Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 6,849

Document Document Title
WO/2021/010072A1
[Problem] To provide an electrostatic-type sound pressure-electrical signal conversion device which enables three-dimensional deformation and has a sheet shape with a low driving voltage. [Solution] In a sound pressure-electrical signal ...  
WO/2021/002540A1
The present invention relates to a microphone and, more particularly, to a MEMS microphone. A microphone according to an example of the present invention comprises: a case including a side wall and an upper wall, and having an open lower...  
WO/2021/000070A1
Provided in the present invention is a MEMS microphone, comprising a base having a rear cavity and a capacitor system arranged on the base, the capacitor system comprising a backplate and a diaphragm, the backplate and the diaphragm bein...  
WO/2021/000163A1
Disclosed are a bone-conduction MEMS microphone and a mobile terminal. The bone-conduction MEMS microphone comprises: an MEMS microphone chip with a back cavity, a mass block, a shell, and a circuit board, wherein the MEMS microphone chi...  
WO/2021/000069A1
Provided is a combined piezoelectric and capacitive MEMS microphone, comprising a base having a back cavity, and a capacitance system arranged on the base, wherein the capacitance system comprises a backplane and a vibrating diaphragm, t...  
WO/2020/258171A1
Provided in the present utility model are a vibration sensor and an audio device. The vibration sensor comprises a cavity with an inner wall as well as an elastic piece, a mass piece and an MEMS chip with a back cavity all arranged in th...  
WO/2020/258172A1
Provided are a vibration sensor, an audio apparatus, and a method for assembling a vibration sensor. The vibration sensor comprises a cavity having an inner wall, a spacer provided within the cavity, an elastic film, and a MEMS chip havi...  
WO/2020/258174A1
The present application provides a vibration sensor and an audio device. The vibration sensor comprises a cavity having a sidewall, an elastic film mounted on the sidewall, and an MEMS chip having a back cavity. The MEMS chip is received...  
WO/2020/259530A1
An acoustic reflector (4000) and an acoustic electronics device are disclosed. The acoustic reflector (4000) is for being used inside an enclosure (1000) of an acoustic electronics device, which is made of thermal conductive material and...  
WO/2020/237651A1
An MEMS capacitive sensor and a preparation method thereof. The sensor comprises a first electrode structure (200), and the first electrode structure (200) comprises a first conductive region (230a) located in a central region, and an in...  
WO/2020/228543A1
Disclosed is an MEMS device, comprising a substrate, and a first sacrificial layer (200), a first conductive film (300), a second sacrificial layer (400) and a second conductive film (500) that are stacked on the substrate (100) in seque...  
WO/2020/229466A1
The invention relates to an acoustic bending transducer system (1, 2) with a plurality of bending transducers (3, 4, 5), which are designed in such a way that deformable elements (31, 32, 41; 32, 34, 42; 31, 32, 3'1, 3'2) of the bending ...  
WO/2020/225808A1
An acoustic device including a membrane having an edge. A membrane support is attached to the edge of the membrane. A central region of the membrane is unsupported by the support. A first electrode and the membrane support are manufactur...  
WO/2020/225573A1
An electrostatic transducer, a diaphragm (2) therefor, and corresponding methods of manufacture are disclosed. The electrostatic transducer is preferably for use in a motor vehicle. A composite laminated diaphragm (2) is manufactured by ...  
WO/2020/224513A1
A method for manufacturing a micro electro mechanical system (MEMS) device, comprising: providing a substrate (100), forming a first sacrificial layer (200) on a front surface of the substrate (100), and forming a functional structure (3...  
WO/2020/217855A1
Provided is an electrostatic transducer that enables improvement of detection accuracy or driving precision while allowing flexibility. This electrostatic transducer (1) is provided with: an insulator sheet (11); at least one electrode s...  
WO/2020/212540A1
The invention relates to a micromechanical acoustic transducer comprising a plurality of bending transducers suspended on one side. Each of the plurality of bending transducers is designed for deflection in an oscillation plane and said ...  
WO/2020/209947A1
A mounting system which includes a pocket for receiving a digital recorder or a wireless transmitter and a connector for connecting to the body of a microphone device, such as a hand held microphone. The pocket is made of a polyurethane ...  
WO/2020/206628A1
The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and...  
WO/2020/205852A1
A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity. An integrated circuit is disposed on t...  
WO/2020/194870A1
Disclosed is a transducer device that is configured to be able to extend the scope of uses thereof. This transducer device (1) is provided with: a transducer element (11); elastic bodies (12a, 12b) which clamp the transducer element (11)...  
WO/2020/196863A1
Provided is an electrostatic transducer which has a reduced film thickness and offers increased detection accuracy or operation accuracy. The electrostatic transducer (1) is provided with: an insulator sheet (11); a first electrode sheet...  
WO/2020/193288A1
The invention relates to a MEMS comprising a substrate having a cavity. The MEMS comprises a moveable layer assembly arranged in the cavity and having a first bar, a second bar and a third bar arranged between the first bar and second ba...  
WO/2020/186884A1
The present invention relates to a microphone and an electronic device. The microphone comprises an encapsulation housing having an inner cavity, and a MEMS microphone chip and an ASIC chip provided in the inner cavity of the encapsulati...  
WO/2020/189129A1
Provided is an electroacoustic transducer having adjustable frequency properties. In an electrostatic electroacoustic transducer (1), an oscillator (10) is disposed between a fixed pole (20U) and a fixed pole (20L). The periphery of the ...  
WO/2020/185998A1
Disclosed herein is an audio system having servo-controlled audio speaker and an amplifier. Interposed between the audio speaker and the amplifier is a feedback circuit configured to provide a feedback signal to the amplifier regarding e...  
WO/2020/174524A1
[Problem] To provide an electrostatic sound wave generation device and an electrostatic speaker that make it less likely that dust, water, humidity, or the like will enter the interior of the device, and make it possible to reduce consum...  
WO/2020/175839A1
A semiconductor apparatus according to the present technology comprises: a readout circuit for reading a first signal generated by detecting an input signal according to a detection signal, to generate a readout signal; and a detection c...  
WO/2020/176149A1
A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the met...  
WO/2020/123550A3
An integrated circuit connectable to a sensor includes a transconductance element and a current-input analog-to-digital converter (I- ADC). The transconductance element is connectable to the sensor and is configured to generate a current...  
WO/2020/123725A3
A transducer assembly comprises an acoustic transducer comprising a transducer substrate having a first aperture defined at a first location of the transducer substrate, an acoustic transducer diaphragm disposed on the transducer substra...  
WO/2020/112769A3
A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first pluralit...  
WO/2020/159652A1
A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and ele...  
WO/2020/160348A1
The problem of contaminants entering a microphone assembly through a pressure equalization aperture is mitigated by moving the pressure equalization aperture from a location near the acoustic port to a location on the cover of the microp...  
WO/2020/154066A1
The present disclosure relates in a first aspect to a method of detecting leakage current from a DC bias voltage circuit of an integrated circuit for a capacitive microelectro mechanicalsystems (MEMS) transducer. A test signal with a pre...  
WO/2020/151140A1
The present invention relates to an electret capacitor microphone with a small noise coefficient and a manufacturing method thereof, comprising a housing and an electret type variable capacitor mounted in the housing, and an ASIC amplifi...  
WO/2020/140572A1
Provided is a method for manufacturing an MEMS microphone, the method comprising the following steps: selecting a substrate, and manufacturing a first diaphragm structure on a first surface of the substrate; manufacturing back plate stru...  
WO/2020/142320A1
An active noise reduction (ANR) device includes a first sensor configured to generate an input signal indicative of an environment of the active noise reduction device, in which the first sensor has a measured roll-off frequency. A first...  
WO/2020/140569A1
The present invention provides a piezoelectric microphone, comprising a base having a back cavity and a piezoelectric cantilever diaphragm fixed at the base. The piezoelectric cantilever diaphragm comprises a first diaphragm positioned a...  
WO/2020/133375A1
An MEMS sound sensor for detecting sound by means of at least one of air sound pressure change and mechanical vibration. The MEMS sound sensor comprises: a substrate provided with a back hole; a back plate provided above the substrate, a...  
WO/2020/139860A1
A microelectromechanical system (MEMS) transducer includes a transducer substrate, a diaphragm, and a stiffening member. A first side of the diaphragm is coupled to the transducer substrate. A second side of the diaphragm is coupled to t...  
WO/2020/133334A1
Disclosed is an MEMS sound sensor, comprising: a substrate; and a first sound sensing unit and a second sound sensing unit arranged on the substrate, wherein the first sound sensing unit is used for detecting a sound by means of at least...  
WO/2020/133312A1
A MEMS sound sensor, comprising: a substrate and a first sound sensing unit and a second sound sensing unit arranged on the substrate; the first sound sensing unit is used for detecting sound by means of at least one of air sound pressur...  
WO/2020/137966A1
This ultrasound device comprises: a support substrate; an ultrasound element; an attenuating material; and one or more electronic elements. The support substrate has a first surface, and a second surface on the reverse side of the first ...  
WO/2020/133352A1
An MEMS sound sensor, for use in detecting sound by means of at least one of air sound pressure change and mechanical vibration. The MEMS sound sensor comprises: a back plate; a diaphragm opposite to the back plate and having a gap with ...  
WO/2020/126843A1
Microphone capsules for capacitive or electret microphones often have individual deviations from a desired ideal electro-acoustic response, e.g. the frequency response and the phase response. In particular when multiple microphone capsul...  
WO/2020/124630A1
Provided is a combination sensor, comprising: a substrate (1); a first ASIC chip (2) and a second ASIC chip (3) mounted in the substrate (1); a first lead plate (4) and a second lead plate (5) arranged on the substrate (1); a first MEMS ...  
WO/2020/123725A2
A transducer assembly comprises an acoustic transducer comprising a transducer substrate having a first aperture defined at a first location of the transducer substrate, an acoustic transducer diaphragm disposed on the transducer substra...  
WO/2020/113698A1
Disclosed are a combined sensor (100) and an electronic device. The combined sensor (100) comprises a cover (10), a substrate (30), an environment sensor (50) and an acoustics sensor (70), wherein the substrate (30) and the cover (10) en...  
WO/2020/113696A1
A combined sensor, the combined sensor comprising: a substrate (100), the substrate having an upper surface (110) and a lower surface; a first MEMS chip (310) and a first ASIC chip (320), the first MEMS chip (310) and the first ASIC chip...  

Matches 1 - 50 out of 6,849