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Matches 1 - 50 out of 85,064

Document Document Title
WO/2021/011424A1
A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed i...  
WO/2021/008864A1
The invention relates to an optoelectronic component comprising a housing (14), an optoelectronic semiconductor chip (5) and an optical element (21). The housing (14) comprises a lead frame (1) which has two external electrical contact p...  
WO/2021/011787A1
A light source system or apparatus configured with an infrared illumination source includes a gallium and nitrogen containing laser diode based white light source. The light source system includes a first pathway configured to direct dir...  
WO/2021/010372A1
This light-emitting element drive device (100) for driving a light-emitting element (21) is provided with: a capacitor (C1) which is charged by a power supply (V1) and which is for supplying electric current to the light-emitting element...  
WO/2021/010894A1
According to embodiments of the present invention, a laser source is provided. The laser source includes a photonic crystal structure including a first domain having a plurality of first holes defined therein, the first domain being asso...  
WO/2021/010089A1
Provided are a Q switch resonator that realizes efficient pulse extraction, and a pulse generator in which the Q switch resonator is used. The Q switch resonator has: an optical resonator that is formed by at least two mirrors, the optic...  
WO/2021/010272A1
A wavelength conversion member according to the present invention is provided with: a ceramic phosphor which converts the wavelength of light incident thereon; a heat dissipation member which dissipates the heat of the ceramic phosphor t...  
WO/2021/010903A1
Packaged light emitter module can provide improved safety features to facilitate sensing the presence of moisture or a mechanical defect such as a crack in a transmissive cover (22) that may result in a safety hazard caused by the emitte...  
WO/2021/010488A1
Provided are a semiconductor laser module, a light source unit, and a direct diode laser which are highly reliable and can be miniaturized. A semiconductor laser module 10 of the present invention comprises: a semiconductor laser element...  
WO/2021/010128A1
A laser device 1A is provided with a light source unit 10A and an optical multiplexing unit 21. The light source unit 10A outputs first laser light L1 and second laser light L2 having a wavelength different from that of the first laser l...  
WO/2021/010424A1
This optical module is provided with: a metal stem; a semiconductor optical element provided on the stem; a metal cap; and a light-transmissive optical window. The cap has an end wall having a first opening at one end of a cylinder and h...  
WO/2021/010023A1
A laser projection display device 1 is provided with: a laser beam source 5 that emits a plurality of colors of laser beams; a laser beam source driving unit 4 that drives the laser beam source; a beam intensity detector 10 that detects ...  
WO/2021/009006A1
The edge emitting semiconductor laser diode (100) comprises a growth substrate (2), a semiconductor layer sequence (1) having an active layer (13), said semiconductor layer sequence being applied on the growth substrate (2), and two face...  
WO/2021/003643A1
A VCSEL device(10) includes a substrate(100), first-type and second-type doped distributed Bragg reflectors(110,140), first and second electrodes(120,170), an active layer stack(130), an anti-phase surface relief layer(150) and a confine...  
WO/2021/004181A1
Provided is a preparation method for GaN-based vertical cavity surface emitting laser, forming a patterned metal substrate on a seed layer by using the photo-etching and patterned electroplating technologies; transferring a sample to a t...  
WO/2021/004916A1
The present invention provides a lighting device (1) for emitting light of a plurality of wavelengths comprising a light source (10); a wavelength-converting device (2), which is arranged in an emission region of the light source (10) an...  
WO/2021/005844A1
This optical device (100) comprises: at least one optical element (20); a substrate (10) having a capacitor arranged thereupon and to which the optical element (20) is mounted; and wiring (40) formed on the substrate (10) and electricall...  
WO/2021/006454A1
The present invention provides a display system comprising: a display device; a wireless power receiving module for supplying power to the display device; and a wireless power transmitting module for emitting laser light toward the wirel...  
WO/2021/006214A1
An opto-electro transmission module 2 is provided with: an opto-electrical hybrid substrate 3; a printed wiring board 4; a photoelectric conversion unit 5; a first heat-transfer member 46; and a metal housing 6. The opto-electrical hybri...  
WO/2021/003644A1
A semiconductor laser beam shaper includes a VCSEL device and a lens member. The VCSEL device includes a substrate, first-type and second-type doped distributed Bragg reflectors, an active layer, a surface relief layer, a confinement mem...  
WO/2021/005700A1
The present invention is provided with: a light-emitting layer 10 that emits light in an electrical current injection state; an optical waveguide 20 in which the width or thickness thereof in an extension direction (y) of the light-emitt...  
WO/2021/006657A1
A photonic integrated device may comprise: a substrate; a first laser diode disposed on the substrate and oscillating in a transverse magnetic mode (TM mode); and a second laser diode disposed on the substrate and oscillating in a transv...  
WO/2021/006338A1
This three-dimensional sensing system is provided with: a photonic crystal laser array (10) in which photonic crystal laser elements are disposed on a flat surface; a control unit (14) for controlling an operating mode of a laser light s...  
WO/2021/003000A1
A multi-section laser device is configured with a gain section and an integrated photodetector section. The photodetector section, rather than being a separate component, is integrated directly into the body of the laser. The integrated ...  
WO/2021/003306A1
A laser source assembly is based upon an optical reference substrate that is utilized as a common optical reference plane upon which both a fiber array and a laser diode array are disposed and positioned to provide alignment between the ...  
WO/2021/003139A1
Disclosed herein are self-mixing interferometry (SMI) sensors, such as may include vertical cavity surface emitting laser (VCSEL) diodes and resonance cavity photodetectors (RCPDs). Structures for the VCSEL diodes and RCPDs are disclosed...  
WO/2021/001964A1
A rear DBR region (101) and a front DBR region (104) are provided with a first current injection unit (111) for injecting a DBR current, and a phase adjusting region (102) is provided with a second current injection unit (112) for inject...  
WO/2021/002652A1
Provided are a semiconductor device package assembly and an electronic device comprising same. The semiconductor device package assembly according to an example embodiment of the present invention comprises: a circuit board; a light-emit...  
WO/2021/003359A1
This application describes a laser driver that can include a voltage source, an inductor, at least one capacitor, a diode laser, and an electronic switch. The switch may be connected to ground and may be configured to alternate between a...  
WO/2021/002198A1
A vertical resonator-type light emitting element which comprises: a substrate (11); a first multilayer film reflection mirror (12) that is formed on the substrate; a first semiconductor layer (13N) that is formed on the first multilayer ...  
WO/2021/003221A1
Methods and apparatus for tuning a photonics-based component. An opto-electrical detector is configured to output an electrical signal based on a measurement of light intensity of the photonics-based component, the light intensity being ...  
WO/2021/001914A1
This semiconductor laser device is provided with: a stem (1) as a base material; a laser diode (LD) sub-mount (2) having surface electrodes (20a, 20b) and joined to a surface of the stem (1); a LD chip (4) disposed on the surface electro...  
WO/2020/262636A1
This electronic element mounting package is provided with: a substrate including a base portion having a first surface, and a protruding portion protruding from the first surface and having a second surface; a wiring substrate positioned...  
WO/2020/261766A1
Provided is a light-emitting device 1 provided with: a substrate 10; a light-emitting element 13 that has a DBR film 14 and that is mounted on the substrate 10; a light-reflective film 16 provided on a surface of the substrate 10; and a ...  
WO/2020/259334A1
Disclosed are an adjustment method, an adjustment apparatus (40), a terminal (10) and a computer-readable storage medium (200). The adjustment method comprises: (301) emitting a laser with a predetermined first pulse width to a target ob...  
WO/2020/262710A1
A semiconductor laser comprising: an optical resonator that has a first compound semiconductor layer containing an n-type impurity, a second compound semiconductor layer containing a p-type impurity, and a light-emitting layer provided b...  
WO/2020/259198A1
A beam combining device and a beam combining method for a Bragg grating external-cavity laser module. The beam combining device comprises a plurality of light-emitting modules (1, 100, 101-10N, 101'-10N') arranged side by side, and the l...  
WO/2020/262711A1
A semiconductor laser comprising: an optical resonator that has a first compound semiconductor layer containing an n-type impurity, a second compound semiconductor layer containing a p-type impurity, and a light-emitting layer provided b...  
WO/2020/259755A1
The invention relates to a method for producing a component assembly for a package, said method comprising: providing a wafer (1) made of a semiconductor material having a polished wafer surface (6); forming an opening (2,3) in the wafer...  
WO/2020/262561A1
A method for manufacturing a semiconductor element according to the present disclosure includes: an element-layer forming step for forming a semiconductor element layer on a first surface of a ground substrate; a first-support-substrate ...  
WO/2020/259804A1
The present disclosure relates to an amplifier for converting a differential input signal to a single ended output signal. In particular, the present disclosure relates to an amplifier with a reduced intrinsic time constant of said conve...  
WO/2020/261209A1
The present invention concerns an optical grating comprising a body defining a first external surface and a second external surface. The first external surface defines a periodic structure comprising a plurality of elongated protrusions ...  
WO/2020/261687A1
A surface emitting laser which is provided with a lower DBR layer, a cavity layer and an upper DBR layer, said layers being sequentially stacked on a substrate; the lower DBR layer comprises a first DBR layer, a contact layer and a secon...  
WO/2020/264034A1
Systems and methods for controlling energy delivered for thermal ablation. An apparatus may include a conductive member comprising an array of conductive filaments, a power supply configured to provide the current to the conductive/resis...  
WO/2020/263184A1
An optical module (200) comprises an emitter (214) configured to emit electromagnetic radiation and a first substrate (212) configured to support the emitter (214). The optical module (200) further comprises a driver (220) configured to ...  
WO/2020/262560A1
The present invention includes: a ground substrate having a first surface; a semiconductor element layer which can be divided into a plurality of element sections and which is positioned above the first surface of the ground substrate; a...  
WO/2020/263818A2
Light-emitting photoluminescent (PL) cell configured to abate thermal quenching when exposed to high levels of radiant excitation; methods and systems of using the same for horticultural growth lighting and other lighting applications. E...  
WO/2020/263747A1
A semiconductor laser comprises: a substrate; a first cladding layer disposed above the substrate; a second cladding layer disposed above the first cladding layer so that the first cladding layer is positioned between the substrate and t...  
WO/2020/259914A1
A tuning arrangement for a vertical-cavity surface-emitting laser, VCSEL (20), comprises a delta sigma modulator (10) configured to generate a bitstream (BS) comprising bit signals, and a current source (11) configured to provide a curre...  
WO/2020/081335A9
In various embodiments, pointing errors in a non-wavelength-beam-combining dimension of a laser system are at least partially alleviated via staircased collimation lenses.  

Matches 1 - 50 out of 85,064