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Matches 1 - 50 out of 146,214

Document Document Title
WO/2018/012616A1
A ceramic circuit board is provided with: a ceramic board with a thickness of not more than 1.0 mm including a first surface and a second surface, the first surface including a first area and a second area; a first metal plate bonded to ...  
WO/2018/012730A1
An electronic device according to various embodiments of the present invention includes: a first rigid substrate on which at least one first module is mounted; a second rigid substrate on which at least one second module is mounted; a fi...  
WO/2018/012013A1
A stretchable substrate (10) is provided with a stretchable base material (20), and a wiring section (41) that is provided on the base material (20), and the wiring section (41) includes a plurality of conductor lines (411) intersecting ...  
WO/2018/012203A1
The present invention addresses the problem of providing a wiring board production method whereby a wiring board having two three-dimensional conductive films arranged facing each other therein can be easily produced. The present inventi...  
WO/2018/011633A1
An underlying recess is provided for component placement beneath Ball Grid Arrays allowing closer proximity for decoupling capacitors and other components. The underlying recess placement of components assists in minimizing reliability i...  
WO/2018/013153A1
A wearable patch capable of wireless communications includes an elastic layer, an adhesive layer under the elastic layer, and a shearable electrode layer that includes: a support substrate comprising one or more openings so positioned to...  
WO/2018/013645A1
A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and plu...  
WO/2018/012759A1
A dual-core planar transformer according to one embodiment of the present invention comprises: a core part having a pair of cores electrically connected to each other; and a base plate part arranged between the pair of cores, and provide...  
WO/2018/012609A1
Disclosed is a method for producing a polyimide laminate, wherein a polyimide film layer is formed on a base by applying a polyimide precursor solution onto the base and heating the polyimide precursor solution thereon. The base is a pla...  
WO/2018/012006A1
This circuit board manufacturing method includes: a step for removing a temporary base material from a circuit formed on the temporary base material; and a step for disposing the circuit on an insulating layer such that the circuit side ...  
WO/2018/012445A1
The objective of the present invention is to provide: a metal-clad laminate which has excellent heat dissipation properties and flexibility, and wherein an insulating layer comprises a graphite sheet as a heat dissipation material and is...  
WO/2018/012760A1
A common-coil planar transformer according to one embodiment of the present invention comprises: a core part having a pair of cores electrically connected to each other; and a base plate arranged between the pair of cores and having a fi...  
WO/2018/011312A1
The invention relates to a composite structure having reconfigurable dielectric characteristics, characterised in that it comprises a composite substrate and a plurality of active loads (21) dispersed in the composite substrate, each act...  
WO/2018/012775A1
The present invention relates to a thermosetting resin composition, a prepreg using the same, a laminated sheet, and a printed circuit board. The thermosetting resin composition comprises: (a) a polyphenylene ether having two or more uns...  
WO/2018/012668A1
The present invention provides a composite substrate for antenna module formation and a method for manufacturing the same, the composite substrate comprising: a first non-magnetic substrate having a first thin copper layer; a second non-...  
WO/2018/012294A1
A waveguide filter circuit (1) which is obtained by mounting a waveguide filter (2) on a mounting substrate (3), and wherein: the waveguide filter (2) is provided with an input/output electrode (22) that is formed on a mounting surface (...  
WO/2018/011195A1
The invention relates to an electronic assembly (2), in particular of an electric motor, having a circuit board (4) which has a current-conducting current path (6) with two mutually spaced-apart current path ends (6a, 6b) which form an i...  
WO/2018/012535A1
The present invention addresses the issue of providing: a method whereby a three-dimensional wiring board having excellent self-support and abrasion resistance properties can be easily produced; and a wiring board. This wiring board prod...  
WO/2018/011269A1
The invention relates to a galvanic separating apparatus, comprising a printed circuit board (3), the printed circuit board (3) comprising a first soldering pad (7), a second soldering pad (8) and a recess (12), whereby the pads (7, 8) a...  
WO/2018/008415A1
Provided are: a curable composition have both low shrinkage during curing and a low modulus of elasticity under high-temperature conditions in a cured product; a cured product of said curable composition; a semiconductor sealing material...  
WO/2018/006831A1
A multi-layer ceramic printed circuit board provided with a heat sink substrate comprising at least one ceramic base PCB board (100) and at least one heat sink substrate (900); the ceramic base PCB board (100) comprises a ceramic base la...  
WO/2018/008410A1
Provided are: an active ester resin having low cure shrinkage and also having a low loss tangent in a cured product; a curable resin composition containing same; a cured product thereof; a printed wiring board; and a semiconductor sealin...  
WO/2018/008125A1
A three-dimensional wiring board comprises: a three-dimensional resin film (1) which has a dynamic viscoelastic property with a storage elastic modulus of not more than 2 × 107 Pa in a saturation region of a glass transition temperature...  
WO/2018/008270A1
Provided are a conductive paste and a method for forming a conductive pattern, which are capable of forming a fine conductive pattern that has sufficient electrical conductivity and good adhesion to a substrate. Specifically provided are...  
WO/2018/007742A1
The invention relates to a modular communication device (1) comprising: - a master element (3) comprising a control unit (6) and N bidirectional electrical control inputs-outputs; - a series of modular elements (2) comprising: o an upstr...  
WO/2018/006819A1
A multi-layer ceramic printed circuit board (50) comprises at least two ceramic base PCB boards (100) covering each other; the ceramic base PCB boards (100) comprise a ceramic base layer (110) for heat conduction and/or dissipation and e...  
WO/2018/006235A1
Provided is a self-repairing flexible printed circuit board and manufacturing method thereof. A substrate of the circuit board is constructed using a self-repairing hydrogel-elastomer based on a dynamic borate ester link. The substrate c...  
WO/2018/008416A1
Provided are: an active ester composition having high curability and excellent performance such as low dielectric properties, etc., in a cured product; a cured product thereof; a semiconductor sealing material using said active ester com...  
WO/2018/008615A1
An electronic device (301) comprises: a first circuit (a circuit substrate (71)); a second circuit (a circuit formed on a mounting substrate (201)); an inductor bridge (101) connecting the first circuit and the second circuit; and a meta...  
WO/2018/008573A1
An electronic device (301) is provided with: a first circuit (circuit board (71)); a second circuit (circuit configured on a mounting board (201)); and an inductor bridge (101A) connecting the first circuit and the second circuit. The in...  
WO/2018/008362A1
A circuit board 20 is provided with: a bus bar 28; a first prepreg 31 overlapping the bus bar 28; and a sheet-like leakage preventing section 33, which overlaps the surface of the first prepreg 31, and suppresses leakage of the first pre...  
WO/2018/008411A1
Provided are: an active ester resin composition which has low shrinkage ratio during the time of curing, and which forms a cured product that has low elastic modulus at high temperatures; a curable resin composition which contains this a...  
WO/2018/008409A1
Provided are: an active ester resin having low cure shrinkage, having excellent dielectric properties, etc., in a cured product, and also having high solvent solubility; a curable resin composition containing same; a cured product thereo...  
WO/2018/008657A1
A sealing film 100 according to the present invention is used for sealing an electronic component mounted substrate 45 that is provided with a substrate 5 and an electronic component 4 mounted on one surface side of the substrate 5, and ...  
WO/2018/008414A1
Provided are: an epoxy resin characterized by having an extremely low dielectric constant and dielectric loss tangent; a curable resin composition containing same; a cured product thereof; a printed wiring board; and a semiconductor seal...  
WO/2018/008643A1
The present invention relates to a resin composition which contains: a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group that has at least two imide bonds; and a catalyst that contains a...  
WO/2018/009150A1
A Method of Fabricating an Electrical Circuit Assembly on a Flexible Substrate A method of fabricating an electrical circuit assembly on a flexible substrate is disclosed. The method comprises: identifying one or more bending-sensitive e...  
WO/2018/008412A1
Provided are: an active ester resin having high heat resistance and moisture-absorption resistance and having excellent dielectric properties, etc., in a cured product; a curable resin composition containing same; a cured product thereof...  
WO/2018/008884A1
A double helical planar transformer according to one embodiment of the present invention can comprise: a core unit having a pair of cores electromagnetically coupled to each other; a substrate unit disposed between the pair of cores and ...  
WO/2018/008624A1
[Problem] To provide an information storage device 1 that does not cause disconnection even when repeatedly bent. [Solution] An information storage device 1 is provided with a lowest-layer substrate 30b and a conductive circuit 18A on th...  
WO/2018/006527A1
Provided is a method for manufacturing a cover film-protected, gold-electroplated and component-inbuilt PCB board, comprising the steps of lamination and stack-up design, inner layer component-mounting surface manufacturing, rapid pressi...  
WO/2018/006894A1
The invention relates to a method for producing an electric component carrier for automobile applications, in particular an electric component carrier for a lock. The electric component carrier is equipped with a conductive track arrange...  
WO/2018/008592A1
[Problem] To provide an adhesive agent composition which exhibits not only adhesiveness to a polyimide film or a copper foil, but also high adhesiveness to a gold-plated copper foil, and superior heat resistance, such as soldering heat r...  
WO/2018/006526A1
Disclosed is a multi-bridging position and small-spacing edge-wrapped printed circuit board, which is mainly composed of a circuit plate (1). A side face of the circuit plate (1) is provided with a metal wrapping edge (3). The metal wrap...  
WO/2018/003391A1
This method for manufacturing a component-embedded substrate comprises: a resist formation step; a patterning step; a first electrode formation step; a resist removal step; a component arrangement step; a substrate formation step; and a ...  
WO/2018/000916A1
A PCB assembly (100) and a mobile terminal having the same PCB assembly, wherein the PCB assembly (100) comprises: a chip (1), a board (2) and a conductive member (3); the board (2) is provided with a grounding point thereon and comprise...  
WO/2018/000921A1
A PCB (100) and a mobile terminal (1000) having the PCB (100). The PCB (100) comprises: a board body (1) and a shielding cover. The board body (1) is provided with a first surface (11) and a sidewall (12) surrounding the periphery of the...  
WO/2018/004273A1
The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using th...  
WO/2018/002092A1
An interconnection system is described including a first printed circuit board, the first printed circuit board including a first portion of a filter, the filter used to communicate a signal between the first printed circuit board and a ...  
WO/2018/003590A1
The heat-curable resin composition according to the present invention is for use in forming an insulating layer of a printed wiring board, and comprises a heat-curable resin, a hardener, and an inorganic filler. The heat-curable resin co...  

Matches 1 - 50 out of 146,214