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JP2012191446 |
To provide an electronic device and a method for manufacturing the electronic device which implement a timesaving and inexpensive manufacturing process and precise positioning of a mounted element.In an electronic device 100, a cavity 50...
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JP2012191660 |
To provide a method for manufacturing a piezoelectric vibration piece with a stair area provided in the outer periphery of a principal surface.A method for manufacturing a mesa-structure piezoelectric vibration piece comprises: a step (S...
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JP2012187689 |
To provide a method for polishing an outer periphery of a wafer that can improve production efficiency and also prevent the occurrence of cracks, chipping and the like to improve production yield, and to provide a method for manufacturin...
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JP2012191389 |
To efficiently machine a thin film formed on a surface of a substrate with a laser beam transmitted through the substrate while suppressing damage to the substrate from the laser beam.With an interlayer 12 transparent to a laser beam 1 i...
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JP2012191559 |
To provide a crystal device that forms an inductor on a support pedestal of the crystal device.A crystal device comprises: a base (10) which has a pair of external electrodes (51 and 52) formed on a mounting surface, and a pair of a firs...
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JP2012190886 |
To enhance shock resistance of the external electrode of a surface mounted electronic component.An electronic component 100 comprises a substrate 1 formed of a fragile material, a package with the substrate 1, an electronic element 8 ins...
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JP2012186727 |
To provide a piezoelectric vibrating reed manufacturing method, a piezoelectric vibrating reed manufacturing apparatus, a piezoelectric vibrating reed, a piezoelectric transducer provided with the piezoelectric vibrating reed, an oscilla...
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JP2012186808 |
To provide a method of forming a SAW transducer or a SAW resonator on a high coupling substrate while guiding energy in a transducer region by insuring wave-guiding in the transducer region.Electrodes form an interdigital transducer on a...
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JP2012186532 |
To provide a wafer, a package manufacturing method, and a piezoelectric vibrator which are capable of improving a yield by reducing warpage of a wafer body.A wafer 50 for a lid substrate includes: a product region 50c in which a large nu...
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JP2012186703 |
To manufacture an electronic component having an electrode and a lead bonded with accuracy, while suppressing deterioration and characteristic defects.An electronic component manufacturing apparatus 100 includes: a base 10 for arranging ...
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JP2012185132 |
To provide a surface property evaluation method capable of surely measuring a surface property of a test object, and improving yield and manufacturing efficiency even when reflected light cannot be obtained from a surface of the test obj...
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JP2012186709 |
To provide a piezoelectric vibrating piece that causes no degradation in vibration characteristics of a vibrating section, and to provide a piezoelectric device.A piezoelectric vibrating piece (20) includes: a first surface (20a) that is...
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JP2012186761 |
To provide an electronic component with excellent mechanical strength and weatherability, and a manufacturing method thereof.A manufacturing method of an electronic component comprises: a step of preparing a plurality of electric element...
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JP2012186696 |
To provide a manufacturing method of an acoustic wave device which has excellent power resistance and whose insertion loss in a pass band is small, and a manufacturing method thereof.A manufacturing method of an acoustic wave device incl...
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JP2012186706 |
To provide a piezoelectric oscillator that allows precise determination of an oscillation state thereof through mounting terminals without being affected by adjacent piezoelectric oscillators in a wafer state.A piezoelectric oscillator (...
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JP2012186728 |
To provide a piezoelectric vibrating reed manufacturing method, a piezoelectric vibrating reed manufacturing apparatus, a piezoelectric vibrating reed, a piezoelectric transducer provided with the piezoelectric vibrating reed, an oscilla...
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JP2012186729 |
To provide a wafer which allows an out gas generated between wafers during the joining of the wafers to be easily emitted to the exterior and improves the yield by cutting out the joined wafers in good conditions, and to provide a manufa...
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JP2012186533 |
To provide a manufacturing method of a package which planarizes a level difference from a base substrate which is formed after a glass flit is burned and secures conductivity between the interior and the exterior of a cavity, and to prov...
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JP2012186633 |
To provide a manufacturing method of an electronic component in which a sealing resin formed so as to cover an electronic component element is prevented from being charged, and to provide an electronic component manufacture by the method...
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JP2012182765 |
To provide a vibration device and an electronic apparatus which are small and reduce the cost, and to provide a manufacturing method of the vibration device.A sensor device 1 has: a substrate 2 including multiple metal pillars having fir...
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JP2012182564 |
To provide a sheet substrate for a piezoelectric device capable of providing stable air-tight sealing by reducing variation in width from an inner peripheral edge to an outer peripheral edge of a frame part of an element mounting member....
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JP2012182854 |
To provide a manufacturing method of a small and low-height surface acoustic wave device which can be collectively formed in a wafer step without characteristic deterioration.A surface acoustic wave device comprises: a piezoelectric subs...
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JP2012178766 |
To detect measurement failure at once in a crystal device leakage vibration measurement process to ensure that measurement-defective crystal resonators will not be distributed in post processes, thereby suppressing occurrence of defects ...
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JP2012178710 |
To easily manufacture an MEMS device that has structure, in which an electrode surface of a substrate side and an undersurface of a vibrating member oppose to each other with a sufficient narrow gap therebetween, and uses torsional vibra...
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JP2012178716 |
To provide an etching system and an etching method that are capable of more precisely confirming the etching amount of an object to be processed.In a processing tank 11, an object 9 to be processed made of AT-cut crystal is etched with a...
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JP2012175492 |
To provide a piezoelectric device that resists damage when a wafer is cut into separate piezoelectric devices and that allows measurement and adjustment of frequency of each of crystal vibrating pieces on a wafer, and to provide a method...
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JP2012175673 |
To provide a method of manufacturing a piezoelectric vibration piece that can improve a short-circuit defect without increasing a resistance value R1.There is provided a method for manufacturing the piezoelectric vibration piece using a ...
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JP2012175672 |
To provide a spin chuck capable of suppressing unevenness in film thickness when a film is formed by applying a film material, a device for manufacturing a piezoelectric vibration piece equipped with the spin chuck, a method for manufact...
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JP2012175363 |
To provide a method of manufacturing a piezoelectric vibration piece with which non-uniformity in film thickness can be suppressed when forming a mask member film, a device for manufacturing the piezoelectric vibration piece, the piezoel...
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JP2012172970 |
To provide a vibration device with stable electric characteristics in which damage of an active region of a semiconductor substrate caused by a laser beam used in tuning a vibration element may be suppressed.In a sensor device 1, a silic...
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JP2012169863 |
To provide a method for manufacturing a piezoelectric vibrating piece, which enhances the accuracy of alignment of a mask while improving workability of the alignment, and can easily form a piezoelectric plate and an electrode with high ...
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JP2012170025 |
To provide an acoustic wave device which can suppress stress, and provide a method for manufacturing the acoustic wave device.The method for manufacturing the acoustic wave device includes: a step of providing a first sealing part 13 whi...
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JP2012169376 |
To provide a positive electrode junction device capable of assuring a high vacuum level in a package, a package manufacturing method that uses the positive electrode junction device, a piezoelectric vibrator, manufactured by the package ...
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JP2012169864 |
To provide a piezoelectric vibration piece manufacturing method by which the contour of a piezoelectric plate can be recognized correctly to form an electrode part with high precise, a piezoelectric vibration piece, a piezoelectric vibra...
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JP2012169788 |
To provide a package manufacturing method by which a lead electrode narrow in width and thick in thickness can be formed with a good precision, and a durable package having a stable electrical property can be obtained, and to provide a p...
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JP2012169707 |
To provide an elastic wave device that has two or more different electromechanical coupling coefficients on an identical chip, and to provide a method for manufacturing the same.An elastic wave device includes: a piezoelectric substrate ...
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JP2012169862 |
To provide a crystal device which positions electrode patterns and bumps with high accuracy while reducing manufacturing man hours and a manufacturing method of the crystal device, and to provide a piezoelectric transducer, an oscillator...
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JP2012167322 |
To provide a method for producing an electronic component which can form electrodes on a substrate with high precision without causing a forming defect.The method for producing an electronic component includes: a substrate preparing stag...
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JP2012165303 |
To provide a method of manufacturing a crystal oscillator that forms the contour pattern of the crystal oscillator with high precision.A method of manufacturing a crystal oscillator includes the steps of: forming a corrosion-preventing f...
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JP2012165039 |
To provide a method of manufacturing a crystal oscillator capable of being cut into a high precision chip.A method of manufacturing a crystal oscillator includes the steps of: preparing a crystal plate having a predetermined thickness; c...
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JP2012162408 |
To provide more inexpensively a piezoelectric material containing KxNa(1-x)NbO3 as a base material, which is environment-friendly and excellent in piezoelectric characteristic.This piezoelectric material contains a compound represented b...
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JP2012165214 |
To provide a film formation system and a film formation method that can set a target film thickness of film formation per substrate and can thus form a film thickness corresponding to an electrode line width.A film formation system 100 h...
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JP2012165035 |
To provide a manufacturing method of a piezoelectric device which simplifies the manufacturing processes and is manufactured at high accuracy.A manufacturing method of a piezoelectric device includes: a first step in which laser light is...
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JP2012165470 |
To provide a piezoelectric device capable of realizing a reduction in size, and further to provide a manufacturing method thereof.A piezoelectric device 100 according to the present invention includes: a lower substrate 30 and an upper s...
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JP2012165132 |
To provide a method for manufacturing an acoustic wave device, by which an acoustic wave device having excellent device characteristics can be easily manufactured with excellent productivity.The method of the present invention for manufa...
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JP2012165191 |
To provide a manufacturing method for a piezoelectric vibration piece, a piezoelectric vibration piece, a piezoelectric transducer, an oscillator, an electronic apparatus, and a wave clock, capable of uniformly forming a coating pattern ...
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JP2012162407 |
To provide a piezoelectric material which uses KxNa(1-x)NbO3 as a base material, is not harmful to the environment, and is excellent in productivity while retaining practicable piezoelectric characteristics.The piezoelectric material com...
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JP2012161104 |
To provide a tuning-fork-type piezoelectric vibration piece or a tuning-fork-type piezoelectric vibrator, which is hard to break during manufacture of the tuning-fork-type piezoelectric vibration piece and has made the tuning-fork-type p...
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JP2012160979 |
To stabilize filter characteristics and improve the reliability in an elastic wave device.An elastic wave device includes a piezoelectric substrate 10, a comb-shaped electrode 12 formed on the piezoelectric substrate 10, and an insulativ...
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JP2012160777 |
To form through electrodes with a minimum fraction defective while suppressing warping, cracking or other incidents of a base substrate, and manufacture a package productively.A method for manufacturing a package is provided in which a t...
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