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WO/2017/086004A1 |
Provided is an elastic-wave device in which the difference in sound speed between an edge region and a center region can be sufficiently large while still achieving a compact-size elastic-wave device. The present invention is an elastic-...
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WO/2017/083150A1 |
Layer structures for RF filters can be fabricated using rare earth oxides and epitaxial aluminum nitride, and methods for growing the layer structures. A layer structure (300) can include an epitaxial crystalline rare earth oxide (REO) l...
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WO/2017/076361A1 |
A complete board package machining process for an SMD quartz crystal resonator. The complete board package machining process comprises the following machining steps: (1), machining a plurality of quartz crystal bases (2) arranged, in a m...
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WO/2017/068268A1 |
The invention relates to a production method for a surface acoustic wave device, remarkable in that it comprises the following steps: • a step of providing a piezoelectric substrate (1) comprising a transducer (2) arranged on the main ...
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WO/2017/047604A1 |
A composite substrate manufacturing method of the present invention comprises: (a) a step of mirror-polishing a piezoelectric substrate side of a bonded substrate which comprises a piezoelectric substrate and a support substrate bonded t...
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WO/2017/047605A1 |
A composite substrate of the present invention is a composite substrate provided with a support substrate having a diameter of 2 inches or more, and a piezoelectric substrate bonded to the support substrate, the piezoelectric substrate h...
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WO/2017/026257A1 |
In order to be able to improve the Q value of a piezoelectric thin-film element once unnecessary vibration has been suppressed, an acoustic reflection film (104) is affixed to a first electrode (102), whereupon a piezoelectric single-cry...
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WO/2017/022504A1 |
An electronic component which is provided with: an electronic element (100); a base member (300) having an upper surface (302) on which the electronic element (100) is mounted; and a lid member (200) that is bonded to the base member (30...
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WO/2017/012348A1 |
Disclosed is a novel piezoelectric quartz wafer with a dual-convex structure. The novel piezoelectric quartz wafer comprises a central component (1), a protection frame (2), and a connection portion (3). A cavity is provided in the prote...
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WO/2017/013945A1 |
Provided is an elastic wave device, whereby a strain of an IDT electrode can be reduced at the time when elastic waves are excited, and excellent IMD characteristics can be achieved. An elastic wave device 1 is provided with: a piezoelec...
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WO/2017/007141A1 |
Disclosed are: a crystal oscillator package capable of preventing the deformation of a crystal oscillator since a laser is locally emitted at a laser-sensitized glass frit so as to melt the same; and a manufacturing method therefor. Acco...
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WO/2016/204110A1 |
A method for manufacturing a piezoelectric vibrator (1) includes: mounting a piezoelectric vibrating element (100) on a base member (300) via a conductive adhesive (340, 342); maintaining the piezoelectric vibrating element (100) for a p...
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WO/2016/194562A1 |
A piezoelectric vibrator 1 comprises: a piezoelectric vibration element 100; a substrate 300 having protrusions 312 having a lower height than the upper surface of the piezoelectric vibration element 100; and a cap 200 joined to the prot...
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WO/2016/190539A1 |
A crystal oscillator and a production method therefor are disclosed. The present invention relates to a crystal oscillator and a production method therefor, the method comprising the steps of: preparing a base structure having an electro...
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WO/2016/190540A1 |
A crystal oscillator and a production method therefor are disclosed. The present invention relates to a crystal oscillator and a production method therefor, the method comprising the steps of: preparing a base structure having an electro...
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WO/2016/190090A1 |
A piezoelectric vibrator (1) is provided with: a piezoelectric vibration element (100); a substrate (300), which has a mounting surface (302), and has an electrode pattern (310) that is formed on the mounting surface (302); and a cap (20...
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WO/2016/185772A1 |
Provided is a surface acoustic wave device with which it is possible to simplify the electrical connections between a circuit portion and other elements, and reduce the size of a mounted electronic component. An end-surface-reflecting su...
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WO/2016/185866A1 |
This surface acoustic wave device is provided with: a piezoelectric substrate (11); an IDT electrode (20) which is provided on one main surface of the piezoelectric substrate (11); a support layer (50) which is formed to stand on the mai...
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WO/2016/181881A1 |
A crystal oscillator (1) equipped with a crystal oscillator element (100) that includes an AT-cut crystal substrate (10) and first and second excitation electrodes (20, 30), and further equipped with a base member (300) and a lid member ...
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WO/2016/171772A1 |
A deep trench (DT) MEMS resonator includes a periodic array of unit cells, each of which includes a single DT formed in a semiconductor substrate and filled with a material whose acoustic impedance is different than that of the substrate...
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WO/2016/169665A1 |
Described is an electroacoustic component with improved acoustic properties. The component comprises a rectangular chip whose lateral edges are rotated relative to the piezoelectric axis.
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WO/2016/164875A1 |
This disclosure describes a low-power, low-phase-noise (LPLPN) oscillator. The LPLPN oscillator (100) includes a resonator load (102), an amplifier stage (104), and a loop gain control circuit (106). The resonator load (102) is structure...
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WO/2016/158965A1 |
The present invention provides an element manufacturing method. An element manufacturing method according to the present invention includes: a first step for obtaining a thickness distribution in a surface direction of a workpiece 100; a...
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WO/2016/158050A1 |
Provided is an elastic wave device wherein a gap between a mounting substrate and a cover member is sufficiently filled with a molding resin, and the cover member is not susceptible to denting. An elastic wave device 1 is provided with a...
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WO/2016/154397A1 |
A piezoelectric two-dimensional mode resonator suited for high frequency filtering applications, with the ability to simultaneously excite lateral and vertical acoustic waves.
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WO/2016/147986A1 |
Provided are an elastic wave device and a production method for the elastic wave device wherein layers do not easily separate during a dicing step. An elastic wave device 1 that is provided with: a piezoelectric body layer 2 that has a f...
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WO/2016/148285A1 |
Provided are a crystal oscillator with which, by not housing a thermistor and a crystal chip in the same space, the thickness of a device as a whole can be reduced while preventing degradation of the thermistor, and a method for manufact...
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WO/2016/147814A1 |
Provided is an elastic wave device that has an excellent degree of parallelism between the top surface of a sealing resin and a terminal electrode, and that is not susceptible to contact defects between the terminal electrode on a mounti...
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WO/2016/147688A1 |
Provided is an elastic wave device wherein unwanted waves do not easily cause deterioration of characteristics. An elastic wave device 1 wherein an IDT electrode 3 is provided as an excitation electrode to a piezoelectric body layer 2, w...
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WO/2016/136015A1 |
A piezoelectric vibration component (40) is provided with a piezoelectric vibrator (20), a substrate (10), and an electroconductive adhesive (12) for bonding the piezoelectric vibrator (20) to the substrate (10). The electroconductive ad...
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WO/2016/137009A1 |
This method for measuring liquid samples is equipped with: a step of providing a sensor chip having a plurality of SAW elements positioned along the direction of flow of a liquid sample on the upper surface of a piezoelectric substrate, ...
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WO/2016/132767A1 |
A piezoelectric vibration device (1) comprising: a piezoelectric vibrator (100) having vibration electrodes (130, 140) formed therein; a base member (300) having a substantially rectangular external shape and having the piezoelectric vib...
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WO/2016/132765A1 |
A piezoelectric vibration device (1) comprising: a piezoelectric vibrator (100) including a piezoelectric vibration piece (110) and a frame (120), said piezoelectric vibration piece (110) having vibration electrodes (130, 140) formed the...
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WO/2016/125753A1 |
Provided is a surface acoustic wave device assembly with which conforming products and defective products can be sorted prior to division into individual surface acoustic wave devices. A surface acoustic wave device assembly 1 comprises:...
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WO/2016/121429A1 |
[Problem] The purpose of the present invention is to provide a method for producing an oxide single crystal substrate that is suppressed in variation of characteristics within the substrate plane. [Solution] A production method according...
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WO/2016/121466A1 |
A quartz resonator (1) having thickness-shear vibration as principal vibration is provided with: a quartz substrate (10) having a front surface and a rear surface and including a vibrating portion (12) disposed in a region including the ...
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WO/2016/117483A1 |
A method for manufacturing an elastic wave device has: a step for layering a plurality of films comprising an electroconductive material sequentially on a piezoelectric substrate on which a first resist pattern is formed; a step for remo...
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WO/2016/113947A1 |
A piezoelectric vibration component (40) is provided with: a substrate (10) that has a main surface (11) having a piezoelectric vibrator (20) mounted thereon; a lid (30), which has a recessed section (31) having an opening facing the mai...
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WO/2016/114172A1 |
This method for manufacturing a piezoelectric device is a method for manufacturing a piezoelectric device (101) that is provided with a substrate (4), a piezoelectric layer (6) which is arranged above the substrate (4) and is directly or...
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WO/2016/114056A1 |
[Problem] To provide a lithium tantalate single crystal substrate for surface acoustic wave elements, said lithium tantalate single crystal substrate having a smaller temperature characteristic than conventional rotated Y-cut LiTaO3 subs...
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WO/2016/114358A1 |
Provided are a substrate with which parasitic capacitance can be reduced, despite advanced miniaturization, and a method for manufacturing the same. The substrate 2 comprises a substrate body 2A having a first main surface 2a and a secon...
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WO/2016/111038A1 |
The present invention increases the adhesive force that exists between a substrate and an adhesive layer and that hermetically seals a piezoelectric oscillator on the substrate. A piezoelectric oscillation member (40) that is provided wi...
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WO/2016/111045A1 |
The present invention addresses the problem of increasing the adhesive force between an adhesive layer and a lid that hermetically seals a piezoelectric vibrator to a substrate. A piezoelectric vibration component (40) is provided with: ...
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WO/2016/111044A1 |
The present invention addresses the problem of increasing the adhesive force between an adhesive layer and a substrate that hermetically seals a piezoelectric vibrator to the substrate. A piezoelectric vibration component (40) is provide...
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WO/2016/111047A1 |
The present invention increases the adhesive force that exists between a lid and an insulating adhesive layer and that is for hermetically sealing a piezoelectric oscillator on a substrate. A piezoelectric oscillation member (40) that is...
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WO/2016/108771A1 |
The invention relates to resonant MEMS temperature sensors that sense the temperature changes by monitoring the frequency shifts of more than one DETF resonators (1, 2) resulting from the changing temperature.
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WO/2016/104576A1 |
This cover material for hermetic sealing (10) is configured from a cladding material (20) which comprises a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) that is bonded onto the silver brazing layer and is c...
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WO/2016/103925A1 |
Provided is an elastic wave device wherein the weather resistance of an IDT electrode can be improved. An elastic wave device 1 which utilizes plate waves. A supporting substrate 2 is provided with a recess 2b in an upper surface 2a. A p...
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WO/2016/104004A1 |
Provided is a resonator manufacturing method whereby it is possible to effectively address resistivity variations in individual wafers. The resonator manufacturing method includes a step of forming a silicon oxide film on the surface of ...
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WO/2016/100626A1 |
A micro-electrical-mechanical system (MEMS) guided wave device includes a piezoelectric layer including multiple thinned regions of different thicknesses each bounding in part a different recess, different groups of electrodes on or adja...
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