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WO/2019/092353A1 |
The invention relates to a method for producing sealed electrical connections passing through the wall of a ceramic case, for example a ceramic case provided on an image-intensifier tube. The method comprises a step (500) of metallising ...
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WO/2019/093069A1 |
The present disclosure provides a stretchable circuit substrate comprising: a base material having a stretchability; a wire which is positioned on a first surface side of the base material, and which includes a bellows-like portion inclu...
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WO/2019/091027A1 |
A flexible flat cable and a display panel. The flexible flat cable comprises an insulating substrate (10), a first terminal (20), and a second terminal (30). The first terminal (20) and the second terminal (30) are provided at a first en...
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WO/2019/090918A1 |
A printed circuit board and a manufacturing method therefor. The printed circuit board comprises a bend formable copper-clad plate as a substrate, the copper-clad plate comprising a copper foil and a thermosetting resin composition impre...
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WO/2019/094600A1 |
A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first ...
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WO/2019/094699A1 |
A system and method for applying a coating to a substrate are disclosed. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coati...
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WO/2019/060402A4 |
A thermal connector comprising an electrically insulating beam having a first end face at a first end and a second end face at a second end is provided. The second end face may be opposite the first end face in an X direction. The beam m...
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WO/2019/091121A1 |
An integrated electrical printed circuit board system, the integrated printed circuit board system comprising a printed circuit board, a high power relay (1), an intermediate relay (2), and a control circuit board (3), the high power rel...
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WO/2019/094549A1 |
A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patter...
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WO/2019/094477A1 |
Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co- planar on the surface, including a gap between the tr...
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WO/2019/094238A1 |
In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can compri...
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WO/2019/092919A1 |
This adhesively attachable biological sensor is provided with: a stretchable backing for adhering to the surface of a living body; an interposer disposed on one side of the backing in the thickness direction; and an electronic component ...
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WO/2019/091830A1 |
The invention relates to a carrier (100) comprising an electrically insulating base material (30), electrically conductive vias (10) and a thermal connecting element (20). The vias (10) and the thermal connecting element (20) are each su...
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WO/2019/093494A1 |
[Problem] The purpose of the present invention is to provide a novel composite copper foil. [Solution] A composite copper foil in which a metal layer comprising a metal layer other than copper is formed on at least part of the surface of...
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WO/2019/092926A1 |
Provided is an electronic circuit device having the effect of a parasitic inductance reduced as much as possible and excellent in heat dissipation properties. This electronic circuit device (1) is formed such that: circuit elements (11-1...
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WO/2019/092881A1 |
Provided is a multilayer wiring plate equipped with a coaxial wire. This multilayer wiring plate 1 comprises: a coaxial wire 10 having a signal line 11, an insulation layer 12, and a shield layer 13, and extending in a first direction; a...
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WO/2019/093427A1 |
A method for producing a joined body is provided with: a first step in which a layered body is prepared, said layered body being provided with a first member comprising metal pillars on the surface thereof, a second member comprising an ...
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WO/2019/093077A1 |
The purpose of the present invention is to provide an object having a roughening-treated copper surface. As one embodiment, there is provided an object having a surface covered by copper that has a thickness of 6 nm or greater, wherein t...
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WO/2019/093756A1 |
An electronic device according to various embodiments of the present disclosure comprises: a housing including a front plate and a rear plate facing away from the front plate; a display panel interposed between the front plate and the re...
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WO/2019/094452A1 |
A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. Th...
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WO/2019/093175A1 |
Provided is a film which has low dielectric loss tangent even at high temperatures, while having excellent dielectric breakdown strength. A film which is characterized by having a dielectric loss tangent of 0.02% or less at a frequency o...
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WO/2019/091728A1 |
The invention relates to a method for the integration of semiconductor components (9) in a confined space, in particular for 3D integration, in which, after positioning relative to a supporting substrate (10) and/or redistribution layer ...
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WO/2019/094373A2 |
The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are ...
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WO/2019/089903A1 |
A communication module may include a communication ground layer (338). The communication module may also include a circuit board (340). The circuit board (340) may be located proximate the communication ground layer (338). The circuit bo...
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WO/2019/086014A1 |
The present application relates to a method for fabricating a circuit board by compositing a metal foil circuit and a wire circuit. In particular, the method comprises the following steps: paste a copper foil on a glued film which has be...
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WO/2019/086455A1 |
The present invention relates to an antenna construction and a method for manufacturing the same, said antenna construction comprising: a printed circuit board (PCB) provided with electric components for controlling operations of the ind...
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WO/2019/085529A1 |
The present invention relates to a method for manufacturing a core board having built-in components, comprising: S110: performing circuit manufacturing of the core board; S120: mounting and soldering correspondingly, on the core board, c...
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WO/2019/090037A1 |
A driver assist system for a vehicle includes a housing and a lens having an axial end extending into the housing. A first printed circuit board (PCB) is connected to the housing. The first PCB has a rigid portion and a flexible portion....
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WO/2019/050046A8 |
Provided is a connection structure for a wiring substrate and a flexible substrate, said connection structure having sufficient mechanical strength and reduced frequency signal transmission loss. A connection structure (1) for a wiring s...
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WO/2019/087939A1 |
Provided are: a molded article, a metal-coated layered product, and a printed wiring board, all of which containing a tetrafluoroethylene polymer, in which an decrease in electrical characteristics is inhibited, and in which a hole can b...
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WO/2019/087352A1 |
This printed circuit board assembly includes: a first printed circuit board having a slit section formed therein, and comprising a first surface and a second surface that is a surface on the side facing away from the first surface; and a...
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WO/2019/085870A1 |
A composite material comprises a first region (110), a second region (120), and a third region (130). The third region is located between the first region and the second region. The first region is formed by sintering a first feedstock, ...
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WO/2019/086815A1 |
The invention relates to a composite (sandwich or monolithic) part (1), comprising a rigid outer surface (10), incorporating an electronic instrumentation circuit (2), the electronic instrumentation circuit (2) comprising a piezoelectric...
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WO/2019/087753A1 |
This interposer (301) is provided with: a laminate (10) which is obtained by laminating a plurality of insulating substrate layers (11, 12, 13); a first electrode (P1) and a second electrode (P2); conductor patterns (21, 22); and an inte...
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WO/2019/086299A1 |
An arrangement for a refrigeration and/or freezing appliance, having an electrical or electronic component (1, 2a) and having ascertainment means (2, 4) by which an electrical or thermal load of the component can be ascertained, wherein ...
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WO/2019/088563A1 |
A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface op...
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WO/2019/080914A1 |
Provided is a method for fabricating a single-sided metal-based circuit board used for soldering pin components; the back side of a flexible single-sided copper-clad board (2) base material is coated with an adhesive, then is attached to...
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WO/2019/082608A1 |
This imaging element mounting substrate comprises: a substrate area in which a substrate is arranged; and a plurality of reinforcement parts arranged in the periphery of the substrate area. The plurality of reinforcement parts are indepe...
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WO/2019/082611A1 |
This substrate assembly sheet is a substrate assembly sheet in which a plurality of mounting substrates for mounting an electronic component are partitioned. The total thickness of the mounting substrates is 60 µm or less. A through hol...
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WO/2019/082970A1 |
This bonded body (10) is formed by bonding a ceramic member (11) formed from an Al-base ceramic and a copper member (12) formed from copper or a copper alloy. In a bonding layer (30) formed between the ceramic member (11) and the copper ...
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WO/2019/080209A1 |
Provided are a signal transmission apparatus (700) and a display apparatus. The signal transmission apparatus (700) comprises: a first flexible printed circuit board (111) provided with a first circuit layer and a connecting part, the fi...
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WO/2019/079902A1 |
A composite includes a plastic substrate and an electrical insulator layer formed on the plastic substrate. The electrical insulator layer contains boron nitride nanotubes (BNNTs), which may be unmodified or modified BNNTS. The composite...
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WO/2019/082971A1 |
The present invention addresses the problem of providing a metal-clad laminate which exhibits high peeling strength between a metal layer and an insulating layer containing a liquid-crystal polymer and in which the insulating layer has g...
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WO/2019/081802A1 |
An illumination device (401) comprises a printed circuit board (PCB; 402), a light source (403) assembled on center section (408) of the PCB and an optical device (404). The center section of the PCB is stamped so that the light emitting...
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WO/2019/080006A1 |
A flexible circuit board (1, 24), which is used for connecting electronic modules (20, 22), the flexible circuit board (1, 24) comprising: a fixing part (11), the fixing part (11) being a part of the flexible circuit board (1, 24) that i...
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WO/2019/080663A1 |
Disclosed in an embodiment of the present application are an optical component on-board device, an assembly method thereof, and an on-board designing device. The optical component on-board device comprises: light assembly and a flexible ...
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WO/2019/081710A1 |
This waveguide assembly comprises a receiving component (14) and an active electronic component (12). The receiving component (14) comprises a waveguide (16), the waveguide (16) defining a propagation zone (40) extending along a propagat...
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WO/2019/082714A1 |
This multilayer board (301) is provided with: an element body (10) having a first main surface (MS1); first external electrodes (external electrodes (P11, P12)) formed on the first main surface (MS1) and formed of a metal foil; first int...
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WO/2019/083893A1 |
An inorganic circuit board article including: a porous inorganic sheet having a low dielectric loss of from 1x10-5 to 3x10-3 at a high frequency of from 10 to 30 GHz and the porous inorganic sheet has a percent porosity of from 30 to 50 ...
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WO/2019/082795A1 |
Provided is an ultra-thin copper foil from which highly miniaturized wires having a line/space (L/S) of 10 μm or less/10 μm or less can be formed into different patterns on both sides, and which can thus be used as an inexpensive and e...
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