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Matches 351 - 400 out of 4,976

Document Document Title
WO/2016/169284A1
Disclosed are a silica gel diaphragm, a speaker module, and a method for reprocessing a silica gel diaphragm. Two symmetrical wire grooves are etched on a surface of the silica gel diaphragm via laser etching technology, a conductive met...  
WO/2016/169283A1
Disclosed are a silica gel diaphragm, a receiver module, and a method for processing a silica gel diaphragm. Two metal pieces are integrally injection moulded and formed on the silica gel diaphragm, the two metal pieces are symmetrically...  
WO/2016/169248A1
Disclosed is a diaphragm composite layer. The diaphragm composite layer comprises a plurality of carrier layers, and a foam adhesive is arranged between two adjacent carrier layers. Also disclosed is a manufacturing method for the diaphr...  
WO/2016/165377A1
Disclosed are a method for reprocessing a diaphragm, a diaphragm, and a receiver. The diaphragm comprises a planar portion located at the centre, a folding ring portion arranged on the edge of the planar portion, and a fixing portion con...  
WO/2016/165376A1
Disclosed are a method for preparing a silica gel diaphragm, and a silica gel diaphragm. The method comprises: using two substrate layers and a liquid silica gel to form a composite material strip via calendering means, the liquid silica...  
WO/2016/167639A1
A frameless audio transducer for mobile applications is provided. The invention relates to an audio transducer realized as speaker to transduce an electrical audio signal into acoustic sound or realized as receiver to transduce an acoust...  
WO/2016/161670A1
Disclosed are an MEMS silicon microphone and a manufacturing method therefor. By arranging a single crystal silicon vibrating diaphragm (2) above a multi-hole back plate silicon substrate (1), and separating same by a silicon dioxide lay...  
WO/2016/155528A1
A method for a terminal to detect a headset status, and the terminal. A processor closes a passage for performing an audio signal output on a second headset, detects electrical signals of a first audio output end and a third audio output...  
WO/2016/157828A1
Provided are a highly reliable probe including a light reflecting layer, which is resistant to the falling off of the light reflecting layer, and an information obtaining apparatus using the same. The probe includes: an element including...  
WO/2016/121765A1
The present invention provides: a highly productive electroacoustic conversion film with which it is possible to appropriately convert vibration and voltage without causing air breakdown between upper and lower thin-film electrodes even ...  
WO/2016/118341A1
System and method for audio transducer stabilization comprising providing a sound generation panel for transmission of audio sound waves in response to a plurality of force inputs received from three or more audio transducers, providing ...  
WO/2016/118351A1
Acoustic emission (AE) microelectromechanical system (MEMS) transducers of the present disclosure utilize a spring-mass system and a capacitance-change transduction principle. The transducers include a dielectric layer between a fixed el...  
WO/2016/114173A1
Provided is a method for manufacturing a piezoelectric device comprising a substrate (4), and a vibrating part supported directly or indirectly by the substrate (4) and having a membrane shape or beam shape arranged to the upper side of ...  
WO/2016/109924A1
The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and ...  
WO/2016/102924A1
A MEMS transducer package (1) is provide having a semiconductor die portion (3) with a thickness bounded by a first surface (9) and an opposite second surface (11). The package further has a transducer element (13) incorporated in the se...  
WO/2016/102923A1
A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) a...  
WO/2016/104820A1
An ultrasonic transducer having a flexible printed circuit board with a thick metal layer and a manufacturing method thereof are disclosed. The ultrasonic transducer, according to an embodiment of the present invention, comprises: an act...  
WO/2016/102925A1
A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) a...  
WO/2016/102922A1
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die th...  
WO/2016/029357A9
Providing a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate (1) to obtain an insulating layer (2) thereon and provi...  
WO/2016/053745A1
A piezoelectric microphone and/or a piezoelectric microphone system is presented herein. In an implementation, a piezoelectric microphone includes a microelectromechanical systems (MEMS) layer and a complementary metal-oxide-semiconducto...  
WO/2016/047186A1
Provided are a structure and a method for making the same, said structure being capable of suppressing the bow of a board on which a CMUT has been formed without affecting a film arrangement that has been optimized so as to maintain the ...  
WO/2016/046412A1
The invention relates to an electrodynamic sound transducer comprising a chassis (400, 1400) and at least one vibrating membrane (100, 1100), which comprises, on the edge thereof (1101), at least two securing sections (1101) which are op...  
WO/2016/021244A1
The present invention is provided with a sheet having: a first oscillator (34); a first oscillator region (38); a columnar section (37); and a film section that connects, in the disposition direction (C), a plurality of first upper elect...  
WO/2016/018624A1
A back plate for use in a microphone includes a first layer; a second layer; and a metal layer disposed between the first layer and the second layer. A first compression of the back plate provided by cooling of the first layer and the se...  
WO/2016/018563A1
This disclosure provides systems, methods and apparatus including microelectromechanical system microphones. In one aspect, the systems include a substrate made of a low dielectric material, such as glass. A layer of semiconductor materi...  
WO/2016/006671A1
An ultrasonic sensor provided with: a substrate having at least one opening part 18; a diaphragm 50 provided on the substrate so as to close up the opening part 18; a plurality of first electrodes 14 provided on a side of the diaphragm 5...  
WO/2016/002206A1
Provided is an ultrasonic sensor which achieves a reduction in impedance without deteriorating the characteristics of elements and an improvement in reliability by efficiently drawing out a wire from the elements arranged in an array. An...  
WO/2015/197262A1
The invention relates to improved microphones and methods for the production thereof, said microphones being characterized by sacrificial layers displaying locally different etching rates.  
WO/2015/197382A1
The present application relates to a transducer element (1) comprising: a movable membrane (2, 2a, 2b) that has a border (4); a frame (5), to which the border (4) of the membrane (2, 2a, 2b) is fastened; and a reinforcement element (10) ...  
WO/2015/197105A1
The present invention concerns a microphone (1) which comprises a substrate (7), a transducer element (2) defining a front volume (5), a lid (10) arranged such that the transducer element (2) is arranged between the substrate (7) and the...  
WO/2015/194602A1
Provided are: a carbonaceous acoustic matching layer which exhibits satisfactory mechanical strength, in which losses at a layer interface are suppressed as far as possible and in which the degree of variation in acoustic impedance in th...  
WO/2015/190429A1
This piezoelectric device is provided, on a substrate (11), with a support layer (14), a lower electrode (15), a piezoelectric film (16) and an upper electrode (17) in this order. The substrate (11) is provided with a first opening (23) ...  
WO/2015/178760A1
The present invention provides a method for fabrication of an electrodynamics microelectromechanical systems (MEMS) micro speaker (100). Accordingly, the method includes: a) forming a first silicon wafer, i.e. wafer 1 (200), having a mov...  
WO/2015/172789A1
The invention relates to a cap (1) for an electro-acoustic transducer (2), which cap (1) comprises a first portion (3) having a form matching in shape and dimensions at least a top part of a magnetic center pole piece (4) of the transduc...  
WO/2015/169600A1
The invention relates to a microphone (1) having a substrate (8), a spring element (14), a conversion element (2) and a cover (25). The spring element (14) is plastically elongated in a direction perpendicular to the substrate (8). The c...  
WO/2015/161940A1
For a microphone having increased rear volume, a cavity housing is proposed that comprises at least one base plate and a cover that define and enclose the cavity. Mounted on the base plate is a microphone transducer, usually an MEMS comp...  
WO/2015/159427A1
Provided are: a structure whereby an increase of a drive voltage in a capacitive ultrasonic transducer can be suppressed, and an ultrasonic transmission sound pressure of a CMUT can be increased; and a method for manufacturing the struct...  
WO/2015/152044A1
Provided are an ultrasonic vibrator which enables the adjustment of a resonance frequency and the prevention of output leakage of ultrasonic vibration, and a manufacturing method therefor. In a cylindrical casing (5), at least part of a ...  
WO/2015/140962A1
[Solution] A vibration plate for a speaker device comprises a sound emission side surface. The sound emission side surface is formed by use of a base material containing fibrous material, and a filler mixed into the base material. The fi...  
WO/2015/124437A1
Disclosed is a loudspeaker comprising a loudspeaker frame (100) and a magnet (200) to which the loudspeaker frame (100) is attached, characterized in that the magnet (200) has a conical outer surface (210), the loudspeaker frame (100) ha...  
WO/2015/119626A1
Techniques described herein generally include methods and systems related to a MEMS-based audio speaker system that includes a first movable element, formed from a first layer of a semiconductor substrate, and a second movable element, f...  
WO/2015/115680A1
Disclosed are: a transducer which is provided with multiple types of arrays, and which is capable of integrating the multiple types of arrays into the single transducer; a method for manufacturing same; and an ultrasonic probe which comp...  
WO/2015/112459A1
A loudspeaker suspension comprises a body formed of a weave fabric. The body has an outer region and a central region. A warp region extends substantially from the central region to the outer region. A weft region orthogonal to the warp ...  
WO/2015/111621A1
This stacked ultrasonic vibration device (2) is provided with: a stacked piezoelectric body unit (75) in which a plurality of piezoelectric bodies (61) and a plurality of electrode layers (62, 63) are stacked and integrated; a first bond...  
WO/2015/085789A1
The present invention relates to the technical field of electroacoustics. Provided are a speaker module and a manufacturing method therefor. The speaker module comprises a housing and a speaker unit body joined within the housing. The sp...  
WO/2015/088874A1
An acoustic device comprises a substrate and a housing that affixes to the substrate via an affixment material to thereby encapsulate at least one acoustic transducer such as a microphone. By one approach the housing comprises brass but ...  
WO/2015/085697A1
A loudspeaker diaphragm, comprising a domed part located in the central position and a corrugated rim part located on the edge; the domed part and/or the corrugated rim part comprise silk cloth and thermoplastic polyurethane combined wit...  
WO/2015/077593A1
Disclosed is a 2D Matrix Array Backing Interconnect Assembly that provides a structure that enables simple construction of complex wring for an ultrasonic transducer array of desired dimension. A backing interconnect assembly can be prod...  
WO/2015/072616A1
Disclosed is a method for manufacturing a microphone package. The method for manufacturing a microphone package according to the present invention comprises the steps of: preparing a substrate having an upper surface on which a mounting ...  

Matches 351 - 400 out of 4,976