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Matches 251 - 300 out of 17,938

Document Document Title
WO/2009/104310A1
A piezoelectric oscillator comprises a base substrate, a lid substrate having a recess portion forming a cavity, joined to the base substrate, and facing the base substrate, piezoelectric oscillating pieces which are joined to the top fa...  
WO/2009/104328A1
A piezoelectric vibrator (1) is provided with a base substrate (2) having polished double surfaces; a lid substrate (3), which has a recessed section (3a) for a cavity (C) and is bonded to the base substrate; a piezoelectric vibrating pi...  
WO/2009/104327A1
A piezoelectric vibrator (1) is provided with a base substrate (2); a lid substrate (3), which has a recessed section (3a) for a cavity and is bonded to the base substrate with the recessed section facing the base substrate; a piezoelect...  
WO/2009/104486A1
Provided is a structure of a microelectromechanical device wherein the gap can be made narrower. Also provided is a process for fabricating the microelectromechanical device. A microelectromechanical device comprises a resonator (22) and...  
WO/2009/101921A1
Provided is an electronic component which can withstand the stress applied from a printed board, or the like. An electronic component (1a) has a cavity (9) sealed airtightly by a base (2) and a lid (5), and a crystal oscillator (6) is he...  
WO/2009/101733A1
Provided are a piezoelectric vibrating piece (4) having a pair of vibrating arms (10, 11) with a base end fixed to a base (12) while placed in parallel and with a weight metallic film (21) formed at the tip, a base substrate (2) having t...  
WO/2009/096563A1
Provided are a small and highly reliable elastic wave device and a method for manufacturing such device. The elastic wave device is provided with a piezoelectric substrate (1); an SAW element (2) formed on one main surface of the piezoel...  
WO/2009/097167A2
Method and apparatus for lowering capacitively-transduced resonator impedance within micromechanical resonator devices. Fabrication limits exist on how small the gap spacing can be made between a resonator and the associated input and ou...  
WO/2009/097167A3
Method and apparatus for lowering capacitively-transduced resonator impedance within micromechanical resonator devices. Fabrication limits exist on how small the gap spacing can be made between a resonator and the associated input and ou...  
WO/2009/093376A1
Disclosed is a method for manufacturing an elastic wave element, which has excellent temperature coefficient of frequency (TCF), high machining accuracy of an IDT pattern and is durable to high-temperature process at 200°C or higher. Th...  
WO/2009/093377A1
Disclosed is an elastic wave element wherein expansion and contraction due to temperature change are sufficiently suppressed and frequency shift is small. A method for manufacturing such elastic wave element is also disclosed. The elasti...  
WO/2009/081686A1
Disclosed is a method for manufacturing a piezoelectric vibrator (1). The method is provided with a step of forming through holes (35, 36), which penetrate a wafer to be used as a base substrate, so that openings are made on the outer si...  
WO/2009/081651A1
A composite piezoelectric substrate manufacturing method by which an ultrathin piezoelectric film having a uniform thickness can be formed by efficiently using a piezoelectric material. The method comprises the steps of a) preparing a pi...  
WO/2009/079188A9
A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the...  
WO/2009/079188A1
A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the...  
WO/2009/078137A1
Disclosed is a surface wave device, for which a dicing blade is hard to wear, for which a dicing speed is hard to drop, and which can be each produced highly precisely and productively from a mother laminate. The surface wave device is p...  
WO/2009/078089A1
An elastic wave device according to the present invention includes a piezoelectric substrate (14), a comb-shaped electrode (13) arranged on the piezoelectric substrate (14), and a SiO2 layer (12) formed so as to cover the electrode (13)....  
WO/2009/072358A1
A piezoelectric vibrator manufacturing method is provided with a cavity forming step of forming a recessed section for a cavity on at least one of two wafers; a bonding electrode film forming step of forming a bonding electrode film on b...  
WO/2009/072585A1
Disclosed are: a novel production process for producing a crystalline KLN film; a novel film structure for process stabilization; and a process for producing a semiconductor device using the crystalline KLN film as a piezoelectric thin f...  
WO/2009/072432A1
Disclosed is a method for manufacturing a package (1) having a base substrate (10) and a lid substrate (20) which are bonded to each other and composed of a glass base material. The package also has a cavity (C) which is formed between t...  
WO/2009/066448A1
A piezoelectric filter is formed by electrically connecting a first piezoelectric oscillator to a second piezoelectric oscillator. Each of the first and the second piezoelectric oscillator has: a substrate; a lower load film formed on th...  
WO/2009/057699A1
Provided is a highly reliable elastic wave device wherein deterioration of electrical characteristics due to deformation of a protection cover is suppressed. A method for manufacturing such elastic wave device is also provided. The elast...  
WO/2009/057195A1
An elastic wave element comprises resonators (2), each including an electrode for exciting elastic waves, power feeding interconnection portion (3) so disposed as to electrically connect the resonators (2), a piezoelectric substrate (4) ...  
WO/2009/047266A1
The invention relates to an electromechanical component vibrating at a nanometric or micrometric scale that comprises a vibrating mechanical member (1) interacting with at least one so-called detection electrode (2). The detection electr...  
WO/2009/037977A1
When an elastic wave measuring device (10) inputs a high-frequency burst signal in a first ball SAW device (5A), the device successively switches the input destination of the high-frequency burst signal to other ball SAW devices (5B) to ...  
WO/2009/035155A1
A crystal oscillator piece having a major axis parallel to X-axis and hardly causing leak vibration even though the shape of the cross section of each of the vibration legs is not symmetric and method for manufacturing such a crystal osc...  
WO/2009/031258A1
[PROBLEMS] To provide a crystal device where a lid and a base are formed entirely of crystal and bonded by siloxane bond (Si-O-Si). [MEANS FOR SOLVING PROBLEMS] A crystal device (100) comprises a crystal frame (50), which is made of crys...  
WO/2009/028683A1
To provide a branching filter and a method for manufacturing the same. In the branching filter, the same mounting board can be shared between a normal arrangement of an electrode group formed in a main surface of a piezoelectric substrat...  
WO/2009/025118A1
A piezoelectric resonator in which the characteristics are not impaired even if the number of acoustic reflection layers is decreased. Its fabrication method is also provided. A piezoelectric resonator (10) comprises (a) a substrate (12)...  
WO/2009/022578A1
A polyimide resin is applied over the surface of a first substrate (5) in a uniform thickness and then heated thereon, thereby forming a semi-cured polyimide layer. Then, the polyimide layer is cured, thereby forming a first polyimide la...  
WO/2009/020015A1
A tuning fork-type crystal oscillator having an improved frequency adjusting accuracy and a method for adjusting its frequency. The tuning fork-type crystal oscillator having a tuning fork-like crystal piece (3) in which a pair of tuning...  
WO/2009/019316A3
A method for forming narrow gaps, for ex ample gaps narrower than 400nm, e.g. less than 200nm or 100 nm, between elements of a MEMS structure is described, as well as a method for forming micromachined or MEMS structures comprising narro...  
WO/2009/016906A1
Provided is an elastic wave device by which cracks are not easily generated in a piezoelectric substrate, contact resistance of a contact section, i.e., an electrically connecting section between wiring patterns, is reduced and an insert...  
WO/2009/000687A1
The invention relates to a detector of micromechanical design which is suitable for detecting particles, for example gas molecules, in a gaseous atmosphere. The detector has a plate (11) as a system capable of oscillation and is mounted ...  
WO/2009/001650A1
A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics. The surface acoustic wave device comprises a piezoelectri...  
WO/2008/149298A1
A pressure/vacuum sensor and method, comprising: driving a MEMS piezoresistive resonator (8) into resonant vibration, applying Joule heating to the resonator (8); and sensing a variable parameter that varies in response to the tendency o...  
WO/2008/143004A1
Provided is a dry etching method by which a substrate is not broken even when the both surfaces of the substrate are dry-etched. An etching gas composed of fluorocarbon gas and a rare gas is introduced into a vacuum chamber to generate p...  
WO/2008/142022A1
The invention relates to an evaluation device for an electronic control unit (ECU) comprising an input for receiving information relating to a current supply to the electronic control unit (ECU) and/or relating to the temperature of said...  
WO/2008/127032A1
The present invention provides a power cutoff device automatically operated upon the occurrence of a spark on an electric wire. The power cutoff device of the present invention automatically cuts off power supply to an earth leakage brea...  
WO/2008/117891A1
A crystal oscillator piece in which generation of leakage oscillation is suppressed, and its manufacturing method. The method for manufacturing a crystal oscillator piece comprises a step for forming a first etching mask on the surface o...  
WO/2008/114784A1
Disclosed is a metal paste for sealing, which comprises a metal powder and an organic solvent, wherein the metal powder comprises at least one metal powder selected from a gold powder, a silver powder, a platinum powder and a palladium p...  
WO/2008/110571A1
The invention relates to a component operated by guided acoustic waves and comprising a layer system (1, 2, 3, 6) that comprises a piezoelectric layer (1), a dielectric layer (2) and electrodes (3) that are arranged between the piezoelec...  
WO/2008/108193A1
A bandpass filter includes a combination of a BAW filter and a patterned planar filter with stubs. The BAW filter is composed of a plurality of piezoelectric resonators to give a specific frequency bandpass, while the planer filter is co...  
WO/2008/105199A1
A miniaturized electromagnetic wave separator is provided, and in particular, an electromagnetic wave separator is provided for making it possible to configure its low back height. The electromagnetic wave separator is comprised of a rec...  
WO/2008/105145A1
[Problems to be Solved] To provide a contour resonator having a desired resonance frequency and a desired temperature characteristic, and a method for adjusting this contour resonator. [Means to Solve the Problems] A contour resonator 10...  
WO/2008/102900A1
Provided is a package type piezoelectric vibrator which is capable of being packaged at a wafer level and is suitable for mass production. The package type crystalline vibrator has a structure wherein an extraction electrode exists by ha...  
WO/2008/102481A1
A method for manufacturing a piezoelectric resonator in which variation in characteristics is suppressed without complicating the manufacturing process, confinement of vibration to a piezoelectric vibrating section is improved and good f...  
WO/2008/087836A1
Provided is a method for manufacturing an elastic boundary wave device, in which a discontinuous portion is hardly formed in a dielectric film thereby to deteriorate the electric characteristics hardly, although an IDT is not thinned so ...  
WO/2008/084578A1
A piezoelectric thin film resonator (101) comprises a substrate (11), an oscillatory portion (20) wherein a piezoelectric thin film is arranged between upper and lower electrodes, and portions (21a, 21b) which support the oscillatory por...  
WO/2008/081935A1
A surface acoustic wave device excellent in reliability and a method for manufacturing the same. The surface acoustic wave device comprises a piezoelectric substrate (1) for making a surface acoustic wave travel thereon, an IDT (2) forme...  

Matches 251 - 300 out of 17,938