018/220998A1
Provided is a semiconductor device comprising a first semiconductor chip (10) and a second semiconductor chip (20) that are disposed so as to face each other. The first semiconductor chip (10) has a first connection part (13) provided in...  
WO/2018/219232A1
A spin coating device and method. The spin coating device comprises a rotary shaft (3) which is rotatable itself, and a sucker (2) fixed on an end portion of the rotary shaft (3), an electromagnetic induction device being provided below ...  
WO/2018/218906A1
The invention discloses quick sample preparation equipment for solar battery luminous decay test. The equipment comprises an upper electrode plate (1), a telescopic pressing rod (2) for supporting the upper electrode plate (1), a sliding...  
WO/2018/221149A1
The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the f...  
WO/2018/222492A1
Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that ca...  
WO/2018/220931A1
An inspection system 1 is provided with: a light source 33; a mirror 40b; Galvano mirrors 44a, 44b; a housing 32 in which the mirror 40b and the Galvano mirrors 44a, 44b are held and which has a mounting part 46 for having an optical ele...  
WO/2018/221854A1
According to one embodiment, a rotary clamping device can comprise: a base; a clamp holder capable of performing a translational motion and a rotational motion relatively to the base; a clamp, which is disposed at the clamp holder, for c...  
WO/2018/220491A1
Provided is a novel semiconductor device in which a storage circuit is constituted by a unipolar circuit that uses OS transistors. Thus, connections with different layers inside the storage circuit are unnecessary. Consequently, the numb...  
WO/2018/221379A1
The support substrate according to the present disclosure is a plate-shaped ceramic body having a first surface and a second surface that is located on the reverse side of the first surface. The arithmetic surface roughness Ra of the fir...  
WO/2018/221357A1
The present invention addresses the problem of providing a ceria-based composite particle dispersion which is capable of performing polishing at high speed, even for silica films, Si wafers, and difficult to process materials, and which ...  
WO/2018/221166A1
A second gas discharge part 81 is provided closer to an axis line P1 than six support pins 13 installed around the axis line P1, and on the outer peripheral side of a substrate W, when the substrate W, which is held with a spin chuck 2, ...  
WO/2018/221290A1
A gettering layer forming device for forming a gettering layer on a substrate has: a substrate holding part that holds the substrate; a lapping film that contacts the substrate held in the substrate holding part and polishes said substra...  
WO/2018/220819A1
The purpose of the present invention is to provide a semiconductor element bonding board, a semiconductor device, and a power conversion device that suppress occurrence of shrinkage cavities when a semiconductor element is bonded to a bo...  
WO/2018/220470A1
Provided is a comparison circuit to which a negative voltage to be compared can be input directly. The comparison circuit includes a first input terminal, a second input terminal, a first output terminal, and a differential pair. The com...  
WO/2018/220741A1
Provided is a technique for obtaining sufficiently large drain current in a field effect type transistor using a nitride semiconductor. The invention involves: forming on the upper surface of a semiconductor substrate 1, a channel layer ...  
WO/2018/221067A1
The present invention provides an exhaust gas detoxification method and a device therefor that can minimize the use of a nitrogen gas for dilution and have superior energy usage efficiency. Namely, the present invention is an exhaust gas...  
WO/2018/220868A1
A semiconductor device comprising a semiconductor element having a plated part on a portion of a bottom surface, and a protective member for sealing the surface other than the bottom surface of the semiconductor element, the plated part ...  
WO/2018/221711A1
The present invention provides a low-resistance nitride compound semiconductor which has been difficult to manufacturing in the past. Furthermore, high electron mobility is shown, and therefore it is possible to configure a high-performa...  
WO/2018/222635A1
A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a pr...  
WO/2018/220271A1
The invention concerns a method of manufacturing a height-modulated optically diffractive grating. The method comprises providing a substrate and manufacturing a plurality of temporary elements of first material onto the substrate, the e...  
WO/2018/221412A1
The present invention is a substrate-accommodating container (1) comprising an annular packing (30) provided between a container body (10) for accommodating a substrate and a lid body (20). In the container body (10), a sealing surface (...  
WO/2018/219424A1
According to an aspect of the present disclosure, a method for processing substrates is provided that includes providing a substrate loading stack arrangement including a multitude of substrates, unloading the multitude of substrates fro...  
WO/2018/219131A1
Provided are a manufacturing method for a display substrate, the display substrate, and a display device. The display substrate comprises a substrate (1) and also comprises a first insulating graphic layer (3), a first metal graphic laye...  
WO/2018/222215A1
A method and apparatus for thermally processing a substrate is described. The apparatus includes a thermal processing chamber having an interior volume which includes a top portion and a side wall. The apparatus also include a getter ass...  
WO/2018/218880A1
A method for manufacturing an array substrate, and an array substrate and a display apparatus. The method for manufacturing an array substrate comprises: providing a base substrate (200); forming a semiconductor layer (213) on the base s...  
WO/2018/221436A1
A sample holder 10 according to the present disclosure is provided with: a ceramic body 1 which has a sample holding surface 11 on one main surface thereof; and a heating resistor 2 which is provided on the other main surface of the cera...  
WO/2018/221504A1
An aluminum nitride-based sintered compact 1 includes: crystalline particles 2 of Mg-containing aluminum nitride; a composite oxide which has a Garnet type crystal structure and contains a rare earth element and Al; and a composite oxyni...  
WO/2018/222381A1
A method for etching features into a porous low-k dielectric etch layer is provided. A plurality of cycles is performed in a plasma processing chamber. Each cycle comprises a deposition phase and an activation phase. The deposition phase...  
WO/2018/218712A1
A low-temperature polysilicon thin film transistor (TFT) substrate and a manufacturing method therefor. The method comprises: on a substrate (100), sequentially forming a light-shielding portion (111), a buffer layer (12) and an island p...  
WO/2018/221868A1
The present invention relates to a method for manufacturing a ceramic heater, and the method for manufacturing a ceramic heater of the present invention comprises the steps of: molding, between a first ceramic blocking layer and a second...  

Matches 1 - 50 out of 1,017,126