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WO/1998/052279 |
In order to realize a subminiature elastic wave device, which has an electric property comparable to at least that of a conventional elastic surface wave device and of which reliability is not degraded even when undergoing resin sealing ...
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WO/1998/052280 |
A piezoelectric thin film device which is composed mainly of a substrate, a piezoelectric thin film formed on the substrate, and thin film electrodes formed on both the upper and lower surfaces of the thin film. The thin film is resonate...
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WO/1998/049772 |
A surface wave device is made by forming conductors on a surface of a piezoelectric material in a conductor pattern defined by exposing photoresist via a reticle. The conductor pattern is provided on the reticle in two parts each definin...
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WO/1998/049773 |
A device, and the related method of fabricating such a device, for generating surface acoustic waves (SAW) based on interdigitation of electrodes. The device has a line width and spacing of quarter wavelengths on the order of 100 nanomet...
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WO/1998/048464 |
Thin film piezoelectric elements (12a, 12b, and 12c) formed on a wafer (11) and having the same characteristics irrespective of the position on the wafer (11) is realized by compensating the variation of the characteristics depending on ...
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WO/1998/047226 |
An AT-cut crystal resonator comprising two exciting electrodes respectively formed on two main surfaces of an AT-cut quartz plate, wherein the relative positional relation between the two electrodes is shifted in the direction perpendicu...
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WO/1998/031095 |
A piezoelectric vibrator so assembled that a space may be formed between a vibrating piece and a plug, with a conductive resin-made connection layer being formed for connecting, to the vibrating piece, a slab-like lead which has its top ...
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WO/1998/024588 |
A method for manufacturing a quartz oscillator in which a quartz piece is ground as small, thin, and accurate as possible as to obtain a quartz oscillator, a quartz resonator or an optical lens for transmission and reception of a high fr...
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WO/1998/016957 |
A Thin Film Bulk Acoustic Wave Resonator (FBAR) (2), comprising a top electrode layer (30), a substrate (40), an acoustic mirror (42) that is formed atop the substrate, and a piezoelectric layer (32) that is formed between the top electr...
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WO/1998/016956 |
A method for fabricating a Thin Film Bulk Acoustic Wave Resonator (FBAR). The method comprises the steps of: (A) forming a sacrificial layer (62) comprising one of a metal and a polymer over a selected portion of a substrate (42); (B) fo...
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WO/1998/015984 |
A method for tuning a Thin Film Bulk Acoustic Wave Resonator (FBAR) located on a wafer. The FBAR comprises a plurality of layers having respective thicknesses. The FBAR exhibits at least one of a series resonance and a parallel resonance...
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WO/1998/013932 |
A branch filter which is used for mobile communication such as a portable telephone and the purpose of the invention is that a band separates two bands with a simple construction in such a way that mutual influence between both the bands...
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WO/1998/008303 |
An odd order N-pole, (N-1)/2 zero elliptic filter (300) is provided having (N-1)/2 BAW resonators (302 and 304). The first Bulk Acoustic Wave (BAW) resonator (302) operates at a first mode number and a first center frequency and the seco...
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WO/1997/042705 |
The dielectric film (102) of a surface acoustic wave element (100) constituted of a piezoelectric substrate (101) composed of Li2B4O7 (LBO), the dielectric film (102), which is formed on the substrate (101), is composed of SiO2, and has ...
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WO/1997/036307 |
A method is provided of producing an LC-circuit in form of a single component, in which the inductor and capacitor elements are arranged atop one another, and where the inductor elements are formed by ferromagnetic zones made of layers (...
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WO/1997/036306 |
A method is provided of producing an LC-circuit in form of a single component, in which the inductor and capacitor elements are arranged atop one another, and where the inductor elements are formed by ferromagnetic zones made of layers (...
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WO/1997/023951 |
In an electronic component, especially an SW component with a conductive structure (2) on a substrate (1) and and encapsulation (4) enclosing them on the substrate (1), at least the conductive structures (2) are covered by a gas-diffusio...
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WO/1997/023904 |
In a process for producing contacts on SW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable...
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WO/1997/023039 |
The invention relates to a method for the structuring of substrates of SAW components by sand blasting. During said method, a blast mask is applied to the substrate (1) and, at points to be structured, windows are made in a selective man...
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WO/1997/018628 |
A method of hermetically bonding oxide materials. The bonding is performed by means of an intermediate layer of a commercially available lead borate glass at a temperature below the melting point of aluminium. The method requires no prev...
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WO/1997/012440 |
A planar electronic network of passive electronic components on a chip are formed in a mass-producible method on a rigid substrate in a manner designed to maximize repeatability of the process. The wafer is diced into individual chips. T...
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WO/1997/011526 |
An improved surface acoustic wave device in which electrodes composed of a film made of copper-added aluminum alloy are formed on a piezoelectric substrate. In the electrodes of the device, copper segregates near crystal grain boundaries...
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WO/1997/007649 |
A method of hermetically encapsulating a crystal oscillator (100) using a thermoplastic shell. First, a thermoplastic shell defining a cavity is molded around a periphery of oscillator locations on a lead frame (102). Second, oscillator ...
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WO/1997/002596 |
An electronic component and a production method thereof. This electronic component comprises a surface acoustic wave device (3) having a main plane on which a transducer (4) and a wiring pattern (5) electrically connected to the transduc...
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WO/1996/039710 |
A method for etching (200) photolithographically produced quartz crystal blanks for singulation. First, a quartz wafer is plated on both sides with metal and subsequently coated on both sides with photoresist (202). Second, the photoresi...
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WO/1996/018182 |
The invention concerns an attenuating structure (5) consisting of a UV-initiated cationically curing epoxy resin for a surface wave component. The solvent-free epoxy resin is based on a cycloaliphatic epoxy resin and is applied to wafers...
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WO/1996/012344 |
A high frequency Surface Acoustic Wave (SAW) device includes a highly oriented diamond layer adjacent a piezoelectric layer. In one embodiment, laterally spaced apart piezoelectric layers or portions confine propagation of the wave withi...
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WO/1996/000985 |
A method and device for selectively reducing the frequency-temperature shift of piezoelectric crystals. The piezoelectric device (100) includes a substrate (102), a piezoelectric element (106) and a temperature-dependent interface struct...
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WO/1996/000464 |
Devices are disclosed for controlling high frequency signals by the generation of surface skimming bulk waves (SSBWs). The devices include: (a) a bulk crystalline substrate of MTiOXO4 (M is K, Rb, Tl, Cs, and/or NH4 and X is P and/or As)...
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WO/1995/030276 |
An encapsulation is disclosed for surface acoustic wave components, with a cap (13-16) which seals in the component structures (10-12) on a substrate (1) and takes the form of a covering on the substrate (1) provided in the areas of the ...
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WO/1995/024075 |
A surface acoustic wave resonator having an extremely stable resonance frequency, a low equivalent series resistance and a high Q value can be accomplished by using a cantilevered resonator element that comprises an IDT and a reflector a...
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WO/1995/017769 |
A method of compliantly mounting piezoelectric device with a substrate (102). First, outer portions (114, 116) of a piezoelectric element (106) are selectively metallized. Next, one layer of aluminum (138) is selectively dispensed on the...
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WO/1995/015013 |
A method of mounting a piezoelectric element (102) with a substrate (106). First, a compliant material is dispensed on at least one side of the substrate and cured. Next, a first conductive adhesive (112) is applied on the other side of ...
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WO/1995/009446 |
A method of manufacturing is employed to produce a size-reduced frequency control device (300), according to the present invention. A temperature compensation circuit (304) and an unsealed piezoelectric element (302) are disposed on a su...
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WO/1995/004406 |
The proposed equalizer (10) for high-frequency networks has a T-shaped adjustable attenuator (12) and at least one reactance element in its longitudinal arm (14) and its transverse arm (20), the said reactance elements being tuned to the...
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WO/1993/018584 |
A method and a manufacturing plant for producing resonators, comprising cleaning the piezoelectric discs (91) of the resonator elements to atomic purity immediately prior to applying electrodes thereto. The resonator elements (9) are tra...
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WO/1993/016577 |
In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by names of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover ...
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WO/1992/019042 |
Process for producing reflectors for differently codable delay lines in surface wave technology in which, in an initial masking stage, finger electrodes which are unconnected or interconnected in pairs are produced for reflectors taking ...
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WO/1992/005592 |
A piezoelectric component-mounting foil and foil making method are disclosed, whereby a first portion (102) of the foil in a first plane substantially parallel to a second portion (124) of the foil in a second plane are connected by a ce...
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WO/1991/012662 |
A piezoresonator of a type wherein an ultra-thin oscillation portion and a ring-like enclosure portion for enclosing the periphery of the oscillation portion are formed integrally. The widths of a pair of thick side edges of the ring-lik...
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WO/1991/012663 |
A piezoelectric resonator constituted in one body of an ultrathin vibrating part and a thick annular enclosing part surrounding the vibrating part, in which a groove for an excess adhesive agent, etc., is formed between an appropriate ar...
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WO/1990/005409 |
A surface acoustic wave transponder in which transducers (14) on the surface of a piezoelectric substrate (10) modify an interrogating signal. The transducers are phase encoded by selectively connecting their finger sets to respective bu...
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WO/1990/004285 |
In a surface acoustic wave transducer having a small gap among IDT electrodes, a metal oxide that is selectively formed only on the edges of the electrodes is interposed between the electrodes, to prevent the electrodes from short-circui...
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WO/1989/011756 |
There is provided a system for automatically integrally calibrating an oscillator (10) and/or a phase-locked loop (30, 32, 34) to achieve frequency accuracy and stability in a synthesized radio, particularly a radio where the temperature...
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WO/1988/006818 |
A piezoelectric vibrator in which the case and the stem are plated with solder containing more than 90 % of lead, an inner lead for fastening a piezoelectric vibrator piece is plated with solder, and the solder is melted to fasten the pi...
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WO/1988/002183 |
A technique for trimming resistors and other passive circuit components buried in hybrid multilayer circuit structures. For example, resistors (13) are formed between two dielectric layers (11, 19) of a hybrid multilayer circuit structur...
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WO/1987/006073 |
In a reflecting face (14) of an electroacoustic delay line there is engraved a network formed of hollows (20) and peaks (21) of which the height difference induces on the waves reflected thereon a phase difference such that the signals i...
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WO/1987/003756 |
The invention relates to surface wave dispersive filters of the RAC type. It consists in the replacement, in an RAC of a known type of one of the input or output transducers (10, 11) by a surface wave filter-forming transducer (20) of wh...
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WO/1986/007507 |
Microminiature resonant sensor structures are prepared according to micromachining/microfabrication techniques, which structures include thin-film deposits of piezoelectric materials. Such piezoelectric deposits may be excited electrical...
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WO/1986/001655 |
A converter for SAW filters on a piezoelectric substrate. The converter consists of several groups (Ga, Gb, ...), which are linked in a half-group manner (Ga1, Ga2, ...) with bus-bars (Ph1, Ph2) for two phases (1, 2). These half-groups a...
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