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Matches 251 - 300 out of 19,088

Document Document Title
WO/2011/004665A1
Provided is an elastic wave device that comprises a piezoelectric film supported by a supporter, wherein a configuration is achieved that prevents various malfunctions from occurring upon joining, and that does not let degradation occur,...  
WO/2011/002028A1
A manufacturing method of piezoelectric-body film that is provided with an aluminum-nitride film containing scandium, comprises a sputtering process wherein sputtering is conducted with aluminum and scandium, in an atmosphere including a...  
WO/2011/001680A1
In a resonator using the MEMS technology, accuracy of the electrode shape can be improved, the short circuit between the input and the output can be avoided, and the reliability of the resonator can be improved. A resonator is provided w...  
WO/2010/147772A1
A method of forming a micromechanical resonator includes forming a resonator body (12) anchored to a substrate (10) by at least a first anchor (12a, 12b). This resonator body may include a semiconductor or other first material having a n...  
WO/2010/147156A1
Disclosed is an easily-producible resonator which uses torsional vibration and has a structure wherein the substrate surface and vibration member lower surface face each other with a sufficiently narrow gap in between. The resonator is p...  
WO/2010/143363A1
Disclosed are a resonator and an oscillator using the same, capable of broadly and finely correcting the resonant frequency of the vibrating element. The resonator comprises a vibrating element (101), electrodes (4, 5) arranged with a cl...  
WO/2010/143475A1
An ion implanted layer (100) is formed inside a piezoelectric single crystal substrate (1) by implanting hydrogen ions under predetermined conditions (S101). A lower electrode (20) functioning as a device is formed on the surface of the ...  
WO/2010/136986A3
A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in th...  
WO/2010/136986A2
A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in th...  
WO/2010/128647A1
Disclosed is a piezoelectric ceramic which is characterized by containing [K1-xNax]1-yLiy[Nb1-z-wTazSbw]O3 (wherein x, y, z and w each represents a molar ratio and satisfies 0 ≤ x ≤ 1, 0 ≤ y ≤ 1, 0 ≤ z ≤ 1, 0 ≤ w ≤ 1) as ...  
WO/2010/125873A1
A SAW device (1) has a substrate (3) that makes elastic waves propagate; IDT electrodes (15) that are placed on a first main face (3a) of the substrate (3); and electrode pads (13) that are connected electrically to the IDT electrodes (1...  
WO/2010/122993A1
Provided is an elastic boundary wave device (1) having a three-medium structure, wherein gaps do not easily form in a first dielectric layer, and the frequency tolerance is low even when using thick IDT electrodes. IDT electrodes (5), a ...  
WO/2010/118512A1
Some embodiments of the invention provide a filter having at least one first filter, each first filter being a band-reject type filter having a first set of filter parameters that are a function of a first material used to fabricate the ...  
WO/2010/116332A1
A bulk-acoustic-mode MEMS resonator has a first portion with a first physical layout, and a layout modification feature. The resonant frequency is a function of the physical layout, which is designed such that the frequency variation is ...  
WO/2010/114115A1
Provided is a package member assembly wherein a plurality of package members are integrally formed. The package member assembly has a plurality of bottomed holes in the front main surface and the rear main surface of a wafer composed of ...  
WO/2010/114602A1
Devices having piezoelectric material structure (10) 2 integrated with substrates (104) are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer...  
WO/2010/101166A1
Provided is a surface acoustic wave device having a low energy loss, and if the device is used for a filtering device, capable of suppressing spurious which occurs near a resonance frequency of a main response, and improving a frequency ...  
WO/2010/097908A1
Provided is a junction-glass cutting method for cutting a junction glass, in which a plurality of glass substrates are junctioned on their junction faces through a junction material, along a cut-scheduled line. The junction glass cutting...  
WO/2010/097910A1
An anodic bonding method for anodically bonding a first substrate and a second substrate is provided with a substrate arranging step wherein the first substrate and the second substrate are arranged such that the substrates are aligned w...  
WO/2010/097909A1
Provided is a package wherein a plurality of substrates, including a first substrate and a second substrate, are bonded, and a cavity is formed between the substrates. The package is provided with a corrosive-resistant bonding film arran...  
WO/2010/097906A1
Provided is a piezoelectric oscillator manufacturing method for manufacturing a piezoelectric oscillator, in which a piezoelectric oscillating reed is sealed in a cavity formed between a base substrate and a lid substrate jointed to each...  
WO/2010/097898A1
Disclosed is a piezoelectric transducer comprising a package formed by joining a first substrate and a second substrate so that a cavity is formed between the substrates; an internal electrode part formed on the first substrate and conta...  
WO/2010/097903A1
Provided is a glass substrate polishing method having a polishing step of polishing the surface of a glass substrate while feeding a polishing agent. The glass substrate polishing method is characterized in that the polishing step compri...  
WO/2010/097904A1
A method for manufacturing a piezoelectric vibrator has a step of inserting a core material section of a conductive tack body, which has a flat-board-like base section and the core material section extending along a direction orthogonall...  
WO/2010/097899A1
Provided is a method for manufacturing a package including a plurality of substrates jointed to each other, a cavity formed inside of the plural substrates, and through electrodes for conducting the inside of the cavity and the outer sid...  
WO/2010/097901A1
In an anodic bonding method, in a state where a first substrate composed of an insulating material or a dielectric material and an anodically bondable second substrate are laminated, a voltage is applied to a bonding film which is formed...  
WO/2010/098250A1
Disclosed is a manufacturing method for packages that are provided with multiple substrates that have been mutually joined, a cavity that has been formed on the inside of the multiple substrates, and penetrating electrodes that provide c...  
WO/2010/097905A1
Provided is a package manufacturing method by which an electronic component can be packaged in a cavity formed between a plurality of substrates bonded to each other. The method has a through electrode forming step of forming a through e...  
WO/2010/097900A1
Disclosed is a method for producing a package wherein at least one of a first substrate and a second substrate composed of a glass material is provided with a convex cavity. The method for producing a package comprises a cavity-forming s...  
WO/2010/097907A1
Provided is a package manufacturing method for manufacturing a package by using a rivet having a flat head portion and a core portion protruding from the back of the head portion. The package includes a plurality of substrates jointed to...  
WO/2010/097902A1
Provided is a glass substrate polishing method for polishing a glass substrate by using a polishing apparatus. This polishing apparatus comprises a surface plate for rotational drives on a first center axis, a plate made rotatable on a s...  
WO/2010/087226A1
Provided is a method for manufacturing a composite substrate, wherein troubles due to etching can be further suppressed compared with conventional methods wherein thin films are patterned only by etching. The method includes pattern for...  
WO/2010/082571A1
Provided is a piezoelectric device which solves various problems generated due to an IDT electrode provided therein. A piezoelectric device (10D) is composed of a structure wherein a piezoelectric thin film (10) and a supporting body (30...  
WO/2010/079803A1
A method of manufacturing a piezoelectric vibratory device has the following steps:a wafer forming stepfor preparing a thick wafer (30) in which a large number of lower cover members (3) are integrally formed; a joining step for joining ...  
WO/2010/074127A9
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/074127A1
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/070753A1
Provided are wafers for forming many package products each of which has a cavity wherein an operation piece is stored between the wafers by anodically bonding the wafers in a stacked state. The wafer has a product region wherein many rec...  
WO/2010/070000A1
The invention relates to a construction element that operates with acoustic waves, comprising a substrate 1 made of a piezoelectric material, a first electrode plane in which lower electrode structures 3 comprising an acoustically active...  
WO/2010/067794A1
Provided is a method for manufacturing a piezoelectric composite substrate, the method capable of controlling the inclinations of the crystal axis and polarization axis of a single-crystalline thin film, achieving good productivity, and ...  
WO/2010/061821A1
An SAW device (1) has a piezoelectric substrate (3) which propagates elastic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) whi...  
WO/2010/061468A1
Provided is a piezoelectric oscillator manufacturing method which manufactures a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; a pu...  
WO/2010/062847A2
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/061479A1
A method for manufacturing an elastic wave device is provided with a lamination step of forming, on a substrate (1), a plurality of elastic wave devices, each of which includes a lower electrode (2), a piezoelectric film (3) and an upper...  
WO/2010/061470A1
Provided are wafers for forming many package products each of which has a cavity between the wafers for storing an operation piece, by anodically bonding the wafers to each other in a state where the wafers are stacked. In the state wher...  
WO/2010/061469A1
Provided is a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; an external electrode formed on the outer surface of the first substrat...  
WO/2010/062847A9
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/062847A3
A micro-electromechanical resonator (10) includes an electrically-trimmed resonator body (14) having at least one stiffness-enhanced semiconductor region therein containing metal-semiconductor lattice bonds. These metal-semiconductor lat...  
WO/2010/058351A1
The present invention exploits the combination of the amplification, provided by the integration of a FET (or any other three terminal active device), with the signal modulation, provided by the MEM resonator, to build a MEM resonator wi...  
WO/2010/048725A1
The present application describes a radio frequency band reject filter including an input port, an output port, a plurality of acoustic resonators and an inductor for matching the impedance of the plurality of acoustic resonators. The in...  
WO/2010/047031A1
Provided are an electronic component wherein each piece of element can be efficiently separated from a collective substrate, and a method for manufacturing the electronic component. On the collective substrate, (a) a conductive layer (10...  

Matches 251 - 300 out of 19,088