Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 551 - 600 out of 11,095

Document Document Title
WO/2000/070130
A method for etching an article containing a crystal while immersing it in an acid liquid at an etching rate higher than the crystal growth rate of the article. An article processed by the etching method is also disclosed. The etching ra...  
WO/2000/057494
A plurality of recesses (101) are formed by etching in the center of a quartz plate (100) obtained by polishing an electronic material such as a quartz plate, silicon or gallium arsenide by using a double-side polishing machine, single-s...  
WO/2000/046920
A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) a...  
WO/2000/046580
A transducer has a closure for components mounted on the substrate (13) comprising: a lid component (16); and a peripheral component (17) of plastics material secured by one side to the lid component (16) and by the other side to the one...  
WO/2000/042706
A method (100) of providing a time delay to a signal utilizing a surface acoustic wave ladder filter includes a first step (102) providing a piezoelectric substrate. A second step (104) includes disposing series and shunt coupled surface...  
WO/2000/042705
A flexural-mode, micromechanical resonator utilizing a non-intrusive support structure to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz is manufactured using polysilicon surface micromachining technology. Also, ...  
WO/2000/042704
A surface acoustic wave device the frequency characteristics of which can be flexibly regulated in response to a system request and which can be downsized and enhanced in out-band characteristics, wherein a grounding terminal wired to a ...  
WO/2000/041299
The invention concerns a surface acoustic wave device comprising a fine piezoelectric material film, a molecular glue layer and a bearing substrate. The fine film constitutes a sound energy guide enabling to increase the performance leve...  
WO/2000/035085
The invention concerns a novel type of encapsulated surface wave components and a collective method for making such components. The component comprises a wave surface device at the substrate surface; the encapsulating case includes, besi...  
WO/2000/033455
A base (1), on which input/output electrode patterns (3) are formed, has an opening in the center. On the other hand, an integrated circuit (2) has an active surface, on which a number of bumps (4) are formed toward its two opposite side...  
WO/2000/033394
A surface acoustic wave device (9) with electrodes (19) having a metallization of a first layer (20) of substantially pure titanium and a second layer (22) of an alloy of aluminum and titanium. The titanium comprises about 0.1% to about ...  
WO/2000/031807
Quartz crystal resonators (30) with a first angle of rotation having an X-axis (17) and Z'-axis (19) lying within a plane corresponding to an AT-cut and a second angle of rotation (34) within the plane of the AT-cut and lying within a ra...  
WO/2000/024123
A surface acoustic wave device (1) comprising a substrate (2) composed of quartz, a pair of comb-tooth-shaped electrodes (3) composed of aluminum layers, electrode pads (4) and a pair of lattice-shaped reflectors (5) composed of the same...  
WO/2000/021195
Electromagnetic resonator and filter devices are formed on a substrate having opposing sides. A superconductor layer on a first side is patterned in the form of at least one self resonant spiral. Input and output coupling structures, suc...  
WO/2000/011782
A multi-pole monolithic crystal filter with at least three acoustically coupled resonators (50, 52, 54) on a piezoelectric blank (56). Each resonator (50, 52, 54) has associated top and bottom electrodes (70, 72, 74, 76, 78, 80). An inpu...  
WO/2000/005812
A piezo-oscillator which prevents an exciting electrode from being kept open between the upper surface and the lower surface of a piezo-oscillator piece even when a noble metal layer is partly removed in order to increase the adhesivenes...  
WO/2000/003481
The invention concerns a device (10) for semi-automatic, fast and accurate adjusting of electronic card potentiometers in an assembly line, comprising a circuit tester (1) connected to a screwdriver (12) provided with an adjusting rod (1...  
WO/1999/060830
The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for...  
WO/1999/059244
Preferably, the resonator is provided with lithographically produced holes or similar structures in the top electrode layer. The average distance between said holes or structures is shorter than the wavelength provided in order to operat...  
WO/1999/057807
According to the inventive thermomechanical method for planing a resist layer which is applied on a partially raised supporting surface, a resist structure, especially an encapsulation for electronic components, is obtained. To this end,...  
WO/1999/056390
The invention relates to a surface wave component and to a method for the production of the same, comprising a chip (2) with a piezoelectric substrate, electronic conductive structures arranged on said chip (IDT converters, contact strip...  
WO/1999/052209
A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20)...  
WO/1999/043084
In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface...  
WO/1999/021275
The invention relates to a piezoelectric ceramic resonator and manufacturing method thereof. More particularly, the invention relates to a piezoelectric ceramic resonator comprising a piezoelectric ceramic body (21) having an upper surfa...  
WO/1999/019982
A surface mount filter (10) has a device body with a plurality of terminations (20, 22) located thereon. The device body is constructed having a rigid insulative substrate (44) with a first conductive pattern having one or more first cap...  
WO/1999/013571
A package for surface acoustical wave (SAW) device includes an electrically insulative substrate having a first surface with an electrically conductive layer formed thereon. A first surface of the SAW device is attached to the electrical...  
WO/1999/010938
A piezroelectric resonator (10) having a sacrificial mass-loading layer (16). Material is removed from the mass-loading layer (16) to raise a resonator frequency to a desired target. The sacrificial layer (16) is of a dense material, suc...  
WO/1999/005788
A conventional surface acoustic wave device is constituted of a piezoelectric substrate, an electrode film formed on the piezoelectric substrate and divided into electrode fingers, a bus bar connecting the electrode fingers in common, an...  
WO/1999/001901
A parallel plate structure (1) is provided with a pair of bimorph piezoelectric elements (2) and prismatic insulation spacers (3) inserted between the piezoelectric elements (2) at the upper and lower ends thereof for cementing the piezo...  
WO/1998/057423
A batch-compatible, post-fabrication annealing method and system are described that can be used to trim the resonance frequency and enhance the quality factor of mechanical microstructures, particularly micromechanical structures, such a...  
WO/1998/052279
In order to realize a subminiature elastic wave device, which has an electric property comparable to at least that of a conventional elastic surface wave device and of which reliability is not degraded even when undergoing resin sealing ...  
WO/1998/052280
A piezoelectric thin film device which is composed mainly of a substrate, a piezoelectric thin film formed on the substrate, and thin film electrodes formed on both the upper and lower surfaces of the thin film. The thin film is resonate...  
WO/1998/049772
A surface wave device is made by forming conductors on a surface of a piezoelectric material in a conductor pattern defined by exposing photoresist via a reticle. The conductor pattern is provided on the reticle in two parts each definin...  
WO/1998/049773
A device, and the related method of fabricating such a device, for generating surface acoustic waves (SAW) based on interdigitation of electrodes. The device has a line width and spacing of quarter wavelengths on the order of 100 nanomet...  
WO/1998/048464
Thin film piezoelectric elements (12a, 12b, and 12c) formed on a wafer (11) and having the same characteristics irrespective of the position on the wafer (11) is realized by compensating the variation of the characteristics depending on ...  
WO/1998/047226
An AT-cut crystal resonator comprising two exciting electrodes respectively formed on two main surfaces of an AT-cut quartz plate, wherein the relative positional relation between the two electrodes is shifted in the direction perpendicu...  
WO/1998/031095
A piezoelectric vibrator so assembled that a space may be formed between a vibrating piece and a plug, with a conductive resin-made connection layer being formed for connecting, to the vibrating piece, a slab-like lead which has its top ...  
WO/1998/024588
A method for manufacturing a quartz oscillator in which a quartz piece is ground as small, thin, and accurate as possible as to obtain a quartz oscillator, a quartz resonator or an optical lens for transmission and reception of a high fr...  
WO/1998/016957
A Thin Film Bulk Acoustic Wave Resonator (FBAR) (2), comprising a top electrode layer (30), a substrate (40), an acoustic mirror (42) that is formed atop the substrate, and a piezoelectric layer (32) that is formed between the top electr...  
WO/1998/016956
A method for fabricating a Thin Film Bulk Acoustic Wave Resonator (FBAR). The method comprises the steps of: (A) forming a sacrificial layer (62) comprising one of a metal and a polymer over a selected portion of a substrate (42); (B) fo...  
WO/1998/015984
A method for tuning a Thin Film Bulk Acoustic Wave Resonator (FBAR) located on a wafer. The FBAR comprises a plurality of layers having respective thicknesses. The FBAR exhibits at least one of a series resonance and a parallel resonance...  
WO/1998/013932
A branch filter which is used for mobile communication such as a portable telephone and the purpose of the invention is that a band separates two bands with a simple construction in such a way that mutual influence between both the bands...  
WO/1998/008303
An odd order N-pole, (N-1)/2 zero elliptic filter (300) is provided having (N-1)/2 BAW resonators (302 and 304). The first Bulk Acoustic Wave (BAW) resonator (302) operates at a first mode number and a first center frequency and the seco...  
WO/1997/042705
The dielectric film (102) of a surface acoustic wave element (100) constituted of a piezoelectric substrate (101) composed of Li2B4O7 (LBO), the dielectric film (102), which is formed on the substrate (101), is composed of SiO2, and has ...  
WO/1997/036307
A method is provided of producing an LC-circuit in form of a single component, in which the inductor and capacitor elements are arranged atop one another, and where the inductor elements are formed by ferromagnetic zones made of layers (...  
WO/1997/036306
A method is provided of producing an LC-circuit in form of a single component, in which the inductor and capacitor elements are arranged atop one another, and where the inductor elements are formed by ferromagnetic zones made of layers (...  
WO/1997/023951
In an electronic component, especially an SW component with a conductive structure (2) on a substrate (1) and and encapsulation (4) enclosing them on the substrate (1), at least the conductive structures (2) are covered by a gas-diffusio...  
WO/1997/023904
In a process for producing contacts on SW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable...  
WO/1997/023039
The invention relates to a method for the structuring of substrates of SAW components by sand blasting. During said method, a blast mask is applied to the substrate (1) and, at points to be structured, windows are made in a selective man...  
WO/1997/018628
A method of hermetically bonding oxide materials. The bonding is performed by means of an intermediate layer of a commercially available lead borate glass at a temperature below the melting point of aluminium. The method requires no prev...  

Matches 551 - 600 out of 11,095