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Matches 1 - 50 out of 52,413

Document Document Title
WO/2021/008847A1
A SAW resonator with reduced spurious modes is provided. The resonator comprises a (111) silicon carrier substrate (CS), an electrode structure (ES) and a piezoelectric layer (PIL). The carrier substrate has a crystal orientation with th...  
WO/2021/010164A1
An electronic component (100) comprises: a substrate (110); functional elements (120) formed on the substrate (110); columnar conductors (140) protruding from the substrate (100); a cover part (130) which is supported by the columnar con...  
WO/2021/010379A1
An acoustic wave filter (40) is provided with a longitudinally coupled resonator (1) having a plurality of IDT electrodes and reflectors. When: [i] a distance between an electrode finger (Fe(k)) and an electrode finger (Fe(k+1)) is defin...  
WO/2021/009008A1
At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.  
WO/2021/010245A1
A filter body comprises: a series arm including a plurality of series resonators connected in series with each other; and one or more parallel resonators, the series arm and the one or more parallel resonators being connected in a ladder...  
WO/2021/008186A1
A bulk acoustic resonator comprises: a substrate (10); an acoustic mirror (20); a bottom electrode (30) disposed on the substrate (10); a top electrode (70); a piezoelectric layer (50) disposed above the bottom electrode (30) and between...  
WO/2021/005833A1
This piezoelectric vibrator (100) comprises a base member (30), a lid member (40), and a laminated structure (101) provided between the base member (30) and the lid member (40), wherein the laminated structure (101) includes: a piezoelec...  
WO/2021/006156A1
Provided is an elastic wave device which can suppress separation of a cover member from support members, and which can suppress separation of the support members from a piezoelectric substrate. This elastic wave device 1 is provided wi...  
WO/2021/003699A1
A manufacturing method for a bulk acoustic wave filter, comprising: sequentially forming acoustic reflection air chambers (2), seed layers (3), lower electrode layers (4), and piezoelectric layers (5, 5-1, 5-2, 5-3) of n resonators (201-...  
WO/2021/004127A1
A bulk acoustic resonator, comprising: a substrate; an acoustic mirror (30); a bottom electrode (10) disposed on the substrate and having a bottom electrode metal connection layer (13); a top electrode (12) opposite to the bottom electro...  
WO/2021/006073A1
Provided is a ladder-type filter capable of ensuring an adequate amount of attenuation in a frequency range different from the own band thereof, and in particular in a frequency range separated from the own band thereof. A ladder-type ...  
WO/2021/006157A1
Provided is an elastic wave device that can suppress peeling of a cover member from a support member. The elastic wave device 1 comprises: a piezoelectric substrate 2; an IDT electrode 3 (excitation electrode) that is provided on the p...  
WO/2021/006055A1
The present invention reduces spurious emissions. An acoustic wave device (1) according to the present invention comprises a support substrate (4), a piezoelectric layer (6), and an IDT electrode (7). The support substrate (4) is made of...  
WO/2021/003755A1
Disclosed is a polished quartz crystal frequency wafer with a boss structure on an edge, the polished quartz crystal frequency wafer comprising an original wafer in the form of a rectangular block, with the boss structure being arranged ...  
WO/2021/006056A1
A purpose of the present invention is to reduce spurious emissions. An elastic wave device (1) comprises a support substrate (4), a piezoelectric body layer (6), and an IDT electrode (7). The support substrate (4) is formed from crystal....  
WO/2021/006023A1
The present invention achieves a decrease in the size of a high-frequency component provided on a main surface of a mounting substrate on which an external connection electrode is disposed. A high-frequency module (1) is provided with a ...  
WO/2021/002321A1
An elastic wave filter (1) that comprises: a split resonator group (11) and series arm resonators (12, 13, 14), arranged upon a path connecting an I/O terminal (110) and an I/O terminal (120); and parallel arm resonators (21, 22, 23) arr...  
WO/2021/002382A1
The present invention suppresses harmonic distortion. This elastic wave device (1) comprises: a silicon substrate (2); a piezoelectric layer (4); and an IDT electrode (5). The silicon substrate (2) has a first main surface (21) and a sec...  
WO/2021/002046A1
[Problem] To provide a bonded body which enables improvement of the Q value of an acoustic wave element. [Solution] A bonded body 9A according to the present invention is provided with a supporting substrate 6, a piezoelectric material s...  
WO/2021/002434A1
The present invention comprises a substrate, an electrode film, and a piezoelectric film which is a polycrystalline film comprising an alkali niobate having a perovskite structure represented by the compositional formula (K1-xNax)NbO3 (0...  
WO/2021/002047A1
[Problem] To provide a joined body that enables improvement of a Q value of an elastic wave element. [Solution] A joined body 9A includes a support substrate 6, a piezoelectric material substrate 1A, and a silicon oxide layer 2 between t...  
WO/2020/261808A1
This elastic wave filter (10) comprises: an input terminal (T1); an output terminal (T2); a series arm circuit (20); and a parallel arm circuit (30). The series arm circuit includes a first series arm resonator (S1) and a second series a...  
WO/2020/259661A1
The present invention provides a high-frequency surface acoustic wave resonator and a preparation method therefor. The high-frequency surface acoustic wave resonator comprises: a high-wave-velocity supporting substrate, a piezoelectric f...  
WO/2020/258177A1
A differential resonator (1), comprising a substrate (10), a first resonator (11), a second resonator (12), and a coupling mechanism (14). The first resonator (11) is connected to the second resonator (12) by means of the coupling mechan...  
WO/2020/262388A1
Provided is a filter device in which insertion loss is reduced. A filter device 1 is provided with: a piezoelectric substrate 2 including a high acoustic velocity support substrate 13 (high acoustic velocity material layer) and a piezoel...  
WO/2020/261819A1
The present invention provides a high-frequency module and a communication device that are capable of suppressing deterioration of a noise index of a low-noise amplifier. A high-frequency module (1) is provided with a mounting substrate ...  
WO/2020/263254A1
A filter is provided. The filter (100) includes a cascade of coupled acoustic wave resonators (110-1,... 110-i) between an input terminal (120) and an output terminal (130) of the filter. The acoustic wave resonators are three terminal r...  
WO/2020/261707A1
A method for manufacturing a ceramic substrate having a recess part on the upper surface, the method having: a step for cutting a mother laminate, which is obtained by laminating a plurality of ceramic green sheets, in a direction that f...  
WO/2020/262023A1
Provided is a composite filter device comprising first and second filters with which it is possible to further reduce insertion loss in a second filter having a high relative passband. A composite filter device 1 is provided with: a piez...  
WO/2020/261630A1
The present invention reduces stress applied to a connection portion between a support arm and a holding part. This resonance apparatus is provided with: a resonator including a base, a vibration arm extending from one end of the base al...  
WO/2020/263659A1
Filter devices and methods of fabricating filter devices. A filter device includes a first chip and a second chip. The first chip has a first material stack and contains one or more series resonators of a ladder filter circuit. The secon...  
WO/2020/262607A1
Provided is an elastic wave device in which a substrate has a piezoelectric predetermined region on a first major surface facing one side in a direction normal to the substrate. An excitation electrode is positioned in the predetermined ...  
WO/2020/261763A1
Provided is an elastic wave device in which ripples due to transverse mode can be more effectively suppressed. An elastic wave device 10 constituted by first and second elastic wave resonator units, wherein: the first elastic wave reso...  
WO/2020/258334A1
A resonator and a preparation method therefor. The resonator comprises a silicon substrate (1), a bottom electrode (3) stacked on part of the silicon substrate (1), a piezoelectric layer (4) covering the bottom electrode (3) and part of ...  
WO/2020/261978A1
The objective of the present invention is to provide a surface acoustic wave device which has excellent electric power resistance and linearity, and with which unwanted waves can be suppressed. A surface acoustic wave device 1 is provi...  
WO/2020/262472A1
An electronic component housing package 100 comprises: an insulating substrate 101 having a major surface; an external connection conductor 105 partly exposed on the major surface; and an inner layer conductor 107 positioned on the inner...  
WO/2020/255474A1
A resonance device 1 is provided with: an MEMS substrate 40 including a resonator 10; an upper lid 30 provided to seal an oscillation space S of the resonator 10; and a grounding part 50 located between the MEMS substrate 40 and the uppe...  
WO/2020/255520A1
The present invention further improves confinement of vibration. This resonator (10) comprises: a vibration unit 120 that includes an Si substrate F2 in which one main surface has an X-axis-direction width W and a Y-axis-direction length...  
WO/2020/254090A1
The invention relates to a temperature-controlled RF resonator (200) comprising a thermally insulating enclosure (110) inside which the following are implemented: - at least one resonating element (120) configured to deliver an RF output...  
WO/2020/252962A1
An acoustic wave device and a preparation method therefor, and a temperature control method of the acoustic wave. The preparation method comprises: respectively providing a first substrate and a second substrate (S110); forming an acoust...  
WO/2020/250490A1
[Problem] To improve the bonding strength when bonding a piezoelectric material substrate to a support substrate formed from quartz, and to prevent delamination even if the piezoelectric material substrate is thin. [Solution] A composite...  
WO/2020/250491A1
[Problem] To improve the bonding strength when bonding a piezoelectric material substrate formed from lithium tantalate or the like to a support substrate formed from quartz, and to prevent delamination even if the piezoelectric material...  
WO/2020/250734A1
The present invention improves both the filter characteristic at the time of transmission and filter characteristic at the time of reception of one filter. A filter (2) allows a transmission signal in a predetermined frequency band to pa...  
WO/2020/250572A1
Provided is an elastic wave device less likely to experience surge destruction. A dielectric film 4 is provided so as to cover an IDT electrode 3. The IDT electrode 3 has: a first and a second edge region E1, E2, which are low-speed-of...  
WO/2020/244332A1
The present invention relates to a bulk acoustic resonator, comprising: a substrate; an acoustic mirror; a bottom electrode provided over the substrate; a top electrode provided oppositely to the bottom electrode and having an electrode ...  
WO/2020/244254A1
A bulk acoustic wave resonator, comprising: a substrate (201); an acoustic mirror (203); a bottom electrode (205) arranged above the substrate (201); a top electrode (209) arranged opposite the bottom electrode (205) and provided with an...  
WO/2020/241776A1
Provided is an elastic wave device that can effectively suppress higher-order modes. This elastic wave device 1 comprises a support substrate 4 that comprises silicon, a piezoelectric layer 6 that is provided directly or indirectly on ...  
WO/2020/238508A1
The present invention relates to a bulk acoustic resonator, comprising a substrate, an acoustic mirror, a bottom electrode provided above the substrate, a top electrode having an electrode connection portion, and a piezoelectric layer pr...  
WO/2020/238509A1
A bulk acoustic wave resonator, comprising: a substrate; an acoustic mirror; a bottom electrode, provided on the substrate; a top electrode (50), opposite to the bottom electrode and having an electrode connection portion; and a piezoele...  
WO/2020/241849A1
This crystal element comprises: an oscillating section having a first surface and a second surface; a flat plate section having a first surface and a second surface, having a thickness greater than that of the oscillating section, and be...  

Matches 1 - 50 out of 52,413