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Matches 1 - 50 out of 154,182

Document Document Title
WO/2020/099576A1
The invention relates to a printed circuit board (1) comprising electronic components (3), a substrate (2) provided with an array of conductor tracks (4) electrically connecting said electronic components (3) and a strain gauge (5A, 5B, ...  
WO/2020/098081A1
A flexible circuit board, a display panel, and a display device. The flexible circuit board comprises: a substrate; a bonding lead; a short-circuit trace for connecting an external test pad, the short-circuit trace and the bonding lead b...  
WO/2020/101022A1
This via wiring formation substrate for mounting at least one semiconductor chip thereon includes: a support substrate; a peelable adhesive layer provided on the support substrate; a first insulation layer provided on the peelable adhesi...  
WO/2020/100625A1
A wiring substrate comprises: a first base material that expands and contracts; wiring positioned on a first surface side of the first base material, the wiring extending in a first direction; and a stopper positioned on the first surfac...  
WO/2020/102119A2
Compact camera heads as used in inspection systems having improved thermal extraction architectures are disclosed. Methods for assembling a camera head and associated components having improved thermal extraction architectures are also d...  
WO/2020/100769A1
An aspect of the present invention provides an electronic device comprising: a circuit board; an electronic component provided on the circuit board; a housing accommodating the circuit board and the electronic component; and a heat stora...  
WO/2020/101183A1
The present invention relates to a plating laminating technique for providing an inner layer of a printed circuit board having improved adhesive force, and has an effect of providing: an electrolessly plated laminate including a non-etch...  
WO/2020/099579A1
The invention relates to a multilayer printed circuit board (1) comprising a control circuit (1a) including n vias (3) that are connected in series between a first (4a) and a second (4b) electrical terminal so that an applied electric cu...  
WO/2020/097767A1
A circuit board (1) and supercomputing equipment, which relate to the technical field of supercomputing equipment and are used for timely dissipation of heat generated in a working process of a chip (30) out of the chip (30), so as to im...  
WO/2020/100934A1
The present invention pertains to a conductive substrate comprising: a base material; and a metal wiring made of a least one of silver or copper. The conductive substrate has an anti-reflection region formed on a portion or the whole of ...  
WO/2020/100802A1
This flexible substrate (101) comprises: a flexible board (30); a connection part formed on the board (30) and connected to an antenna board (10) and a circuit board (20); and a first line and a second line formed on the board (30) and c...  
WO/2020/099464A1
The present invention discloses a circuit carrier (20) for establishing a mechanical and electrical connection for at least one (power) electronic component (500), comprising: - a support plate (100) which has at least one through-hole (...  
WO/2020/101269A1
The present invention provides an FPC connection structure. An FPC connection structure according to an aspect of the present invention may comprise: FPC conductive patterns having several strands, which are covered with an insulation fi...  
WO/2020/101610A2
The invention is related to a mounting method in which the electronic element (2) is mounted in a demountable manner on the mounting region (11) formed on a designed electronic card (1) in a solderless manner without the requirement of e...  
WO/2020/100314A1
[Problem] To provide: a thermosetting resin composition by which heat resistance can be significantly improved compared to conventional high heat-resistant substrates, and which has the same curing condition as in the case of using an ep...  
WO/2020/100899A1
Provided are an electronic component with an improved heat-dissipating property, and an electronic component module comprising the same. The electronic component (1) is provided with a substrate (2), a function portion (3), a plurality o...  
WO/2020/099143A1
The invention describes an LED lighting arrangement (10) comprising a single- layer carrier (3) comprising a mounting surface (30), a metal core (32), and a dielectric layer (31) between the mounting surface (30) and the metal core (32);...  
WO/2020/099324A1
The invention relates to a method for producing a plurality of radiation-emitting components (12), comprising the following steps: providing a composite (6) having a plurality of connection carriers (9), each connection carrier (9) compr...  
WO/2020/100849A1
In the present invention, a substrate (20) has a first main surface (201) and a second main surface (202). A first electronic component (31) is mounted on the substrate (20) such that one surface (311) on which an electric function part ...  
WO/2020/096036A1
The present invention pertains to: a resin composition containing (A) a polyphenylene ether derivative having an ethylenic-unsaturated-bond-containing group, (B) one or more selected from the group consisting of maleimide compounds havin...  
WO/2020/093729A1
A flexible connector, comprising an insulator (10), a side surface of the insulator (10) being provided with several first conductors (11), and the other side surface of the insulator (10) being provided with several second conductors (1...  
WO/2020/096602A1
In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plura...  
WO/2020/095813A1
This ceramic electronic component is provided with: a component body including a ceramic layer; at least one terminal electrode disposed on one main surface of the component body; and an insulating coating layer disposed across the ceram...  
WO/2020/095860A1
A drive control device (10) such as a variable-damping-force damper comprises a circuit substrate (100) having a high voltage generation circuit (11) for generating a voltage higher than a power supply voltage. This circuit substrate (10...  
WO/2020/095474A1
A circuit board (100) which is obtained by mounting an electronic component (150) on a wiring board (110), and which is configured such that: the electronic component (150) is provided with a plurality of terminals (151) that are electri...  
WO/2020/096005A1
[Problem] To provide a fastener with which one member can be fastened to another member with a gap ensured between the two members, and the effort needed for the fastening work can be reduced. [Solution] The fastener is configured so as ...  
WO/2020/095833A1
The present invention addresses the problem that creases and billows readily form after stretching of a garment, etc., as pertains to an extendable/contractible wiring member in which extendable/contractible wiring is formed in the garme...  
WO/2020/094492A1
The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the f...  
WO/2020/095783A1
This coaxial connector is provided with a base surface, a coaxial structure in which a dielectric body is present between a central conductor and an outer conductor, and a protruding section protruding from the base surface. The central ...  
WO/2020/095919A1
An electromagnetic shielding film comprising: a shielding film part provided with an adhesive layer, a shielding layer layered on the adhesive layer, and an insulating layer layered on the shielding layer; and a protective part comprisin...  
WO/2020/095092A1
A novel printed circuit board waveguide structure based on optimized straight lines and connected at will by 3D multi-angle vertical transition. The complete system is having a well-controlled constant characteristic impedance Z0. The st...  
WO/2020/093400A1
A manufacturing method for a rigid-flex circuit board, comprising the following steps: providing a first wiring board and a first substrate, and pressing the first substrate on the surface of the first wiring board by means of a first ad...  
WO/2020/094474A1
In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second ...  
WO/2020/095656A1
Provided is a method for manufacturing a conductive member for use in electrical inspections, which is compatible with the miniaturization of electronic components. The method comprises: an electrode part formation step of forming electr...  
WO/2020/095988A1
The present invention provides a thermoplastic liquid crystal polymer film that has a dielectric constant in the thickness direction, which is suitable for millimeter wave radar base materials. This thermoplastic liquid crystal polymer f...  
WO/2020/096201A1
An electric compressor according to the present invention comprises: a compression module for compressing a fluid; and an inverter module for controlling the operation of the compression module, wherein the inverter module comprises: a p...  
WO/2020/093138A1
In accordance with some embodiments, a stereoscopic imaging apparatus includes a tubular housing configured to be inserted into a confined space and including a bore there through. The apparatus also includes first and second image senso...  
WO/2020/046039A3
The present invention relates to a voice coil plate and a flat panel speaker, and more specifically, to: a voice coil plate having a multi-patterned coil for a slim speaker, the voice coil plate enabling weight reduction, impedance value...  
WO/2020/094491A1
The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the f...  
WO/2020/095980A1
In a wiring board C, a base 1 has a protruding section 1d that protrudes toward the outside from one side of the base 1. In the protruding section 1d, the center section of the main surface has a shape that rises from the outer circumfer...  
WO/2020/095548A1
The present invention provides a chip package positioning structure that can reduce mounting variation by controlling the inclination and the position of a chip package with respect to a circuit board. This chip package positioning and f...  
WO/2020/043939A3
Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an ex...  
WO/2020/093683A1
Disclosed are a printed circuit board, and a display connection structure containing the printed circuit board. The printed circuit board comprises: several bond pad areas for being electrically connected to a display, and several dummy ...  
WO/2020/095422A1
Provided are: a resin composition capable of exhibiting excellent dielectric properties in the 10-GHz band and higher-frequency bands; a cured object obtained from the resin composition; a prepreg; a laminate; a resin film; a multilayere...  
WO/2020/096902A1
In an example, a communication module (200A) such as an optoelectronic communication module may include an integrated circuit (IC) (218), an electrical interconnect (210A-D), and an interposer circuit (208). The electrical interconnect m...  
WO/2020/094493A1
The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the f...  
WO/2020/096040A1
Provided is a bonded body that can suppress a decrease in thermal conductivity of an aluminum member even if the aluminum member comprising an Al-Mn type alloy and a copper member comprising copper or a copper alloy are bonded. A bonded ...  
WO/2020/096748A1
A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on t...  
WO/2020/092296A1
A low inductance electrical switching circuit arrangement (200), includes a two sided substrate (202) with a plurality of through-substrate electrical vias (220, 222). A capacitor (212) is arranged on the substrate first side above a fir...  
WO/2020/088909A1
A device includes a first substrate formed of a first material that exhibits a threshold level of thermal conductivity. The threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit o...  

Matches 1 - 50 out of 154,182