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Patent Searching and Data


Matches 1 - 50 out of 147,165

Document Document Title
WO/2018/069309A1
The invention relates to a sensor device (1) for a vehicle, in particular a motor vehicle, having at least one sensor module (2) and having at least one connecting line connected to the sensor module (2) for making electrical contact wit...  
WO/2018/069081A1
The invention relates to a semi-finished product, in particular for thermal and/or electrical contacting of components, such as battery cells and/or electronic components, for example. In order to simplify methods for producing electrica...  
WO/2018/068463A1
Disclosed are a flexible printed circuit and a touch device. The flexible printed circuit (3) comprises a light guiding area (5) arranged on a base material, that has pre-set transparency, of the flexible printed circuit (3), and a key a...  
WO/2018/070987A1
Examples disclosed herein relate to a rigid board with a pliable region. An example system can include a board including a cut to form a beam region of pliability in the board. An example system may include a component to be mounted on t...  
WO/2018/070171A1
This printed wiring is formed from a cured conductive ink film formed on a surface of a base material, and configured by including at least: a single wavy line; a first wiring element that is positioned on one of opposite sides of the wa...  
WO/2018/068293A1
A circuit board device component having adjustable air supply rate, comprising a circuit board device (12), a hinge frame (9) fixedly provided at an extremity of the circuit board device (12), and a cooling plate device (2) connected to ...  
WO/2018/069429A1
A test element support (108) is disclosed. The test element support (108) comprises a heating element (132) for heating a test element (124) for analytical examination of a sample. The heating element (132) comprises a substrate (146). T...  
WO/2018/068948A1
The invention specifies a method for testing a printed circuit board (L), in which method a printed circuit board (L) is provided with a first main section (H1), a second main section (H2), a bent connecting section (V) and at least one ...  
WO/2018/070329A1
A printed wiring board according to one aspect of the present invention is provided with: a base film having an insulation property; and a conductive pattern including a plurality of wiring parts that are stacked on at least one surface ...  
WO/2018/068921A1
The invention relates to a sensor device (1) for a vehicle, in particular a motor vehicle, having at least one sensor module (2) and at least one connecting line connected to the sensor module (2) for making electrical contact with the s...  
WO/2018/070192A1
An electronic device (100) comprising: electronic components (110, 120); a resin molded body (130) embedding and fixing therein the electronic components (110, 120); and a heat-transfer layer (150) having higher thermal conductivity than...  
WO/2018/069069A1
The invention relates to a method for forming at least one heat dissipation pathway for a microelectronic component and to a corresponding microelectronic component. In step A of the method, the microelectronic component is permanently a...  
WO/2018/069448A1
A method of manufacturing a component carrier (100), wherein the method comprises applying a fluidic medium (102) selectively towards a recess (104) in a layer structure (106), and transferring at least part of the fluidic medium (102) i...  
WO/2018/069657A1
The invention relates to an electronic input interface (10) comprising: a dielectric base (11), one face (11A) of which is arranged to be accessible to the user; and a capacitive sensor (12) located at a distance from the aforementioned ...  
WO/2018/069476A1
A mounting assembly is disclosed which comprises an electronic component (1) mounted on a upper surface of a circuit board (5), comprising at least one electrical connector (2,3) and further comprising a thermal pad (7) provided on a low...  
WO/2018/068949A1
The invention relates to an electronic unit (1), having: at least one printed circuit board (3) having conducting tracks (5); at least one assembly (9) for limiting current in the form of a thermal predetermined breaking point in at leas...  
WO/2018/069152A1
The invention relates to power electronics having a circuit carrier (2) and at least one coil (4.1), wherein the coil (4.1) is connected to the circuit carrier (2) in a current-conducting manner. In order to describe power electronics wh...  
WO/2018/065582A1
A control unit (10) for an apparatus, the control unit (10) comprising: a component-carrying member (18) provided with at least one electronic component (29) configured to provide a function of the apparatus; wherein the component-carryi...  
WO/2018/066213A1
This multilayer printed wiring board is provided with a core substrate, a first buildup layer and a second buildup layer. The first buildup layer is configured by alternately laminating first insulating layers and first conductor layers....  
WO/2018/067703A1
An electro-optical interconnection platform is provided. The platform includes an interface medium; a plurality of optical pads; a plurality of electrical pads; and at least one beam coupler adapted to optically couple at least one pair ...  
WO/2018/066857A1
The present invention relates to a fingerprint sensor package which can be mounted on a smart card or a mobile terminal, and a fingerprint sensor card and fingerprint sensor module each including the same, and the fingerprint sensor pack...  
WO/2018/065855A1
A printed electronic display device and methods of manufacturing and using the same are disclosed. The device includes a substrate (200) having a plurality of traces (230, 232) thereon, a printed integrated circuit (210), a battery (220)...  
WO/2018/065585A1
A control unit (10) for an apparatus (12), the control unit (10) comprising a component-carrying member (14; 114; 18; 118) provided with at least one electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78) configured to provide a funct...  
WO/2018/067594A1
New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling conditi...  
WO/2018/067674A1
One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-...  
WO/2018/065268A1
The invention relates to an arrangement, comprising a mold body (15), a spacer (20), and a printed circuit board (25), wherein at least one electrical connection (110, 115) connects the mold body to a conductor path (70, 75) of the print...  
WO/2018/066324A1
This multilayer substrate (101) is provided with: a laminate (10A) that is obtained by laminating a plurality of insulating base material layers (11a, 12a, 13a, 14a, 15a); an (IC31) that is contained within the laminate (10A); a first co...  
WO/2018/066203A1
A method for producing a composite member 100 according to one embodiment of the present invention comprises: a resin layer formation step wherein a resin layer 40 that contains a resin having a carboxyl group is formed on a substrate 10...  
WO/2018/065604A1
A control unit (10) for an apparatus, the control unit (10) comprising a component-carrying member (18) provided with at last one electronic component (60, 62) configured to provide a function of the apparatus, wherein the component-carr...  
WO/2018/065160A1
The invention relates to a circuit arrangement (15) comprising a heat sink (17) and a layer assembly (20) which is disposed on a surface (21) of the heat sink (17) and which includes a first electrically insulating insulation layer (28) ...  
WO/2018/065207A1
The invention relates to a control device having a printed circuit board (2) having a first and a second main surface (3o,4o; 3u,4u), wherein on at least one main surface (3o,4o; 3u,4u), components (5) are arranged. The printed circuit b...  
WO/2018/061736A1
This metal-clad laminate is provided with: an insulating layer that is formed of a cured product of a resin composition; and a metal foil that is arranged on at least one main surface of the insulating layer. The resin composition contai...  
WO/2018/060247A1
A component carrier (100) for carrying at least one component (1400) and comprising a plurality of electrically conductive layer structures (102, 104), and a plurality of electrically insulating layer structures (106, 108), wherein the p...  
WO/2018/058560A1
Various examples disclosed relate to a substrate for a semiconductor. The substrate includes a first conducting layer, having a first surface and an opposite second surface. The substrate further includes a second conducting layer extend...  
WO/2018/063171A1
Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact finger...  
WO/2018/060670A1
A method of electrically connecting an electronic textile (108, 110) to an electronic device (300), the electronic textile (108, 110) comprising an electrically insulating textile carrier (400) and one or more electrical conductor lines ...  
WO/2018/060554A1
A stretchable structure (101) comprises or is configured to receive a conductive path (102) and an interface region (105). The interface region (105) comprises a peripheral line comprising at least one inwardly curved portion (106), such...  
WO/2018/063150A1
Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plural...  
WO/2018/063631A1
Aspects of the disclosure are directed to a printed circuit board and methods of making a printed circuit board. A printed circuit board strip can include a plurality of finger pads to receive metal contact fingers. The printed circuit b...  
WO/2018/064079A1
Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supporte...  
WO/2018/062373A1
A resistor according to this disclosure contains 40 mass% or more of copper, nickel, and lanthanum boride in total, and contains copper particles having a particle size of 2.5 μm or more. A circuit board according to this disclosure is ...  
WO/2018/060231A1
A manufacturing method of manufacturing a constituent (350) for a component carrier (300), wherein the method comprises providing an electrically conductive structure (100), forming a highly thermally conductive and electrically insulati...  
WO/2018/063412A1
Electronic device package technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly includes a connector body. The connector body has a sub-assembly interface and a circuit b...  
WO/2018/062405A1
Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the insulation layer. This cured body is a cured body of a resin composition including ...  
WO/2018/060233A1
A component carrier ( 100) which comprises a heat absorbing and thermally conductive surface layer (102) configured for being heated by an external heat source (104), and a thermoelectric device (106) fully surrounded by material of the ...  
WO/2018/059847A1
The invention relates to a printed circuit board (1), having conducting tracks (2) arranged on at least one surface (11) of the printed circuit board (1), wherein the surface (11) comprises regions (4) having solder resist (3), said regi...  
WO/2018/061727A1
Provided is a polyimide film having a non-thermoplastic polyimide layer, wherein: the non-thermoplastic polyimide constituting the non-thermoplastic polyimide layer preferably contains at least one of a biphenyl-tetracarboxylic dianhydri...  
WO/2018/063416A1
Embodiments are generally directed to a mutual inductance suppressor for crosstalk immunity enhancement. An embodiment of a printed circuit board includes a first signal trace and a second signal trace on a first layer, wherein the first...  
WO/2018/060731A1
A method of processing an electronic textile (108, 110), the method comprising: providing an electronic textile (108, 110), the electronic textile (108, 110) comprising an electrically insulating textile carrier (400) and one or more ele...  
WO/2018/062810A1
An embodiment comprises: a housing; a bobbin disposed in the housing; a first coil disposed in the bobbin; a magnet disposed in the housing; a first sensing coil, disposed in the housing, for generating a first induced voltage by interac...  

Matches 1 - 50 out of 147,165