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Matches 251 - 300 out of 18,694

Document Document Title
WO/2010/097906A1
Provided is a piezoelectric oscillator manufacturing method for manufacturing a piezoelectric oscillator, in which a piezoelectric oscillating reed is sealed in a cavity formed between a base substrate and a lid substrate jointed to each...  
WO/2010/097898A1
Disclosed is a piezoelectric transducer comprising a package formed by joining a first substrate and a second substrate so that a cavity is formed between the substrates; an internal electrode part formed on the first substrate and conta...  
WO/2010/097903A1
Provided is a glass substrate polishing method having a polishing step of polishing the surface of a glass substrate while feeding a polishing agent. The glass substrate polishing method is characterized in that the polishing step compri...  
WO/2010/097904A1
A method for manufacturing a piezoelectric vibrator has a step of inserting a core material section of a conductive tack body, which has a flat-board-like base section and the core material section extending along a direction orthogonall...  
WO/2010/097899A1
Provided is a method for manufacturing a package including a plurality of substrates jointed to each other, a cavity formed inside of the plural substrates, and through electrodes for conducting the inside of the cavity and the outer sid...  
WO/2010/097901A1
In an anodic bonding method, in a state where a first substrate composed of an insulating material or a dielectric material and an anodically bondable second substrate are laminated, a voltage is applied to a bonding film which is formed...  
WO/2010/098250A1
Disclosed is a manufacturing method for packages that are provided with multiple substrates that have been mutually joined, a cavity that has been formed on the inside of the multiple substrates, and penetrating electrodes that provide c...  
WO/2010/097905A1
Provided is a package manufacturing method by which an electronic component can be packaged in a cavity formed between a plurality of substrates bonded to each other. The method has a through electrode forming step of forming a through e...  
WO/2010/097900A1
Disclosed is a method for producing a package wherein at least one of a first substrate and a second substrate composed of a glass material is provided with a convex cavity. The method for producing a package comprises a cavity-forming s...  
WO/2010/097907A1
Provided is a package manufacturing method for manufacturing a package by using a rivet having a flat head portion and a core portion protruding from the back of the head portion. The package includes a plurality of substrates jointed to...  
WO/2010/097902A1
Provided is a glass substrate polishing method for polishing a glass substrate by using a polishing apparatus. This polishing apparatus comprises a surface plate for rotational drives on a first center axis, a plate made rotatable on a s...  
WO/2010/087226A1
Provided is a method for manufacturing a composite substrate, wherein troubles due to etching can be further suppressed compared with conventional methods wherein thin films are patterned only by etching. The method includes pattern for...  
WO/2010/082571A1
Provided is a piezoelectric device which solves various problems generated due to an IDT electrode provided therein. A piezoelectric device (10D) is composed of a structure wherein a piezoelectric thin film (10) and a supporting body (30...  
WO/2010/079803A1
A method of manufacturing a piezoelectric vibratory device has the following steps:a wafer forming stepfor preparing a thick wafer (30) in which a large number of lower cover members (3) are integrally formed; a joining step for joining ...  
WO/2010/074127A9
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/074127A1
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/070753A1
Provided are wafers for forming many package products each of which has a cavity wherein an operation piece is stored between the wafers by anodically bonding the wafers in a stacked state. The wafer has a product region wherein many rec...  
WO/2010/070000A1
The invention relates to a construction element that operates with acoustic waves, comprising a substrate 1 made of a piezoelectric material, a first electrode plane in which lower electrode structures 3 comprising an acoustically active...  
WO/2010/067794A1
Provided is a method for manufacturing a piezoelectric composite substrate, the method capable of controlling the inclinations of the crystal axis and polarization axis of a single-crystalline thin film, achieving good productivity, and ...  
WO/2010/061821A1
An SAW device (1) has a piezoelectric substrate (3) which propagates elastic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) whi...  
WO/2010/061468A1
Provided is a piezoelectric oscillator manufacturing method which manufactures a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; a pu...  
WO/2010/062847A2
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/061479A1
A method for manufacturing an elastic wave device is provided with a lamination step of forming, on a substrate (1), a plurality of elastic wave devices, each of which includes a lower electrode (2), a piezoelectric film (3) and an upper...  
WO/2010/061470A1
Provided are wafers for forming many package products each of which has a cavity between the wafers for storing an operation piece, by anodically bonding the wafers to each other in a state where the wafers are stacked. In the state wher...  
WO/2010/061469A1
Provided is a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; an external electrode formed on the outer surface of the first substrat...  
WO/2010/062847A9
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/062847A3
A micro-electromechanical resonator (10) includes an electrically-trimmed resonator body (14) having at least one stiffness-enhanced semiconductor region therein containing metal-semiconductor lattice bonds. These metal-semiconductor lat...  
WO/2010/058351A1
The present invention exploits the combination of the amplification, provided by the integration of a FET (or any other three terminal active device), with the signal modulation, provided by the MEM resonator, to build a MEM resonator wi...  
WO/2010/048725A1
The present application describes a radio frequency band reject filter including an input port, an output port, a plurality of acoustic resonators and an inductor for matching the impedance of the plurality of acoustic resonators. The in...  
WO/2010/047031A1
Provided are an electronic component wherein each piece of element can be efficiently separated from a collective substrate, and a method for manufacturing the electronic component. On the collective substrate, (a) a conductive layer (10...  
WO/2010/044491A1
Provided is a quartz oscillator manufacturing method whereby high-precision, fine adjustment can be realized without applying excessive force to a quartz oscillator, and whereby multiple quartz oscillators can be adjusted at one time. Th...  
WO/2010/038295A1
An ultrasonic bonding apparatus (1) bonds a storage member (30) for housing an electronic material member (50) and a lid material (20) by applying the ultrasonic vibration in parallel to bonding surfaces (21) and (31) respectively. The u...  
WO/2010/039307A3
The present invention is directed to a CMOS integrated micromechanical device fabricated in accordance with a standard CMOS foundry fabrication process. The standard CMOS foundry fabrication process is characterized by a predetermined la...  
WO/2010/035457A1
A piezoelectric device has excellent bonding by using solder and excellent electrical continuity by forming an external electrode layer so as to cover a sealing material after tightly sealing a through hole with a sealing material. In a ...  
WO/2010/032982A2
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032982A3
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032346A1
Provided is a piezoelectric vibrator using a piezoelectric substrate in which a bismuth layered compound sets the main crystal phase, wherein satisfactory oscillation characteristics are realized. A piezoelectric vibrator (1) is comprise...  
WO/2010/023732A1
This piezoelectric vibrator comprises a tuning-fork piezoelectric vibrating reed including a pair of vibrating arms, a package for housing the piezoelectric vibrating reed, and getter members formed along the length direction of the vibr...  
WO/2010/023733A1
A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded with each other and between which a cavity is formed, a piezoelectric vibrating strip mounted on the base substrate within the cavity, an external el...  
WO/2010/023741A1
A piezoelectric vibrating reed manufacturing method for manufacturing from a wafer a piezoelectric vibrating reed comprising a pair of vibrating arm portions disposed parallel to each other, a base portion for integrally fixing base end ...  
WO/2010/023730A1
A piezoelectric vibrator having a pair of vibration arms extending in parallel with a base substrate and a lid substrate bonded with each other so as to have a cavity therebetween, a pair of excitation electrodes for vibrating the pair o...  
WO/2010/023727A1
The piezoelectric vibrator is provided with a piezoelectric vibrating piece and a metal film getter material. The piezoelectric vibrating piece has a pair of vibrating arm sections, which are connected to each other and extending paralle...  
WO/2010/023729A1
A piezoelectric vibrator includes a tuning-fork type piezoelectric vibrating strip equipped with a pair of vibrating arm parts, a package housing the piezoelectric vibrating strip, and adjustment films formed along the longitudinal direc...  
WO/2010/023728A1
A piezoelectric vibrator includes a tuning-fork type piezoelectric vibrating strip equipped with a pair of vibrating arm parts, a package housing the piezoelectric vibrating strip, and a pair of adjustment films formed along the longitud...  
WO/2010/023731A1
A piezoelectric vibrator comprising a base substrate and a lid substrate bonded to each other and having a cavity formed, an external electrode formed on the lower surface of the base substrate, an internal electrode so formed on the upp...  
WO/2010/016487A1
A sealing member for a piezoelectric oscillation device hermetically seals oscillation electrodes of a piezoelectric oscillation piece having the oscillation electrodes formed thereon. The sealing member has a through hole for bringing ...  
WO/2010/009719A1
The invention relates to a method for producing a dielectric layer (3) in an electroacoustic component (1), particularly a component working with acoustic surface or acoustic volume waves, having a substrate and an associated electrode s...  
WO/2010/005062A1
A functional device (1) is configured and equipped with an integrated circuit substrate (5), on the surface of which is a multilayer wiring layer (3), and which has a connection electrode (4a) on the uppermost layer (11a) of the multilay...  
WO/2010/001885A1
A piezoelectric vibration device is provided with a piezoelectric vibration piece, and a first sealing member and a second sealing member which hermetically seal an exciting electrode formed on the piezoelectric vibration piece. The pie...  
WO/2009/157453A1
A silicon oxide film (113) is formed on the oscillation parts (102, 103) of an MEMS type electrostatic drive bending oscillator, and at least one structure whereon no oxide is formed is provided near the oscillation parts (102, 103). Whe...  

Matches 251 - 300 out of 18,694