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Matches 1 - 50 out of 149,689

Document Document Title
WO/2019/011554A1
The invention relates to a reflective composite material (V) which comprises a support (1) consisting of aluminum, an intermediate layer (2) made of aluminum oxide located on one side (A) of the support (1), and a reflection-amplifying o...  
WO/2019/013947A1
An electronic device includes a metal housing having a height greater than a width, four sides that form an inner chamber in a center thereof. Four sidewalls extend from a first back wall form a first chamber located at a first of the fo...  
WO/2019/013143A1
The present invention provides a flexible printed board which has excellent folding properties and is prevented from defects due to disconnection of wiring even in cases where the flexible printed board is repeatedly folded. A flexible p...  
WO/2019/012953A1
A metal-clad laminate which is provided with an insulating layer and a metal foil that is in contact with at least one surface of the insulating layer, and wherein: the insulating layer contains a cured product of a resin composition tha...  
WO/2019/013039A1
The present invention provides: a laminate in which a silver nanoparticle layer (B) and a metal plating layer (C) are laminated in the stated order on a support body (A), the laminate being characterized in that, when the surface of the ...  
WO/2019/013038A1
The present invention provides: a laminated body which has a primer layer (B), a metallic nanoparticle layer (C), and a metal plating layer (D) layered in order on a support body (A), and which is characterized in that the primer layer (...  
WO/2019/011456A1
The invention relates to an optoelectronic device (LV) and a reflective composite material (V) which is to be used in particular in said device and which comprises a support (1) consisting of aluminum, an intermediate layer (2) made of a...  
WO/2019/013440A1
The power supply device according to the present embodiment comprises: a charging unit comprising a rechargeable battery, a flexible substrate, and a wireless charging antenna disposed on the flexible substrate for receiving wirelessly s...  
WO/2019/012909A1
The sensor according to an embodiment of the present disclosure is provided with: a substrate; a sensor element placed on the substrate; a wire electrically connected to the sensor element; and a stretchable member covering the sensor el...  
WO/2019/012954A1
One aspect of the present invention pertains to a resin composition that comprises: a modified polyphenylene ether compound which is terminally modified with a substituent group having a carbon-carbon unsaturated double bond; a crosslink...  
WO/2019/010871A1
Provided are a photosensitive cover film and a preparation method therefor, and a photosensitive cover film product, relating to the field of electronic materials. The photosensitive cover film comprises a protective film (1), a photosen...  
WO/2019/013223A1
Provided is a resin composition for printed wiring board containing: (A) a silicon-containing polymer which contains bonds (a), (b), (c) and (d); (B) a cyanic acid ester compound; (D) an epoxy resin; and a filler (E) (In bonds (a) to (d)...  
WO/2019/012912A1
This wiring substrate is characterized by being provided with: a base material having a mounting surface; a first terminal electrode provided to the mounting surface of the base material; a second terminal electrode that is provided to t...  
WO/2019/012849A1
Provided is an electronic circuit board which allows positional shifting when mounting an electronic component to be prevented with high precision without requiring the presence of excess space in the surroundings of the electronic compo...  
WO/2019/014129A1
A circuit board has a dielectric core, a foil top surface, and a thin foil bottom surface with a foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surfa...  
WO/2019/012679A1
An electronic module, having: a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a second substrate 21 provided on one side of the first electronic element 13; and a positioning part 200, ...  
WO/2019/009259A1
[Problem] The purpose of the present invention is to provide a composition for forming a flexible device substrate, which enables the achievement of a resin thin film that has excellent properties as a base film for a flexible device sub...  
WO/2019/007034A1
Provided are a circuit board, an electrical element and a display device. The circuit board comprises a wiring pad (1), wherein the wiring pad (1) is divided into a plurality of sub-pads (11); bubble discharge paths (2), dividing the wir...  
WO/2019/010403A1
A flashlight having a housing, a light-end assembly, and a user interface. The light-end assembly, which may be coupled to an end of the housing, may comprise a flexible light component having a proximal end and a distal end. A first plu...  
WO/2019/009062A1
This high frequency power circuit module (101) is provided with: an electronic circuit board (1) having a bent portion; a high frequency power circuit formed on the electronic circuit board (1); a battery (3) connected to the high freque...  
WO/2019/009208A1
This heat dissipation substrate (100) comprises a plurality of conductor pattern layers (4, 4A-4D); and an electronic component is mounted on this heat dissipation substrate. This heat dissipation substrate is provided with a plurality o...  
WO/2019/007624A1
The invention relates to a tolerance compensation element for circuit configurations having a DCB (direct copper bonded) substrate (1) and a PCB (printed circuit board) (2) and to a circuit configuration having said tolerance compensatio...  
WO/2019/008876A1
Provided are a laminated body in which wrinkles and interlayer separation are suppressed, a method for manufacturing the same, and a method for manufacturing a flexible printed board in which occurrence of wrinkles and interlayer separat...  
WO/2019/008004A1
The invention relates to a method for producing a via in a carrier layer (1) produced from a ceramic, comprising: providing the carrier layer (1), creating a through-hole (2) in the carrier layer, at least partially filling the through-h...  
WO/2019/007994A1
A charging surface comprising multiple conductive regions can be used to charge an electronic device placed on it the surface so that electrodes on the device engage respective conductive regions of the surface. In order to distinguish s...  
WO/2019/007995A1
A charging surface comprising multiple conductive regions can be used to charge an electronic device placed on it the surface so that electrodes on the device engage respective conductive regions of the surface. In order to distinguish s...  
WO/2019/007715A1
The invention relates to a lighting unit for a vehicle, comprising a light source carrier (10) with an arrangement of data lines (13, 14). The lighting unit also comprises a plurality of light sources (20) positioned on the light source ...  
WO/2019/009631A1
A sensor manufacturing method using a printing process is disclosed. The sensor manufacturing method using a printing process comprises the steps of: forming a first terminal and a second terminal on a substrate; and forming a sensor, el...  
WO/2019/008821A1
The purpose of the present invention is to inhibit dielectric loss while setting the direction of an antenna formed on a flexible substrate. This antenna device is characterized by being provided with: a flexible substrate having, formed...  
WO/2019/009269A1
A flexible printed wiring board according to one embodiment of the present invention is provided with: an insulating base film; a conductive pattern which is laminated on at least the back surface of the base film and comprises a spiral ...  
WO/2019/002623A1
Disclosed in the present application is an apparatus for preparing an electronic element composite electrode, comprising a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing a...  
WO/2019/002007A1
The invention relates to an electrical assembly (1) and to a method for the production thereof. The electrical assembly (1) comprises at least a first component (6) which is formed at least partially from a foamed material. In the method...  
WO/2019/001273A1
The present invention relates to a hole drilling cover plate used for controlling the hole drilling depth of a circuit board, and a processing method and a hole drilling apparatus. The hole drilling cover plate comprises a processing sur...  
WO/2019/003820A1
Provided are: an active ester composition having high curability and exceptional properties such as dielectric properties and heat resistance in the cured product; a cured product of the composition; and a semiconductor sealing material ...  
WO/2019/003671A1
This aggregate substrate (10) has a plurality of slave substrate regions (11), and a plurality of slave substrates are formed by separating the plurality of slave substrate regions (11). An RFIC arrangement region (9) is provided in a re...  
WO/2019/004091A1
Disclosed is an alumina substrate comprising an alumina ceramic that has pores in a surface and contains at least 96% by mass of Al in the form of Al2O3 per 100% by mass of all constituent components of the alumina substrate. The area oc...  
WO/2019/005431A1
A multi-layer spiral inductive array includes a first multi-layer spiral inductor with a second layer matching a spiral pattern of a first layer. The multi-layer spiral inductive array also includes a second multi-layer spiral inductor w...  
WO/2019/005306A1
A smart functional vehicle component includes a vehicle component, a leather sheet fixed over a surface of the vehicle component, a flexible electronic circuit contacting an A-surface of the leather sheet and including a printed and cure...  
WO/2019/003821A1
The purpose of the present invention is to provide an active ester compound having a low elastic modulus under high-temperature conditions in a cured product, a curable composition containing the active ester compound, a cured product th...  
WO/2019/002541A1
The invention relates to a substrate (1) for electrical circuits, comprising at least one paper ceramic layer (2) having a top side and bottom side (2a, 2b), which has a pore structure consisting of a plurality of pore-shaped cavities, c...  
WO/2019/003697A1
This relay is provided with a relay main body (10) that has: a base section (20) having a first surface (21); and a relay substrate section (30), which extends, in the direction intersecting the first surface (21), from a second surface ...  
WO/2019/000890A1
Provided are a shielding type rigid-flex board and a manufacturing method therefor. The shielding type rigid-flex board comprises a flexible core board (10), a first covering film (21), a second covering film (22), a first rigid core boa...  
WO/2019/003823A1
The purpose of the present invention is to provide an active ester compound having a low elastic modulus under high-temperature conditions in a cured product, a curable composition containing the active ester compound, a cured product th...  
WO/2019/002567A1
The invention relates to a device (22) and to a method for producing an electrical connecting contact (6) on a coated metal sheet (1), the coating (2) of which metal sheet has at least one electrical conducting track (4) covered by an el...  
WO/2019/003502A1
A base surface for a plurality of wires has steps in a second region, the steps including a plurality of upper surfaces with mutually different heights arranged side by side in a second direction and risers that rise from each of the plu...  
WO/2019/002008A1
The invention relates to an electric assembly (1) comprising a sensor device (10) and to a method for controlling an electric assembly (1). According to the invention, measurement data provided by a control device from the sensor device ...  
WO/2019/004223A1
This organic insulator has an organic resin phase as a main component, and a weathering stabilizer is included in the organic resin phase. The organic resin phase includes an inner area and a surface area, which is formed on at least one...  
WO/2019/000594A1
Disclosed are a circuit board (10, 30) and a display device (100), wherein the circuit board (10, 30) comprises a metal foil layer (11) and an insulating layer (20); the metal foil layer (11) is provided on a surface of the insulating la...  
WO/2019/002059A1
There is provided an apparatus comprising: a base substrate and a component substrate having at least two electronic components arranged thereon. At least one aperture is formed through an entire thickness of the component substrate. The...  
WO/2019/006063A1
A multi-layer circuit board is formed by positioning a top sub having traces on at least one side to one or more pairs of composite layers, each composite layer comprising an interposer layer and a sub layer. Each sub layer which is adja...  

Matches 1 - 50 out of 149,689