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WO/2019/161121A1 |
In embodiments, a power splitter/combiner includes a first electrically conductive trace included in a first layer; second and third electrically conductive traces included in a second layer; a first via electrically coupled to the first...
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WO/2019/160218A1 |
The present invention provides a polyamic acid composition having excellent storage stability, a manufacturing method for a polyimide film using same, and a polyimide film, the polyamic acid composition comprising an organic solvent and ...
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WO/2019/159505A1 |
Provided is an expandable substrate (101) provided with an expandable base material (1) and a conductor pattern (6) formed on the base material (1). The base material (1) includes a particular layer. The particular layer includes a first...
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WO/2019/159463A1 |
Provided are a substrate connection structure and a substrate connection structure manufacturing method that enable electrically excellent joining between a conductor layer and a metal member and enable prevention of electric corrosion o...
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WO/2019/158805A1 |
A speaker apparatus (20) is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity (24). The speaker apparatus includes a speaker (22) and a speaker ca...
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WO/2019/159678A1 |
This circuit structure 20 is provided with: a substrate 21 which has a conductive path; electronic components 25A-25C which are mounted on the substrate 21; and a terminal block 30 which is in contact with the substrate 21. The terminal ...
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WO/2019/159473A1 |
A method for manufacturing a substrate for a flexible printed wiring board according to one embodiment comprises: a reforming step in which at least one surface of a base film is reformed; and a layering step in which a conductive layer ...
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WO/2019/158806A1 |
A speaker apparatus (20) is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker (22) and a speaker cavity ...
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WO/2019/160216A1 |
The present invention provides a polyamic acid composition which comprises polyamic acid and an organic solvent and has a viscosity of 1,000-10,000 cP, the polyamic acid being generated by a polymerization reaction between at least one k...
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WO/2019/160140A1 |
Provided are a multilayer substrate, filter, multiplexer, high-frequency front-end circuit, and communication device with which it is possible to suppress the occurrence of stray capacitance. A multilayer substrate (1), comprising a diel...
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WO/2019/160287A1 |
The present invention relates to a thermosetting resin composition, for a semiconductor package, having excellent flowability and stiffness, and a prepreg using same. More particularly, provided are a thermosetting resin composition for ...
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WO/2019/159337A1 |
This flexible printed circuit (1) can be bent at a bending part (1a). First and second electrode patterns (3, 4) are provided respectively on first and second main surfaces of a base layer (2). In the bending part (1a), a thermally contr...
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WO/2019/159521A1 |
A multilayer substrate (101) is provided with: a laminated body (10) that is formed by laminating a plurality of insulating base layers (11, 12, 13); and a plurality of conductor patterns (signal conductor (31, 32), ground conductor (41,...
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WO/2019/134031A3 |
An apparatus and method to reliably attach an electronic module to a textile. The overall mechanical assembly of the invention includes: (a) light pipe, (b) top enclosure, (b) magnet, (c) main electronics which contains (d) the main PCB,...
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WO/2019/159407A1 |
Connector terminals (40) are configured from a connector-connection piece (40C) connected to a counterpart-side terminal, a connector-bonding piece (40A) bent from the connector-connection piece (40C) and extending along a substrate (31)...
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WO/2019/160417A1 |
A method of manufacturing a curved electronic device (100) and resulting product. A patterned layer of non-conductive support material (12m) is printed onto a thermoplastic substrate (11) to form a support pattern. An electrical circuit ...
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WO/2019/094373A3 |
The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are ...
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WO/2019/160240A1 |
A flexible circuit board is provided. The flexible circuit board comprises: a base film having an outer lead region defined on either one surface or the other surface thereof; and an outer lead provided in the outer lead region so as to ...
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WO/2019/159549A1 |
This circuit board is provided with a prescribed circuit unit that generates heat and electromagnetic noise, and is fixed to a conductive casing by a conductive screw. The circuit board has: an insulator layer that includes an insulative...
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WO/2019/155829A1 |
Provided is an electrically conductive paste capable of forming a break-proof wiring for an electric circuit and/or an electronic circuit which is less likely to be broken. An electrically conductive paste containing (A) metal-coated par...
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WO/2019/155819A1 |
The present invention discloses a photosensitive composition containing a conductive powder, a photopolymerizable compound, and a photopolymerization initiator. The photopolymerization initiator contains at least two components: (1) 2,4,...
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WO/2019/125047A3 |
The present invention provides a flexible complex substrate and a method for manufacturing the same, the substrate comprising: a first insulating film including one surface on which a first adhesive layer is disposed; and a second insula...
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WO/2019/154993A1 |
A lighting arrangement (10) is disclosed, comprising a substrate (11) for mechanically and electrically connecting at least one light-emitting element (12) thereto. The substrate (11) comprises at least a first side (13) and a second sid...
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WO/2019/156808A1 |
In one embodiment, a flexible circuit board includes: a plurality of facet locations that each correspond to a particular one of a plurality of rigid sensor facets and a particular one of a plurality of rigid display facets. The flexible...
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WO/2019/153121A1 |
A hybrid printed circuit board, comprising a low frequency substrate (10), a high frequency substrate (20), and a monolithic microwave integrated circuit grain (30), wherein the monolithic microwave integrated circuit grain (30) is flip-...
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WO/2019/153427A1 |
A COF monolayer flexible circuit board (1) and a corresponding liquid crystal display. The COF monolayer flexible circuit board comprises: a flexible packaging substrate (10), a bonding area being provided on the flexible packaging subst...
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WO/2019/154498A1 |
The invention relates to a connection device (20). The shape and material composition of the connection device (20) are designed a) to thermally connect the case (2) of a semiconductor chip mounted on a PCB (6) to a supporting structure ...
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WO/2019/156117A1 |
[Problem] An electronic component mounted substrate according to the present invention is provided with: a substrate which comprises a first substrate terminal, a second substrate terminal and an insulating material that is arranged betw...
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WO/2019/156806A1 |
In one embodiment, an electronic display assembly includes a sensor array located on one side of a circuit board; an electronic display array located on an opposite side of the circuit board from the sensor array, and a logic unit layer ...
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WO/2019/156696A1 |
A compact and thermally efficient traction drive motor inverter featuring an integrated printed circuit board carrying both power circuitry and signal circuitry on separate electrically isolated layers without significant electromagnetic...
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WO/2019/154638A1 |
Techniques related to microwave attenuator son high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal c...
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WO/2019/153452A1 |
Disclosed are a printed circuit board and a manufacturing method therefor and an electronic device, the printed circuit board comprising: a core board assembly comprising a first core board and a second core board successively laminated,...
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WO/2019/154822A1 |
A method of manufacturing a multi-layer circuit includes providing a first layer (11, 15) with an insulating substrate (11) and conductors (15, 16). This may ultimately form an external layer for a circuit. A solder mask (30, 31) is appl...
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WO/2019/156284A1 |
The present invention relates to a wireless sound device comprising: a housing having a sound hole formed on one side thereof; a sound output unit provided to the housing so as to output sound via the sound hole; a substrate provided to ...
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WO/2019/153122A1 |
A hybrid printed circuit board, comprising a low frequency substrate (10), a high frequency substrate (20), and a monolithic microwave integrated circuit die (30) mounted on the low frequency substrate (10). The low frequency substrate (...
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WO/2019/148267A1 |
There is provided an implementation in which an electronic component is divided into two parts, one for connection to a circuit, and one for establishing as intimate a contact as possible between the energy-excessive device and an energy...
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WO/2019/151122A1 |
This metal base substrate, in which a metal substrate (10), an insulating layer (20), and a metal foil (40) are laminated in this order, is characterized by having an adhesive layer (30) between the insulating layer (20) and the metal fo...
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WO/2019/150969A1 |
Provided is an electromagnetic wave shielding film 101 including an insulating protective layer 112 and a peeling film 115 covering the surface of the insulating protective layer 112. The peeling film 115 has a transmittance of 20% or mo...
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WO/2019/151752A1 |
The present invention relates to a method for manufacturing a printed circuit board having a test point, and a printed circuit board manufactured thereby, the method being capable of: forming pads having a pitch interval smaller than the...
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WO/2019/151488A1 |
An insulating film (10) comprises: a resin (11) composed of a polyimide, a polyamideimide, or a mixture thereof; and α-alumina single crystal particles (12) having an average particle diameter in the range of 0.3 μm to 1.5 μm, the amo...
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WO/2019/150950A1 |
The purpose of the present invention is to realize a connection terminal unit which can be adequately connected to a terminal connection part of a semiconductor module that includes a semiconductor element, and with which it is possible ...
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WO/2019/149148A1 |
Provided are a printed circuit board (PCB), a manufacturing method for the PCB, and a mobile terminal. The PCB comprises: a PCB body, a groove being formed in a first surface of the PCB body; and a PCB device, the PCB device comprising a...
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WO/2019/150001A1 |
An electronic circuit (4) comprises at least one electrically conductive portion arranged to a substrate (2) and at least one electrical coupling point (5) determined at the at least one electrically conductive portion. The electronic ci...
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WO/2019/151003A1 |
The purpose of the present invention is to provide: a reliable and inexpensive glass core device in which the surface of a glass core forming a TGV is made flat, and sufficient mechanical strength is provided by protecting the surface of...
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WO/2019/151304A1 |
The present invention has: a first substrate having a first main surface, and having an electronic element mounting part, which has a rectangular shape, is located on the first main surface, is composed of an insulator, and has one longi...
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WO/2019/151414A1 |
This electronic circuit comprises: a first printed wiring board (9); second printed wiring boards (10, 30, 50); and third printed wiring boards (20, 40, 60). The second printed wiring boards are mounted so that one edge (10A, 30A, 50A) t...
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WO/2019/150994A1 |
Provided is a resin composition capable of suppressing a decrease in capacitance or a decrease in dielectric constant while maintaining excellent dielectric properties and circuit adhesiveness when used as a dielectric layer of a capacit...
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WO/2019/150861A1 |
Provided is a power conversion device capable of minimizing increases in the size of a system on which the device is mounted. The power conversion device (1) comprises a metal substrate (10) and a terminal (20) mounted on the metal subst...
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WO/2019/150863A1 |
A wiring substrate 1 is provided with a support 10 and an electrical conductor 40 supported on the support 10. The support 10 comprises: a woven fabric 20 woven using weaving yarns 21, 22 each configured by bundling insulating fibers 211...
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WO/2019/150892A1 |
The purpose of the present invention is to reduce insertion loss of a multilayer substrate and an antenna element. A multilayer substrate (1) according to one embodiment of the present invention is provided with a laminated body (140), a...
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