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WO/2012/061183 |
Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces and at least one via extending through the dielectric layer from the firs...
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WO/2012/060284 |
When using a substrate having a low resistance to heat, it is preferred that heat treatment is performed at approximately 120°C which is a temperature in which the substrate does not become deformed. Moreover, if it is possible to achie...
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WO/2012/061568 |
Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use a...
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WO/2012/060121 |
[Problem] To provide a multi-part wired substrate for manufacturing a miniature wired substrate with which it is possible to make good bonds with wires of an external circuit substrate. [Solution] A multi-part wired substrate comprises: ...
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WO/2012/061182 |
An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive mater...
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WO/2012/061184 |
Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavit...
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WO/2012/059159 |
The invention relates to a flexible device for electrically connecting an electric component and a printed circuit board together, wherein the flexible electric-connection device includes a main extension direction, and the flexible elec...
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WO/2012/059186 |
The invention relates to a method for producing a laminate (1, 11) for making contact with at least one electronic component (6, 16), in which an insulating layer (4, 14) is arranged between a first metal layer (2, 12) and a second metal...
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WO/2012/060657 |
The present invention relates to a printed circuit board comprising a separation member where first and second conductive layers separable from each other are disposed in succession at each of the upper and lower surfaces of a separation...
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WO/2012/061008 |
A high performance electrical interconnect adapted to provide an interface between terminals on first and second circuit members. The electrical interconnect includes a first circuitry layer with a first surface and a second surface havi...
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WO/2012/059364 |
The invention relates to a lighting device composed of a control module (1) with a first substrate (3), said first substrate (3) being equipped with at least one electronic component (5), and a light source module (7) with a second subst...
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WO/2012/054960 |
The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components (220, 215) in recesses (210, 215) in a thermoplastic substra...
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WO/2012/055785 |
Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding active components such as micro chips. The c...
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WO/2012/055733 |
An electronics card comprising a stack (9) of printed circuit layers (10), each comprising an electrically insulating support (12) having at least one conductive track (11) extending thereon, and two electromagnetic shields (13) extendin...
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WO/2012/057124 |
The present invention provides a metal-clad laminate, wherein a metal foil and a base are firmly bonded with each other, and which exhibits excellent electrical characteristics. This metal-clad laminate comprises a metal foil and a first...
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WO/2012/055696 |
A flexible printed circuit for a contact- communication device, comprises: -a flexible substrate (6) having opposed first and second faces (6a, 6b), -electrical contacts (7a-7h) patterned on the first face (6a), electrical zones (13a-13h...
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WO/2012/057227 |
Provided are a method for connecting electronic parts and a connecting structure that make the obtainment of high connection reliability possible. An anisotropic conductive film (20) is provisionally installed prior to thermal compressio...
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WO/2012/056995 |
A display module of the present invention is a display module wherein an active matrix substrate (AM) and an IC chip (DT) for a driver are connected with each other via an anisotropic conductive layer (ACL) that contains conductive parti...
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WO/2012/056879 |
The present invention provides a module substrate that can increase the number of mountable electronic components and can reduce size even when the necessary number of electronic components is mounted and a method for manufacturing that ...
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WO/2012/056703 |
[Problem] To provide a laminate which has excellent thermal conductivity, heat resistance, drill workability and flame retardancy. [Solution] A prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin c...
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WO/2012/056663 |
Disclosed is a circuit board which comprises: a contact hole that is formed in a first insulating layer, a first conductive film and a second insulating layer; and a second conductive film that is connected to the first conductive film w...
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WO/2012/057428 |
The present invention relates to a printed circuit board and a substrate block for a vehicle using the same. A housing (10) forms an exterior of the substrate block of the present invention. The housing (10) is composed of a housing body...
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WO/2012/055934 |
Process for producing conductive and /or piezoresistive traces in a non-conductive polymer substrate through laser irradiation, characterized in that said substrate is a composite polymer material, comprising the matrix of a non char for...
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WO/2012/057427 |
The present invention relates to a circuit block for a vehicle. The shape of the circuit block (10') according to the present invention is formed by a housing (10), which includes a housing body (12) and a housing cover (20). The housing...
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WO/2012/053580 |
[Problem] To provide an electrical connection box that uses a metal core substrate that can prevent bending. [Solution] The electrical connection box, which performs power distribution in an automobile, is provided with a metal core subs...
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WO/2012/053728 |
Disclosed are a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes forming a base circuit board including a cavity circuit pattern in a cavity region on upper an...
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WO/2012/054459 |
Methods and systems for electrically coupling bonded components, including; a support layer ( 110 ), an electrically conductive wire ( 115 ) supported by the support layer, and an electrically conductive adhesive ( 120 ), the electricall...
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WO/2012/053092 |
A connector (10A) formed by assembling connector plates (30a—30f) having connector pins (60) that are electrically connected to a signal line (4) embedded in a predetermined position on a printed wiring board (1A). The connector plates...
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WO/2012/048840 |
The invention relates to a structure (14) which is disposed on an electrically non-conductive, electrostatically chargeable strip-like carrier film (12), wherein said structure has electrically conductive and/or semiconducting structural...
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WO/2012/048596 |
A crimping device for fixing a structure (3) on a printed circuit board (PCB) (2) is provided. The crimping device comprises a nut (11), a fixing part (12) and pins (13). A through hole (121) for being embedded with the nut (11) is arran...
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WO/2012/050128 |
A flexible conductive material that contains: an elastomer; a conductive agent with which said elastomer is filled; and an adsorbent that is affixed inside the elastomer and can adsorb ionic substances. Said flexible conductive material ...
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WO/2012/049895 |
This module with a built-in component comprises: a substrate that has a front surface and a back surface; a plurality of electronic components that are mounted on the front surface of the substrate; a resin that seals the front surface o...
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WO/2012/048359 |
The invention relates to an optical sensor device (1), comprising a substrate (2), on which at least one light source (4), such as an LED, is arranged, from which at least one optical waveguide (7) leads to at least one receiver (5), suc...
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WO/2012/048357 |
In a method and system for providing a plate-shaped object (6) that in particular contains or accommodates a plurality of circuit board elements (1, 2, 3, 4) and into which a circuit board element (1, 2, 3, 4) is inserted in a correspond...
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WO/2012/049898 |
This module with a built-in component comprises: a flexible substrate which has a first surface and a second surface that is on the reverse side of the first surface, said first surface being provided with a recessed portion that is rece...
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WO/2012/046370 |
Provided is a metal base circuit board that makes it possible to suppress abrasion of a metal substrate due to a white resist layer even if metal base circuit boards are managed by being stacked by product management. A metal base circui...
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WO/2012/045239 |
A device (3) for providing a mechanical and electrical connection between a radio frequency filter (RF filter) (1), with a radio frequency contact pin (11), and a printed circuit board (PCB) (2) is disclosed, where the contact pin (11) i...
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WO/2012/046804 |
Provided is a copper foil with carrier capable of providing wirings of line/space=15 μm/15 μm or less on a printed circuit board on which copper foils are laminated. Also provided are a printed circuit board and a multilayer printed ci...
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WO/2012/046640 |
Provided are a multi-cavity wiring board which hardly causes breakage, chipping or cracking from the vicinity of dividing grooves at the time of division or before the division and has high reliability, and a method for manufacturing the...
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WO/2012/046338 |
This semiconductor package is provided with a substrate on which a semiconductor device is mounted and a loop-shaped heat pipe joined to the surface on the opposite side from the mounting surface for the semiconductor device on that subs...
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WO/2012/047220 |
Technologies generally described herein relate to multilayer circuit boards with optical vias for data transmission between the layers. One or more regions may be created on a multilayer circuit board for optical vias. A transparent cond...
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WO/2012/046621 |
The purpose of the present invention is to provide: a mother substrate for a touch panel, the mother substrate having a novel structure from which a touch panel can be easily cut out; and a touch panel cut out from the aforementioned mot...
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WO/2012/046591 |
Disclosed is a flexible printed circuit board with excellent flexibility and a diffusely reflective white surface (a white surface) which is not prone to color change even when irradiated with light, including short wavelength light, has...
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WO/2012/048137 |
Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a semiconductor chip within the cavity, such that a backside of the chip is dis...
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WO/2012/048095 |
In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic comm...
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WO/2012/042286 |
An apparatus, the apparatus comprising first and second circuit boards, and an electrolyte, the first and second circuit boards each comprising a capacitive element, wherein the apparatus is configured such that a chamber is defined betw...
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WO/2012/042740 |
The disclosed structural body is provided with: a first conductor (102) and a second conductor (103) opposite of one another in at least one portion; a third conductor (101) disposed between the first conductor (102) and the second condu...
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WO/2012/044563 |
A shield that protects high-value input resistors in a power meter against unwanted effects due to electromagnetic interference from a nearby power supply and/or due to crosstalk from adjacent phases. The shield includes multiple printed...
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WO/2012/041529 |
The invention is directed to a subsea control system (1) with a computer unit (2), the computer unit (2) comprising a printed circuit board (3) that contains a central processing unit (4) and the computer unit (2) comprising a socket (5)...
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WO/2012/041730 |
The invention relates to an electronic control device (1) for a lighting device of a motor vehicle, comprising at least one flexible printed circuit board (5) which is provided with electric conductor tracks and which is populated with e...
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