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WO/2021/010173A1 |
The wiring module according to an embodiment of the present technology comprises a wiring board and a heat dissipation member. The wiring board has: a body part that has an obverse-surface layer to which an element package is connected, ...
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WO/2021/010320A1 |
Provided is a resin composition for a circuit board that has excellent low dielectric properties and heat dissipation. The resin composition for a circuit board contains a melt-workable fluorine resin and boron nitride particles.
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WO/2021/008592A1 |
Provided are a circuit board assembly, a manufacturing method for a circuit board assembly, and an electronic device, so as to improve the heat dissipation performance of a circuit board assembly. The circuit board assembly comprises a f...
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WO/2021/011628A1 |
The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at...
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WO/2021/010754A1 |
A printed circuit board according to an embodiment comprises: a first insulating layer; a first circuit pattern disposed inside or on the lower surface of the first insulating layer; a second circuit pattern disposed on the upper surface...
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WO/2021/008902A1 |
A composition comprising a monomer of the general formula (M1) wherein M is a metal or semimetal of main group 3 or 4 of the periodic table; XM1, XM2 are each O; RM1, RM2 are the same or different and are each an -CRaRb-Ar-O-Rc; Ar is a ...
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WO/2021/007940A1 |
Provided are a display panel and a method for monitoring the precision of a printed circuit of the display panel. The display panel comprises a color filter substrate (101, 201, 301), a thin-film transistor substrate (100, 200, 300), a m...
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WO/2021/011286A1 |
Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over ...
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WO/2021/011780A1 |
This invention is directed generally to an electrical connector system and particularly to a connector system for interfacing with a circuit card. The card edge connector system includes a socket body that is formed to have a socket ther...
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WO/2021/008965A1 |
The invention relates to an electronic circuit comprising: a printed circuit board (110); at least one first electronic component (120) comprising a face (120f), called the interconnect face, provided with electrical interconnections (12...
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WO/2021/004011A1 |
The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission comprises: a first shielding film, a second shielding film and a circuit board body...
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WO/2021/006080A1 |
According to the present invention, loss due to wiring is reduced. A high frequency module (1) comprises: a mounting board (5), a low-noise amplifier, and an input matching circuit. The mounting board (5) has a first main surface (51) an...
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WO/2021/004493A1 |
A packaging structure and a power amplifier, the power amplifier containing the packaging structure. The packaging structure comprises: a first component (101), a second component (102), a printed circuit board (103) and a metal plate (1...
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WO/2021/004459A1 |
The present application mainly provides an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a core board, provided with a slot; at least one chip, provided in the slot and having a lead-out ...
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WO/2021/006164A1 |
The present invention addresses the problem of providing a composition capable of producing a cured product that improves the peel strength while maintaining heat resistance, also achieves lowering of the elastic modulus, or enables both...
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WO/2021/005863A1 |
A mounting board 1 is equipped with a base insulation layer 4 containing a polyimide, a development accelerator, and a photosensitizer and a first terminal 10 arranged on one surface 4A of the base insulation layer 4. The sum of the cont...
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WO/2021/005916A1 |
This semiconductor device (100) comprises: a first semiconductor element (1) and a second semiconductor element (2) which have electrodes formed on both sides thereof and which are configured to be mountable on a wiring board having wiri...
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WO/2021/006323A1 |
A flexible printed wiring board according to an aspect of the present invention is provided with: a base film; a conductive pattern layered on one surface of the base film; an excess-length absorption part disposed so as to project from ...
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WO/2021/006325A1 |
The flexible printed wiring board according to an embodiment of the present disclosure comprises an insulative base film and an electroconductive pattern laminated on one surface side of the base film, wherein: the flexible printed wirin...
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WO/2021/005278A1 |
Disclosed is an electronic card in the form of a flexible smart card (1) provided with a flexible circuit (20) comprising a bottom face receiving electronic components (3) and a top face provided with contact tabs (10) intended to be con...
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WO/2021/006163A1 |
The present invention addresses the problem of providing a resin composition which exhibits a stress relaxation effect by lowering an elastic modulus and has more favorable adhesion to a copper foil while maintaining the heat resistance ...
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WO/2021/006037A1 |
A first frequency of a high-frequency signal transmitted along a first signal line, and a second frequency of a high-frequency signal transmitted along a second signal line are higher than a third frequency of a high-frequency signal tra...
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WO/2021/006625A1 |
According to certain aspects of the disclosure, an electronic device comprises: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surro...
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WO/2020/236609A3 |
In a method making a flexible electrical conductor, a mask layer (216) is applied to a substrate (210). A portion of the mask layer (216) is removed to expose the substrate (210) in an exposed shape (220) corresponding to the conductor. ...
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WO/2021/002387A1 |
This storage device unit comprises: a substrate that has a main surface, and that has a plurality of laminated wiring layers; and a storage device that has a plate shape having a first surface, the storage device being such that the firs...
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WO/2021/002238A1 |
The present invention inhibits a harmonic component of a signal passing through a relatively low-frequency passband filter from adversely affecting the filter characteristics of a relatively high-frequency passband filter. A high-frequen...
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WO/2021/002200A1 |
This circuit board comprises a first layer having a first circuit and a second layer having a second circuit that is different from the first circuit. The first layer and the second layer are arranged to overlap each other. The second ci...
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WO/2021/000197A1 |
Disclosed in the present application are a fiber optic circuit board and a fabrication method therefor, a multilayer fiber optic circuit board, an optical transmission device, a photoelectric hybrid circuit board, and a signal transmissi...
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WO/2021/002132A1 |
The purpose of the present invention is to suppress abnormal overheating of a circuit pattern while increasing current ratings. A semiconductor module (1) circuit structure is provided with: an insulating circuit board (3) comprising an ...
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WO/2021/002241A1 |
An electronic device having a user-replaceable option installed therein, said device comprising a main board and a flexible printed circuit board that is connected to the main board and has a coupling connector mounted thereon which is c...
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WO/2021/003052A1 |
The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members....
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WO/2021/002157A1 |
The purpose of the present invention is to suppress variations in the potential of a ground terminal. This high-frequency module (1) comprises a mounting board (9), a first circuit element (2), a second circuit element (3), signal termin...
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WO/2021/002374A1 |
In the present invention, a circuit substrate (3) comprises: first and second rigid parts (11, 12) having six metal foil layers; and a thin flexible part (13) having two metal foil layers connecting the two rigid parts. Ground wiring (51...
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WO/2021/002099A1 |
A coil component (1) is attached to a printed board (2), which has an attachment hole formed therein in the thickness direction (mounting direction of coil component (1)), by inserting a portion thereof into the printed board (2). The co...
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WO/2021/002271A1 |
The present invention improves isolation between transmission of TDD transmitted signals and reception of TDD received signals. A radio-frequency module (1) comprises a mounting board (5), a power amplifier, a low-noise amplifier, at lea...
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WO/2021/002296A1 |
The present invention achieves a reduction in the dimension of a mounting board in the thickness direction. This high frequency module (1) comprises a mounting board (9), an electronic component (2), a first chip component (3A), and a se...
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WO/2020/258743A1 |
The present application relates to a millimeter wave active antenna unit and an interconnect structure between PCB boards. The interconnect structure between PCB boards comprises a main board and an AIP antenna module. The main board is ...
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WO/2020/261994A1 |
This composite component has an interposer structure and an electronic component. The interposer structure includes: an Si base layer having a first principal surface and a second principal surface which mutually oppose each other; a rew...
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WO/2020/262891A1 |
A circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer ...
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WO/2020/262345A1 |
The present invention provides a method for producing a wiring board, said method being capable of forming a metal wiring line having excellent conductivity especially on a substrate such as a polymer insulating film that does not have h...
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WO/2020/263678A1 |
A latch configured to secure a module to a panel. The latch includes an outer latch and an inner latch configured to move independently of the outer latch. The outer latch and the inner latch are configured to provide at least two latchi...
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WO/2020/261707A1 |
A method for manufacturing a ceramic substrate having a recess part on the upper surface, the method having: a step for cutting a mother laminate, which is obtained by laminating a plurality of ceramic green sheets, in a direction that f...
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WO/2020/258161A1 |
Provided are a printed circuit board and a method for manufacturing same. According to the printed circuit board of the present invention, a substrate thereof uses a unidirectional non-woven reinforced fiber material as a reinforcement b...
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WO/2020/262015A1 |
Provided are: a low-cost metal-ceramic joined substrate comprising a ceramic substrate and a metal circuit board made of aluminum or an aluminum alloy and directly joined to the ceramic substrate; and a method for manufacturing the same....
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WO/2020/259016A1 |
A printed circuit board assembly and a terminal. The printed circuit board assembly comprises: a first printed circuit board (1) and a second printed circuit board (2), the second printed circuit board (2) being electrically connected to...
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WO/2020/261332A1 |
A conductor base plate (2) provided on a dielectric substrate (1) and having a patch antenna (11) formed therein, and a conductor base plate (4) provided on the surface of a dielectric substrate (5) having a through hole (5a) are connect...
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WO/2020/261920A1 |
A flexible substrate (160) is provided with: a flexible dielectric (1); a first line (141); a second line (142); and ground power (GND). The dielectric (1) has a first surface (161a), and a second surface (161b) opposed to the first surf...
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WO/2020/262450A1 |
Provided are a resin film and a metal-clad laminate for a wiring substrate, which exhibit high transparency and which exhibit excellent heat resistance, dimensional stability, as represented by a coefficient of thermal expansion, flexibi...
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WO/2020/156595A9 |
Provided is a flexible circuit board (10), the flexible circuit board (10) comprising a main body sub-circuit board (100) and a bridge sub-circuit board (200); the main body sub-circuit board (100) comprises a first substrate, as well as...
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WO/2020/258447A1 |
The present application discloses a joined multi-layer circuit board, pertaining to the technical field of printed circuit boards. The joined multi-layer circuit board comprises a first substrate, a second substrate, and a positioning fr...
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