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JP5291859B2 |
The bolometer has an absorbing membrane (1) fixed, by two thermal insulating support units, on a front side of a substrate (2) having two connection terminals (3) integrated with bases of respective posts (8). Each unit has a bridge with...
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JP2013179322A |
To provide a thermoelectric conversion material which is not weathered, and exhibits high thermoelectric conversion characteristics stably at about 300-600°C, while having high physical strength and excellent durability, stability and r...
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JP2013171020A |
To provide a thermal electromagnetic wave detecting element which is easy to manufacture.A thermal electromagnetic wave detecting element 1 includes: a detection part 5 having a bottom electrode 511 and an upper electrode 513; a base pla...
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JP5267967B2 |
The invention relates to a spin current thermal conversion device and a thermoelectric conversion device, with which a spin current is thermally generated, and its concrete application is realized. A temperature gradient creating means w...
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JP2013160708A |
To provide a pyroelectric detector, a pyroelectric detection device and an electronic apparatus that enhance pyroelectric effect of a pyroelectric detection element in a pyroelectric material and can improve detection accuracy.A pyroelec...
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JP5260890B2 |
To provide a method for manufacturing a sensor device capable of improving yield of a bonding process for bonding a sensor substrate having a thermal type infrared radiation detection section formed thereon with a package substrate and p...
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JP5259430B2 |
In an infrared sensor (1) having a bolometer element (11) and a reference element (21), the reference element (21) comprises a bolometer film (22), a substrate-side insulating film (31) formed on the substrate-side surface of the bolomet...
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JP5256321B2 |
To provide a radiation detector that generates large thermo-electromotive force and a method for detecting electromagnetic wave using the same.A method for detecting electromagnetic force, comprises: preparing a radiation detector includ...
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JP5255873B2 |
An infrared detector 1 by having a bolometer element 11 and a reference element 21 is provided with a bolometer thin film 22 supported on a surface of a substrate 10 while spaced apart from the surface of the substrate 10, a metal film 2...
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JP2013148493A |
To realize heat radiation control with high reliability in a terahertz camera and an electronic apparatus using the terahertz camera.A non-contact type thermal switch is employed for a terahertz camera. A supporting member including an e...
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JP2013148492A |
To provide a terahertz camera and an electronic apparatus, having a heat collector structure with high heat conduction efficiency, for detecting terahertz waves at frequencies of 100GHz or more and 30THz or less.A terahertz camera includ...
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JP2013148489A |
To provide a pyroelectric light detection device that can suppress noise due to power source variations even when pyroelectric currents are output from a plurality of pyroelectric elements, and further to provide an electronic apparatus....
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JP2013148444A |
To provide a terahertz camera and an electronic apparatus which enable electromagnetic waves that are not directly incident on an electromagnetic wave absorber to contribute to electromagnetic waves detection, so as to improve detection ...
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JP5250743B2 |
An improved method and apparatus for thermal-to-electric conversion involving relatively hot and cold juxtaposed surfaces separated by a small vacuum gap wherein the cold surface provides an array of single charge carrier converter eleme...
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JPWO2011145295A1 |
A polymer film (102) is formed on the substrate (101), a thermistor resistor (106) is formed on the polymer film (102), and a light reflecting film (104) is formed between the thermistor resistor (106) and the substrate (101). Has been d...
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JPWO2011135975A1 |
In the SiGe laminated thin film in which at least one Si layer and one or more Ge layers are alternately laminated on the substrate 1, the thicknesses of the Si layer 31 and the Ge layer 22 are in the range of 5 to 500 nm, respectively. ...
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JP5240373B2 |
To provide a pyroelectric photodetector having a structure allowing an incidence of light in a pyroelectric photodetection element while preventing easy intrusion of reducing gas.A pyroelectric photodetector 200 includes: a pyroelectric ...
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JP2013134080A |
To provide a terahertz camera additionally using a pyroelectric detector that detects a terahertz wave having wavelength of 100-1000 μm, reflecting a detection principle that polarization quantity of a pyroelectric body material changes...
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JP5218460B2 |
A pyroelectric detector (200) includes a pyroelectric detection element (220), a support member (210), a fixing part (100) and a first reducing gas barrier layer (140, 280). A first side of the support member faces a cavity (102) and the...
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JPWO2011101938A1 |
The present invention provides an infrared sensor capable of detecting a plurality of different types such as temperature detection and gas detection with a simple configuration, and capable of miniaturization and cost reduction. The inf...
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JP5207620B2 |
To provide a low-cost power generation device used for generating charge with temperature change, high in power generation efficiency, having power generation performance hardly adversely affected even by a use temperature condition, and...
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JP2013113692A |
To provide an infrared sensor which has such excellent heat resistance as to perform e.g., reflow packaging.An infrared sensor 1 comprises a pyroelectric layer 10 and a pair of electrodes 11a, 11b. The pyroelectric layer 10 is comprised ...
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JP2013520008A |
A structure and method for transferring electronic charge or heat or light between substrates. The structure includes first and second substrates separated from one another and a plurality of localized spacers connecting the first and se...
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JP2013096786A |
To increase a detection output of a pyroelectric photodetector.A pyroelectric photodetector comprises: a substrate 10; a support member 215 supported on the substrate; and a pyroelectric photodetecting element 251 formed in contact with ...
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JP2013092389A |
To provide a pyroelectric infrared detection element capable of detecting infrared radiation without repolarization, a pyroelectric infrared imaging element, and a pyroelectric infrared imaging device.A pyroelectric infrared detection el...
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JP5174995B2 |
A pyroelectric element 10 includes a pyroelectric substrate 20 being a substrate of lithium tantalate single crystal having an X-axis, a Y-axis, and a Z-axis as crystal axes; front-side electrodes 41 and 42 disposed on a front side of th...
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JP2013057582A |
To provide a method for forming a cavity by etching only a sacrificial film, in a sensor which includes the cavity formed by etching the sacrificial film.A manufacturing method for an infrared sensor includes: an insulating film forming ...
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JP2013057526A |
To provide an infrared sensor whose support part having an infrared detector is positioned at a place facing to a recess and is prevented from adhering to a bottom of the recess.An infrared sensor includes: a substrate 2; an insulating f...
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JP2013044594A |
To provide a pyroelectric infrared sensor capable of heightening output voltage and improving an S/N ratio.A pyroelectric infrared sensor 10 includes plural light receiving parts 3 on one surface side of a diaphragm part 2 provided on on...
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JP2013044595A |
To provide an infrared sensor capable of improving sensitivity without changing a view angle, a number of detection areas, or size.An infrared sensor comprises: a multi-split lens 1 having a plurality of lenses 10 combined on one curved ...
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JP2013044586A |
To provide a pyroelectric infrared detection device that can perform fine adjustment of the light reception quantity of incident energy of infrared radiation from human bodies or the like.A pyroelectric infrared detection device uses a p...
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JP2013038292A |
To provide a logic operation element that outputs heat by using heat as an input.The logic operation element includes at least two thermoelectric elements that performs thermoelectric conversion using a spin orbit interaction and a condu...
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JP5143368B2 |
The detector has a bolometric membrane with a bolometric material layer (6) whose resistivity varies with the temperature. A post (3) positions the membrane and the electrical conductor with respect to a reading circuit. A thermal insula...
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JP2013024745A |
To provide an infrared sensor capable of reducing a variation of the S/N ratio in a plane of an infrared sensor chip caused from the heat generated by an IC chip.The infrared sensor comprises: an infrared sensor chip 100; an IC chip 200;...
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JP2013019857A |
To provide a pyroelectric sensor element which has small heat capacity, high sensitivity, and high responsiveness, which is difficult to cause dielectric breakdown at polarization, and which allows mass production while achieving size re...
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JP5123225B2 |
To provide a package of an infrared sensor element which can prevent a joint of a lid and an infrared transmitting member from being damaged by a difference in a linear expansion coefficient between the lid and the infrared transmitting ...
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JP2013004780A |
To provide a pyroelectric sensor element that has high accuracy and high sensitivity by taking advantage of a niobium oxide-based polycrystalline formed into a thin film, and to provide a detector using the same.A pyroelectric sensor ele...
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JP5106313B2 |
To form an ohmic surface whose interface has small deterioration even in an atmosphere so as to apply a C12A7 electride to an element such as a cold electron emission source and an organic EL. In a method of using a 12CaO-7Al2O3electride...
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JP2012251776A |
To provide a detection device which is adjustable in sensitivity, a sensor device, and an electronic apparatus.The detection device includes a pyroelectric element 10, a sensitivity adjustment circuit 30 which is connected to the pyroele...
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JP2012235092A |
To provide a thermoelectric module which utilizes a thermoelectric element showing spin Seebeck effect.Proposed in a new thermoelectric module comprising: a thermoelectric element formed by a thermoelectric material showing spin Seebeck ...
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JP5054628B2 |
To provide an infrared sensor which includes higher structural stability and is producible in a higher yield, and is capable of raising its sensitivity. A heat insulation section 4 includes a support section 41 which is arranged separate...
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JP2012195514A |
To provide a substrate with elements that has a through electrode including a fine insulation film having high aspect and excellent insulation characteristics without causing migration problems, an infrared sensor, and a through electrod...
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JP2012173142A |
To provide a method for manufacturing a pyroelectric detection element with reduced damage by etching.A method for manufacturing a pyroelectric detection element comprises: a first film formation step of forming and patterning a Sn film ...
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JP2012520576A |
A pyroelectric material is made of lithium tantalate treated to an extent that a bulk resistivity is in a range of less than 2e+14Ω*cm, preferably less than 5e+12Ω*cm, but more than a lower threshold is obtained.
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JP5015170B2 |
A current source and method of producing the current source are provided. The current source includes a metal source, a buffer layer, a filter and a collector. An electrical connection is provided to the metal layer and semiconductor lay...
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JP2012154685A |
To improve the detection sensitivity of a thermal photodetector.A thermal photodetector comprises: a substrate 20; a support member 215 supported with respect to the substrate across a cavity 102; a heat-detecting element 220 formed on t...
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JP5002815B2 |
An integrated device including a sensor and the like formed on a gamma-alumina layer epitaxially grown on a silicon substrate is provided at low cost. This integrated device includes: a silicon substrate; a first function area formed on ...
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JP4994034B2 |
A number of compact, high-efficiency and high-power density thermoelectric systems utilizing the advantages of thermal isolation are described. Such configurations exhibit high system efficiency and power density. Some configurations exh...
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JP4989139B2 |
To provide a thin and small-sized and low-cost infrared detector, capable of easily forming a space for thermal insulation of the infrared detector. The infrared detector A is constituted, enclosing in a circuit block 3 for mounting a py...
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JP4989138B2 |
To provide an infrared detector capable of reducing the number of man-hours and of easily performing examination in a manufacturing process. In this infrared detector A, joining of a power supplying terminal pin 19a and a detection signa...
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