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JP2000068702 |
To secure the almost even width of strip lines which construct a filer element with a comparatively simple method and also to improve the production yield and reliability by preparing a cavity space opened on the surface of a dielectric ...
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JP2000061668 |
To excise an electrode without deteriorating Q of a dielectric body resonator etc., and without using many equipment by including a first process to excise the electrode formed on a dielectric body with a laser beam and a second process ...
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JP2000059101 |
To enable the element to be used instead of a diode, a transistor, or a tube and to easily manufacture it at low cost by providing a control layer, which can have its conductivity controlled by temperature variation and is coupled with a...
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JP2000059106 |
To provide a small-sized antenna multicoupler and a communication equipment capable of coping with the dual band system of largely different frequency bands. This antenna multicoupler 31 is provided with a frequency variable type filter ...
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JP2000054153 |
To reduce the electric resistance of a metallic film and to improve the Q characteristics thereof by forming a metallic film to be an electrode on a prescribed place on the surface of electronic parts by electroless plating, placing this...
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JP2000049256 |
To improve the yield and high-frequency characteristic of a semiconductor device by forming connection electrodes and transmission lines for high frequency on the side faces of a semiconductor circuit board. A circuit 2 containing an act...
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JP2000049515 |
To provide an electric circuit part having a conductor layer satisfying both an electric characteristic and a mechanical characteristic on a porcelain substrate by constituting the conductor layer of a first conductor layer, an intermedi...
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JP2000049508 |
To provide a nonreversible circuit element which reduces the number of parts, can be a simple configuration and is excellent in mass-productivity. A substrate 100 is composed of insulation magnetic substance. A 1st central conductor patt...
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JP3031459 |
To provide a method capable of easily manufacturing a three- dimensional circuit board with excellent productivity in the manufacture of the three-dimensional circuit board of a dielectric antenna or the like where the conductor layer of...
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JP2000040905 |
To provide a dielectric resonator which is formed of an electrode and a dielectric block, in which the face to require adhesive strength between the electrode and the surface of the dielectric block is metallized by a method, capable of ...
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JP2000031711 |
To provide a microwave circuit that is provided with a switching circuit smaller in size and lighter in weight and a higher off-state attenuation in comparison with those of a conventional switching circuit and to provide its manufacture...
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JP2000031713 |
To provide a method by which a dielectric resonator with stable quality is easily and inexpensively manufactured. An input output terminal 8 and a coupling terminal 7 formed to a side face of a dielectric block 1', a nonconductor part 5 ...
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JP2000031709 |
To simplify manufacture and to improve reliability by turning a transmission line between the inner conductor layers of a tri-plate line composed of plural through-hole plating conductors to impedance higher than the one of the tri-plate...
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JP2000031710 |
To provide an electronic printed circuit board with a simple structure, design, and manufacture where the manufacturing cost and the manufacturing period can be reduced. A potential fixing board 2 consisting of a metallic thin plate 4 an...
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JP2000031712 |
To provide a microstrip line - waveguide conversion structure whose passing loss is reduced even in the case of use at a frequency of a millimeter wave band with a simple structure and coping with a frequency of a broad band, to provide ...
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JP2000022432 |
To easily manufacture elements at a required pitch with a small error. An electrically conductive coating 6 is applied on an outer surface of a dielectric pipe 1 that is a pipe shaped dielectric body via a masking pipe 4 with slits havin...
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JP2000022292 |
To obtain a high-frequency circuit board for using a microwave or millimeter wave, by providing a resin film directly coating a metal base material and having a specific value of less of relative permittivity and a specific value or less...
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JP2000013117 |
To attain light weight and high rigidity of a three-dimensional waveguide at the same time. A circumferential wall of a hollow structure is made of a triaxially woven member which is woven by using three groups of carbon fibers a, b and ...
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JP2000013135 |
To provide the slot array antenna with uniform performance regardless of a simple configuration with a reduced working time and excellent mass- productivity. A waveguide wall 13 and a distribution waveguide wall 14 are integrally formed ...
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JP2000004111 |
To obtain specific characteristics according to the purpose of use and to obtain high Q without previously designing the shape regarding line width, line length, etc. On one side of an insulating layer 1a constituting a printed board 1, ...
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JP2000004101 |
To obtain a microwave integrated circuit type high-frequency filter which has good uniformity and mass-productivity and whose frequency characteristic is reversibly adjusted with ease. Dielectric components 2a to 2c are embedded in the t...
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JP11355016 |
To provide a dielectric resonator unit where a Q does not drop and joint strength is not deteriorated over time. In a dielectric resonator unit, simultaneous burning is executed in a state where a ceramic molded body becoming a dielectri...
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JP11355014 |
To provide a high frequency non-reversible circuit element whose adjustment of a frequency characteristic is easy and which is superior in uniformity and mass production. In a high frequency non-reversible circuit element, a hole for eng...
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JP11355005 |
To provide a filter which improves mass-productivity, hardly generates dispersion in characteristics and makes high frequency characteristics uniform and stable, by integrally forming a substrate and a dielectric resonator and providing ...
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JP11355001 |
To provide a low-cost bend by enabling mass-production within the severe range for allowable errors by forming two rectangular holes for connecting as to form a double side corner respectively on an inner surface to change the direction ...
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JP11350184 |
To produce parts having a deep and fine groove structure on the inside surface of a pipe shape with high accuracy without distortion. Two kinds of electroforming methods by metals, for example, a nickel electroforming method/a copper ele...
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JP11346103 |
To provide an inexpensive radio equipment using milimeter waves and microwaves by realizing a milimeter wave module, where a filter of low loss and MMIC, etc., are mix-mounted by simple work. A recess 102 is formed at a silicon substrate...
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JP11340714 |
To provide a manufacturing method of a dielectric resonance member with excellent mass productivity without dispersing input capacity components and coupling capacity components. This manufacturing method of the dielectric resonance memb...
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JP11340713 |
To provide a dielectric resonance member of a high Q value and excellent handleability by changing the structure of an outer conductor (short- circuit conductor) formed on a short-circuit end face. In this dielectric resonance member 10,...
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JP11330814 |
To reduce the area occupied by insulating parts watched from the side of a mounting surface and to attain miniaturization in the width of the same terminal conductor by forming a first insulating part on the mounting surface and forming ...
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JP11330819 |
To provide a ceramic electronic component of high Q value. The materials of a dielectric ceramic 2 of a BaO-TiO2-Nd2O3-Bi2 O3 system composition (r=92, Qf=5,000 GHz) are mixed, and temporarily burned and crushed. Next, a binder is added ...
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JP3004121 |
PURPOSE: To prevent interference to another communication through the transmission of a message whose reception is disable in the label multiplex communication of connection-less type. CONSTITUTION: Every time a message is received, whet...
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JP11317607 |
To provide a ceramic laminated device which suppresses the occurrence of an internal fault such as cracks and has little conductor loss. A stripline conductor layer 4, a shield conductor layer 2 and a conductor pattern that becomes a cap...
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JP11312881 |
To provide a mounting method by which a substrate can be surely jointed to an enclosure, etc., even when the substrate has a thin and a large area, an antenna and a high-frequency circuit manufactured by a method, a communication system ...
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JP11312910 |
To provide a dielectric resonator high in non-load Q by simplifying a manufacturing process. This device is composed of a dielectric 11 of almost a columnar, thin film multi phase electrodes 12 formed on the two surfaces of the dielectri...
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JP11310455 |
To obtain a composition having high dielectric constant and Q value and temperature stability and capable of sintering at relatively low temperatures by mixing a BaO-TiO2-ReO3/2-Bi2O3-based first porcelain composition with a glass compos...
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JP11308010 |
To obtain a dielectric filter which is easily manufactured, with small size and at a low cost by forming two resonators by forming a notched part in parallel with an internal conductor from an external conductor to the internal conductor...
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JP11308027 |
To obtain an inexpensive, highly reliable dielectric filter with freedom in designing, by forming an input/output terminal and a connection terminal of a dielectric filter in recessed shapes. A dielectric filter has a bonded structure fo...
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JP11308015 |
To reduce transmission loss in a uniplanar line. A high dielectric layer 12 that is constituted of SrTiO3 film whose thickness is 1 μm is formed on the principal plane of a substrate 11, that is constituted of half insulation property G...
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JP11289205 |
To reduce frequency fluctuations by burying conductive layers for frequency fluctuation correction in a dielectric substrate and arranging the conductive layers for correction between a stripline conductive layer and themselves so as to ...
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JP11284430 |
To provide a short-circuited antenna manufactured by microstrip technology and a device containing the antenna. An antenna manufactured by microstrip technology has a composite short-circuit body constituted of two conduction bands C2 an...
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JP11284413 |
To avoid impedance of main and sub lines from being decreased, even in the case of miniaturization of the coupler by forming a board made of an electric insulation material, placing the main line on one side of the board, providing an in...
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JP11274811 |
To provide a means capable of keeping a uniform parallelopiped shape even when the central frequencies of respective filtering parts are considerably different concerning a dielectric filter equipped with plural filtering parts like a di...
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JP11274823 |
To obtain the manufacture of electronic parts capable of obtaining a stable quality at a low cost by pulling out a wire from a stacked matter so as to form a through hole and calcining the stacked matter having the through hole so as to ...
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JP11274812 |
To provide a means capable of maintaining the uniform parallelopiped shape even when the central frequencies of respective filtering parts are considerably different concerning a dielectric filter equipped with plural filtering parts lik...
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JP11273997 |
To bring silver used as wiring in a substrate into contact with a Cu-Ag conductor film and to prevent electrical disconnection by allowing a conductor pattern to include the Cu-Ag conductor film and to adhere to a substrate. Electronic p...
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JP11274814 |
To obtain a band pass filter with connection structure for a resonator of a low cost by weld-joining joints between terminating thin plates and between a connecting thin plate and respective conductor cross-section parts. Each conductor ...
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JP11274813 |
To secure the mechanical joint having sufficient strength and necessary electric connection by electrically connecting a resonance porcelain matter and a circuit stacked matter by way of a soldering ball. The mechanical connection of the...
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JP11266101 |
To improve wave guiding property and coupling strength by coupling the electrically conductive flange of another body through an electrically conductive adhesive agent to the terminal part of the main body of waveguide which covers the o...
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JP2983169 |
To reduce the transmission loss by forming a groove to a part of a dielectric board in contact with a conductor ridge so as to relax a partial electric field concentration in the conductor thereby decreasing a current density of the part...
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