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WO/2006/018788 |
Thin-film bulk acoustic wave filters based on piezoelectric resonators operating in the thickness extensionally mode achieve relative band-widths in the order of to 4 % at a center frequency of 2 GHz. According to an exemplary embodiment...
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WO/2006/013301 |
The invention concerns an electromechanical resonator comprising a vibrating body (4), at least one excitation electrode (14, 16) and at least one detection electrode (10, 12), characterized in that the vibrating body comprises a first p...
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WO/2006/011417 |
Disclosed is a surface acoustic wave device wherein an insulator layer is so formed as to cover an IDT electrode and the surface of the insulator layer is planarized. In such a surface acoustic wave device, the electrode can have a suffi...
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WO/2006/011449 |
It is possible to provide a concatenated body of MEMS filters having a design flexibility and capable of ignoring the affect of the mass load. There is provided a structure in which the affect of the mass load is not reflected in the cha...
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WO/2006/006343 |
A piezoelectric device which has reduced sizes and improved moisture resistance and does not require sealing after being mounted on a circuit board, and a method for manufacturing such device are provided. The piezoelectric device (10) i...
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WO/2006/004470 |
The invention discloses a tuneable resonator (100, 200, 300, 500, 600, 700, 900) with a substrate layer (140, 260, 360, 560, 660, 960), which substrate layer supports a structure with a first electrode (130, 240, 350, 550, 650). In conne...
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WO/2006/003933 |
An electronic part includes: a substrate; a comb-shaped electrode having a plurality of electrode fingers arranged parallel to one another on the upper surface of the substrate; and a protection film formed on the substrate so as to cove...
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WO/2005/125007 |
There is provided a high-frequency element capable of stabilizing DC bias voltage applied to an electrostatic drive type vibrator and a power supply element capable of supplying a stable DC bias voltage. There is also provided a communic...
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WO/2005/125006 |
It is possible to provide a quartz device having a stable oscillation characteristic and a high reliability. The quartz device includes a first main surface having a part of a basic part and a part of an oscillation leg within a single p...
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WO/2005/125005 |
A SAW device removing the defects of prior art that a filter satisfying the standards required for the RF SAW filter of a GPS receiver could not be realized and that the performance of a circuit or an apparatus degrades when a SAW filter...
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WO/2005/122395 |
A small-sized highly integrated electric machine signal selecting element, which can select and output only a signal of a prescribed frequency without providing a high sensitive oscillation detecting function, and an electric device usin...
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WO/2005/114836 |
Plural band film bulk acoustic resonators may be formed on the same integrated circuit using lithographic techniques. As a result, high volume production of reproducible components can be achieved, wherein the resonators, as manufactured...
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WO/2005/112259 |
Disclosed herein is a method of manufacturing a lithium tantalate substrate for surface acoustic wave elements, which includes heating a lithium tantalate material to a temperature of not less than the Curie temperature of lithium tantal...
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WO/2005/109636 |
The electronic device comprises a network of at least one thin-film capacitor and at least one inductor on a first side of a substrate of a semiconductor material. The substrate has a resistivity sufficiently high to limit electrical los...
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WO/2005/109639 |
There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected ...
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WO/2005/104257 |
An electromechanical device (201) includes a support structure (210) formed by attaching inner surfaces of second and third substrates (220a-b) to a first substrate (230). The support structure (210) includes at least one cavity (250) be...
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WO/2005/104639 |
When inner electrodes (22-24) are formed of a conductive paste for a multilayer ceramic board, which can be sintered at a low temperature and contraction of which at the time of baking is suppressed, the inner electrodes (22-24) contract...
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WO/2005/104361 |
The present invention provides an electro-mechanical device , for example , a Micro-Electro-Mechanical Systems (MEMS) device, for example a low-loss Film Bulk Acoustic Resonators (FBAR) filter, and a process to produce the same. In order...
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WO/2005/102910 |
Disclosed is an MEMS component that is disposed on a panel as a chip component. Each assembly point for a chip is tightly encircled by a frame structure that sits on the panel. The joint between the frame structure and the chip is sealed...
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WO/2005/099090 |
A surface acoustic wave filter for preventing a large void from being generated at the time of pressing a resin sheet covering an element chip while heating the resin sheet, and a method for manufacturing the surface acoustic wave filter...
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WO/2005/099088 |
An integrated circuit is provided which includes one or more device elements (24) formed above a base substrate (22), a structure (43) forming a sealed cavity (46) above at least a portion of the one or more device elements (24), and one...
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WO/2005/099089 |
A SAW device employing a quartz substrate having device size smaller than that of conventional structure and exhibiting a high Q and excellent frequency-temperature characteristics. An IDT (2) consisting of a plurality of interdigital el...
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WO/2005/099087 |
A μ-flap type nano/micro mechanical device with a lower electrode 1, 1a, 1b, an upper electrode layer 2, an dielectric layer 3 arranged between the lower electrode 1, 1a, 1b and the upper layer 2, such that the dielectric layer 3 and sa...
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WO/2005/096493 |
A method for manufacturing a quartz oscillator having a stable temperature drift characteristic attributed to the quartz oscillating piece and a quartz oscillator are disclosed. The method comprises a quartz crystal etching step (S1) of ...
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WO/2005/096373 |
After forming an unwelded part in a primary welding process step (S203) composed of a first beam irradiation process step (S203a) and a second beam irradiation process step (S203b), a prescribed part on an electronic beam trajectory form...
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WO/2005/093949 |
A method of manufacturing a boundary acoustic wave device with less frequency variation. First to third media (1 to 3) are formed sequentially in this order. An electrode (5) is disposed at the boundary between the first and second media...
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WO/2005/091500 |
A surface acoustic wave device arranged such that pyroelectricity of a piezoelectric substrate is not revived, and a process for fabricating that device. The piezoelectric substrate (12) of a surface acoustic wave element (10) being cont...
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WO/2005/083881 |
A surface acoustic wave device such that the resonance frequency and the center frequency can be easily adjusted, the frequency temperature characteristic is favorable, the specific bandwidth is wide, and the antiresonance resistance is ...
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WO/2005/081272 |
The LC composite component of the present invention comprises a base, a first to third terminals provided on the base, a helical conductor provided on the base, and an internal layer conductor inside the base, the internal layer conducto...
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WO/2005/078752 |
A piezoelectric thin-film electromechanical microsystem (MEMS) device (18) comprising an RF-MEMS switch (14) and a bulk acoustic wave piezoelectric thin-film RF resonator (10) mounted on a substrate (12) provided with an acoustic mirror ...
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WO/2005/076470 |
The invention relates to a modularly constructed electrical component having a module substrate preferably made of Si and having one or more preferably unhoused chips, which are placed on this module substrate while being electrically co...
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WO/2005/074502 |
High-Q micromechanical resonator devices and filters utilizing same are provided. The devices and filters include a vibrating polysilicon micromechanical 'hollow-disk' ring resonators obtained by removing quadrants of material from solid...
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WO/2005/076473 |
A plurality of surface acoustic wave resonators (15-20), each consisting of an interdigital electrode and a grating reflector, are connected on a piezoelectric substrate (12). A dielectric film (14) is formed on the surface of at least o...
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WO/2005/074052 |
A mask material (12) applied to the surface to be processed of a piezoelectric material (11) is brought into contact with solvent vapor (V) and reflowed, and then shaped into a bump mask (14) where the central part is raised by the surfa...
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WO/2005/071731 |
An electronic component manufacturing method in which few voids in the resin encapsulation portion are produced, degradation of the characteristics hardly occurs, and the cost can be reduced. The method includes a reduced-pressure packin...
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WO/2005/071832 |
There is provided a piezoelectric resonator frequency adjustment method for suppressing lowering of insulation resistance, shortcircuit defect, and inter-electrode migration when frequency adjustment is performed for etching an electrode...
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WO/2005/069486 |
An acoustic boundary wave device (1) using an acoustic boundary wave of SH type. The devise effectively suppresses unwanted spurious and have a good resonance characteristic and a filter characteristic. Electrodes including an interdigit...
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WO/2005/060091 |
Disclosed is a method for manufacturing a piezoelectric thin-film device comprising a step wherein an insulating layer (12) to be etched with a specific chemical substance is formed on the upper surface of a substrate (11); a step wherei...
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WO/2005/055422 |
The invention relates to an electronic component (1) comprising at least one resonator element (5) which is disposed in a housing (8) of a case. The aforementioned case comprises: a main part (2) with a base (20) and at least one annular...
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WO/2005/048450 |
The present invention relates to a method of manufacturing a resonator within a semiconductor device, said semiconductor device comprising a substrate, wherein said method comprises the steps of: - etching a hole in the substrate, - crea...
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WO/2005/046051 |
A micro-resonator wherein the combined impedance of the resonator can be reduced so as to allow the resonator to be applied to a desired device. A communication apparatus having a filter comprising such a micro-resonator. The micro-reson...
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WO/2005/035436 |
A method of increasing a quality factor for a micromechanical resonator uses a laser beam to anneal the micromechanical resonator. In one embodiment, the micromechanical oscillator is formed by fabricating a mushroom shaped silicon oscil...
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WO/2005/034345 |
In order to provide a resonator structure (100) in particular a bulk-acoustic-wave (BAW) resonator, such as a film BAW resonator (FBAR) or a solidly-mounted BAW resonator (SBAR), comprising at least one substrate (10); at least one refle...
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WO/2005/034344 |
Embodiments of the present invention form a weightcompensating/ tuning layer on a structure (e.g., a silicon wafer with one or more layers of material (e.g., films)) having variations in its surface topology. The variations in surface ...
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WO/2005/034347 |
A surface acoustic wave device having a structure where an insulator layer is formed to cover an IDT electrode. The reflection coefficient of the IDT is sufficiently high and deterioration of the characteristics due to undesired ripple c...
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WO/2005/031862 |
A method of making one or more sealed assemblies is provided which includes assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a ...
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WO/2005/031863 |
Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The ...
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WO/2005/031861 |
A structure and method of making a capped chip is provided. A capped chip includes a chip having a front surface, and a plurality of bond pads exposed at the front surface. A cap member has a top surface, a bottom surface opposite the to...
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WO/2005/029700 |
By differentiating the output phase by 180 degrees, it is possible to output an unbalanced input as a balanced output. A micro electric machine system resonator (MEMS resonator (101)) includes: an input electrode (111) for inputting a si...
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WO/2005/020435 |
A piezoelectric resonant component utilizing a basic wave and having good characteristics in which a spurious resonance due to a high order mode is suppressed. The piezoelectric resonant component (1) comprises a plurality of resonance e...
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