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WO/2019/159410A1 |
Provided are: a resonance device wherein the vibration space of a resonator can be maintained in a high vacuum state; and a resonance device manufacturing method. A resonance device 1 is provided with: a MEMS substrate 50 that includes a...
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WO/2019/159738A1 |
This bonded substrate has a crystal substrate which is cut at an angle intersecting the crystal X axis, and a piezoelectric substrate laminated on the crystal substrate, wherein: the cut angle of the crystal substrate is preferably an an...
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WO/2019/155120A1 |
The invention relates to a microelectromechanical resonator, comprising a support structure, a resonator element suspended to the support structure, the resonator element comprising a plurality of sub-elements, and an actuator for exciti...
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WO/2019/155119A1 |
The invention concerns a microelectromechanical resonator comprising a support structure, a resonator element suspended to the support structure, and an actuator for exciting the resonator element to a resonance mode. According to the in...
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WO/2019/156713A1 |
A micromechanical resonator is provided that enables a smaller total package size with an acceptable quality factor for timing applications. The MEMS resonator includes a vibration portion with a base and three or more vibrating beams ex...
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WO/2019/142483A1 |
[Problem] To improve the bonding strength in the bonding of a piezoelectric material substrate made from lithium tantalite or the like to a supporting substrate having a silicon oxide layer formed thereon. [Solution] An assembly is provi...
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WO/2019/132931A1 |
A resonator including a III-N material is described. The III-N based resonators include a cavity in a substrate, where the substrate includes a group IV material. The resonator further includes a liner on a surface of the substrate withi...
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WO/2019/130852A1 |
[Problem] To make it possible to suppress characteristic deterioration of an assembly when joining a piezoelectric material substrate consisting of a material such as lithium niobate, and a support substrate provided with a silicon oxide...
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WO/2019/129979A1 |
The invention relates to a method for producing an adjustable bulk acoustic wave resonator comprising a transducer stack (E1) and a tuning stack (E2). According to the invention, transducer stack (E1) comprises two defined electrodes (4,...
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WO/2019/130857A1 |
[Problem] To suppress characteristic deterioration of an assembly when joining a piezoelectric material substrate consisting of a material selected from the group consisting of lithium niobate, lithium tantalate, and lithium niobate-lith...
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WO/2019/120759A1 |
A wafer arrangement comprises a carrier wafer (CW) having a top surface divided into a regular pattern (RP) of first (SA1, ARS) and second surface areas (SA2, PES), wherein each first surface area is assigned to an adjacently applied res...
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WO/2019/124126A1 |
Provided is an acoustic wave device which is capable of enhancing the productivity more reliably. An acoustic wave device 1 according to the present invention is provided with: a piezoelectric substrate 2 which comprises a supporting sub...
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WO/2019/118761A1 |
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used...
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WO/2019/117258A1 |
This manufacturing method of a mounting structure involves: a step for preparing a mounting member comprising a first circuit member and multiple second circuit members mounted on the first circuit member; an arrangement step for arrangi...
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WO/2019/117259A1 |
This manufacturing method of a mounting structure involves: a step for preparing a mounting member comprising a first circuit member and multiple second circuit members mounted on the first circuit member; an arrangement step for arrangi...
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WO/2019/110504A1 |
An electro-acoustic resonator device comprises a substrate (100), bottom and top electrodes (121, 122), and a piezoelectric layer (130) disposed therebetween. A bragg mirror element (110) is disposed between the bottom electrode and the ...
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WO/2019/102952A1 |
A piezoelectric device comprising: a piezoelectric body 10, at least one section of which is capable of bending vibration; an upper electrode 22 that is positioned on an upper surface of the piezoelectric body 10, and in which warping of...
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WO/2019/102951A1 |
A piezoelectric device comprising: a piezoelectric monocrystalline body 10 with a uniform polarization condition, at least one section of which is capable of bending vibration; an upper electrode 22 that is positioned on an upper surface...
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WO/2019/089150A1 |
A passive on glass (POG) filter capping apparatus (400) includes an acoustic filter die (440). The apparatus further includes a capping die (402) electrically coupled to the acoustic filter die (440). The capping die (402) includes a 3D ...
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WO/2019/088128A1 |
A method for producing a package structure, which comprises: a step for preparing a package member which is provided with a first circuit member and a plurality of second circuit members that are mounted on the first circuit member, with...
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WO/2019/087874A1 |
The purpose of the present invention is to provide a crystal oscillation element with which it is possible to suppress an increase in a crystal impedance value. The crystal oscillation element of the present invention is provided with: a...
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WO/2019/071068A1 |
An integrated circuit package includes a first die (1230) that has a microelectromechanical system (MEMS) resonator coupled to a first coil (1240). A second die (1231) includes a second coil (1241) fabricated on a top surface of the seco...
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WO/2019/071066A1 |
An oscillator circuit (501) has tank circuit terminals for coupling to a tank circuit. A microelectromechanical system (MEMS) resonator (100) serves as a tank circuit. The MEMS resonator (100) is coupled to the oscillator circuit (501) u...
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WO/2019/065669A1 |
In the present invention, a reduction in size is achieved while characteristics degradation is suppressed. An elastic wave device (1) has a first acoustic impedance layer (31) and second acoustic impedance layers (32, 33), an IDT electro...
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WO/2019/065519A1 |
The present invention enables stable conduction between a base member and a lid member. A crystalline oscillator of the present invention is provided with: a crystalline oscillation element; a base member; a conductive lid member that is...
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WO/2019/065847A1 |
The present invention comprises: a first electrode (10); a second electrode (20) opposing the first electrode (10) across a piezoelectric substrate; a cover (50) surrounding the second electrode (20) so that the tip end is exposed; a sup...
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WO/2019/065977A1 |
This method for producing a mounting structure is provided with: a step for preparing a mounting member provided with a first circuit member, and a plurality of second circuit members mounted on the first circuit member; a step for prepa...
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WO/2019/056553A1 |
A method for preparing a piezoelectric resonator and a piezoelectric resonator, the preparation method comprising: forming a monocrystalline piezoelectric material layer on a first substrate; and forming a polycrystalline piezoelectric m...
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WO/2019/057161A1 |
A surface acoustic wave (SAW) device including a piezoelectric layer, a high acoustic velocity layer coupled to the piezoelectric layer, and at least one transducer. The SAW device may include a multi-layer graphene layer in the electrod...
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WO/2019/058632A1 |
A resonator wherein the frequency temperature characteristics are able to be adjusted with high accuracy. This resonator is provided with: a vibration part which comprises a first electrode, a second electrode, a piezoelectric film that ...
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WO/2019/059247A1 |
This manufacturing method of a piezoelectric vibration element 10 includes: preparing a piezoelectric substrate 11; providing a first electrode layer 60a on a first main surface 12a of the piezoelectric substrate 11; disposing a mask 70a...
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WO/2019/059338A1 |
The present invention suppresses decrease in airtightness between a cover member and a base member. According to the present invention, a crystal oscillator is provided with: a crystal oscillation element; a cover member and a base membe...
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WO/2019/054349A1 |
This method for producing a crystal oscillator element (10) comprises: a step for preparing a crystal piece (111); a step for providing a central part (117) of the crystal piece (111) with a first excitation electrode (114a); a step for ...
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WO/2019/054238A1 |
[Problem] To improve a Q value of an acoustic wave device in which a piezoelectric material substrate is directly bonded on a support substrate composed of polycrystalline ceramics. [Solution] This acoustic wave device 10 comprises: a pi...
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WO/2019/055787A1 |
A device has a plurality of coils arranged along a perimeter within the device, where each coil has a winding configured to be coupled to a power converter through a resonant capacitor, and forms a resonator with the resonant capacitor. ...
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WO/2019/048736A1 |
The invention relates to a frequency reference oscillator device and method of providing a frequency reference signal. The oscillator device comprises a first oscillator comprising a first resonator having first long-term stability and a...
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WO/2019/048737A1 |
The invention relates to a temperature-compensated microelectromechanical oscillator and a method of fabricating thereof. The oscillator comprises a resonator element comprising highly doped silicon and an actuator for exciting the reson...
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WO/2019/049830A1 |
This filter device (1) is provided with: a substrate (50) which has piezoelectricity; a first filter (10) which comprises an IDT electrode (52) that is provided on the substrate (50); an electrode (30a) for terminals, which is provided o...
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WO/2019/034442A1 |
A high Q acoustic BAW resonator with high coupling and improved spurious mode suppression is given. The BAW resonator comprises an active resonator region (AR) formed by an overlap of the three layers bottom electrode (BE), piezoelectric...
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WO/2019/029911A1 |
A BAW resonator (RES) with reduced losses, an RF filter with a BAW resonator and a method of manufacturing a BAW resonator are provided. The BAW resonator has a bottom electrode layer (BEL), a top electrode layer (TEL) and an acoustic re...
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WO/2019/029912A1 |
An electrically and acoustically improved resonator is provided. The resonator (BAWR) has a center region (CR) and a termination region (TER) surrounding the center region. A trench (TR) in a top electrode (TE), a frame (FR) on the top e...
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WO/2019/025132A1 |
An acoustic filter device comprises a filter chip with filter elements that are arranged in a series signal line as well as in parallel branches connected to a ground termination each. A carrier substrate for the filter chip comprises gr...
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WO/2018/235339A1 |
Provided is a simpler and more highly accurate frequency adjustment method. Disclosed is a method for manufacturing a resonance device that is provided with a resonator having a vibrating section that vibrates in accordance with a voltag...
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WO/2018/230442A1 |
This bonded substrate comprises a quartz substrate, and a piezoelectric substrate which is bonded onto the quartz substrate and on which a surface acoustic wave propagates, the bonding comprising a covalent bonding at a bonding interface...
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WO/2018/218037A1 |
System and apparatus for measuring biopotential and implementation thereof. A device for mitigating electromagnetic interference (EMI) thereby increasing signal-to-noise ratio is disclosed. Specifically, the present disclosure relates to...
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WO/2018/212150A1 |
Provided are a liquid crystal oscillation element, a liquid crystal oscillator, and a method for manufacturing these in which it is possible to achieve a reduction in size while suppressing degradation of oscillation characteristics. Thi...
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WO/2018/212184A1 |
The method for manufacturing the piezoelectric oscillator (1) involves: a step for preparing a piezoelectric vibration element (10) comprising a piezoelectric substrate (11) having a first principal surface (12a) and a second principal s...
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WO/2018/212181A1 |
The present invention is provided with: a base part (50); a plurality of vibration arm parts (60) extending from the base part (50) in a first direction (D1), the vibration arm parts (60) being arranged in a second direction (D2) that in...
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WO/2018/203430A1 |
[Problem] To provide an elastic wave element in which a piezoelectric material substrate and a support substrate are joined together via a joining layer, wherein the elastic wave element has a structure with which it is possible to furth...
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WO/2018/199071A1 |
Provided is an acoustic wave device manufacturing method with which a resist residue is less likely to remain and degradation in electric characteristics is less likely to occur, and which makes it possible to increase productivity. An a...
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