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Matches 1,001 - 1,050 out of 6,673

Document Document Title
JP2016537883A
An ultrasonic probe is formed using protected interconnection and a more robust probe arises as a result by it. Interconnection is installed between an array of a transducer element, and an integrated circuit. An array of a transducer el...  
JP2016536154A
The present invention presents the method provided with the following steps for manufacturing a minute electricity machinery converter. The step which manufactures a plurality of minute electricity machinery converters (1) respectively p...  
JP2016195333A
To provide a probe or the like whose light reflection layer is hard to be peeled off and has a light reflection layer excellent in reliability.A probe includes: an element 101 which has one or more cells including a first electrode provi...  
JP2016072661A5  
JP2015082748A5  
JP2016534563A
The element incorporating a multilayer thin film piezo-electricity material stack and such a stack is provided. According to an embodiment, an intervention material layer is arranged between two continuous piezoelectric material layers i...  
JP2016534685A
The present invention relates to a method of producing a film a diaphragm of a loud speaker, or for diaphragms of a microphone (7) from a thermoplastic elastomer, and a thermoplastic elastomer is fabricated by film by extrusion fabrication.  
JP2016185574A
To provide an MEMS element which obtains a large output signal and is structurally robust, and to provide a manufacturing method of the MEMS element.An MEMS element is formed by a first movable electrode part 12 in which a movable electr...  
JP2016184794A
To provide a unidirectional MEMS microphone suitable for application to a production process under heating atmosphere such as reflow soldering.A MEMS acoustic chip and an acoustic resistor are housed in a casing, and a first sound hole a...  
JP2016184821A
To provide an ultrasonic sensor capable of maintaining good acoustic properties, while achieving high density of ultrasonic sensor elements.Assuming that two axes orthogonal to each other are X axis and Y axis, a plane formed by the X ax...  
JP2016181842A
To provide an ultrasonic sensor that ensures high reliability.The ultrasonic sensor includes: a substrate 10 along an XY plane, where the XY plane is a plane formed by an X-axis and a Y-axis, which are two axes orthogonal to each other; ...  
JP6006877B2  
JP2016178648A
To reduce variations in the characteristics of vibration films in an electromechanical transducer.An electromechanical transducer is configured by arraying nine cell structures 2. Each cell structure 2 includes a first insulation film 12...  
JP2016178651A
To provide a method for manufacturing an ultrasound transducer and other components.A method for manufacturing an electric component such as an ultrasound transducer is provided, which comprises patterning an electrode for connecting an ...  
JP5999174B2  
JP2016171555A
To provide a diaphragm for a speaker which has a flexibly and smoothly vibrating vibrator and a suspension in which reverse phase noise occurring on the back surface of the vibrator does not go round to the front surface side of the vibr...  
JP2016529834A
Especially the present invention relates to the ultrasonic transducer assembly (10) for the ultrasonic wave system in a pulse pipe. An assembly (10) has a transducer array (12) containing a plurality of transducer elements (14) for trans...  
JP2016167757A
To provide a method for producing a film for a speaker diaphragm that can prevent complication of a process of producing a speaker, and can obtain excellent moisture resistance, water resistance, heat resistance, lightweight properties, ...  
JP5986441B2  
JP2016161682A
To provide an acoustic Fresnel lens and a method of manufacturing the same which can form a layer capable of effectively preventing leakage of acoustic waves and efficiently converge the acoustic waves.An acoustic Fresnel lens 1 comprise...  
JPWO2014061584A1
It contributes to it being efficient and oscillating a powerful directive sound wave. an electroacoustic transducer separates predetermined space from a piezoelectric vibrator and a piezoelectric vibrator, and is arranged -- an inner wal...  
JP2016526277A
A device which has the 1st chip and the 2nd chip combined with this generable on a wafer level is shown. This combination is generated by the 1st joint pattern and the 2nd joint pattern, and the 1st contact pattern and the 2nd contact pa...  
JP5982868B2  
JP5983437B2  
JP5978376B1
[Subject] Provide a manufacturing method which can manufacture efficiently a magnesium diaphragm for sound which the antirust performance was good and was provided with a good acoustic feature. [Means for Solution] Hydroxide layer 2 form...  
JP5978685B2  
JP5979501B2  
JP5975681B2  
JP5975178B2  
JP5975458B2  
JP5973792B2  
JP2016149677A
To provide a diaphragm with a diaphragm base and a reinforcement film having a uniform thickness.The diaphragm includes: a diaphragm base 2 having a center dome 21 and a sub dome 22 surrounding the periphery of the center dome; a reinfor...  
JP5971274B2  
JP2016523725A
It is a method for removal of manufacture of coating which has the structure of pattern form, or coating on conditions mild from a delicate field, and a release film is formed under coating in a non-coating field, and is patternized. In ...  
JP2016146569A
To provide a diaphragm for electroacoustic transducer having proper rigidity according to the use, by using a sol-like suspension of bacterial cellulose produced by stirring culture method, when spraying to the surface of a diaphragm mat...  
JP5961697B2  
JP2016136667A
To suppress acoustic impedance in a thin air layer between a magnetic pole and a voice coil and prevent degradation of frequency response.An electrokinetic electro-acoustic transducer 1 includes: a magnetic circuit 20, forming a magnetic...  
JP5956157B2  
JP2016131350A
To provide a capacitor microphone capable of securely electrically connecting a voice signal output circuit substrate and a rear part case.The capacitor microphone includes: a microphone unit 10; a voice signal output circuit substrate 2...  
JP5954773B2  
JP2016520353A
The present invention relates to a unit ultrasonic wave probe, an ultrasonic probe module, and an ultrasonic probe device. The elasticity board part by which the unit ultrasonic wave probe by the present invention is arranged on the uppe...  
JP2016521056A
The present invention is a complex for manufacture of the membrane for sound, and is the above-mentioned complex, Complex which is the layer which was able to do the above-mentioned career layer with the Polyaryl- ether ketone film inclu...  
JP5950863B2  
JP2016520264A
A sound device contains a substrate, minute electricity mechanical system (MEMS) Di, and an integrated circuit. A lasting opening is pierced and prolonged in a substrate. Minute electricity mechanical system (MEMS) Di containing the hole...  
JP2016127371A
To provide an acoustic sensor which improves an impulse resistance performance without being restricted by semiconductor manufacturing technology and without reducing a sensitivity/noise performance, and a manufacturing method of the aco...  
JP5947234B2  
JP5949599B2  
JP2016518739A
[Subject] Make manufacture of a device easy by lessening a labor and time more. [Means for Solution] A method for forming a phase assistant type metal oxide semiconductor (CMOS) ultrasonic transducer (CUT) and CUT is indicated. CUT may c...  
JP2016106500A
To provide an ultrasonic transducer element chip that is thin and has strength to withstand pressing force in a thickness direction of a substrate.Openings are disposed in an array on a substrate. Ultrasonic transducer elements are provi...  
JP5931127B2  

Matches 1,001 - 1,050 out of 6,673