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JP5973792B2 |
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JP2016149677A |
To provide a diaphragm with a diaphragm base and a reinforcement film having a uniform thickness.The diaphragm includes: a diaphragm base 2 having a center dome 21 and a sub dome 22 surrounding the periphery of the center dome; a reinfor...
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JP5971274B2 |
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JP2016523725A |
It is a method for removal of manufacture of coating which has the structure of pattern form, or coating on conditions mild from a delicate field, and a release film is formed under coating in a non-coating field, and is patternized. In ...
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JP2016146569A |
To provide a diaphragm for electroacoustic transducer having proper rigidity according to the use, by using a sol-like suspension of bacterial cellulose produced by stirring culture method, when spraying to the surface of a diaphragm mat...
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JP5961697B2 |
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JP2016136667A |
To suppress acoustic impedance in a thin air layer between a magnetic pole and a voice coil and prevent degradation of frequency response.An electrokinetic electro-acoustic transducer 1 includes: a magnetic circuit 20, forming a magnetic...
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JP5956157B2 |
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JP2016131350A |
To provide a capacitor microphone capable of securely electrically connecting a voice signal output circuit substrate and a rear part case.The capacitor microphone includes: a microphone unit 10; a voice signal output circuit substrate 2...
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JP5954773B2 |
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JP2016520353A |
The present invention relates to a unit ultrasonic wave probe, an ultrasonic probe module, and an ultrasonic probe device. The elasticity board part by which the unit ultrasonic wave probe by the present invention is arranged on the uppe...
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JP2016521056A |
The present invention is a complex for manufacture of the membrane for sound, and is the above-mentioned complex, Complex which is the layer which was able to do the above-mentioned career layer with the Polyaryl- ether ketone film inclu...
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JP5950863B2 |
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JP2016520264A |
A sound device contains a substrate, minute electricity mechanical system (MEMS) Di, and an integrated circuit. A lasting opening is pierced and prolonged in a substrate. Minute electricity mechanical system (MEMS) Di containing the hole...
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JP2016127371A |
To provide an acoustic sensor which improves an impulse resistance performance without being restricted by semiconductor manufacturing technology and without reducing a sensitivity/noise performance, and a manufacturing method of the aco...
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JP5947234B2 |
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JP5949599B2 |
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JP2016518739A |
[Subject] Make manufacture of a device easy by lessening a labor and time more. [Means for Solution] A method for forming a phase assistant type metal oxide semiconductor (CMOS) ultrasonic transducer (CUT) and CUT is indicated. CUT may c...
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JP2016106500A |
To provide an ultrasonic transducer element chip that is thin and has strength to withstand pressing force in a thickness direction of a substrate.Openings are disposed in an array on a substrate. Ultrasonic transducer elements are provi...
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JP5931127B2 |
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JP5927186B2 |
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JP2016100611A |
To provide a method of manufacturing a compact loudspeaker that can increase the magnetic flux density in a magnetic gap.In a method of manufacturing a compact loudspeaker, a first guide hole 51A is fitted to a first reference pin 61, an...
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JP2016096576A |
To reduce mechanical characteristic variation of an oscillation film of an electromechanical converting device.A manufacturing method of an electromechanical converting device of the invention, comprises: a step of forming an insulation ...
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JP5923849B2 |
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JP5921079B2 |
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JP2016092624A |
To enable achievement of an acoustic matching layer having high durability and reliability by preventing exfoliation of a coat and occurrence of crack or chip of a gel mold.An acoustic matching layer 10 comprises a gel mold 11 having a s...
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JP2016514438A |
How to make at least one electrode deposit on the basic member of an ultrasonic transducer according to some embodiments, The surface of a basic member is partially etched at least using the 1st etching agent, Copper is plated [exerting ...
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JP2016086441A |
To solve the problem of a conventional vibration film in which the vibration film is largely bent since a membrane with compression stress is used on a cavity side.An electromechanical conversion device of the present invention includes:...
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JP2016082321A |
To provide an electroacoustic transducer capable of controlling directional characteristics in a characteristic direction only by a speaker unit without inclining a mounting surface of a speaker and also mounting a retrofitted component ...
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JP2016513941A |
A method of manufacturing a small ultrasonic wave transducer includes receiving a wafer in which a plurality of small ultrasonic wave transducers were formed. A small ultrasonic wave transducer contains respectively a transducer membrane...
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JP2016082442A |
To provide a highly rigid vibrating plate excellent in waterproofness, and to provide a method of manufacturing the same.A vibrating plate 1 for speaker is formed by alternately laminating a solid layer 2 containing wood pulp and thermop...
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JP2016082447A |
To provide a dual electret sensor capable of efficiently capturing a change in the transmission rate of a sound due to hardness of a soft material, with no risk of impairing a measured sample, and to provide a method of manufacturing the...
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JP2016076980A |
To provide a transducer and a method of forming the transducer.The method comprises locating a feed wire for forming a drive pin 174 on a surface of a reed 166 at a wire contact point, welding a first end of the feed wire to the reed, cu...
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JP5914684B2 |
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JP2016072807A |
To eliminate leakage of contact portions between an insulation seat and a stationary electrode that is disposed oppositely to a diaphragm, in a capacitor microphone unit where an edge of the stationary electrode is supported by the insul...
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JP2016072661A |
To provide a structure which can suppress the warpage of a substrate on which a CMUT is formed without affecting a film structure optimized so as to maintain the characteristics of the CMUT and suppress the strain of a membrane, and a me...
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JP5911085B2 |
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JP5907553B2 |
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JP2016511607A |
Capacitive micro-processing ultrasonic wave transducer (CUMT) device 100 contains at least one CUMT cell 101 containing the 1st substrate 101 that has the top part side which contains the patterned dielectric layer on it, including thick...
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JP2016511582A |
The embodiment of the present invention decreases the capacitive cross talk between these arrays through the grounding part of a substrate by which the ultrasonic transformer juicer (MUT) array of micro processing is manufactured. In the...
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JP5901566B2 |
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JP2016049193A |
To provide a highly reliable thin ultrasonic device, a manufacturing method thereof, an ultrasonic probe equipped with the ultrasonic device, an ultrasonic measurement device, and electronic equipment.An ultrasonic device unit 130 as an ...
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JP5899346B2 |
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JP2016509493A |
According to the present invention, the manufacturing method of an ultrasonic transducer is provided. Piezo-electric polymer is mixed into the solution containing the 1st and 2nd chemical substances, and a viscous film is formed. In a ce...
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JP2016509777A |
The present invention provides a manufacturing method of an ultrasonic transducer. A substrate which has the 2nd side with the 1st and 1st opposite side is provided. A lower electrode is formed in the substrate 1st side. A piezoelectric ...
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JP5896665B2 |
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JP2016040798A |
To provide a piezoelectric material, having both high piezo-electric constant and specific band, capable of being stably produced, an ultrasonic transducer including the same, and an ultrasonic imaging apparatus.A piezoelectric material ...
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JP2016039512A |
To provide a technology which realizes a through wiring structure securing device performance, enabling reduction of the manufacturing costs, and having low resistance and high chemical resistance, and to provide an electrostatic capacit...
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JP2016039476A |
To provide a technique for achieving a structure capable of controlling the cell diameter of a capacitive transducer accurately, while suppressing a step between a connection and the vibrating membrane of a cell even when an inter-cell c...
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JP2016508052A |
This indication provides a method of separating a plurality of small ultrasonic wave transducers from a wafer. A method includes receiving a wafer in which a plurality of small ultrasonic wave transducers were formed. Each small ultrason...
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