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Matches 551 - 600 out of 17,792

Document Document Title
WO/2001/078229A1
The invention describes a tunable filter arrangement with a plurality of resonators which are coupled to one another and of which there is at least one which comprises a piezoelectric component made of a ferroelectric material and to whi...  
WO/2001/076064A2
A surface-acoustic-wave die includes a generally rectangular die that comprises a piezoelectric material, atop which is positioned a surface-acoustic-wave electrode pattern. The pattern has a generally rectangular footprint, and the foot...  
WO/2001/069781A2
A high power SAW device (10) includes an electrode (16, 19) positioned on a piezoelectric substrate (11). The electrode includes a bonding layer (30) of material deposited on and bonding with the substrate and a conductive structure (35)...  
WO/2001/063759A1
A method of manufacturing a piezoelectric filter with a resonator comprising a layer of a piezoelectric material (1) which is provided with an electrode (2, 3) on either side, which resonator is situated on an acoustic reflector layer (4...  
WO/2001/063758A1
A method of manufacturing a hybrid integrated circuit comprising a semiconductor element (1) and a piezoelectric filter (2), which are situated next to each other and connected to a carrier substrate (3). The semiconductor element compri...  
WO/2001/061847A1
The electronic device (10) of the invention has a first inductor (12) and a first capacitor (11). The capacitor (11) comprises a first capacitor electrode (21) in a first electrically conducting layer (3), a dielectric (26), and a second...  
WO/2001/061846A1
The invention relates to a hollow microbeam that is fabricated upon a base or pedestal. Processing of the hollow microbeam includes forming at least one hollow channel in the microbeam by removing temporary fillers after formation of the...  
WO/2001/059812A2
The invention relates to an assembly comprising a multitude of products provided with an electronic component (1), which has a fundamental quantity that can be modified by tuning the component (1) using an electrical signal. The inventiv...  
WO/2001/059827A1
Sensitive component structures (2) can be encapsulated by enclosing them with a frame structure (6) consisting of a light-sensitive reaction resin and covering the latter with another, structured layer of reaction resin after applying an...  
WO/2001/059853A2
The aim of the invention is to increase resistance to breaking and to prevent optical reflections during structuring for producing components on piezoelectric substrates. To this end, an absorber layer (2) which has high optical absorpti...  
WO/2001/058007A1
A piezoelectric vibrator (101), in a closed vessel consisting of a lid (105), a frame (103), and a board (104), is fixed on the board (104) (the surface of the board) by a fixing member (104a) made of a material having conductivity, and ...  
WO/2001/052410A2
A high-resistance layer arranged on a pyroelectric substrate, for the harmless draining of pyroelectric voltages, is disclosed. Said layer can be applied to the whole surface in a thin layer process and then formed, such that electricall...  
WO/2001/043181A1
This invention discloses a crystalline substrate based device including a crystalline substrate (102) having formed thereon a microstructure (100); and at least one packaging layer (106) which is sealed over the microstructure by means o...  
WO/2001/041304A1
In a surface acoustic wave device, a metal oxide layer is formed on a piezoelectric base on which an electrode of Al or an Al alloy is formed in such a way that the metal oxide layer covers at least the electrode. The metal oxide layer i...  
WO/2001/035469A1
A thin-film piezoelectric device comprises a silicon substrate (1); a dielectric film (21) including a silicon nitride film (16) formed on the silicon substrate (1) and a silicon oxide film (2) formed on the silicon nitride film (16); a ...  
WO/2001/024361A1
The acoustic mirror is essentially comprised of at least one first insulating layer (Il'), a first metal layer (M1') arranged thereon, a second insulating layer arranged thereon (I2') and a second metal layer (M2') arranged thereon. An a...  
WO/2001/022580A1
A surface acoustic wave device in the form of a piezoelectric body formed with a comb tooth electrode and a terminal electrode is opposed face-to-face to a base board formed with an element connection terminal and an external connection ...  
WO/2001/005031A1
The invention relates to a surface acoustic wave (SAW) filter of the reactance filter type comprising at least two SAW resonators (R2, R3) in two parallel branches and comprising a SAW resonator (R1) in a serial branch. According to the ...  
WO/2000/079217A2
A gyroscope (100) comprises a piezoelectric substrate (105) having a surface. Disposed on the surface are a resonator transducer (115a, 1 15b), a pair of reflectors (120a, 120b), a structure such as a metallic dot (135), and a sensor tra...  
WO/2000/079217A3
A gyroscope (100) comprises a piezoelectric substrate (105) having a surface. Disposed on the surface are a resonator transducer (115a, 1 15b), a pair of reflectors (120a, 120b), a structure such as a metallic dot (135), and a sensor tra...  
WO/2000/074235A1
A surface acoustic wave device having an electrode film which contains aluminum single crystal film excellent in power resistance and is formed on a lithium tantalate substrate having a cut corner in the vicinity of 36-degree rotation Y ...  
WO/2000/070130A1
A method for etching an article containing a crystal while immersing it in an acid liquid at an etching rate higher than the crystal growth rate of the article. An article processed by the etching method is also disclosed. The etching ra...  
WO/2000/057494A1
A plurality of recesses (101) are formed by etching in the center of a quartz plate (100) obtained by polishing an electronic material such as a quartz plate, silicon or gallium arsenide by using a double-side polishing machine, single-s...  
WO/2000/046920A1
A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) a...  
WO/2000/046580A1
A transducer has a closure for components mounted on the substrate (13) comprising: a lid component (16); and a peripheral component (17) of plastics material secured by one side to the lid component (16) and by the other side to the one...  
WO/2000/042706A1
A method (100) of providing a time delay to a signal utilizing a surface acoustic wave ladder filter includes a first step (102) providing a piezoelectric substrate. A second step (104) includes disposing series and shunt coupled surface...  
WO/2000/042705A1
A flexural-mode, micromechanical resonator utilizing a non-intrusive support structure to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz is manufactured using polysilicon surface micromachining technology. Also, ...  
WO/2000/042704A1
A surface acoustic wave device the frequency characteristics of which can be flexibly regulated in response to a system request and which can be downsized and enhanced in out-band characteristics, wherein a grounding terminal wired to a ...  
WO/2000/041299A1
The invention concerns a surface acoustic wave device comprising a fine piezoelectric material film, a molecular glue layer and a bearing substrate. The fine film constitutes a sound energy guide enabling to increase the performance leve...  
WO/2000/035085A1
The invention concerns a novel type of encapsulated surface wave components and a collective method for making such components. The component comprises a wave surface device at the substrate surface; the encapsulating case includes, besi...  
WO/2000/033455A1
A base (1), on which input/output electrode patterns (3) are formed, has an opening in the center. On the other hand, an integrated circuit (2) has an active surface, on which a number of bumps (4) are formed toward its two opposite side...  
WO/2000/033394A1
A surface acoustic wave device (9) with electrodes (19) having a metallization of a first layer (20) of substantially pure titanium and a second layer (22) of an alloy of aluminum and titanium. The titanium comprises about 0.1% to about ...  
WO/2000/031807A1
Quartz crystal resonators (30) with a first angle of rotation having an X-axis (17) and Z'-axis (19) lying within a plane corresponding to an AT-cut and a second angle of rotation (34) within the plane of the AT-cut and lying within a ra...  
WO/2000/024123A1
A surface acoustic wave device (1) comprising a substrate (2) composed of quartz, a pair of comb-tooth-shaped electrodes (3) composed of aluminum layers, electrode pads (4) and a pair of lattice-shaped reflectors (5) composed of the same...  
WO/2000/021195A2
Electromagnetic resonator and filter devices are formed on a substrate having opposing sides. A superconductor layer on a first side is patterned in the form of at least one self resonant spiral. Input and output coupling structures, suc...  
WO/2000/011782A1
A multi-pole monolithic crystal filter with at least three acoustically coupled resonators (50, 52, 54) on a piezoelectric blank (56). Each resonator (50, 52, 54) has associated top and bottom electrodes (70, 72, 74, 76, 78, 80). An inpu...  
WO/2000/005812A1
A piezo-oscillator which prevents an exciting electrode from being kept open between the upper surface and the lower surface of a piezo-oscillator piece even when a noble metal layer is partly removed in order to increase the adhesivenes...  
WO/2000/003481A1
The invention concerns a device (10) for semi-automatic, fast and accurate adjusting of electronic card potentiometers in an assembly line, comprising a circuit tester (1) connected to a screwdriver (12) provided with an adjusting rod (1...  
WO/1999/060830A1
The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for...  
WO/1999/059244A2
Preferably, the resonator is provided with lithographically produced holes or similar structures in the top electrode layer. The average distance between said holes or structures is shorter than the wavelength provided in order to operat...  
WO/1999/057807A1
According to the inventive thermomechanical method for planing a resist layer which is applied on a partially raised supporting surface, a resist structure, especially an encapsulation for electronic components, is obtained. To this end,...  
WO/1999/056390A1
The invention relates to a surface wave component and to a method for the production of the same, comprising a chip (2) with a piezoelectric substrate, electronic conductive structures arranged on said chip (IDT converters, contact strip...  
WO/1999/052209A1
A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20)...  
WO/1999/043084A1
In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface...  
WO/1999/021275A1
The invention relates to a piezoelectric ceramic resonator and manufacturing method thereof. More particularly, the invention relates to a piezoelectric ceramic resonator comprising a piezoelectric ceramic body (21) having an upper surfa...  
WO/1999/019982A1
A surface mount filter (10) has a device body with a plurality of terminations (20, 22) located thereon. The device body is constructed having a rigid insulative substrate (44) with a first conductive pattern having one or more first cap...  
WO/1999/013571A1
A package for surface acoustical wave (SAW) device includes an electrically insulative substrate having a first surface with an electrically conductive layer formed thereon. A first surface of the SAW device is attached to the electrical...  
WO/1999/010938A1
A piezroelectric resonator (10) having a sacrificial mass-loading layer (16). Material is removed from the mass-loading layer (16) to raise a resonator frequency to a desired target. The sacrificial layer (16) is of a dense material, suc...  
WO/1999/005788A1
A conventional surface acoustic wave device is constituted of a piezoelectric substrate, an electrode film formed on the piezoelectric substrate and divided into electrode fingers, a bus bar connecting the electrode fingers in common, an...  
WO/1999/001901A1
A parallel plate structure (1) is provided with a pair of bimorph piezoelectric elements (2) and prismatic insulation spacers (3) inserted between the piezoelectric elements (2) at the upper and lower ends thereof for cementing the piezo...  

Matches 551 - 600 out of 17,792