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WO/2023/173622A1 |
The present application discloses a stably switched negative-pressure liquid cooling system. A gas extraction pipeline (11) of a gas circuit (1) is used for extracting gas to form negative pressure, and a gas conveying pipeline (12) is u...
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WO/2023/176417A1 |
This power supply device comprises: a battery cell; a circuit substrate provided with a substrate-side connector; a lead wire connected to the substrate-side connector; an opening case that stores the battery cell, the lead wire, and the...
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WO/2023/177474A1 |
A power supply module including a substrate, an electronic component provided on an upper surface of the substrate, a lower board electrically connected with the electronic component through the substrate, and an upper board electrically...
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WO/2023/176522A1 |
Provided is a semiconductor device capable of improving cooling efficiency by a Peltier effect element. The semiconductor device comprises a semiconductor element, a Peltier effect element mounted on a first surface of the semiconductor ...
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WO/2023/177292A1 |
The invention relates to an electric bicycle, comprising a bicycle frame, and one or more control units at least partially accommodated within said bicycle frame. The invention also relates to a control unit for use in such an electric b...
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WO/2023/177156A1 |
The present invention relates to a touch screen device improved such that heat inside a panel of the touch screen device is forcibly circulated so as not to be stagnated, so that a blackout phenomenon is prevented and also, power loss is...
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WO/2023/173471A1 |
Provided are a combined evaporator vapor chamber and a machining method therefor. The vapor chamber comprises an upper cover plate (1), a lower cover plate (2), an evaporator (3), a capillary structure and a support structure (5), wherei...
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WO/2023/169116A1 |
The present disclosure relates to a case, an electronic device and a case exhaust method. The case comprises: a housing, which forms an accommodation cavity configured to accommodate a cooling liquid and a heat generation component immer...
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WO/2023/169286A1 |
The present disclosure relates to a server cabinet and a data center. The server cabinet comprises a sealed cabinet body (10), an IT equipment unit (20), a liquid-air heat exchanger (30) and a fan (40), the IT equipment unit (20), the li...
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WO/2023/172223A1 |
The present invention is related with improvement of heat transfer performance of a plug-in unit by implementing phase change mechanism into the cover/frame (definitions are taken from family of ANSI/VITA standards e.g.). Especially for ...
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WO/2023/168488A1 |
A data logger (100, 3100) comprising a sensor interface for connecting at least one sensor or actuator to the data logger (100, 3100); an accessible memory (SD card) for storing data received from said at least one sensor or actuator; an...
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WO/2023/171529A1 |
This cooling device comprises a liquid-cooled jacket and a heat-dissipating member. The heat-dissipating member includes: a planar base portion that extends in a first direction along which refrigerant flows, and in a second direction or...
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WO/2023/169709A1 |
The invention relates to a fluid circulation device comprising a casing (2) containing an electric machine (3), a cycle-gas circuit (5) subjecting the cycle gas to a change between a minimum pressure and a maximum pressure, a cycle-gas d...
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WO/2023/170893A1 |
This method for manufacturing a substrate cooling structure (1) includes: a step for disposing a lower substrate (3), having a lower connector (31) on an upper surface thereof, on a bottom surface of a housing (2) having an opening (21) ...
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WO/2023/170750A1 |
A lead support device (1) comprises: a rail (11) positioned with respect to an object (20) and extending in a first direction (X); a movable part (12) that can move along the rail (11) in the first direction (X); a support part (13) that...
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WO/2023/171904A1 |
An electronic device according to an embodiment comprises: a first housing; a second housing; a display which can be extended out of or retracted into an inner space; a first printed circuit board which is disposed in the second housing;...
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WO/2023/171227A1 |
A locking mechanism (10) is attached to an exterior body for housing an electronic apparatus and comprises a latch (20) and a bumper (30). The latch (20) has a first flat plate (21), which has a main surface (22), and a first protrusion ...
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WO/2023/172470A1 |
A modular serviceability sled includes a frame, subassembly, interconnection, gasket, and shielding component. The interconnection is operatively connected to the subassembly and includes an electrical, pneumatic, and/or hydraulic connec...
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WO/2023/171907A1 |
Disclosed are a fluid channel module and a power device including same. A fluid channel module according to an aspect of the present invention may include: a fluid channel division member communicating with a space of a housing to allow ...
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WO/2023/170671A1 |
A system and methods are provided for controlling data center heat reuse. The system includes multiple evaporators units (EUs), each configured to operate as a two-phase evaporator, each EU affixed to a central processing unit (processin...
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WO/2023/171532A1 |
This thermoelectric conversion module comprises: a substrate that has a first main surface and a second main surface; a thermoelectric conversion part that is located on the first main surface; and a first thermal conduction part and a s...
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WO/2023/172602A1 |
Apparatuses, systems, and methods are provided for an electrically isolating thermal interface device. The system may include a power source, a thermal dissipation element, and a thermal interface module coupleable between the power sour...
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WO/2023/169313A1 |
Disclosed in embodiments of the present disclosure are a heat dissipation device for an electronic apparatus and an electronic apparatus. The heat dissipation device for the electronic apparatus can comprise: a substrate, a liquid coolin...
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WO/2023/166307A1 |
A module, used in cooling one or more heat generating components, comprises: a heat exchanger, having a plurality of ports for flow of a primary coolant carrying heat from the one or more heat generating components and for flow of a seco...
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WO/2023/167086A1 |
Provided are a cooling device and a cooler that is capable of causing boiling at a low superheat by suppressing an increase in a boiling starting point. The cooler uses a boiling method for cooling a heating element, and comprises: a con...
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WO/2023/167422A1 |
Disclosed are a slot member and a power electronic device including same. A slot member according to an aspect of the present invention may comprise: a slot body on which a capacitor assembly is seated and which supports the capacitor as...
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WO/2023/167087A1 |
Provided are a cooling member having a favorable cooling effect, a cooler, a cooling device, and a cooling member manufacturing method. The cooling member comprises integrally formed electrolytic metal foils constituted by a double-layer...
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WO/2023/165404A1 |
Embodiments of the present application relate to the technical field of outdoor base stations, and particularly disclosed is an unmanned aerial vehicle base station. The unmanned aerial vehicle base station comprises: a first shell, a pl...
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WO/2023/167959A1 |
Actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the print...
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WO/2023/165555A1 |
A fan structure and an electronic device, the fan structure being capable of ventilation and heat dissipation for the electronic device. The fan structure comprises a fan support, a fan body and a connector assembly, the fan body being e...
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WO/2023/159966A1 |
The present application discloses a heat dissipation module and a heat dissipation device. The heat dissipation module (100) comprises a heat dissipation fin bodies (110) and at least two loop channels (121) arranged on the heat dissipat...
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WO/2023/160109A1 |
Provided in the embodiments of the present application are a heat dissipation device and an electronic apparatus. The heat dissipation device comprises a housing and a fluid working medium, wherein the housing internally comprises evapor...
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WO/2023/161015A1 |
The invention relates to a modular field device (1) which can be manufactured safely and which comprises the following components: Two electronic modules (12, 13), the first electronic module (12) being secured in the housing interior (1...
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WO/2023/162029A1 |
A drive device (1) comprises: a substrate (2) having a conductor portion; a power module (3) spaced apart from the substrate (2) in a first direction that is the plate thickness direction of the substrate (2); and a metal member (4) that...
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WO/2023/161924A1 |
A sustainable system of energy-intensive facilities (e.g., crypto-currency mining, data center, Al system, etc.) where the heat generated by the system is used to warm greenhouses to grow crops sustainably. According to an embodiment of ...
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WO/2023/162679A1 |
The present invention achieves both heat dissipation and maintenance performance at a high level. A servo driver (10) comprises: a case (20) having a first space (S1) and a second space (S2) therein; a heat sink (40) that is accommodated...
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WO/2023/163423A1 |
The present invention relates to a ceramic substrate unit and a method for manufacturing same, the ceramic substrate unit comprising: a ceramic substrate comprising a ceramic base material and metal layers provided at the upper and lower...
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WO/2023/162413A1 |
A cooler (1) comprises: a plate (1A) that has one main surface having formed therein a mounting part for mounting a heat-generating element (7) to be cooled, and a plurality of recesses (11) formed in a main surface (20) opposite to the ...
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WO/2023/161121A1 |
A mechanism for providing ingress protection for an electrical device. A protective element is coupled between an electrical element and a support element supporting the electrical element. Potting material covers exposed areas of the el...
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WO/2023/160962A1 |
The invention relates to an exchangeable electronics assembly (25) of a motor vehicle, comprising at least one circuit board (38, 40) with at least one electronics component (44) to be cooled arranged on the circuit board (38, 40), at le...
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WO/2023/160393A1 |
A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surfa...
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WO/2023/159391A1 |
A system includes a first base, a second base, a cable, and a control portion. The first base has a first heating element configured to heat a first functional component to increase the temperature of a fluid within the first functional ...
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WO/2023/162880A1 |
This battery cut-off unit (1) is provided with: a relay (10); a bus bar (31) connected to a terminal (11) of the relay (10); a heat sink (41); and an insulating sheet (61) which is disposed between a cooling device (50), which is a water...
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WO/2023/163200A1 |
Provided is a vapor chamber that not only has resistance to pressure from the external environment but is also highly resistant to pressure from within the vapor chamber.　The vapor chamber comprises: a container in which a hollow porti...
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WO/2023/160498A1 |
Disclosed in the present application are a head-mounted display device and a heat dissipation method therefor. The head-mounted display device comprises: an device body, the device body comprising a front housing region, a temple region ...
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WO/2023/162881A1 |
This battery cut-off unit (1) is provided with: a fuse (20); a bus bar (32) connected to a terminal (21) of the fuse (20); and a heat sink (42) that is in contact with the terminal (21) of the fuse (20), wherein the terminal (21) of the ...
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WO/2023/161445A1 |
Embodiments herein relate to a heat sink for a radio unit. The heat sink (200) comprises a base (201) having a surface and a central longitudinal axis (Al), the surface comprising a first portion (202) and a second portion (204) disposed...
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WO/2023/160963A1 |
The invention relates to a device with exchangeable electronics assemblies of a motor vehicle, comprising at least one housing (11), in order to at least partially enclose the electronics assemblies (25) that can be exchanged in an inser...
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WO/2023/162468A1 |
Provided is a heat transport device that can prevent dry-out of working fluid in an evaporation unit even under a use condition in which a heat-generating body having a large volume of heat generated is thermally connected, or under a us...
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WO/2023/162527A1 |
[Problem] To provide a technology by which an electronic apparatus case can be made lighter while ensuring electromagnetic compatibility and heat dissipation properties thereof. [Solution] This electronic apparatus case is provided with ...
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