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Matches 551 - 600 out of 17,938

Document Document Title
WO/2003/065576A2
The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wa...  
WO/2003/061119A1
A template (3) manufactured to have high−accuracy protrusions and recesses in advance by a lithography technology employing an electron beam is pressed against a resist film (2) applied onto a substrate (1) thus transferring a resist p...  
WO/2003/057618A2
The invention relates to a method for producing a protective covering for a component provided on a substrate (102), according to which at least one sacrificial structure is produced on the substrate (102). The sacrificial structure cove...  
WO/2003/058811A1
The invention relates to a method for producing an electrode (106) for a thin film resonator. Said electrode (106) is embedded in an insulating layer (126) of the resonator in such a manner that a surface (110) of the electrode is expose...  
WO/2003/058810A1
The aim of the invention is to encapsulate components in a simple and reliable manner. To this end, the connection between a chip and a carrier substrate is made by means of bump contacts which are sunk in recesses on the carrier substra...  
WO/2003/052839A1
The invention relates to a method for producing a component (100) with a predefined physical parameter, according to which the component (100), which comprises a supplementary layer (118) that is used to set the parameter, is first provi...  
WO/2003/052929A1
A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The firs...  
WO/2003/052927A1
A film bulk acoustic resonator is formed on a substrate having a major surface. The film bulk acoustic resonator includes an elongated stack. The elongated stack includes a layer of piezoelectric material positioned between a first condu...  
WO/2003/052928A1
The invention relates to a method for production of a piezoelectrical oscillator circuit with thin film technology, whereby the oscillator circuit has a fixed resonant frequency and a number of layers (112a, 112b, 114, 116a, 116b). First...  
WO2002061833A3
The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon b...  
WO/2003/044857A1
A piezoelectric vibrating device, comprising a ceramic package (1) having an upwardly opening recessed part, a crystal vibrating plate (3) stored in the recessed part of the ceramic package (1), and a metal cover (2) connected to the ope...  
WO/2003/043189A2
The invention concerns a method for adjusting the operating gap of two mechanical elements of a substantially planar mechanical structure obtained by micro-etching. The method consists in attributing (A) to one of the elements (E) a fixe...  
WO/2003/043188A1
The invention relates to a BAW resonator comprising a substrate (102), a first electrode (108) which is arranged on a surface (106) of the substrate (102), a piezoelectric layer (112) which is at least partially arranged on the first ele...  
WO2003028212A3
A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of...  
WO/2003/041273A1
The present invention provides a filter device comprising: a substrate having a top surface and a bottom surface; at least one acoustic wave situated on the top surface of the substrate, wherein the bottom surface of the substrate is rou...  
WO/2003/036736A2
Mass distribution within programmable surface control devices is controlled by the presence or absence of an electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable electric field. One such progr...  
WO/2003/036735A2
Programmable surface control devices whose physical features, such as surface charcteristics and mass distribution, are controlled by the presence or absence of an electrodeposition (40) of metal and/or metal ions from a solid solution u...  
WO/2003/032484A1
An encapsulating method for sensitive components is disclosed, in which a film, in particular a plastic film is laminated over the whole surface of an arrangement with a flip-chip style component mounted on a support. A plastic mass is t...  
WO2002093738A3
A nanomechanical actuator/oscillator system (10) comprises a substrate (12) having a first electrode (14) and a second electrode (16) and a nanobimorph (18) which includes first and second self-assembled nanotubes (20, 22). System (10) i...  
WO/2003/032485A1
A surface acoustic wave device in which the interval between electrodes is enlarged by partially cutting the common part and the strip part of the electrode of a reflector. Since the effect of the quantity of electrostatic charges genera...  
WO/2003/030358A1
The invention relates to a method for the production of a piezo-electrical component, comprising at least two stacked crystal filters. A piezo-electric component comprising two stacked crystal filters, directly connected to each other by...  
WO/2003/028211A2
A resonator having temperature and electronic compensation. The resonator has several layers on a substrate having opposite thermal coefficients of the sound velocity for temperature compensation. Also, the frequency of the resonator is ...  
WO/2003/028212A2
A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of...  
WO/2003/023957A1
A resonator (10(2)) includes a member (14(1)) with an embedded charge (15), at least one input electrode (16(2)), at least one output electrode (20(2)), and at least one common electrode (16(1), 20(1)). The input and output electrodes (1...  
WO2002007234A9
A lens-line type piezoelectric device thinner than the manufacture limit thickness, which is conventionally difficult to manufacture, and a method for manufacturing the same. The piezoelectric device has a vibrating part of at least two ...  
WO/2003/017364A1
A method of producing an electronic device which includes an enclosure consisting of an insulation ceramic substrate and a lid member covering the surface of the ceramic substrate, and at least one electronic element mounted inside the e...  
WO/2003/015266A1
A tunable impedance matching circuit is provided for tuning an active device, such as, e.g., a field effect transistor, in a RF power amplifier circuit. The matching circuit includes an adjustable length transmission line for electricall...  
WO/2003/005576A1
The invention relates to a frequency-tunable resonator comprising a base body with at least one piezoelectric layer (2) and at least one semiconducting layer (1,3). The electrodes (E1, E2) that are configured on opposing principal surfac...  
WO/2003/005577A1
A method for manufacturing a surface acoustic wave device comprising a first conductive pattern and a second conductive pattern having different thicknesses on the same piezoelectric substrate. The surface acoustic wave device having a p...  
WO/2003/002450A2
A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducin...  
WO/2003/001666A1
A surface acoustic wave device, wherein comb electrodes (2) and reflector electrodes (3) are surrounded by a plurality of auxiliary electrodes (6a, 6b) electrically independent of each other and having different widths according to the p...  
WO2002095085A8
The invention relates to a method for producing a layer with a locally adapted or predefined layer thickness profile. Said method comprises the following steps: a) at least one layer (7) is applied to a substrate, b) a removal profile is...  
WO2002054592A3
An acoustic wave filter (10) and a method (30) of forming the acoustic wave filter (10) are disclosed. The acoustic wave filter includes a substrate (20) supporting a first die (18) and a second die (18). The first die (18) and second di...  
WO2002081365A3
A first type of MEMS resonator (1400) adapted to be fabricated on a SOI wafer (200) is provided. A second type of MEMS resonator that is fabricated using deep trench etching and occupies a small area of a semiconductor chip is taught. Ov...  
WO/2002/095085A1
The invention relates to a method for producing a layer with a locally adapted or predefined layer thickness profile. Said method comprises the following steps: a) at least one layer (7) is applied to a substrate, b) a removal profile is...  
WO/2002/095939A1
A resonator device comprises a piezoelectric resonator (10) with a detuning layer sequence (52), arranged on the piezoelectric resonator (10). The detuning layer sequence (52) comprises at least one first layer (52A) with a high acoustic...  
WO/2002/093549A1
A high performance thin film acoustic resonator with excellent electromechanical coupling factor and acoustic quality factor, wherein a recess (52) is formed in a substrate obtained by forming a silicon oxide thin layer (53) on the surfa...  
WO/2002/093738A2
A nanomechanical actuator/oscillator system (10) comprises a substrate (12) having a first electrode (14) and a second electrode (16) and a nanobimorph (18) which includes first and second self-assembled nanotubes (20, 22). System (10) i...  
WO/2002/087080A1
A surface acoustic wave device comprising a piezoelectric substrate, a comb−shaped electrode constituting an IDT on the substrate, a reflector electrode arranged close in the direction of the propagation of a surface wave generated by ...  
WO/2002/082645A1
An elastic wave element comprising a piezoelectric, at least one electrode formed on the piezoelectric, a corrosion resistant layer formed on the surface of the electrode, a hydrophilic film formed on the corrosion resistant layer, and a...  
WO/2002/082644A1
An acoustic wave device includes a piezoelectric element, at least one electrode formed on the piezoelectric element, a compound layer formed on the surface of the electrode, and a dielectric film formed on the compound layer. The compou...  
WO/2002/081365A2
A first type of MEMS resonator (1400) adapted to be fabricated on a SOI wafer (200) is provided. A second type of MEMS resonator that is fabricated using deep trench etching and occupies a small area of a semiconductor chip is taught. Ov...  
WO/2002/080361A1
A tunable nanomechanical filter system (10) comprising an array of nanofeatures (18), such as nanotubes, where the nanofeatures (18) are in signal communication with means for inducing a difference in charge density in the nanofeature (1...  
WO2002017482A3
A micromechanical resonator device and a micromechanical filter utilizing the same are disclosed based upon a radially or laterally vibrating disk structure and capable of vibrating at frequencies well past the GHz range. The center of t...  
WO/2002/080360A1
A tunable nanomechanical oscillator device (10) and system is provided. The nanomechanical oscillator device (10) comprising at least one nanoresonator, such as a suspended nanotube (24), designed such that injecting charge density into ...  
WO2002016256A3
A method and resulting formed device are disclosed wherein the method combines polysilicon surface-micromachining with metal electroplating technology to achieve a capacitively-drive, lateral micromechanical resonator with submicron elec...  
WO/2002/063763A1
A surface acoustic wave device for realizing a device miniaturization such as area reduction or ridge lowering, a cost reduction, and an improvement in reliability. This surface acoustic wave device comprises a piezoelastic substrate (1)...  
WO/2002/061833A2
The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon b...  
WO/2002/061943A1
A surface acoustic wave (SAW) device which has a piezo-electric substrate, an interdigital transducer (IDT) electrode provided on a first surface of the piezo-electric substrate and a resin coating covering the IDT electrode, wherein the...  
WO/2002/060054A1
An instrument for inspecting a surface acoustic wave device used as a high frequency filter in the field of mobile communication. The instrument comprises an electron gun (1) for generating and projecting an electron beam as primary elec...  

Matches 551 - 600 out of 17,938