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WO/2020/099576A1 |
The invention relates to a printed circuit board (1) comprising electronic components (3), a substrate (2) provided with an array of conductor tracks (4) electrically connecting said electronic components (3) and a strain gauge (5A, 5B, ...
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WO/2020/098081A1 |
A flexible circuit board, a display panel, and a display device. The flexible circuit board comprises: a substrate; a bonding lead; a short-circuit trace for connecting an external test pad, the short-circuit trace and the bonding lead b...
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WO/2020/101022A1 |
This via wiring formation substrate for mounting at least one semiconductor chip thereon includes: a support substrate; a peelable adhesive layer provided on the support substrate; a first insulation layer provided on the peelable adhesi...
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WO/2020/100625A1 |
A wiring substrate comprises: a first base material that expands and contracts; wiring positioned on a first surface side of the first base material, the wiring extending in a first direction; and a stopper positioned on the first surfac...
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WO/2020/102119A2 |
Compact camera heads as used in inspection systems having improved thermal extraction architectures are disclosed. Methods for assembling a camera head and associated components having improved thermal extraction architectures are also d...
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WO/2020/100769A1 |
An aspect of the present invention provides an electronic device comprising: a circuit board; an electronic component provided on the circuit board; a housing accommodating the circuit board and the electronic component; and a heat stora...
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WO/2020/101183A1 |
The present invention relates to a plating laminating technique for providing an inner layer of a printed circuit board having improved adhesive force, and has an effect of providing: an electrolessly plated laminate including a non-etch...
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WO/2020/099579A1 |
The invention relates to a multilayer printed circuit board (1) comprising a control circuit (1a) including n vias (3) that are connected in series between a first (4a) and a second (4b) electrical terminal so that an applied electric cu...
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WO/2020/097767A1 |
A circuit board (1) and supercomputing equipment, which relate to the technical field of supercomputing equipment and are used for timely dissipation of heat generated in a working process of a chip (30) out of the chip (30), so as to im...
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WO/2020/100934A1 |
The present invention pertains to a conductive substrate comprising: a base material; and a metal wiring made of a least one of silver or copper. The conductive substrate has an anti-reflection region formed on a portion or the whole of ...
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WO/2020/100802A1 |
This flexible substrate (101) comprises: a flexible board (30); a connection part formed on the board (30) and connected to an antenna board (10) and a circuit board (20); and a first line and a second line formed on the board (30) and c...
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WO/2020/099464A1 |
The present invention discloses a circuit carrier (20) for establishing a mechanical and electrical connection for at least one (power) electronic component (500), comprising: - a support plate (100) which has at least one through-hole (...
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WO/2020/101269A1 |
The present invention provides an FPC connection structure. An FPC connection structure according to an aspect of the present invention may comprise: FPC conductive patterns having several strands, which are covered with an insulation fi...
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WO/2020/101610A2 |
The invention is related to a mounting method in which the electronic element (2) is mounted in a demountable manner on the mounting region (11) formed on a designed electronic card (1) in a solderless manner without the requirement of e...
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WO/2020/100314A1 |
[Problem] To provide: a thermosetting resin composition by which heat resistance can be significantly improved compared to conventional high heat-resistant substrates, and which has the same curing condition as in the case of using an ep...
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WO/2020/100899A1 |
Provided are an electronic component with an improved heat-dissipating property, and an electronic component module comprising the same. The electronic component (1) is provided with a substrate (2), a function portion (3), a plurality o...
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WO/2020/099143A1 |
The invention describes an LED lighting arrangement (10) comprising a single- layer carrier (3) comprising a mounting surface (30), a metal core (32), and a dielectric layer (31) between the mounting surface (30) and the metal core (32);...
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WO/2020/099324A1 |
The invention relates to a method for producing a plurality of radiation-emitting components (12), comprising the following steps: providing a composite (6) having a plurality of connection carriers (9), each connection carrier (9) compr...
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WO/2020/100849A1 |
In the present invention, a substrate (20) has a first main surface (201) and a second main surface (202). A first electronic component (31) is mounted on the substrate (20) such that one surface (311) on which an electric function part ...
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WO/2020/096036A1 |
The present invention pertains to: a resin composition containing (A) a polyphenylene ether derivative having an ethylenic-unsaturated-bond-containing group, (B) one or more selected from the group consisting of maleimide compounds havin...
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WO/2020/093729A1 |
A flexible connector, comprising an insulator (10), a side surface of the insulator (10) being provided with several first conductors (11), and the other side surface of the insulator (10) being provided with several second conductors (1...
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WO/2020/096602A1 |
In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plura...
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WO/2020/095813A1 |
This ceramic electronic component is provided with: a component body including a ceramic layer; at least one terminal electrode disposed on one main surface of the component body; and an insulating coating layer disposed across the ceram...
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WO/2020/095860A1 |
A drive control device (10) such as a variable-damping-force damper comprises a circuit substrate (100) having a high voltage generation circuit (11) for generating a voltage higher than a power supply voltage. This circuit substrate (10...
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WO/2020/095474A1 |
A circuit board (100) which is obtained by mounting an electronic component (150) on a wiring board (110), and which is configured such that: the electronic component (150) is provided with a plurality of terminals (151) that are electri...
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WO/2020/096005A1 |
[Problem] To provide a fastener with which one member can be fastened to another member with a gap ensured between the two members, and the effort needed for the fastening work can be reduced. [Solution] The fastener is configured so as ...
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WO/2020/095833A1 |
The present invention addresses the problem that creases and billows readily form after stretching of a garment, etc., as pertains to an extendable/contractible wiring member in which extendable/contractible wiring is formed in the garme...
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WO/2020/094492A1 |
The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the f...
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WO/2020/095783A1 |
This coaxial connector is provided with a base surface, a coaxial structure in which a dielectric body is present between a central conductor and an outer conductor, and a protruding section protruding from the base surface. The central ...
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WO/2020/095919A1 |
An electromagnetic shielding film comprising: a shielding film part provided with an adhesive layer, a shielding layer layered on the adhesive layer, and an insulating layer layered on the shielding layer; and a protective part comprisin...
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WO/2020/095092A1 |
A novel printed circuit board waveguide structure based on optimized straight lines and connected at will by 3D multi-angle vertical transition. The complete system is having a well-controlled constant characteristic impedance Z0. The st...
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WO/2020/093400A1 |
A manufacturing method for a rigid-flex circuit board, comprising the following steps: providing a first wiring board and a first substrate, and pressing the first substrate on the surface of the first wiring board by means of a first ad...
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WO/2020/094474A1 |
In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second ...
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WO/2020/095656A1 |
Provided is a method for manufacturing a conductive member for use in electrical inspections, which is compatible with the miniaturization of electronic components. The method comprises: an electrode part formation step of forming electr...
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WO/2020/095988A1 |
The present invention provides a thermoplastic liquid crystal polymer film that has a dielectric constant in the thickness direction, which is suitable for millimeter wave radar base materials. This thermoplastic liquid crystal polymer f...
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WO/2020/096201A1 |
An electric compressor according to the present invention comprises: a compression module for compressing a fluid; and an inverter module for controlling the operation of the compression module, wherein the inverter module comprises: a p...
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WO/2020/093138A1 |
In accordance with some embodiments, a stereoscopic imaging apparatus includes a tubular housing configured to be inserted into a confined space and including a bore there through. The apparatus also includes first and second image senso...
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WO/2020/046039A3 |
The present invention relates to a voice coil plate and a flat panel speaker, and more specifically, to: a voice coil plate having a multi-patterned coil for a slim speaker, the voice coil plate enabling weight reduction, impedance value...
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WO/2020/094491A1 |
The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the f...
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WO/2020/095980A1 |
In a wiring board C, a base 1 has a protruding section 1d that protrudes toward the outside from one side of the base 1. In the protruding section 1d, the center section of the main surface has a shape that rises from the outer circumfer...
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WO/2020/095548A1 |
The present invention provides a chip package positioning structure that can reduce mounting variation by controlling the inclination and the position of a chip package with respect to a circuit board. This chip package positioning and f...
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WO/2020/043939A3 |
Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an ex...
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WO/2020/093683A1 |
Disclosed are a printed circuit board, and a display connection structure containing the printed circuit board. The printed circuit board comprises: several bond pad areas for being electrically connected to a display, and several dummy ...
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WO/2020/095422A1 |
Provided are: a resin composition capable of exhibiting excellent dielectric properties in the 10-GHz band and higher-frequency bands; a cured object obtained from the resin composition; a prepreg; a laminate; a resin film; a multilayere...
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WO/2020/096902A1 |
In an example, a communication module (200A) such as an optoelectronic communication module may include an integrated circuit (IC) (218), an electrical interconnect (210A-D), and an interposer circuit (208). The electrical interconnect m...
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WO/2020/094493A1 |
The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the f...
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WO/2020/096040A1 |
Provided is a bonded body that can suppress a decrease in thermal conductivity of an aluminum member even if the aluminum member comprising an Al-Mn type alloy and a copper member comprising copper or a copper alloy are bonded. A bonded ...
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WO/2020/096748A1 |
A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on t...
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WO/2020/092296A1 |
A low inductance electrical switching circuit arrangement (200), includes a two sided substrate (202) with a plurality of through-substrate electrical vias (220, 222). A capacitor (212) is arranged on the substrate first side above a fir...
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WO/2020/088909A1 |
A device includes a first substrate formed of a first material that exhibits a threshold level of thermal conductivity. The threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit o...
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