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WO/2019/214943A1 |
The subject disclosure relates generally to a method of implementing magnetic shielding walls with specific respective dimensions to reduce crosstalk between transmission lines in wire-bonds for supercomputing chipsets. In one embodiment...
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WO/2019/217102A1 |
Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the...
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WO/2019/156760A8 |
Techniques for providing hardware-efficient fault-tolerant quantum operations are provided. In some aspects a cavity and an ancilla transmon are used to implement a quantum operation by encoding a logical qubit using more than two energy...
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WO/2019/116103A3 |
A superconducting article includes a substrate and a superconducting metal oxide film formed on the substrate. The metal oxide film including ions of an alkali metal, ions of a transition metal, and ions of an alkaline earth metal or a r...
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WO/2019/198402A1 |
The present invention provides a manufacturing method of a superconducting thin film wire which improves crystallinity and properties of a thin film of a compound comprising elements with very different vapor pressures. The manufacturing...
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WO/2019/099171A3 |
Various fabrication method are disclosed. In one such method, at least one structure is formed on a substrate which protrudes outwardly from a plane of the substrate. A beam is used to form a layer of material, at least part of which is ...
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WO/2019/160715A3 |
A superconductor device includes a high superconductivity transition temperature enhanced from the raw material transition temperature. The superconductor device includes a matrix material and a core material. The enhancing matrix materi...
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WO/2019/195015A1 |
In an example, a system (100) comprises a first optical device (110), a second optical device (120), and an optical modulator (130). The first optical device (110), in a non-cryogenic environment (111), receives a light signal, outputs t...
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WO/2019/156759A3 |
Techniques for implementing robust quantum logic gates are provided and described. In some aspects, a quantum logic gate between a plurality of cavities comprising a first cavity and a second cavity is implemented by performing a first b...
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WO/2019/179731A1 |
A chip surface base device structure (300) comprises a first superconducting material (112) physically coupled to a crystalline substrate (206A, 206B), wherein the crystalline substrate is physically coupled to a second superconducting m...
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WO/2019/179733A1 |
A chip surface base device structure (200) comprises a superconducting material (214A) located on a first side of a substrate (106A, 106B), and a second superconducting material located (104) on a second side of the substrate and stacked...
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WO/2019/180267A1 |
The present disclosure relates to a method for manufacturing of specially designed substrates for growth of nanostructures and patterned growth on said nanostructures. The present disclosure further relates to nanostructures, in particul...
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WO/2019/164591A3 |
Techniques for quantum error correction of a multi-level system are provided and described. In some aspects, techniques for encoding a state of a multi-level quantum system include encoding a quantum information in a two-mode state of tw...
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WO/2019/181200A1 |
A superconductive cable (1) comprises a superconductive cable core (2) and a corrugated pipe (21) that accommodates the superconductive cable core (2). The superconductive cable core (2) has a corrugated pipe (11), a superconductive cond...
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WO/2019/059879A8 |
A stacked device including a first substrate that includes a quantum information processing device, a second substrate bonded to the first substrate, and multiple bump bonds and at least one pillar between the first substrate and the sec...
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WO/2019/179732A1 |
A chip surface base device structure (1100) comprises a substrate (206A, 206B) comprising crystalline silicon that is coupled with a first superconducting layer (104), wherein the first superconducting layer is coupled with a second subs...
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WO/2019/176557A1 |
Provided is a superconducting coil device which is able to reduce the production cost in comparison to conventional superconducting coil devices. A superconducting coil device (100) according to the present invention is provided with a b...
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WO/2019/140031A3 |
In a weak link of two s-wave superconductors (SCs) coupled via a time-reversal-invariant (TRI) topological superconducting (TSC) island, a Josephson current can flow due to Cooper pairs tunneling in and out of spatially separated Majoran...
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WO/2019/172343A1 |
The present invention facilitates bending and installing, for example, a stacked conductor superconducting cable. When bending a superconducting cable having a stacked structure in which a plurality of stages of tape wires are stacked, a...
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WO/2019/173593A1 |
In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb-Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.
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WO/2019/160869A1 |
The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a superconducting component includes: (1) a superconductor having a plurality of alternating narrow an...
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WO/2019/156760A1 |
Techniques for providing hardware-efficient fault-tolerant quantum operations are provided. In some aspects a cavity and an ancilla transmon are used to implement a quantum operation by encoding a logical qubit using more than two energy...
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WO/2019/157408A1 |
A nanophononic metamaterial-based thermoelectric energy conversion device and processes for fabricating a nanophononic metamaterial-based thermoelectric energy conversion device is provided. In one implementation, for example, a nanophon...
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WO/2019/156259A1 |
The present invention relates to a superconductor comprising magnesium diboride and a manufacturing method therefor. A superconductor is manufactured by doping liquid chloroform in magnesium diboride, and thus a superconductor having a h...
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WO/2019/157321A1 |
A method for manufacturing a superconductor is described. A metal assembly precursor can be formed within a hollow copper support element. Forming the metal assembly precursor within a hollow copper support element by positioning a plura...
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WO/2019/150092A1 |
A device comprising a high temperature superconductor, HTS, circuit; wherein the HTS circuit comprises: a quenchable section comprising HTS material and connected in series to other elements of the HTS circuit, the HTS material comprisin...
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WO/2019/150674A1 |
The objective of the present invention is to provide a production device for an MgB2 superconductive thin film wire material enabling a reduction in the cost of a long wire material. The production device for the superconductive thin fil...
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WO/2019/150091A1 |
A monitoring device for use in a cryogenic system. The monitoring device comprises first (201) and second (202) conducting elements and a current detector (205). The first conducting element comprises high temperature superconducting, HT...
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WO/2019/152281A1 |
A tri-stable storage loop useful in reciprocal quantum logic (RQL) gate circuits and systems has control and signal input lines. When alternating stable current storage states are induced in the storage loop by an alternating input provi...
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WO/2019/146271A1 |
This superconductive cable according to one aspect of the present disclosure is for transmitting electric power among a plurality of electric power devices mounted on an aircraft. The superconductive cable is provided with: a heat insula...
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WO/2019/146269A1 |
This superconductive cable according to one aspect of the present disclosure is for transferring electric power among a plurality of electric power devices mounted on an aircraft. The superconductive cable is provided with: a heat insula...
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WO/2019/146270A1 |
A superconductive cable system according to one aspect of the present disclosure is for transmitting electric power among a plurality of electric power devices mounted on an aircraft. This superconductive cable system is provided with: a...
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WO/2019/143813A1 |
A superconducting fault current limiter element, comprising: a plurality of tapes, arranged in electrical parallel fashion among one another, wherein at least one tape of the plurality of tapes comprises a superconductor tape, and wherei...
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WO/2019/122608A1 |
A superconducting current limiting dipole (L6) comprising a superconducting conductor (F6) wound to form a two-wire coil extending in a single plane, an insulating layer (E1 to E11, H1) being disposed between two turns of said coil. The ...
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WO/2019/126564A1 |
A device includes a first semiconductor oxide layer (204); a portion of a semiconductor layer (206a) disposed on the first semiconductor oxide layer (204); and a second semiconductor oxide layer (208) including a first region disposed on...
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WO/2019/125498A1 |
One aspect of the present disclosure proposes a method of fabricating semiconductor-based Josephson Junctions in quantum circuit assemblies. The method is based on providing a semiconductor tunnel barrier element of a Josephson Junction ...
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WO/2019/117929A1 |
One aspect of the present disclosure proposes a method of fabricating quantum circuit assemblies that include Josephson Junctions. The method is based on providing an opening in a stack that includes an upper layer of a substrate, a laye...
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WO/2019/117883A1 |
One aspect of the present disclosure proposes a method of fabricating quantum circuit assemblies that include Josephson Junctions. The method is based on providing a structure that forms a bridge or a cantilever over a lead for the botto...
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WO/2019/118651A1 |
This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable metho...
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WO/2019/116103A2 |
A superconducting article includes a substrate and a superconducting metal oxide film formed on the substrate. The metal oxide film including ions of an alkali metal, ions of a transition metal, and ions of an alkaline earth metal or a r...
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WO/2019/111019A1 |
A poloidal field coil assembly for use in a tokamak. The poloidal field coil assembly comprises inner and outer poloidal field coils and a controller. The inner poloidal field coil is configured for installation inside a toroidal field c...
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WO/2019/105715A1 |
A method of forming a multi-qubit chip includes annealing a Josephson junction of a qubit to either increase or decrease the frequency of the qubit. The conditions of the anneal may be based on historical conditions, and may be chosen to...
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WO/2019/105778A1 |
Superconducting articles are disclosed which comprise at least two superconducting tapes (10, 20), each tape comprising a stabilizer layer (15, 25), a superconductor layer (13, 23), and a buffer layer (12, 22) formed in that order on a s...
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WO/2019/105716A1 |
A quantum bit (qubit) flip chip assembly is formed when a qubit is formed on a first chip and an optically transmissive path is formed on a second chip. The two chips are bonded using solder bumps. The optically transmissive path provide...
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WO/2019/106416A1 |
A technique relates to a structure. A first surface includes an inductive element of a resonator. A second surface includes a first portion of a capacitive element of the resonator and at least one qubit. A second portion of the capaciti...
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WO/2019/101763A1 |
The invention relates to a superconducting strip conductor (1) comprising a strip-like substrate (3) having two main surfaces (31a, 31b) and at least one planar superconducting layer (5) applied to a first main surface (31a) of the subst...
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WO/2019/101448A1 |
A capacitive coupling device (superconducting C-coupler) includes a trench formed through a substrate, from a backside of the substrate, reaching a depth in the substrate, substantially orthogonal to a plane of fabrication on a frontside...
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WO/2019/102071A1 |
A detector of microwave radiation comprises a signal input (401) and a detector output (402). An absorber element (404) of ohmic conductivity is coupled to said signal input (401) through a first length of superconductor (405). A variabl...
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WO/2019/100041A1 |
Organic-inorganic hybrid perovskite has demonstrated tremendous potential for the next generation of electronic and optoelectronic devices due to their remarkable carrier dynamics. However, current studies of electronic and optoelectroni...
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WO/2019/099171A2 |
Various fabrication method are disclosed. In one such method, at least one structure is formed on a substrate which protrudes outwardly from a plane of the substrate. A beam is used to form a layer of material, at least part of which is ...
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