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Patent Searching and Data


Matches 601 - 650 out of 4,274

Document Document Title
JP4794637B2  
JP4798524B2  
JP2011193455A
To provide an electronic device case formed with a radiator on the outer side thereof, a manufacturing mold therefor, and a mobile communication terminal.The electronic device case includes: a radiator formed with an antenna pattern unit...  
JP4779556B2  
JP2011188216A
To provide a non-contact IC card antenna having such a structure as not to deteriorate communication performance.A surface of an FPC is used as a communication surface for performing communication through antenna wiring. On the communica...  
JP4776618B2  
JP4773226B2  
JP2011176813A
To provide an antenna pattern frame, a case of an electronic device and a mold for manufacturing the same.The antenna pattern frame includes: a radiator that includes an antenna pattern part transmitting or receiving signals, and a conne...  
JP4764688B2  
JP4755360B2  
JP2011160293A
To improve characteristics of a waveguide component including finline waveguide structure.Fin bodies (fins 10, 20) are metal patterns and are held between films U, L. In this manner, mutual displacement of the fins 10, 20 can be prevented.  
JP2011160372A
To provide an antenna apparatus and a method of manufacturing the antenna apparatus, in which manufacturing is facilitated and stable antenna characteristics can be obtained, by making a portion to fix an antenna element common.An antenn...  
JP2011523788A  
JP2011160290A
To improve characteristics of a waveguide component including finline waveguide structure.A metal block 2 is disposed over metal plates 101U, 102U. A metal block 1 is disposed over metal plates 101L, 102L. The corners in the waveguide ar...  
JP4748334B2  
JP4737291B2  
JP4731515B2  
JP2011142648A
To provide an antenna having low resistance and high yield and having also high reliability.The antenna includes a first substrate, a first pattern, a second substrate, a second pattern, and an anisotropic conductive material. The first ...  
JP4720907B2  
JP4720906B2  
JP4722254B2  
JP2011135153A
To provide an antenna sheet with an antenna pattern formed by etching, wherein poor communication by a chipped pattern due to overetching or side etching is reduced and proper communication characteristics are secured.The antenna sheet h...  
JP2011130239A
To provide a double resonant antenna which attempts to reduce size while balancing an antenna characteristic on the high frequency side with an antenna characteristic on the low frequency side at a low cost, a method for manufacturing th...  
JP2011129817A
To provide a method of printing an antenna pattern that can improve productivity of an antenna device.The method of printing the antenna pattern (30) is a method of printing the antenna pattern (30) on a projection-shaped dielectric subs...  
JP4711988B2  
JP4704194B2  
JP2011114719A
To provide a high-frequency device capable of suppressing reduction of high-frequency characteristics of a high-frequency device having openings on a substrate.On a substrate 11, a dielectric layer 15A, high-frequency element 16s (slot a...  
JP4696827B2  
JP2011109461A
To simulateneously bake Cu and a magnetic substance material without damaging electrode characteristics or ferrite characteristics even with Cu used for a metal material.A laminate block is manufactured by layering a plurality of magneti...  
JP2011109284A
To provide a manufacturing method by which a line width reduction and disconnection of a side face line due to dissolution into solder in a filter chip can be prevented.A manufacturing method of a filter chip 1 has a process (S7 and S10)...  
JP2011109274A
To provide a method of manufacturing a chip component, wherein the chip body can be polished while suppressing variation, and solder wettability can be assured by cleaning the outer surface electrode of the chip component.A method of man...  
JP2011103602A
To provide a transmission line less in conductor loss, a high frequency device, and a method of manufacturing the transmission line.The transmission line 10 for transmitting high frequency signals includes: wiring 103 where a high freque...  
JP2011103578A
To provide a bonding structure in which a gap or strain does not occur between laminated plates, so that the laminated plates are tightly bonded together even in an environment where vibration shock acts on the laminated plates and the t...  
JP2011103060A
To achieve cost reduction and high productivity, and to provide a method for manufacturing an RFID tag capable of obtaining stable communication characteristics.This method for manufacturing an RFID tag having an IC chip for radio commun...  
JP2011515998A  
JP2011097524A
To provide a ferrite composition having a high real part μ' and a low imaginary part μ" of a complex magnetic permeability at high frequency band (for instance, 13.56 MHz), a magnetic member for an antenna element constructed by the fe...  
JP2011091835A
To provide a laminated structure with an optional hollow structure that is implemented by laminating a plurality of platy bodies with punched out optional shapes in a given order, wherein the laminating order of the platy bodies, vertica...  
JP4672053B2  
JP2011077779A
To provide a magnetic force adjustment method and device of ferrite/magnet elements, which avoids the size increase of the device and the increase of power consumption.The magnetic force adjustment method and device of ferrite/magnet ele...  
JP2011511495A  
JP2011511345A  
JP2011066891A
To provide a circularly polarized patch antenna and a manufacturing method thereof capable of optimizing signal characteristics of the circularly polarized patch antenna.A radiation metal sheet and a ground metal sheet are disposed on to...  
JP4656180B2  
JP4658535B2  
JP4656186B2  
JP2011055317A
To provide a filter device having small dispersion of a passing loss of signals.The filter device includes a plating layer formed on the entire surface of pipes 31 and made of copper or silver in resonant elements 23, and junction sectio...  
JP2011055318A
To provide a filter device having small dispersion of a passing loss of signals.In a method of manufacturing a filter device, plating layers by copper or silver formed on the entire surface of pipes 31 are provided in resonant elements 2...  
JP2011046183A
To provide a method for manufacturing a radome, which suppresses labor and cost required for manufacturing by shortening a manufacturing process and suppressing defective products.The method for manufacturing the radome 10 provided on a ...  
JP2011049397A
To provide a high-frequency device having a membrane structure with an improved mechanical strength.A stopper layer 12 (first dielectric layer) and a dielectric layer 13 (second dielectric layer) acting as an element forming layer are pr...  
JP4649598B2  

Matches 601 - 650 out of 4,274