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WO/2016/102925A1 |
A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) a...
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WO/2016/102922A1 |
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die th...
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WO/2016/095597A1 |
Disclosed is an impedance matching method for an electret microphone. The method comprises: acquiring a bias voltage between a source and a drain of a field effect transistor built in an electret microphone; determining whether the bias ...
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WO/2016/099181A1 |
The present invention relates to a waterproof sound device comprising: a sound part through which sound is emitted or inputted; and a membrane for vibrating so as to transmit, to the outside, the sound emitted from the sound part or to t...
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WO/2016/097714A1 |
This application relates to MEMS transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the me...
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WO/2016/099884A1 |
An apparatus includes a microelectromechanical system (MEMS) device having a diaphragm and a back plate; a clipping circuit coupled to the MEMS device, wherein the clipping circuit is configured to clip an output signal of the MEMS devic...
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WO/2016/091438A1 |
The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate...
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WO/2016/091624A1 |
The invention related to an ultrasound system comprising: an ultrasound array including at least one capacitive micromachined ultrasonic transducer device comprising a membrane coupled to a first electrode, a substrate opposing the membr...
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WO/2016/088699A1 |
Provided is a composition for an acoustic wave probe, said composition containing a polysiloxane mixture comprising: a polysiloxane having a vinyl group; a polysiloxane having at least two Si-H groups in the molecular chain thereof; and ...
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WO/2016/090011A1 |
A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to rece...
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WO/2016/086714A1 |
Disclosed are a recording apparatus and a terminal. The recording apparatus comprises: a microphone arranged on a PCB, and a microphone interface. The microphone interface extends outwards at one side of a housing, and the microphone is ...
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WO/2016/090015A2 |
Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor n...
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WO/2016/085812A1 |
A microphone includes a base; a micro electro mechanical system (MEMS) device disposed on the base, the MEMS device configured to convert sound into a first electrical signal; an integrated circuit disposed on the base and coupled to the...
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WO/2016/085758A1 |
A far end signal from a far end user and broadcasting the far end signal at a loudspeaker is received. A signal for use in an echo transfer function is determined, and the signal selected from between: the far end signal or an echo refer...
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WO/2016/080668A1 |
A microphone package is disclosed. The microphone package according to the present invention comprises: a base; a package structure including a first space formed on the upper surface of the base and a second space formed on the lower su...
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WO/2016/075113A1 |
The invention relates to a package comprising a base structure (102) which comprises an electrically insulating material and/or an electrically conductive contact structure (110), an electronic component (104) which is embedded in the ba...
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WO/2016/077231A1 |
A micro electro-mechanical system (MEMS) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupl...
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WO/2016/077100A1 |
A microphone includes a microelectromechanical system (MEMS) device, an amplifier, and an attenuation apparatus. The MEMS device converts acoustic energy into electrical signals. The amplifier is coupled to the MEMS device and receives a...
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WO/2016/077101A1 |
An acoustic apparatus includes a microelectromechanical system (MEMS) device, a controlled filter coupled to the MEMS device, and an amplifier. The controllable filter and the amplifier are coupled together at a node. A cut-off frequency...
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WO/2016/077193A1 |
Sound waves cause pressure changes in the air, and the pressure changes cause changes in the dielectric constant of air. Capacitive sensor measurements indicative of the changes in the dielectric constant of air can be processed to extra...
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WO/2016/077228A1 |
Providing security features in an audio sensor is presented herein. A micro-electro-mechanical system (MEMS) microphone can include an acoustic membrane that converts an acoustic signal into an electrical signal; an electronic amplifier ...
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WO/2016/069691A1 |
A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) el...
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WO/2016/063767A1 |
This electret element has an electret layer including silicon oxide, and an aluminum oxide protective layer deposited on the electret layer by means of an atomic layer deposition method.
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WO/2016/060148A1 |
In the present invention, a region in which an oscillation element of an electrostatic electroacoustic transducer oscillates is ensured without a member being placed between the oscillation element and a fixed pole. In the electrostatic ...
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WO/2016/060886A1 |
An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back...
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WO/2016/059762A1 |
An electrostatic capacitance type transducer includes one or more elements 2. The one or more elements each include a plurality of cell groups 14 each including a cell 1 including a first electrode 4 and a second electrode 5 arranged wit...
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WO/2016/060210A1 |
An acoustic system comprising: a vibration part which constitutes a planar speaker for outputting sound waves having directivity toward a floor and generates sound waves; and a sound insulation part which constitutes the speaker, is disp...
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WO/2016/053715A1 |
A microphone includes a base, a micro electro mechanical system (MEMS) device disposed on the base, and a front end processing apparatus disposed on the base and coupled to the MEMS device, the front end processing apparatus being config...
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WO/2016/054366A1 |
In accordance with one aspect of the disclosure, a method of operating an acoustic system including detecting an ultrasonic sound signal and pattern matching the received ultrasonic sound signal to determine when the received ultrasonic ...
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WO/2016/054370A1 |
In accordance with one aspect of the disclosure, an acoustic apparatus is provided included a transducer, a signal generator, a buffering module, and a proximity detection module. A switching module is coupled to the transducer, signal g...
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WO/2016/052499A1 |
This dielectric material (1) for transducers is produced from a composition comprising metal oxide particles having a hydroxyl group, a rubber polymer having a functional group capable of reacting with an epoxy group, a bisphenol type ep...
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WO/2016/047186A1 |
Provided are a structure and a method for making the same, said structure being capable of suppressing the bow of a board on which a CMUT has been formed without affecting a film arrangement that has been optimized so as to maintain the ...
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WO/2016/044593A1 |
Approaches are provided for an apparatus that includes an input buffer, an analog-todigital converter coupled to the input buffer, a decompress module coupled to the analog to digital converter, and a gain control module coupled to the i...
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WO/2016/040157A1 |
Approaches are provided for an acoustic apparatus including a base, a transducer coupled to the base, an acoustic interface assembly, and a cover disposed on the base and enclosing the acoustic interface assembly and the transducer. The ...
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WO/2016/040793A1 |
A microelectromechanical system (MEMS) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the ...
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WO/2016/038450A1 |
A method of detecting defects in a high impedance network of a MEMs microphone sensor interface circuit. The method includes adding a high-voltage reset switch to a high- voltage high impedance network, closing the high-voltage reset swi...
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WO/2016/034563A1 |
The invention relates to a loudspeaker arrangement (1) for a plurality of MEMS loudspeakers (5) for generating sound waves in the audible wavelength spectrum, comprising a housing (2), which has a sound conduction cavity (3) and at least...
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WO/2016/034560A1 |
The invention relates to a MEMS loudspeaker arrangement (1) for generating sound waves in the audible wavelength spectrum, comprising a housing (2), which has a sound conduction channel (8) and a sound outlet opening (10) arranged at the...
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WO/2016/029378A1 |
A MEMS device (100) is provided. The MEMS device (100) comprises a printed circuit board (110), a cover (120) attached to the printed circuit board (110) to form a housing, at least one sound hole (112) formed in the housing, a transduce...
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WO/2016/029359A1 |
A PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrat...
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WO/2016/029365A1 |
A method for manufacturing a fully wafer-level-packaged MEMS microphone and a microphone manufactured with the same are provided, the method comprises: separately manufacturing a first packaging wafer, an MEMS microphone wafer and a seco...
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WO/2016/029358A1 |
A silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate (3), wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm (1) on a silicon substrate (2); and one side surface of the MEMS acoustoelectric ch...
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WO/2016/022355A1 |
A micro electro mechanical system (MEMS) microphone includes a base; a MEMS die disposed on the base; and a cover coupled to the base and enclosing the MEMS die. The MEMS die includes and diaphragm and back plate and posts extend from a ...
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WO/2016/018624A1 |
A back plate for use in a microphone includes a first layer; a second layer; and a metal layer disposed between the first layer and the second layer. A first compression of the back plate provided by cooling of the first layer and the se...
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WO/2016/015530A1 |
An MEMS microphone comprises a substrate (100), a supporting part (200), an upper polar plate (300) and a lower polar plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower polar plat...
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WO/2016/018625A1 |
A micro electro mechanical system (MEMS) microphone includes a base; a MEMS device disposed on the base, the MEMS device comprising a diaphragm and a back plate; a condition sensor disposed on the base; and an integrated circuit coupled ...
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WO/2016/018563A1 |
This disclosure provides systems, methods and apparatus including microelectromechanical system microphones. In one aspect, the systems include a substrate made of a low dielectric material, such as glass. A layer of semiconductor materi...
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WO/2016/008532A1 |
The present invention concerns a transducer element (1) which comprises a substrate (5) which comprises a cavity (23) extending through the substrate (5), a backplate (3) which is arranged in the cavity (23) of the substrate (5) and a me...
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WO/2016/008106A1 |
A silicon microphone (10) with a high-aspect-ratio corrugated diaphragm (200). The microphone (10) comprises a compliant diaphragm (200) on which at least one ring-shaped corrugation (210) is formed in the vicinity of the edge of the dia...
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WO/2016/008833A1 |
A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is...
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