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Matches 51 - 100 out of 127,867

Document Document Title
WO/2024/051235A1
Disclosed in the present invention is a manufacturing method for a planar transformer. The method comprises the following steps: manufacturing a first circuit board including a first circuit, and a second circuit board including a second...  
WO/2024/048283A1
This method for manufacturing a magnetic board, which comprises a magnetic layer and a conductor layer formed on a surface of the magnetic layer, includes a step (EP) of forming the conductor layer on the surface of the magnetic layer by...  
WO/2024/044853A1
Capacitive micromachined ultrasonic transducers (CMUTs) may be fabricated on pre- fabricated and interconnected substrates, such as printed circuit boards (PCBs). The PCBs may be rigid or flexible. The substrate may also be a ceramic. Th...  
WO/2024/046064A1
The present disclosure relates to a flexible circuit board, comprising a first region extending in a first direction; in the first direction, the first region comprises a binding area and a wiring area which are adjacently arranged; in a...  
WO/2024/048628A1
This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 1...  
WO/2024/046033A1
A signal transmission structure (100) and a manufacturing method therefor. The signal transmission structure (100) comprises a first device (10), a second device (20), and a first grounding portion (30). The first device (10) and the sec...  
WO/2024/047751A1
This electronic component support structure is a support structure for supporting an electronic component provided on a substrate, and is provided with a cover member that covers the electronic component. The cover member is an integral ...  
WO/2024/048216A1
This wiring board (10) comprises a substrate part (11) and a conductor part (12). The substrate part (11) comprises a conductor layer (20) that has a wiring pattern (first wiring pattern (21)) and an insulation layer (30) that has an ins...  
WO/2024/048728A1
Provided are: a film including a layer A and a layer B on at least one surface of the layer A, having a dielectric loss tangent of 0.01 or less, and having a surface free energy of 30 mJ/m2 or less on the surface of the layer B opposite ...  
WO/2024/048206A1
One embodiment of the present disclosure provides a method for producing a laminated substrate, the method including: laminating a metal plate, a semicured-resin-impregnated plate, and an electroconductive plate in the stated order; heat...  
WO/2024/049100A1
This embodiment comprises: a fixture unit including a second circuit board; a moving unit including a first circuit board disposed on the second circuit board and an image sensor electrically connected to the first circuit board; and a s...  
WO/2024/044984A1
Provided are a circuit board module and an electronic device. The circuit board module comprises: a bottom plate; and one or more chip modules located on the bottom plate and connected to the bottom plate. Each chip module comprises: an ...  
WO/2024/048444A1
A coating agent which comprises an acid-modified polyolefin resin (A), an epoxy compound (B), and an aqueous medium, and is characterized in that the acid-modified polyolefin resin (A) contains 0.1-10 mass% unsaturated carboxylic acid co...  
WO/2024/045735A1
Embodiments of the present application provide a computing node and a computing apparatus. The computing node comprises a mainboard and a current conducting structure, and an electronic device is mounted on a first surface of the mainboa...  
WO/2024/048921A1
An electronic device is disclosed. An electronic device (100) according to one embodiment of the present disclosure may comprise: a display (150); a housing (310) including a transparent front side plate (111) through which the display (...  
WO/2024/049027A1
A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper f...  
WO/2024/047872A1
The present invention discloses a method for manufacturing an electronic component, the method comprising: preparing an intermediate structure comprising a substrate having a first main surface and a second main surface on the rear side ...  
WO/2024/049999A1
A printed circuit board having an electrically insulative layer and a conductive solder pad. The conductive solder pad is disposed at least partially over the electrically insulative layer, and defines a solder contact area. The solder c...  
WO/2024/048317A1
The present invention addresses a first problem of providing a photosensitive composition from which it is possible to form a pattern having a low relative permittivity and excellent resolution. The present invention addresses a second p...  
WO/2024/048348A1
The present invention provides a film that has a layer A having a thermal expansion coefficient of 30 to 70 ppm/K and a void percentage of 20 to 60 vol%. Also provided is a layered body that uses this film.  
WO/2024/045574A1
The present invention relates to a printed circuit board having a pad and a communication device. The printed circuit board comprises: a signal layer and a reference layer, wherein the signal layer is provided with a pad, and the pad com...  
WO/2024/049183A1
The present invention relates to a method for producing a ceramic substrate. The ceramic substrate can be used in high-output power modules due to the 0.3-0.8mm thickness of the upper and lower metal layers that adhere to the upper and l...  
WO/2024/045975A1
An electronic device, a printed circuit board, and a printed circuit board preparation method. The printed circuit board comprises a layer structure body, a transmission line (1), which is used for transmitting a signal, and at least two...  
WO/2024/048729A1
The present invention provides a film comprising a layer A and a layer B on at least one side of the layer A. The dielectric loss tangent is less than or equal to 0.01 and the density of recessed portions having a depth of 0.5 μm or mor...  
WO/2024/044925A1
A system with an image sensor including: M metal layers (i) and M radiation detectors (i), i=1, …, M. M is an integer greater than 1. The radiation detector (i) includes a radiation absorption layer (i) and IC chips (i, j), j=1, …, N...  
WO/2024/049032A1
An electronic device according to an embodiment may comprise: a first housing; a second housing which is coupled to the first housing to be slidable with respect to the first housing; a display including a second area which is exposed to...  
WO/2024/045803A1
Provided in the embodiments of the present disclosure are a printed circuit board, an electronic device, and a method for controlling the propagation delay skew of a differential pair. The printed circuit board comprises a board body, wh...  
WO/2024/045977A1
A printed circuit board, comprising a layered structure body (1) and transmission lines (2) for transmitting signals. The transmission lines (2) are located in the layered structure body (1). The layered structure body (1) comprises a fi...  
WO/2024/041995A1
Ultra-low loss curable hydrocarbon resin compositions comprising vinylbenzyl compounds, a method for the preparation thereof and their use for the manufacture of articles which find application in the electric/electronic industries.  
WO/2024/043595A1
A flexible circuit board according to an embodiment comprises: a base material having a first surface and a second surface opposite the first surface; a circuit pattern disposed on the first surface of the base material; and a protective...  
WO/2024/043693A1
A circuit board according to the present invention comprises: an insulating layer; and a circuit layer which is arranged on the insulating layer, and which comprises a lower surface in contact with the insulating layer and an upper surfa...  
WO/2024/043976A1
In various aspects, the disclosure relates to methods of adhering a liquid metal composite to a substrate. The method can include applying a pretreatment to a surface of the substrate to form an activated surface. In some aspects, the pr...  
WO/2024/042449A1
One or more systems, devices, and/or methods of use provided herein relate to signal filters for scalable quantum computing architectures. According to one embodiment, a device can comprise a circuit board comprising a plurality of layer...  
WO/2024/043695A1
A circuit board according to an embodiment comprises: a first insulating layer; and a first circuit pattern layer comprising a pad disposed on the first insulating layer, wherein the pad comprises a first metal layer at least partially e...  
WO/2024/043977A1
Vertical launch impedance matched through-hole vias to ensure proper impedance matching is maintained after a printed circuit board connector is attached to a printed circuit board. A conductive via having a center aperture and a via bod...  
WO/2024/043083A1
One aspect of the present invention is a resin composition comprising: a preliminary reaction product (A) obtained by preliminarily reacting a mixture that includes a polyphenylene ether compound (a1) and a carbodiimide compound (a2), th...  
WO/2024/043572A1
This display device comprises: a light emitting element disposed in a display region on a substrate; a pad part disposed in a pad region on the substrate and including a plurality of output pads; a driving chip; and a control signal wire...  
WO/2024/043084A1
An aspect of the present invention relates to a resin composition comprising: a polyphenylene ether compound (A); a reactive compound (B) having an unsaturated double bond in the molecule; and at least one additive (C) selected from the ...  
WO/2024/043664A2  
WO/2024/040725A1
A backlight module (B) and a display device. The backlight module (B) comprises an outer frame unit (2), a light guide plate (4) disposed in the outer frame unit (2), a light-emitting unit (5), a plurality of fixing adhesives (6) for fix...  
WO/2024/041303A1
A circuit board and an electronic device, for solving the problem that molten solder is prone to flowing into a via hole (102). The circuit board comprises a substrate (100); the substrate (100) comprises a first plane and a second plane...  
WO/2024/043418A1
Disclosed are an IC type jumper package which can greatly increase the freedom of wiring design even when using a single-sided printed circuit board, and a printed circuit board having same. The jumper package comprises one or more condu...  
WO/2024/043222A1
This photosensitive surface treatment agent contains a compound represented by formula (M1). In formula (M1), R1 represents a linear, branched, or cyclic alkyl group having 1-6 carbon atoms, and Y1 represents a single bond or a linear or...  
WO/2024/041382A1
The present disclosure relates to a display module, which comprises a display panel and a flexible circuit board bound and connected to the display panel. The display panel comprises a display area, a binding area and a bendable area loc...  
WO/2024/043476A1
An electronic device according to one embodiment controls both a first conductive pattern and a second conductive pattern in a first time period indicated by a control signal transmitted from an external electronic device that differs fr...  
WO/2024/036770A1
A semiconductor package substrate (300), a manufacturing method for the semiconductor package substrate (300), and a semiconductor package structure (1300). The semiconductor package substrate (300) comprises: a substrate (310); and a go...  
WO/2024/039208A1
An electronic device according to various embodiments of the present disclosure may comprise: a housing; a first printed circuit board arranged in the housing; a second printed circuit board arranged in the housing; a battery arranged be...  
WO/2024/038761A1
The purpose of the present invention is to provide a cured product having excellent impact resistance. A cured product according to one mode of the present invention is obtained by curing a curable composition containing a (meth)acrylic ...  
WO/2024/037499A1
A circuit board assembly and a manufacturing method therefor. The circuit board assembly comprises: a substrate (10), the substrate (10) comprising a plurality of layers of daughter boards (11) which are stacked, a first conductive layer...  
WO/2024/039041A1
An electronic device, according to one embodiment of the present disclosure, may comprise: a first support member having a flat plate shape; a first circuit board disposed on one surface of the first support member; a fixing member dispo...  

Matches 51 - 100 out of 127,867