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WO/2018/130591A2 |
A solderless joint arrangement comprising a receptacle of a PCB arranged to receive a conductive compliant pin, the receptacle comprising a conductive portion for contact with the compliant pin wherein the receptacle is positioned on a f...
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WO/2018/131285A1 |
Provided is a method for producing a flexible printed board, which comprises a step for forming a via hole in a short time without any remaining smear. Specifically, a method for producing a flexible printed board according to the presen...
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WO/2018/130229A1 |
Disclosed are a printed circuit board and a method for preparing the printed circuit board, wherein the printed circuit board comprises a circuit board body comprising a plurality of sub-boards arranged one on another, wherein a first su...
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WO/2018/131799A1 |
According to an embodiment of the present disclosure, an electronic device may comprise a light source configured to emit light and a display panel configured to output an image, wherein the display panel may include a pixel layer includ...
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WO/2018/131189A1 |
A wiring board (1) is provided with: an image pickup element (3) that is provided on one surface of a substrate (2); a reinforcing plate (4) that is provided at a position overlapping the image pickup element (3) by having the substrate ...
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WO/2018/131570A1 |
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a ...
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WO/2018/131960A1 |
The present invention relates to a technology for fabricating a three-dimensional electroformed object or circuit, a flexible circuit board, a mesh, a filter, a three-dimensional MEMS component, a three-dimensional circuit, a three-dimen...
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WO/2018/129944A1 |
A PCB and a signal transmission system. In the PCB, at least two signal layers and at least two reference layers (103) are distributed at intervals; a first connecting terminal (1011) of a connecting module (101) is connected with at lea...
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WO/2018/131569A1 |
Provided is an epoxy resin composition having excellent electrical characteristics (especially a low dielectric loss tangent) and being capable of achieving high adhesion to metal.　Specifically, an epoxy resin composition containing an...
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WO/2018/131390A1 |
This printed wiring board with a built-in thick conductor is provided with a printed wiring board, an insulating resin layer, an insulating base material layer and a conductor layer. The printed wiring board comprises: an insulating laye...
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WO/2018/131571A1 |
Provided is an epoxy resin composition having excellent adhesion and low dielectric properties. Specifically, an epoxy resin composition is provided that contains an acid-modified polyolefin resin and an epoxy resin having a specific str...
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WO/2018/130156A1 |
A windowed circuit board device and manufacturing method therefor, and a circuit board device embedding a mounted element and manufacturing method therefor. The windowed circuit board device comprises a circuit board part (10, 40) and a ...
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WO/2018/131583A1 |
A metal-ceramic bonded substrate (1) has a heat dissipating surface (4a) formed into a spherical convex shape, thus allowing for high contact pressure with heat conductive grease when attaching heat radiating fins onto the heat dissipati...
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WO/2018/131374A1 |
The present invention relates to a printed circuit board embedding a power die wherein interconnections between the power die and the printed circuit board are composed of micro/nano wires, the printed circuit board comprising a cavity w...
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WO/2018/130550A1 |
The invention relates to a method for producing a vehicle component (1) having an electrical conductive structure (3) arranged thereon which extends at least between a first electrical contact point (4) for feeding an electric current an...
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WO/2018/128037A1 |
A manufacturing method for a printed wiring board according to one aspect of the present invention includes a step for forming a resist pattern, and a step for forming a conductive pattern by using the resist pattern. The resist pattern ...
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WO/2018/128045A1 |
Provided is a multilayer substrate that has high connection reliability of interlayer connection conductors and that can save space while reducing the bending stress applied to an interlayer connection conductor when a bending force is e...
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WO/2018/129156A1 |
An apparatus comprises a multi-layer printed circuit board (PCB) including a plurality of board layers arranged between a top surface of the PCB and a bottom surface of the PCB; and a surface wave launcher for a single-wire transmission ...
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WO/2018/129169A1 |
A stand-alone assay system for POC IVD that is fast, easy to use, inexpensive and delivers laboratory quality results for one or more target analytes from a small volume of unprocessed aqueous sample is disclosed. The stand-alone assay s...
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WO/2018/128082A1 |
A flexible printed wiring board according to one aspect of the present invention is a flexible printed wiring board provided with: a base film having insulation properties; and a conductive pattern that is laminated on at least one surfa...
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WO/2018/128157A1 |
An electronic device (401), provided with a circuit substrate (301), a first element (101), and a second element (201). The first element (101) has a first connection part (CN1) having a concave part, and first connection part-side elect...
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WO/2018/128120A1 |
Provided is an electronic device comprising a substrate (20) and a connector (10) disposed on one side forming the outer circumference of the substrate (20). A slit (21) is formed in the substrate (20) with the starting point of the slit...
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WO/2018/127660A1 |
The invention concerns a three-dimensional electrical module (1), comprising: - first and second parallel substrates (11, 12), each of said first and second substrates having an electrical contact (111, 121) orientated towards the other ...
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WO/2018/125603A1 |
Printed circuit boards (100) include conductive metallic paths, such as vias (110, 112, 114), traces (116), and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit...
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WO/2018/124158A1 |
A prepreg according to the present invention includes a thermosetting resin, a filler, and a substrate in order to provide a prepreg, a laminated board, a metal-foil-clad laminated board, a printed wiring board, and a multilayer printed ...
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WO/2018/123480A1 |
Provided are a heat dissipation board, a heat dissipation circuit structure, and a method for manufacturing the same, in which stable adhesion can be ensured while reducing cost. A heat dissipation board according to the present inventio...
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WO/2018/123459A1 |
A multilayer substrate (101), provided with: a first base material (B1) obtained by laminating insulating base material layers (11, 12, 13); a second base material (B2) laminated on the first base material (B1) so as to straddle a step p...
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WO/2018/124161A1 |
The resin composition according to the present invention contains :an allylphenol compound (A); a maleimide compound (B); a cyanate ester compound (C); and/or an epoxy compound (D), in order to provide a printed wiring board resin compos...
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WO/2018/123974A1 |
This wiring body 40 is provided with: a second resin part 70; a first conductor part 60 that is provided on one surface of the second resin part and comprises a first electrode part 61; and a second conductor part 80 that is provided on ...
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WO/2018/123414A1 |
An interposer substrate (10), provided with an elementary body (20), external connection conductors (31, 32, 33), and wiring conductors (340, 350). The elementary body (20) has a first main surface (201), a second main surface (202), and...
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WO/2018/120590A1 |
The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000;...
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WO/2018/122745A1 |
Conductive articles include an electrically insulating substrate with conductive regions on the substrate, the conductive regions are conductive patterns of a transparent conductor and a resist matrix. The substrate also has non-conducti...
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WO/2018/123732A1 |
Disclosed is a wiring board 100 which comprises a stretchable resin layer 10, a conductor foil 20 that is arranged on the stretchable resin layer 10 and forms a wiring pattern; and a via hole 30 that is formed in the stretchable resin la...
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WO/2018/122971A1 |
The present invention pertains to an electroconductive paste containing: high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at t...
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WO/2018/125446A1 |
A microelectronic device system and a method of forming a microelectronic device are described. The microelectronic device includes a flex printed circuit board (PCB) having two or more electrical sub-systems that are electrically couple...
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WO/2018/123584A1 |
A circuit structure 20 is provided with: a bus bar substrate 30 that includes a bus bar 31 and a resin part 35 in close contact with the bus bar 31; press-fit members 50A, 50B which are made of a metal thicker in the thickness dimension ...
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WO/2018/122824A1 |
Cortical stimulating and recording electrode comprising a flexible support element for at least one conductive element, which flexible support element has a head end (11) and a tail end (13). The conductive element has at least one head ...
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WO/2018/125679A1 |
An electronic circuit including a substrate having a first dielectric characteristic. The substrate can include a first side and a second side. An intermediary material can be disposed within the substrate. For instance, the intermediary...
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WO/2018/120614A1 |
Provided in the present invention are a phosphorus-containing active ester and a halogen-free resin composition thereof, as well as a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) a thermosettin...
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WO/2018/120488A1 |
A pre-impregnated material used for a circuit substrate. The pre-impregnated material comprises a pre-impregnated core material layer and an outer resin layer formed on at least one side of the pre-impregnated core material layer; the pr...
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WO/2018/125527A1 |
A structure can include a first element and a carrier bonded to the first element along an interface. A waveguide can be defined at least in part along the interface between the first element and the carrier. The waveguide can comprise a...
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WO/2018/120141A1 |
Disclosed is a circuit board structure (10), comprising a base layer (12), and a first line layer (14), a second line layer (16) and an insulating layer (18) arranged on the base layer (12). The first line layer (14) comprises a pluralit...
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WO/2018/123557A1 |
A circuit construction 1 is provided with a bus bar group 31 comprising a plurality of bus bars 31A, 31B, 31C that are laterally arranged, a circuit substrate 20 disposed over the bus bar group 31, and an electronic component 50 connecte...
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WO/2018/124288A1 |
This power supply device (100-1) is provided with: a substrate (20) on which an electric component (25) is mounted; a chassis (10) which has a chassis surface (11) that faces one surface (20a) of the substrate (20); and an insulating fat...
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WO/2018/124169A1 |
In order to provide: a resin composition having a high glass transition temperature (high Tg) or not having a distinct glass transition temperature (Tg less), and being capable of sufficiently suppressing the warpage (achieving low-warpa...
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WO/2018/124164A1 |
In order to provide a resin composition having a high glass transition temperature (high Tg) or not having a definite glass transition temperature (Tg-less), whereby warping can be adequately reduced (low warping can be achieved) in a pr...
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WO/2018/124004A1 |
An electronic device (101) comprises: a circuit board (5), a first element (1) and a second element (2) which are surface mounted on the circuit board (5), and a third element (3) that is mounted so as to straddle the first element (1) a...
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WO/2018/123818A1 |
Disclosed is a stretchable member with a metal foil, which comprises a stretchable resin substrate and a conductive metal foil that is disposed on the stretchable resin substrate. The stretchable resin substrate-side surface of the metal...
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WO/2018/120449A1 |
A welding end structure (100) and a component (02). A problem in the existing technology is solved, wherein an inner layer material is easily exposed at a corner between an external surface of a side portion terminal (011) and a lower su...
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WO/2018/123977A1 |
A wiring substrate 1 comprises: a support 10 including at least one woven fabric 11 that is woven using weaving yarns 12, 13, which are respectively constituted by bundling insulating fibers 121, 131; and a conductor 20 supported by the ...
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