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Patent Searching and Data


Matches 851 - 900 out of 6,673

Document Document Title
JP6243668B2  
JP2017536016A
Very special character is required of the material used for a sound transducer film, and it requires many trade-offs in arbitrary actual systems. Graphene and a graphene reference material are the materials of the newly discovered kind p...  
JP2017535981A
The embodiment of this indication has indicated related Di with whom the microphone device which uses silicon penetration beer (TSV) is united, technique, and composition. The semiconductor substrate which has the 2nd side that a device ...  
JP2017208772A
To provide a backing member having a novel structure capable of reliably forming resin containing a filler between reeds even when an arrangement pitch of the reeds is narrowed.A backing member includes a resin layer 50 containing a fill...  
JP2017208845A
To reduce variation in characteristics of a diaphragm of an electromechanical transducer.An electromechanical transducer of the present invention includes: a substrate; a first electrode formed on the substrate; and a diaphragm which has...  
JP6233581B2  
JP6235902B2  
JP6234641B1
An ultrasonic transducer is provided with the drive unit attached to the perimeter of a bolt in the state where it is inserted between the tip side block and the end face side block about the direction in alignment with a longitudinal ax...  
JP6229653B2  
JP6232124B2  
JP2017201782A
To suppress mixing of air bubbles and prepare a sufficient bonding area when providing a member such as a protective film on an ultrasonic transducer.In the manufacturing method of an ultrasonic transducer, an ultrasonic transducer 101 i...  
JP6218279B2  
JP6219577B2  
JP2017192143A
To provide ultrasonic transducers, especially, ultrasonic transducers used for medical imaging.An ultrasonic transducer includes a backing element, an active element over the backing layer, and a matching element over the active element,...  
JP6214054B2  
JP6214401B2  
JP6214333B2  
JP6211661B2  
JP2017178780A
To provide a lead-free piezoelectric composition and a lead-free piezoelectric element having a high piezoelectric constant by a simple process.Provided is a method for producing a lead-free piezoelectric composition having a perovskite ...  
JP2017181118A
To provide a pressure sensor having high performance characteristics and its manufacturing method.A microphone 20 as a pressure sensor is provided with a diaphragm 21 made of metallic glass. Preferably, an electrode 25 should be so arran...  
JP6209041B2  
JP6209537B2  
JP6208933B2  
JP2017173095A
To provide a structure where ultrasonic flaw detection for an inspection object can be performed with high accuracy.An ultrasonic probe 100 is formed which comprises: an ultrasonic vibrator 111 which transmits and receives an ultrasonic ...  
JP2017528178A
They are a plurality of substrate islands 110, 120, and 130 by which were spatially separated by flexible polymer assembly 150, and interconnection was carried out electrically, 1st substrate island 110 that includes the conductive track...  
JP2017528940A
A piezo-electric micro mechanical ultrasonic wave transducer (PMUT) contains the multilayer stack arranged on a substrate. A multilayer stack may contain the anchor structure arranged on a substrate, the piezo-electric layer stack arrang...  
JP2017170156A
To provide an ultrasonic transducer device avoiding an increase in wiring resistance while having a piezoelectric film for each vibration film.A plurality of vibration films 24 is disposed in an array on a substrate 21. On the plurality ...  
JP2017167230A
To provide a method for manufacturing a structure with a high aspect ratio, by which a structure with a high aspect ratio having a recessed portion including a side face substantially perpendicular to a major surface of a substrate is ma...  
JP2017513344A5  
JP2017164258A
To provide an improved technology related to a structure of an ultrasonic probe equipped with a two-dimensional array vibrator.A back face of a backing member 20 is provided with multiple lead electrodes to be electrically connected to m...  
JP2017528026A
The present invention relates to a transducer device in which each of an electric plane array-like sound cell contains a piezo-electric double layer unit. A transducer device has high wave transmission sensitivity over a large zone. A tr...  
JP6199076B2  
JP2017163408A
To provide a technology capable of avoiding damage of a vibration electrode film by suppressing excessive deformation of the vibration electrode film even if the vibration electrode film is deformed in any direction in the case where an ...  
JP2017163183A
To provide an ultrasonic element array that can have higher resistance against moisture and voltage even in a layout where wires intersect.An ultrasonic element array 1 includes: a first piezoelectric element 3, a second piezoelectric el...  
JP2017157664A
To provide a piezoelectric thin film which is capable of being easily manufactured and whose crystal structure orientation is controlled, a piezoelectric element with excellent piezoelectric characteristics, and an ultrasonic probe and a...  
JP2017153789A
To reduce manufacturing cost by downsizing a housing and also simplifying an assembly process.An ultrasonic probe manufacturing method assembles an ultrasonic probe including a probe substrate on a first main surface of which laminated o...  
JP2017148258A
To provide an ultrasonic probe having improved detection accuracy of ultrasonic waves.The ultrasonic probe includes: an acoustic material AA having a plane FS1, a plane FS2, and a plane FS3 sequentially aligned in a Y direction; and a ch...  
JP2017152798A
To provide an ultrasonic device having high reliability, an ultrasonic probe, an ultrasonic apparatus, and a method of manufacturing the ultrasonic device.An ultrasonic device 22 comprises: an element substrate 41 including an ultrasonic...  
JP6186696B2  
JP6187684B2  
JP6190387B2  
JP6189033B2  
JP2017147545A
To provide a MEMS device capable of preventing destruction of the MEMS device and suppressing decrease or fluctuation in sensitivity and a method of manufacturing the same.A second spacer 12 is formed between a silicon substrate 1 and a ...  
JP6183599B2  
JP6185988B2  
JP6184534B2  
JP6184282B2  
JP6181644B2  
JP2016049193A5  
JP2016513941A5  

Matches 851 - 900 out of 6,673