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Matches 1,151 - 1,200 out of 6,795

Document Document Title
JP5973792B2  
JP2016149677A
To provide a diaphragm with a diaphragm base and a reinforcement film having a uniform thickness.The diaphragm includes: a diaphragm base 2 having a center dome 21 and a sub dome 22 surrounding the periphery of the center dome; a reinfor...  
JP5971274B2  
JP2016523725A
It is a method for removal of manufacture of coating which has the structure of pattern form, or coating on conditions mild from a delicate field, and a release film is formed under coating in a non-coating field, and is patternized. In ...  
JP2016146569A
To provide a diaphragm for electroacoustic transducer having proper rigidity according to the use, by using a sol-like suspension of bacterial cellulose produced by stirring culture method, when spraying to the surface of a diaphragm mat...  
JP5961697B2  
JP2016136667A
To suppress acoustic impedance in a thin air layer between a magnetic pole and a voice coil and prevent degradation of frequency response.An electrokinetic electro-acoustic transducer 1 includes: a magnetic circuit 20, forming a magnetic...  
JP5956157B2  
JP2016131350A
To provide a capacitor microphone capable of securely electrically connecting a voice signal output circuit substrate and a rear part case.The capacitor microphone includes: a microphone unit 10; a voice signal output circuit substrate 2...  
JP5954773B2  
JP2016520353A
The present invention relates to a unit ultrasonic wave probe, an ultrasonic probe module, and an ultrasonic probe device. The elasticity board part by which the unit ultrasonic wave probe by the present invention is arranged on the uppe...  
JP2016521056A
The present invention is a complex for manufacture of the membrane for sound, and is the above-mentioned complex, Complex which is the layer which was able to do the above-mentioned career layer with the Polyaryl- ether ketone film inclu...  
JP5950863B2  
JP2016520264A
A sound device contains a substrate, minute electricity mechanical system (MEMS) Di, and an integrated circuit. A lasting opening is pierced and prolonged in a substrate. Minute electricity mechanical system (MEMS) Di containing the hole...  
JP2016127371A
To provide an acoustic sensor which improves an impulse resistance performance without being restricted by semiconductor manufacturing technology and without reducing a sensitivity/noise performance, and a manufacturing method of the aco...  
JP5947234B2  
JP5949599B2  
JP2016518739A
[Subject] Make manufacture of a device easy by lessening a labor and time more. [Means for Solution] A method for forming a phase assistant type metal oxide semiconductor (CMOS) ultrasonic transducer (CUT) and CUT is indicated. CUT may c...  
JP2016106500A
To provide an ultrasonic transducer element chip that is thin and has strength to withstand pressing force in a thickness direction of a substrate.Openings are disposed in an array on a substrate. Ultrasonic transducer elements are provi...  
JP5931127B2  
JP5927186B2  
JP2016100611A
To provide a method of manufacturing a compact loudspeaker that can increase the magnetic flux density in a magnetic gap.In a method of manufacturing a compact loudspeaker, a first guide hole 51A is fitted to a first reference pin 61, an...  
JP2016096576A
To reduce mechanical characteristic variation of an oscillation film of an electromechanical converting device.A manufacturing method of an electromechanical converting device of the invention, comprises: a step of forming an insulation ...  
JP5923849B2  
JP5921079B2  
JP2016092624A
To enable achievement of an acoustic matching layer having high durability and reliability by preventing exfoliation of a coat and occurrence of crack or chip of a gel mold.An acoustic matching layer 10 comprises a gel mold 11 having a s...  
JP2016514438A
How to make at least one electrode deposit on the basic member of an ultrasonic transducer according to some embodiments, The surface of a basic member is partially etched at least using the 1st etching agent, Copper is plated [exerting ...  
JP2016086441A
To solve the problem of a conventional vibration film in which the vibration film is largely bent since a membrane with compression stress is used on a cavity side.An electromechanical conversion device of the present invention includes:...  
JP2016082321A
To provide an electroacoustic transducer capable of controlling directional characteristics in a characteristic direction only by a speaker unit without inclining a mounting surface of a speaker and also mounting a retrofitted component ...  
JP2016513941A
A method of manufacturing a small ultrasonic wave transducer includes receiving a wafer in which a plurality of small ultrasonic wave transducers were formed. A small ultrasonic wave transducer contains respectively a transducer membrane...  
JP2016082442A
To provide a highly rigid vibrating plate excellent in waterproofness, and to provide a method of manufacturing the same.A vibrating plate 1 for speaker is formed by alternately laminating a solid layer 2 containing wood pulp and thermop...  
JP2016082447A
To provide a dual electret sensor capable of efficiently capturing a change in the transmission rate of a sound due to hardness of a soft material, with no risk of impairing a measured sample, and to provide a method of manufacturing the...  
JP2016076980A
To provide a transducer and a method of forming the transducer.The method comprises locating a feed wire for forming a drive pin 174 on a surface of a reed 166 at a wire contact point, welding a first end of the feed wire to the reed, cu...  
JP5914684B2  
JP2016072807A
To eliminate leakage of contact portions between an insulation seat and a stationary electrode that is disposed oppositely to a diaphragm, in a capacitor microphone unit where an edge of the stationary electrode is supported by the insul...  
JP2016072661A
To provide a structure which can suppress the warpage of a substrate on which a CMUT is formed without affecting a film structure optimized so as to maintain the characteristics of the CMUT and suppress the strain of a membrane, and a me...  
JP5911085B2  
JP5907553B2  
JP2016511607A
Capacitive micro-processing ultrasonic wave transducer (CUMT) device 100 contains at least one CUMT cell 101 containing the 1st substrate 101 that has the top part side which contains the patterned dielectric layer on it, including thick...  
JP2016511582A
The embodiment of the present invention decreases the capacitive cross talk between these arrays through the grounding part of a substrate by which the ultrasonic transformer juicer (MUT) array of micro processing is manufactured. In the...  
JP5901566B2  
JP2016049193A
To provide a highly reliable thin ultrasonic device, a manufacturing method thereof, an ultrasonic probe equipped with the ultrasonic device, an ultrasonic measurement device, and electronic equipment.An ultrasonic device unit 130 as an ...  
JP5899346B2  
JP2016509493A
According to the present invention, the manufacturing method of an ultrasonic transducer is provided. Piezo-electric polymer is mixed into the solution containing the 1st and 2nd chemical substances, and a viscous film is formed. In a ce...  
JP2016509777A
The present invention provides a manufacturing method of an ultrasonic transducer. A substrate which has the 2nd side with the 1st and 1st opposite side is provided. A lower electrode is formed in the substrate 1st side. A piezoelectric ...  
JP5896665B2  
JP2016040798A
To provide a piezoelectric material, having both high piezo-electric constant and specific band, capable of being stably produced, an ultrasonic transducer including the same, and an ultrasonic imaging apparatus.A piezoelectric material ...  
JP2016039512A
To provide a technology which realizes a through wiring structure securing device performance, enabling reduction of the manufacturing costs, and having low resistance and high chemical resistance, and to provide an electrostatic capacit...  
JP2016039476A
To provide a technique for achieving a structure capable of controlling the cell diameter of a capacitive transducer accurately, while suppressing a step between a connection and the vibrating membrane of a cell even when an inter-cell c...  
JP2016508052A
This indication provides a method of separating a plurality of small ultrasonic wave transducers from a wafer. A method includes receiving a wafer in which a plurality of small ultrasonic wave transducers were formed. Each small ultrason...  

Matches 1,151 - 1,200 out of 6,795