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Matches 251 - 300 out of 18,642

Document Document Title
WO/2010/082571A1
Provided is a piezoelectric device which solves various problems generated due to an IDT electrode provided therein. A piezoelectric device (10D) is composed of a structure wherein a piezoelectric thin film (10) and a supporting body (30...  
WO/2010/079803A1
A method of manufacturing a piezoelectric vibratory device has the following steps:a wafer forming stepfor preparing a thick wafer (30) in which a large number of lower cover members (3) are integrally formed; a joining step for joining ...  
WO/2010/074127A9
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/074127A1
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for e...  
WO/2010/070753A1
Provided are wafers for forming many package products each of which has a cavity wherein an operation piece is stored between the wafers by anodically bonding the wafers in a stacked state. The wafer has a product region wherein many rec...  
WO/2010/070000A1
The invention relates to a construction element that operates with acoustic waves, comprising a substrate 1 made of a piezoelectric material, a first electrode plane in which lower electrode structures 3 comprising an acoustically active...  
WO/2010/067794A1
Provided is a method for manufacturing a piezoelectric composite substrate, the method capable of controlling the inclinations of the crystal axis and polarization axis of a single-crystalline thin film, achieving good productivity, and ...  
WO/2010/061821A1
An SAW device (1) has a piezoelectric substrate (3) which propagates elastic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) whi...  
WO/2010/061468A1
Provided is a piezoelectric oscillator manufacturing method which manufactures a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; a pu...  
WO/2010/062847A2
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/061479A1
A method for manufacturing an elastic wave device is provided with a lamination step of forming, on a substrate (1), a plurality of elastic wave devices, each of which includes a lower electrode (2), a piezoelectric film (3) and an upper...  
WO/2010/061470A1
Provided are wafers for forming many package products each of which has a cavity between the wafers for storing an operation piece, by anodically bonding the wafers to each other in a state where the wafers are stacked. In the state wher...  
WO/2010/061469A1
Provided is a piezoelectric oscillator including: a package having a first substrate and a second substrate superposed so as to form a cavity between the substrates; an external electrode formed on the outer surface of the first substrat...  
WO/2010/062847A9
A micro-electromechanical resonator includes a resonator body having a semiconductor region therein doped with boron to a level greater than about 1x1018 cm-3 and even greater than about 1x1019 cm-3, in order to obtain reductions in the ...  
WO/2010/062847A3
A micro-electromechanical resonator (10) includes an electrically-trimmed resonator body (14) having at least one stiffness-enhanced semiconductor region therein containing metal-semiconductor lattice bonds. These metal-semiconductor lat...  
WO/2010/058351A1
The present invention exploits the combination of the amplification, provided by the integration of a FET (or any other three terminal active device), with the signal modulation, provided by the MEM resonator, to build a MEM resonator wi...  
WO/2010/048725A1
The present application describes a radio frequency band reject filter including an input port, an output port, a plurality of acoustic resonators and an inductor for matching the impedance of the plurality of acoustic resonators. The in...  
WO/2010/047031A1
Provided are an electronic component wherein each piece of element can be efficiently separated from a collective substrate, and a method for manufacturing the electronic component. On the collective substrate, (a) a conductive layer (10...  
WO/2010/044491A1
Provided is a quartz oscillator manufacturing method whereby high-precision, fine adjustment can be realized without applying excessive force to a quartz oscillator, and whereby multiple quartz oscillators can be adjusted at one time. Th...  
WO/2010/038295A1
An ultrasonic bonding apparatus (1) bonds a storage member (30) for housing an electronic material member (50) and a lid material (20) by applying the ultrasonic vibration in parallel to bonding surfaces (21) and (31) respectively. The u...  
WO/2010/039307A3
The present invention is directed to a CMOS integrated micromechanical device fabricated in accordance with a standard CMOS foundry fabrication process. The standard CMOS foundry fabrication process is characterized by a predetermined la...  
WO/2010/035457A1
A piezoelectric device has excellent bonding by using solder and excellent electrical continuity by forming an external electrode layer so as to cover a sealing material after tightly sealing a through hole with a sealing material. In a ...  
WO/2010/032982A2
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032982A3
The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof. Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base bod...  
WO/2010/032346A1
Provided is a piezoelectric vibrator using a piezoelectric substrate in which a bismuth layered compound sets the main crystal phase, wherein satisfactory oscillation characteristics are realized. A piezoelectric vibrator (1) is comprise...  
WO/2010/023732A1
This piezoelectric vibrator comprises a tuning-fork piezoelectric vibrating reed including a pair of vibrating arms, a package for housing the piezoelectric vibrating reed, and getter members formed along the length direction of the vibr...  
WO/2010/023733A1
A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded with each other and between which a cavity is formed, a piezoelectric vibrating strip mounted on the base substrate within the cavity, an external el...  
WO/2010/023741A1
A piezoelectric vibrating reed manufacturing method for manufacturing from a wafer a piezoelectric vibrating reed comprising a pair of vibrating arm portions disposed parallel to each other, a base portion for integrally fixing base end ...  
WO/2010/023730A1
A piezoelectric vibrator having a pair of vibration arms extending in parallel with a base substrate and a lid substrate bonded with each other so as to have a cavity therebetween, a pair of excitation electrodes for vibrating the pair o...  
WO/2010/023727A1
The piezoelectric vibrator is provided with a piezoelectric vibrating piece and a metal film getter material. The piezoelectric vibrating piece has a pair of vibrating arm sections, which are connected to each other and extending paralle...  
WO/2010/023729A1
A piezoelectric vibrator includes a tuning-fork type piezoelectric vibrating strip equipped with a pair of vibrating arm parts, a package housing the piezoelectric vibrating strip, and adjustment films formed along the longitudinal direc...  
WO/2010/023728A1
A piezoelectric vibrator includes a tuning-fork type piezoelectric vibrating strip equipped with a pair of vibrating arm parts, a package housing the piezoelectric vibrating strip, and a pair of adjustment films formed along the longitud...  
WO/2010/023731A1
A piezoelectric vibrator comprising a base substrate and a lid substrate bonded to each other and having a cavity formed, an external electrode formed on the lower surface of the base substrate, an internal electrode so formed on the upp...  
WO/2010/016487A1
A sealing member for a piezoelectric oscillation device hermetically seals oscillation electrodes of a piezoelectric oscillation piece having the oscillation electrodes formed thereon. The sealing member has a through hole for bringing ...  
WO/2010/009719A1
The invention relates to a method for producing a dielectric layer (3) in an electroacoustic component (1), particularly a component working with acoustic surface or acoustic volume waves, having a substrate and an associated electrode s...  
WO/2010/005062A1
A functional device (1) is configured and equipped with an integrated circuit substrate (5), on the surface of which is a multilayer wiring layer (3), and which has a connection electrode (4a) on the uppermost layer (11a) of the multilay...  
WO/2010/001885A1
A piezoelectric vibration device is provided with a piezoelectric vibration piece, and a first sealing member and a second sealing member which hermetically seal an exciting electrode formed on the piezoelectric vibration piece. The pie...  
WO/2009/157453A1
A silicon oxide film (113) is formed on the oscillation parts (102, 103) of an MEMS type electrostatic drive bending oscillator, and at least one structure whereon no oxide is formed is provided near the oscillation parts (102, 103). Whe...  
WO/2009/157587A1
An acoustic wave device according to one embodiment of the present invention comprises a base body on which a vibrating body is arranged, a sealing body which is joined to the base body in a frame region thereof surrounding the vibrating...  
WO/2009/157305A1
To manufacture a high-quality piezoelectric vibrator which reliably maintains the airtightness in a cavity and ensures stable conductivity between a piezoelectric vibrating piece and an external electrode, the piezoelectric vibrator is m...  
WO/2009/150786A1
Provided are an elastic surface wave device, which can be reduced in size and which can be enhanced in power resistance and hardly has a protrusion such as a hillock in the comb-like electrode of an IDT, and a method for manufacturing th...  
WO/2009/130279A1
At least two structured conductive layers (LS) are configured adjacent to each other on a piezo substrate (PS), each implementing a SAW filter. The conductive layers comprise transducer structures, reflectors and conductive tracks and ea...  
WO/2009/128196A1
Disclosed is a laminated piezoelectric ceramic element fabrication method wherein the lamination step and the cutting step can be simplified, the cutting precision can be increased, and the cutting allowance can be minimized, even when t...  
WO/2009/128546A1
Provided is a method for testing a piezoelectric/electrostrictive actuator, by which the displacement of a piezoelectric/electrostrictive actuator is estimated, on the basis of the relations between one or more frequency characteristic v...  
WO/2009/121901A1
The invention is concerned with the field of material sciences and relates to a layer system for electrodes which can be used for example in frequency filters, sensors or actuators. The object of the present invention is to specify a lay...  
WO/2009/121906A1
Method for producing an electroacoustic component, comprising the following steps: a substrate for an electroacoustic component is provided; an electrically conductive layer is applied to the substrate; the electrically conductive layer ...  
WO/2009/104438A1
Provided is an elastic wave device which can prevent flux from flowing into a hollow space when the elastic wave device is mounted using solder bumps. An elastic wave device comprises (a) a substrate (11), (b) a vibration portion (14) fo...  
WO/2009/104333A1
A piezoelectric vibrator (1) is provided with a base substrate (2), a lid substrate (3) which has a recessed portion (3a) for a cavity and is joined to the base substrate with the recessed portion facing the base substrate, a piezoelectr...  
WO/2009/104486A1
Provided is a structure of a microelectromechanical device wherein the gap can be made narrower. Also provided is a process for fabricating the microelectromechanical device. A microelectromechanical device comprises a resonator (22) and...  
WO/2009/104314A1
A piezoelectric vibrator comprises a base substrate having polished facing sides; a lid substrate, which has a recess for cavity and is bonded to the base substrate so that the recess faces the base substrate; a piezoelectric vibrating r...  

Matches 251 - 300 out of 18,642