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Patent Searching and Data


Matches 251 - 300 out of 18,540

Document Document Title
WO/2010/032982A2
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032982A3
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032346A1
Provided is a piezoelectric vibrator using a piezoelectric substrate in which a bismuth layered compound sets the main crystal phase, wherein satisfactory oscillation characteristics are realized. A piezoelectric vibrator (1) is comprise...  
WO/2010/023732A1
This piezoelectric vibrator comprises a tuning-fork piezoelectric vibrating reed including a pair of vibrating arms, a package for housing the piezoelectric vibrating reed, and getter members formed along the length direction of the vibr...  
WO/2010/023733A1
A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded with each other and between which a cavity is formed, a piezoelectric vibrating strip mounted on the base substrate within the cavity, an external el...  
WO/2010/023741A1
A piezoelectric vibrating reed manufacturing method for manufacturing from a wafer a piezoelectric vibrating reed comprising a pair of vibrating arm portions disposed parallel to each other, a base portion for integrally fixing base end ...  
WO/2010/023730A1
A piezoelectric vibrator having a pair of vibration arms extending in parallel with a base substrate and a lid substrate bonded with each other so as to have a cavity therebetween, a pair of excitation electrodes for vibrating the pair o...  
WO/2010/023727A1
The piezoelectric vibrator is provided with a piezoelectric vibrating piece and a metal film getter material. The piezoelectric vibrating piece has a pair of vibrating arm sections, which are connected to each other and extending paralle...  
WO/2010/023729A1
A piezoelectric vibrator includes a tuning-fork type piezoelectric vibrating strip equipped with a pair of vibrating arm parts, a package housing the piezoelectric vibrating strip, and adjustment films formed along the longitudinal direc...  
WO/2010/023728A1
A piezoelectric vibrator includes a tuning-fork type piezoelectric vibrating strip equipped with a pair of vibrating arm parts, a package housing the piezoelectric vibrating strip, and a pair of adjustment films formed along the longitud...  
WO/2010/023731A1
A piezoelectric vibrator comprising a base substrate and a lid substrate bonded to each other and having a cavity formed, an external electrode formed on the lower surface of the base substrate, an internal electrode so formed on the upp...  
WO/2010/016487A1
A sealing member for a piezoelectric oscillation device hermetically seals oscillation electrodes of a piezoelectric oscillation piece having the oscillation electrodes formed thereon. The sealing member has a through hole for bringing ...  
WO/2010/009719A1
The invention relates to a method for producing a dielectric layer (3) in an electroacoustic component (1), particularly a component working with acoustic surface or acoustic volume waves, having a substrate and an associated electrode s...  
WO/2010/005062A1
A functional device (1) is configured and equipped with an integrated circuit substrate (5), on the surface of which is a multilayer wiring layer (3), and which has a connection electrode (4a) on the uppermost layer (11a) of the multilay...  
WO/2010/001885A1
A piezoelectric vibration device is provided with a piezoelectric vibration piece, and a first sealing member and a second sealing member which hermetically seal an exciting electrode formed on the piezoelectric vibration piece. The pie...  
WO/2009/157453A1
A silicon oxide film (113) is formed on the oscillation parts (102, 103) of an MEMS type electrostatic drive bending oscillator, and at least one structure whereon no oxide is formed is provided near the oscillation parts (102, 103). Whe...  
WO/2009/157587A1
An acoustic wave device according to one embodiment of the present invention comprises a base body on which a vibrating body is arranged, a sealing body which is joined to the base body in a frame region thereof surrounding the vibrating...  
WO/2009/157305A1
To manufacture a high-quality piezoelectric vibrator which reliably maintains the airtightness in a cavity and ensures stable conductivity between a piezoelectric vibrating piece and an external electrode, the piezoelectric vibrator is m...  
WO/2009/150786A1
Provided are an elastic surface wave device, which can be reduced in size and which can be enhanced in power resistance and hardly has a protrusion such as a hillock in the comb-like electrode of an IDT, and a method for manufacturing th...  
WO/2009/130279A1
At least two structured conductive layers (LS) are configured adjacent to each other on a piezo substrate (PS), each implementing a SAW filter. The conductive layers comprise transducer structures, reflectors and conductive tracks and ea...  
WO/2009/128196A1
Disclosed is a laminated piezoelectric ceramic element fabrication method wherein the lamination step and the cutting step can be simplified, the cutting precision can be increased, and the cutting allowance can be minimized, even when t...  
WO/2009/128546A1
Provided is a method for testing a piezoelectric/electrostrictive actuator, by which the displacement of a piezoelectric/electrostrictive actuator is estimated, on the basis of the relations between one or more frequency characteristic v...  
WO/2009/121901A1
The invention is concerned with the field of material sciences and relates to a layer system for electrodes which can be used for example in frequency filters, sensors or actuators. The object of the present invention is to specify a lay...  
WO/2009/121906A1
Method for producing an electroacoustic component, comprising the following steps: a substrate for an electroacoustic component is provided; an electrically conductive layer is applied to the substrate; the electrically conductive layer ...  
WO/2009/104438A1
Provided is an elastic wave device which can prevent flux from flowing into a hollow space when the elastic wave device is mounted using solder bumps. An elastic wave device comprises (a) a substrate (11), (b) a vibration portion (14) fo...  
WO/2009/104333A1
A piezoelectric vibrator (1) is provided with a base substrate (2), a lid substrate (3) which has a recessed portion (3a) for a cavity and is joined to the base substrate with the recessed portion facing the base substrate, a piezoelectr...  
WO/2009/104486A1
Provided is a structure of a microelectromechanical device wherein the gap can be made narrower. Also provided is a process for fabricating the microelectromechanical device. A microelectromechanical device comprises a resonator (22) and...  
WO/2009/104314A1
A piezoelectric vibrator comprises a base substrate having polished facing sides; a lid substrate, which has a recess for cavity and is bonded to the base substrate so that the recess faces the base substrate; a piezoelectric vibrating r...  
WO/2009/104327A1
A piezoelectric vibrator (1) is provided with a base substrate (2); a lid substrate (3), which has a recessed section (3a) for a cavity and is bonded to the base substrate with the recessed section facing the base substrate; a piezoelect...  
WO/2009/104310A1
A piezoelectric oscillator comprises a base substrate, a lid substrate having a recess portion forming a cavity, joined to the base substrate, and facing the base substrate, piezoelectric oscillating pieces which are joined to the top fa...  
WO/2009/104293A1
A piezoelectric vibrator comprises a base substrate composed of a glass material having a bonding film formed on the upper surface, a lid substrate composed of a glass material having a recess for cavity and bonded to the base substrate ...  
WO/2009/104308A1
Provided is a piezoelectric vibrator manufacturing method for manufacturing a plurality of piezoelectric vibrators, in which piezoelectric vibration members are sealed in cavities formed between a base substrate and a lid substrate joint...  
WO/2009/104328A1
A piezoelectric vibrator (1) is provided with a base substrate (2) having polished double surfaces; a lid substrate (3), which has a recessed section (3a) for a cavity (C) and is bonded to the base substrate; a piezoelectric vibrating pi...  
WO/2009/104309A1
This piezoelectric vibrator comprises a base substrate, a lid substrate having a recess for a cavity and joined to the base substrate with the recess being opposed to the base substrate, a piezoelectric vibrating reed so joined to the up...  
WO/2009/104329A1
A method for manufacturing a piezoelectric vibrator comprises an overlapping step for overlapping a lid substrate (40) on a base substrate (50) such that a piezoelectric vibrating-reed (4) is contained in a cavity (C) after the piezoelec...  
WO/2009/101733A1
Provided are a piezoelectric vibrating piece (4) having a pair of vibrating arms (10, 11) with a base end fixed to a base (12) while placed in parallel and with a weight metallic film (21) formed at the tip, a base substrate (2) having t...  
WO/2009/101921A1
Provided is an electronic component which can withstand the stress applied from a printed board, or the like. An electronic component (1a) has a cavity (9) sealed airtightly by a base (2) and a lid (5), and a crystal oscillator (6) is he...  
WO/2009/097167A2
Method and apparatus for lowering capacitively-transduced resonator impedance within micromechanical resonator devices. Fabrication limits exist on how small the gap spacing can be made between a resonator and the associated input and ou...  
WO/2009/097167A3
Method and apparatus for lowering capacitively-transduced resonator impedance within micromechanical resonator devices. Fabrication limits exist on how small the gap spacing can be made between a resonator and the associated input and ou...  
WO/2009/096563A1
Provided are a small and highly reliable elastic wave device and a method for manufacturing such device. The elastic wave device is provided with a piezoelectric substrate (1); an SAW element (2) formed on one main surface of the piezoel...  
WO/2009/093376A1
Disclosed is a method for manufacturing an elastic wave element, which has excellent temperature coefficient of frequency (TCF), high machining accuracy of an IDT pattern and is durable to high-temperature process at 200°C or higher. Th...  
WO/2009/093377A1
Disclosed is an elastic wave element wherein expansion and contraction due to temperature change are sufficiently suppressed and frequency shift is small. A method for manufacturing such elastic wave element is also disclosed. The elasti...  
WO/2009/081686A1
Disclosed is a method for manufacturing a piezoelectric vibrator (1). The method is provided with a step of forming through holes (35, 36), which penetrate a wafer to be used as a base substrate, so that openings are made on the outer si...  
WO/2009/081651A1
A composite piezoelectric substrate manufacturing method by which an ultrathin piezoelectric film having a uniform thickness can be formed by efficiently using a piezoelectric material. The method comprises the steps of a) preparing a pi...  
WO/2009/078089A1
An elastic wave device according to the present invention includes a piezoelectric substrate (14), a comb-shaped electrode (13) arranged on the piezoelectric substrate (14), and a SiO2 layer (12) formed so as to cover the electrode (13)....  
WO/2009/079188A1
A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the...  
WO/2009/078137A1
Disclosed is a surface wave device, for which a dicing blade is hard to wear, for which a dicing speed is hard to drop, and which can be each produced highly precisely and productively from a mother laminate. The surface wave device is p...  
WO/2009/079188A9
A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the...  
WO/2009/072432A1
Disclosed is a method for manufacturing a package (1) having a base substrate (10) and a lid substrate (20) which are bonded to each other and composed of a glass base material. The package also has a cavity (C) which is formed between t...  
WO/2009/072585A1
Disclosed are: a novel production process for producing a crystalline KLN film; a novel film structure for process stabilization; and a process for producing a semiconductor device using the crystalline KLN film as a piezoelectric thin f...  

Matches 251 - 300 out of 18,540