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Matches 1 - 50 out of 148,916

Document Document Title
WO/2018/188918A1
The invention relates to a printed circuit board assembly (1) for an electronic circuit. The printed circuit board assembly (100) comprises a first printed circuit board (110) having one or more electrically conductive first contact poin...  
WO/2018/189419A2
Multilayer structure (100), comprising a substrate film (102) having a first side and opposite second side, said substrate film (102) comprising electrically substantially insulating material, a number of conductive traces (108) on the f...  
WO/2018/190952A1
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial o...  
WO/2018/190215A1
This imaging element mounting substrate, which is used for the purpose of mounting an imaging element, has a wiring region that is provided with: a first insulating layer; a metal wiring line which is arranged on one side of the first in...  
WO/2018/191708A1
The disclosure provides an insulated metal substrate (IMS) including a substrate having a first side and a second side. The IMS may also include a first dielectric layer on the first side of the substrate. The dielectric layer may includ...  
WO/2018/188924A1
A method for producing an electronic sensor module (10) for measuring at least one measurement value, in particular for a transmission controller, is proposed, wherein the method comprises the following steps: providing a printed circuit...  
WO/2018/190850A1
A circuit board assembly, the assembly including: a first circuit board; a second circuit board; and a functional component with a first side and a second side opposite the first side, the functional component comprising an electrical pa...  
WO/2018/191492A1
Electrically-conductive ink compositions comprising: (i) a particulate, electrically-conductive material; (ii) a carrier liquid; (iii) a polymer binder; and (iv) a microcrystalline cellulose component; methods comprising: (a) providing a...  
WO/2018/190292A1
A resin composition which contains an epoxy resin (A) represented by general formula (1) and a cyanic acid ester compound (B).  
WO/2018/190121A1
A signal via (5) penetrates through a plurality of dielectric layers (L1 to L3) in a stacking direction and connects signal line patterns (3, 4) disposed on both outer surfaces of a stack of a plurality of dielectric layers that are exte...  
WO/2018/191178A1
A modular optical device having a set of optoelectronic modules that enables the device to operate, e.g., as a WDM or multichannel transceiver. In an example embodiment, the set of optoelectronic modules includes a laser module, a modula...  
WO/2018/191103A1
A label adapted to be attached to an item and a system for validating a label are provided. The label contains an identifying portion of a circuit path extending between at least a pair of contact points in which the identifying portion ...  
WO/2018/186223A1
Provided are a metal clad laminated plate and a production method thereof. The metal clad laminated plate is a metal clad laminated plate in which at least a thermoplastic liquid crystal polymer film and a metal sheet are laminated, wher...  
WO/2018/186025A1
A metal-clad laminated board provided with an insulation layer and a metal layer, the insulation layer including a cured material of a resin composition containing a modified polyphenylene ether compound modified at a terminal end thereo...  
WO/2018/186654A1
Disclosed are a printed circuit board for minimizing a production process by filling via holes formed on a flexible substrate and a curing base material with a conductive material and then laminating the same and a method for producing t...  
WO/2018/186030A1
Provided is a resin composition capable of: giving a prepreg which has satisfactory formability and high adhesiveness to the base and is reduced in dusting; and forming a cured object having a low coefficient of thermal expansion. The re...  
WO/2018/186486A1
Provided is a porous low-dielectric-constant polymer film which has a low permittivity with respect to the high frequencies of millimeter waves, while being useful as a sheet for a millimeter-wave antenna and having excellent circuit boa...  
WO/2018/186217A1
Provided are: an iron-nickel alloy electroplating liquid for filling, characterized in that an acetylene alcohol is furthermore contained in the iron-nickel alloy electroplating liquid; a method for filling an opening using the iron-nick...  
WO/2018/184595A1
In an exemplary embodiment, a heat dissipation device is configured to dissipate heat from electronic components on a printed circuit board. The heat dissipation device generally includes a support mechanism comprising a main body and a ...  
WO/2018/186051A1
This method for manufacturing an electronic component is characterized by being provided with: a step for forming, on a substrate, a base layer that has a first metal film comprising Cu, Fe, Ag, or an alloy having any of these as a main ...  
WO/2018/184592A1
The charging circuit provided in the embodiments of the present application comprises: a universal serial bus USB interface, a motherboard, and a battery. The charging circuit also comprises a first charging line for transmitting a curre...  
WO/2018/185859A1
Provided is a protective structure of a semiconductor element, comprising: a circuit substrate (6); a spacer (9) disposed on a first surface of the circuit substrate (6); a semiconductor element disposed on the spacer (9); a heat dissipa...  
WO/2018/186154A1
The present invention is provided with: a multilayer substrate (600) including a plurality of insulator layers; an amplification circuit (110) provided on the multilayer substrate (600), the amplification circuit (110) amplifying a high-...  
WO/2018/185935A1
The invention comprises: a signal line conductor (22) provided on the surface layer of a printed circuit board (100); a signal line conductor (24) extending from the signal line conductor (22) toward a signal pad (21), and forming with t...  
WO/2018/180091A1
Provided is a resin composition that is capable of achieving excellent thermal properties. The resin composition comprises an epoxy compound and a trinaphthylbenzene compound. (Provided that in the trinaphthylbenzene compound, one or mor...  
WO/2018/177796A1
There is provided an electrical arrangement (100), comprising at least one electrical unit (110), which in its turn comprises electrical element(s) (120) with electrical contact point(s) (130a, 130b) and electrically conductive track(s) ...  
WO/2018/181286A1
The present invention provides: a method for producing a prepreg which has small variation in the amount of dimensional change; a prepreg which has small variation in the amount of dimensional change; a laminate; a printed wiring board; ...  
WO/2018/179707A1
The purpose of the present invention is to provide a carboxylic acid group-containing polyester adhesive composition having an excellent sheet life and having sufficiently high wet heat resistance to withstand lead-free soldering under h...  
WO/2018/181083A1
Provided are: a bonding material capable of bonding an electronic component to a substrate with a silver bonding layer in which large cracks are unlikely to form even when being subjected to repeated cooling and heating cycles; and a bon...  
WO/2018/180939A1
The present invention addresses the problem of providing a circuit module in which it is possible to reduce wraparound of noise due to a shield layer, and to improve isolation characteristics between electronic components, while suppress...  
WO/2018/180176A1
To reliably implement an electronic component having exceptional DC superimposition properties. An electronic component (10) provided with an element assembly (20) and coil conductors (301-304). The element assembly (20) is provided with...  
WO/2018/178022A1
The invention relates to a method for producing electrically conductive structures, preferably conducting track structures, by means of laser light on a non-conductive carrier material (LDS method), characterized in that a non-conductive...  
WO/2018/180413A1
This electronic device is provided with a first circuit board (1), a second circuit board (2), and an interposer board (3). The interposer board (3) has a first main surface (MS1) facing the first circuit board (1), and a second main sur...  
WO/2018/181742A1
The present invention provides a method for producing a printed circuit board using a metal-lined laminate plate formed of an insulating resin substrate having metal foil laminated on both surfaces thereof. The method comprises at least:...  
WO/2018/182207A1
An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal l...  
WO/2018/181514A1
Provided are: a prepreg for a coreless substrate, which is able to satisfy heat resistance, low thermal expansion and bonding strength to a metal circuit at high levels required for coreless substrates; and a coreless substrate and a sem...  
WO/2018/179799A1
The purpose of the present invention is to achieve a shield effect against noise radiated from an electronic component in an in-vehicle control device. The electronic control device according to the present invention has: an electronic c...  
WO/2018/179853A1
The purpose of the present invention is to provide a vehicle-mounted control device which is excellent in heat dissipation and capable of effectively increasing the amount of heat transfer from an electronic component and a circuit board...  
WO/2018/183104A1
Systems, methods, and articles for a portable power case are disclosed. The portable power case is comprised of at least one battery and at least one PCB. The portable power case has at least two access ports, at least two leads, or at l...  
WO/2018/181842A1
Provided is a novel soluble polyfunctional vinyl aromatic copolymer capable of giving a cured product or molded body having improved heat resistance, compatibility, dielectric properties, reliability in moist heat and thermal oxidative d...  
WO/2018/182628A1
Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a firs...  
WO/2018/179538A1
This power module is characterized by being provided with a power wiring to which a power element is provided, a glass ceramic multilayer substrate to which a control element that controls the power element is provided, and a highly heat...  
WO/2018/180920A1
The purpose of the present invention is to provide rolled copper foil having excellent vibration resistance. This copper foil is rolled copper foil having a thickness of at least 50 ┬Ám and no more than 10% non-recrystallized crystal gra...  
WO/2018/179682A1
Provided are: a wiring substrate having a low dielectric constant and a low dielectric tangent; and a copper foil having an adhesive agent adhered thereto and a copper-clad laminated plate, each of which is suitable for the production of...  
WO/2018/183787A1
An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal ba...  
WO/2018/181516A1
Provided are: a coreless substrate prepreg; and a coreless substrate, a coreless substrate manufacturing method, and a semiconductor package which use said prepreg. The coreless substrate prepreg comprises a thermosetting resin compositi...  
WO/2018/182756A1
Embodiments of the invention include a mmWave transceiver and methods of forming such devices. In an embodiment, the mmWave transceiver includes an RF module. The RF module may include a package substrate, a plurality of antennas formed ...  
WO/2018/180671A1
In the present invention, a first placement part (23a) of a heat-dissipating body (23) has placed thereon a conductor (22) via an insulating member (24). A FET (4) is electrically connected to the conductor (22). When a current flows acr...  
WO/2018/181523A1
This composite ceramic multilayer substrate comprises: a glass ceramic insulating layer containing a wiring layer; and a high thermal conduction ceramic insulating layer made of a ceramic material with a higher thermal conductivity than ...  
WO/2018/181436A1
Provided is a polyimide film that can be utilized as a flexible printed circuit board, etc. The polyimide film has a dielectric tangent of 0.007 or lower, a water absorption rate of 0.8% or lower, and a linear expansion coefficient at 50...  

Matches 1 - 50 out of 148,916