| Document |
Document Title |
|
JP5949599B2 |
A method for producing a composite piezoelectric body includes: forming a composite piezoelectric body by filling a non-conductive polymer between a plurality of piezoelectric materials arranged in an array state at predetermined interva...
|
|
JP5931127B2 |
A piezoelectric ceramic speaker includes a piezoelectric element using a vibration sheet formed with piezoelectric ceramic having a primary phase constituted by ceramic grains of perovskite crystal structure containing Pb, Nb, Zn, Ti, an...
|
|
JP5927186B2 |
A transducer and method of forming a transducer is disclosed. The method comprises locating a feed wire for forming a drive pin on a reed surface, welding a first end of the feed wire to the reed, cutting the feed wire to form a drive pi...
|
|
JP2016100611A |
To provide a method of manufacturing a compact loudspeaker that can increase the magnetic flux density in a magnetic gap.In a method of manufacturing a compact loudspeaker, a first guide hole 51A is fitted to a first reference pin 61, an...
|
|
JP5923849B2 |
To provide an oscillator which uses a piezoelectric element and has a novel structure.A support member 40 has an opening 42. A piezoelectric film 22 is in close contact with an inner peripheral surface of the opening 42 and is constitute...
|
|
JP5921079B2 |
An electromechanical transducer includes a substrate, a first electrode disposed on the substrate, and a vibration film including a membrane disposed on the first electrode with a space therebetween and a second electrode disposed on the...
|
|
JP2016092624A |
To enable achievement of an acoustic matching layer having high durability and reliability by preventing exfoliation of a coat and occurrence of crack or chip of a gel mold.An acoustic matching layer 10 comprises a gel mold 11 having a s...
|
|
JP2016082321A |
To provide an electroacoustic transducer capable of controlling directional characteristics in a characteristic direction only by a speaker unit without inclining a mounting surface of a speaker and also mounting a retrofitted component ...
|
|
JP5914684B2 |
A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. The MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture ...
|
|
JP5911085B2 |
To make a vibration member of an oscillation device thinner.A vibration member 10 is deposited on a base material 100 by using, for instance, a sputtering method. Then a first electrode layer 26 is deposited on the vibration member 10 by...
|
|
JP5907553B2 |
|
|
JP5901566B2 |
A transducer includes at least one element (14) including a plurality of cells (12). Each of the cells includes a pair of electrodes (1, 2) disposed with a gap (3) therebetween and a vibrating membrane (9) including one of the electrodes...
|
|
JP5899346B2 |
A balanced armature motor assembly has a circuit board mounted to a bobbin. A first end of a wire coil is secured to a first terminal on the circuit board and passes through a first cutout of the bobbin. A second end of the wire coil is ...
|
|
JP2016509493A |
According to the present invention, a method for manufacturing an ultrasonic transducer is provided. The piezoelectric polymer is mixed into a solution containing the first and second chemicals to form a viscous film. In some embodiments...
|
|
JP2016509777A |
The present invention provides a method for manufacturing an ultrasonic transducer. A substrate having a first side and a second side opposite to the first side is provided. A lower electrode is formed on the first side of the base mater...
|
|
JP5896665B2 |
Provided is a method of manufacturing an electromechanical transducer having a reduced variation in a breakdown strength caused by a variation in flatness of an insulating layer. In the method of manufacturing the electromechanical trans...
|
|
JP2016039512A |
To provide a technology which realizes a through wiring structure securing device performance, enabling reduction of the manufacturing costs, and having low resistance and high chemical resistance, and to provide an electrostatic capacit...
|
|
JP2016039476A |
To provide a technique for achieving a structure capable of controlling the cell diameter of a capacitive transducer accurately, while suppressing a step between a connection and the vibrating membrane of a cell even when an inter-cell c...
|
|
JP2016508052A |
The present disclosure provides a method of separating a plurality of small ultrasonic transducers from a wafer. The method comprises receiving a wafer on which a plurality of small ultrasonic transducers are formed. Each small ultrasoni...
|
|
JP5881582B2 |
By successively depositing the layers of a backing material (1), an inorganic piezoelectric element layer (91a), a sound-adjustment layer (94), an organic layer (95), and an electrical conductive layer (96), and dicing at any pitch in th...
|
|
JP5881127B2 |
|
|
JP5877907B2 |
A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.
|
|
JP5878930B2 |
The invention relates to location determination apparatus for determining a location of a first object (2) like a catheter within a second object (3) being, for example, the heart of a person. The first object comprises a first ultrasoun...
|
|
JP2016030037A |
To provide a method of easily manufacturing an ultrasonic probe.An ultrasonic probe comprises: a plurality of ultrasonic vibrators 21; a wiring section 25; and a back load material 24. The wiring section includes a portion arranged on th...
|
|
JP5876500B2 |
A method is provided for forming a piezoelectric ultrasonic transducer apparatus having a first electrode deposited on a dielectric layer disposed on a primary substrate. A piezoelectric material is deposited between the first electrode ...
|
|
JP5876200B1 |
To improve production efficiency. A multifunction device used for assembling and testing wire control headphones includes an operation platform, and a wire control arrangement area and a wiring groove are provided on an upper surface of ...
|
|
JP5875243B2 |
A method of producing an electromechanical transducer (2) includes forming an insulating film on a first electrode (13), forming a sacrificial layer on the insulating film, forming a first membrane (16) on the sacrificial layer, forming ...
|
|
JP5875244B2 |
An electromechanical transducer includes a first electrode (13); a silicon oxide film disposed on the first electrode (13); and a vibration film including a silicon nitride film disposed on the silicon oxide film with a space therebetwee...
|
|
JP5864246B2 |
|
|
JP5863402B2 |
|
|
JP5859049B2 |
|
|
JPWO2013190852A1 |
It is an acoustic matching member composed of dried gel particles (8) and bonded particles (10). The dried gel particles have fine pores (7) inside and maintain interparticle voids between the dried gel particles. , The bound particles e...
|
|
JP2016018835A |
To provide a piezoelectric thin film with excellent characteristics and a method for manufacturing the same.An ultrasonic probe comprises an element chip. The element chip comprises a flexible film, a lower electrode provided on the flex...
|
|
JP2016007681A |
To provide an MEMS element of which a capacity of a buck chamber can be increased without an additional manufacturing process.In an MEMS element, a buck chamber 11, in which a substrate is so removed that a movable electrode 3 is exposed...
|
|
JP5836727B2 |
A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surf...
|
|
JP5828627B2 |
A probe (100) for an ultrasonic diagnostic apparatus and a method of manufacturing the same are disclosed. The probe (100) includes a sound matching layer (130) having a mounting groove (135), a piezoelectric member (120) mounted on the ...
|
|
JP5825634B2 |
|
|
JP5825899B2 |
The sensor has a rectangular deformable cavity (20) for receiving variations of pressure of ambient atmosphere, where the cavity is formed in a flat layer or a flat substrate. The deformable cavity comprises a movable or deformable wall ...
|
|
JP5828049B2 |
The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is encl...
|
|
JP2015213224A |
To provide a technology for suppressing damage on a through electrode even in a manufacturing method employing sacrificial layer etching in a capacitive transducer to be manufactured on a through electrode substrate.The manufacturing met...
|
|
JP5812625B2 |
Provided is a method of manufacturing a capacitive electromechanical transducer using fusion bonding, which is capable of reducing fluctuations in initial deformation among diaphragms caused at positions having different boundary conditi...
|
|
JP5812660B2 |
|
|
JP5815629B2 |
In an ear tip and a method of manufacturing the same, the ear tip includes a sound transfer part including a hollow shaft and an external sheet and an acoustic absorbent making contact with the external sheet and the hollow shaft. The ho...
|
|
JP2015204544A |
To provide a small and highly reliable MEMS element capable of high frequency operation, in which variation of operation frequency is reduced.A MEMS element 1000 has a cavity 108 formed in a substrate 100, a diaphragm 101 provided above ...
|
|
JP5807226B2 |
|
|
JP2015192415A |
To provide a diaphragm capable of suppressing increase in weight and improving designability, a manufacturing method of the diaphragm, and a speaker device.A second layer L2 is formed between a third layer L3 and a first layer L1, such t...
|
|
JP5802448B2 |
|
|
JP2015186157A |
To provide an electrostatic capacity type transducer capable of reducing a level difference of wiring between cells of the electrostatic capacity type transducer and improving performance, and to provide a manufacturing method of the ele...
|
|
JP5796551B2 |
|
|
JP2015177382A |
To provide a device capable of disposing an element and a through-wiring portion even with a high density.A manufacturing method of a device 12 in which an electrode of an element 3 is electrically connected with through-wiring within a ...
|
