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Patent Searching and Data


Matches 801 - 850 out of 6,662

Document Document Title
JP6309034B2  
JP2018056734A
To provide an ultrasonic transducer that has reduced driving voltage and increased reliability.An ultrasonic transducer includes: a hollow section 110 formed between insulation films 104 and 106 sandwiched between a lower electrode 103 a...  
JP2018509114A
An integral-type voice coil and a corn assembly contain a corn assembly which has a top diaphragm skin and a lower diaphragm skin which have space between a top diaphragm skin and a lower diaphragm skin. A voice coil constituted so that ...  
JP2018046532A
To provide a "speaker" having high sound quality and reliability while using a diaphragm having a non-axial symmetrical shape.A speaker of the invention includes a magnetic circuit 1 having a magnetic gap G, a frame 7 bonded to the magne...  
JP6297131B2  
JP2018041865A
To provide a technique capable of realizing a piezoelectric body having high crystal orientation even in a form of a film and an ultrasonic imaging apparatus having high spatial resolution in ultrasonic image diagnosis and realizing a hi...  
JP6293447B2  
JP2018037918A
To provide a diaphragm for speaker capable of achieving a speaker of a high sound pressure with satisfactory waterproof performance with a weight lighter than conventional diaphragms for speaker impregnated with waterproof liquid.The dia...  
JP6286636B2  
JP2018506171A
Electric parts in which it is simply manufactured for the chip which has a part structure with high susceptibility are provided. Parts are provided with a joining structure object and a wiring connection structure, and a supporting board...  
JPWO2017030045A1
It can reproduce with sufficient volume, and heat dissipation is high, and it provides a manufacturing method and an electroacoustic transducer of a small electroacoustic transduction film of sound pressure change by temporality, and an ...  
JP2018027235A
To reduce an accumulation error of a lead interval in a lamination direction accompanied by the lamination processing of a lead frame including lead rows which are aligned in one direction, in a lead array possessed by a backing with lea...  
JP6277899B2  
JP6275793B1
[Subject] Reliable "speaker" is provided by high-quality sound, using a diaphragm of non-axisymmetric geometry. [Means for Solution] Magnetic circuit 1 where a speaker of the present invention has magnetic gap G, and frame 7 combined wit...  
JP2018019339A
To simply perform a step of thinning a substrate thickness for suppressing reflection of ultrasonic waves by the substrate in a manufacturing method of a CMUT while suppressing a change of stress characteristics, etc. of a vibrating film...  
JP6270506B2  
JP6273297B2  
JP6270505B2  
JP6267787B2  
JP6265573B2  
JP6266106B2  
JP6265906B2  
JP2018011143A
To provide a speaker and its manufacturing method capable of allowing an outer diameter of a connection part between a top plate and a frame to be smaller than that of the top plate.A speaker includes: a frame where a diaphragm is arrang...  
JP2018011206A
To facilitate the positioning of a center position of an oscillator while preventing the deterioration of an acoustic characteristic of an ultrasonic probe.An ultrasonic probe 2 includes: a foundation part 21 having a circular arcuate co...  
JP6263520B2  
JP6261820B2  
JP2018500825A
An ultrasonic device contains the converter array (404) formed in the substrate (402) 1st side. Penetration beer (406) penetrates the thickness of the substrate between the 2nd side opposite to the first and 1st side. A conductor (410) i...  
JP2017538914A
While the present invention is an electronic card (13) for controlling a housing (16) provided with an electrical connector (17), at least one ultrasonic transducer (15), and the vibrator and being allocated in an inside of the housing, ...  
JP2017226036A
To selectively manufacture microstructure having desired property in accordance with usage.An upper electrode 14 of CMUT10 is constituted of a first electrode part 14A made of tungsten (W) and a second electrode part 14B made of aluminum...  
JP6252248B2  
JP6252130B2  
JP6253101B2  
JP6251661B2  
JP6248535B2  
JP2017220666A
To provide a method for fabricating high annealing temperature piezoelectric structures compatible with low-cost thin-film sensor devices.A method is provided for fabricating piezoelectric plates. An anti-corrosion layer is formed overly...  
JP6246719B2  
JP6244808B2  
JP6245989B2  
JP2016537883A5  
JP6242160B2  
JP6243668B2  
JP2017536016A
Very special character is required of the material used for a sound transducer film, and it requires many trade-offs in arbitrary actual systems. Graphene and a graphene reference material are the materials of the newly discovered kind p...  
JP2017535981A
The embodiment of this indication has indicated related Di with whom the microphone device which uses silicon penetration beer (TSV) is united, technique, and composition. The semiconductor substrate which has the 2nd side that a device ...  
JP2017208772A
To provide a backing member having a novel structure capable of reliably forming resin containing a filler between reeds even when an arrangement pitch of the reeds is narrowed.A backing member includes a resin layer 50 containing a fill...  
JP2017208845A
To reduce variation in characteristics of a diaphragm of an electromechanical transducer.An electromechanical transducer of the present invention includes: a substrate; a first electrode formed on the substrate; and a diaphragm which has...  
JP6233581B2  
JP6235902B2  
JP6234641B1
An ultrasonic transducer is provided with the drive unit attached to the perimeter of a bolt in the state where it is inserted between the tip side block and the end face side block about the direction in alignment with a longitudinal ax...  
JP6229653B2  
JP6232124B2  

Matches 801 - 850 out of 6,662