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Patent Searching and Data


Matches 251 - 300 out of 19,021

Document Document Title
WO/2010/136986A3
A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in th...  
WO/2010/136986A2
A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in th...  
WO/2010/128647A1
Disclosed is a piezoelectric ceramic which is characterized by containing [K1-xNax]1-yLiy[Nb1-z-wTazSbw]O3 (wherein x, y, z and w each represents a molar ratio and satisfies 0 ≤ x ≤ 1, 0 ≤ y ≤ 1, 0 ≤ z ≤ 1, 0 ≤ w ≤ 1) as ...  
WO/2010/125873A1
A SAW device (1) has a substrate (3) that makes elastic waves propagate; IDT electrodes (15) that are placed on a first main face (3a) of the substrate (3); and electrode pads (13) that are connected electrically to the IDT electrodes (1...  
WO/2010/122993A1
Provided is an elastic boundary wave device (1) having a three-medium structure, wherein gaps do not easily form in a first dielectric layer, and the frequency tolerance is low even when using thick IDT electrodes. IDT electrodes (5), a ...  
WO/2010/118512A1
Some embodiments of the invention provide a filter having at least one first filter, each first filter being a band-reject type filter having a first set of filter parameters that are a function of a first material used to fabricate the ...  
WO/2010/116332A1
A bulk-acoustic-mode MEMS resonator has a first portion with a first physical layout, and a layout modification feature. The resonant frequency is a function of the physical layout, which is designed such that the frequency variation is ...  
WO/2010/114115A1
Provided is a package member assembly wherein a plurality of package members are integrally formed. The package member assembly has a plurality of bottomed holes in the front main surface and the rear main surface of a wafer composed of ...  
WO/2010/114602A1
Devices having piezoelectric material structure (10) 2 integrated with substrates (104) are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer...  
WO/2010/101166A1
Provided is a surface acoustic wave device having a low energy loss, and if the device is used for a filtering device, capable of suppressing spurious which occurs near a resonance frequency of a main response, and improving a frequency ...  
WO/2010/097908A1
Provided is a junction-glass cutting method for cutting a junction glass, in which a plurality of glass substrates are junctioned on their junction faces through a junction material, along a cut-scheduled line. The junction glass cutting...  
WO/2010/097910A1
An anodic bonding method for anodically bonding a first substrate and a second substrate is provided with a substrate arranging step wherein the first substrate and the second substrate are arranged such that the substrates are aligned w...  
WO/2010/097909A1
Provided is a package wherein a plurality of substrates, including a first substrate and a second substrate, are bonded, and a cavity is formed between the substrates. The package is provided with a corrosive-resistant bonding film arran...  
WO/2010/097906A1
Provided is a piezoelectric oscillator manufacturing method for manufacturing a piezoelectric oscillator, in which a piezoelectric oscillating reed is sealed in a cavity formed between a base substrate and a lid substrate jointed to each...  
WO/2010/097898A1
Disclosed is a piezoelectric transducer comprising a package formed by joining a first substrate and a second substrate so that a cavity is formed between the substrates; an internal electrode part formed on the first substrate and conta...  
WO/2010/097903A1
Provided is a glass substrate polishing method having a polishing step of polishing the surface of a glass substrate while feeding a polishing agent. The glass substrate polishing method is characterized in that the polishing step compri...  
WO/2010/097904A1
A method for manufacturing a piezoelectric vibrator has a step of inserting a core material section of a conductive tack body, which has a flat-board-like base section and the core material section extending along a direction orthogonall...  
WO/2010/097899A1
Provided is a method for manufacturing a package including a plurality of substrates jointed to each other, a cavity formed inside of the plural substrates, and through electrodes for conducting the inside of the cavity and the outer sid...  
WO/2010/097901A1
In an anodic bonding method, in a state where a first substrate composed of an insulating material or a dielectric material and an anodically bondable second substrate are laminated, a voltage is applied to a bonding film which is formed...  
WO/2010/098250A1
Disclosed is a manufacturing method for packages that are provided with multiple substrates that have been mutually joined, a cavity that has been formed on the inside of the multiple substrates, and penetrating electrodes that provide c...  
WO/2010/097905A1
Provided is a package manufacturing method by which an electronic component can be packaged in a cavity formed between a plurality of substrates bonded to each other. The method has a through electrode forming step of forming a through e...  
WO/2010/097900A1
Disclosed is a method for producing a package wherein at least one of a first substrate and a second substrate composed of a glass material is provided with a convex cavity. The method for producing a package comprises a cavity-forming s...  
WO/2010/097907A1
Provided is a package manufacturing method for manufacturing a package by using a rivet having a flat head portion and a core portion protruding from the back of the head portion. The package includes a plurality of substrates jointed to...  
WO/2010/097902A1
Provided is a glass substrate polishing method for polishing a glass substrate by using a polishing apparatus. This polishing apparatus comprises a surface plate for rotational drives on a first center axis, a plate made rotatable on a s...  
WO/2010/087226A1
Provided is a method for manufacturing a composite substrate, wherein troubles due to etching can be further suppressed compared with conventional methods wherein thin films are patterned only by etching. The method includes pattern for...  
WO/2010/082571A1
Provided is a piezoelectric device which solves various problems generated due to an IDT electrode provided therein. A piezoelectric device (10D) is composed of a structure wherein a piezoelectric thin film (10) and a supporting body (30...  
WO/2010/079803A1
A method of manufacturing a piezoelectric vibratory device has the following steps:a wafer forming stepfor preparing a thick wafer (30) in which a large number of lower cover members (3) are integrally formed; a joining step for joining ...  
WO/2010/074127A9
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/074127A1
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/070753A1
Provided are wafers for forming many package products each of which has a cavity wherein an operation piece is stored between the wafers by anodically bonding the wafers in a stacked state. The wafer has a product region wherein many rec...  
WO/2010/070000A1
The invention relates to a construction element that operates with acoustic waves, comprising a substrate 1 made of a piezoelectric material, a first electrode plane in which lower electrode structures 3 comprising an acoustically active...  
WO/2010/067794A1
Provided is a method for manufacturing a piezoelectric composite substrate, the method capable of controlling the inclinations of the crystal axis and polarization axis of a single-crystalline thin film, achieving good productivity, and ...  
WO/2010/061821A1
An SAW device (1) has a piezoelectric substrate (3) which propagates elastic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) whi...  
WO/2010/061468A1
Provided is a piezoelectric oscillator manufacturing method which manufactures a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; a pu...  
WO/2010/062847A2
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/061479A1
A method for manufacturing an elastic wave device is provided with a lamination step of forming, on a substrate (1), a plurality of elastic wave devices, each of which includes a lower electrode (2), a piezoelectric film (3) and an upper...  
WO/2010/061470A1
Provided are wafers for forming many package products each of which has a cavity between the wafers for storing an operation piece, by anodically bonding the wafers to each other in a state where the wafers are stacked. In the state wher...  
WO/2010/061469A1
Provided is a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; an external electrode formed on the outer surface of the first substrat...  
WO/2010/062847A9
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/062847A3
A micro-electromechanical resonator (10) includes an electrically-trimmed resonator body (14) having at least one stiffness-enhanced semiconductor region therein containing metal-semiconductor lattice bonds. These metal-semiconductor lat...  
WO/2010/058351A1
The present invention exploits the combination of the amplification, provided by the integration of a FET (or any other three terminal active device), with the signal modulation, provided by the MEM resonator, to build a MEM resonator wi...  
WO/2010/048725A1
The present application describes a radio frequency band reject filter including an input port, an output port, a plurality of acoustic resonators and an inductor for matching the impedance of the plurality of acoustic resonators. The in...  
WO/2010/047031A1
Provided are an electronic component wherein each piece of element can be efficiently separated from a collective substrate, and a method for manufacturing the electronic component. On the collective substrate, (a) a conductive layer (10...  
WO/2010/044491A1
Provided is a quartz oscillator manufacturing method whereby high-precision, fine adjustment can be realized without applying excessive force to a quartz oscillator, and whereby multiple quartz oscillators can be adjusted at one time. Th...  
WO/2010/038295A1
An ultrasonic bonding apparatus (1) bonds a storage member (30) for housing an electronic material member (50) and a lid material (20) by applying the ultrasonic vibration in parallel to bonding surfaces (21) and (31) respectively. The u...  
WO/2010/039307A3
The present invention is directed to a CMOS integrated micromechanical device fabricated in accordance with a standard CMOS foundry fabrication process. The standard CMOS foundry fabrication process is characterized by a predetermined la...  
WO/2010/035457A1
A piezoelectric device has excellent bonding by using solder and excellent electrical continuity by forming an external electrode layer so as to cover a sealing material after tightly sealing a through hole with a sealing material. In a ...  
WO/2010/032982A2
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032982A3
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032346A1
Provided is a piezoelectric vibrator using a piezoelectric substrate in which a bismuth layered compound sets the main crystal phase, wherein satisfactory oscillation characteristics are realized. A piezoelectric vibrator (1) is comprise...  

Matches 251 - 300 out of 19,021