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WO/2024/035338A1 |
A computer room cooling system including a plurality of bifurcated heated air return pathways for heated air generated by a plurality of server rack rows 15C operating in a computer room 15 with a false ceiling plenum 16 and a heated air...
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WO/2024/035235A1 |
An electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; a hinge structure connected to the first housing and the second housing to enable the first housing and the second...
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WO/2024/033203A1 |
The invention relates to a cooling system (100), preferably for a motor vehicle, preferably an autonomous or semi-autonomous driving motor vehicle, having a first and a second cooling circuit (10, 20), which are or can be thermally conne...
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WO/2024/031161A1 |
The present utility model relates to a structural arrangement for a power supply with a double fastening system, which is intended to overcome the disadvantages of the prior art by means of a power supply (100) for low-voltage LED light ...
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WO/2023/246423A9 |
A heat dissipation film, a display module and a display device, which relate to the technical field of displays. The heat dissipation film comprises a foam tape layer, and a metal layer, which is laminated on a side of the foam tape laye...
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WO/2024/032146A1 |
The present disclosure belongs to the technical field of display screens, and relates to a casing frame (1) and an LED display screen. The casing frame (1) comprises a frame border (11), the frame border (11) comprising a plurality of co...
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WO/2024/034632A1 |
A vapor chamber according to the present disclosure comprises: a vapor chamber body that has a first surface, a second surface positioned opposite the first surface, and an inner space portion that is positioned between the first surface...
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WO/2024/033202A1 |
The invention relates to a cooling system (100), preferably for a motor vehicle, comprising a battery cooling circuit (10) for cooling a battery device (12) and comprising power electronics (21), preferably for processing data for an aut...
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WO/2024/034291A1 |
The present invention suppresses the occurrence of a deviated flow distribution in a cooler and the increase in pressure loss. A cooler (10) comprises, inside a container (14): a first flow path (14e) disposed parallel with a first sid...
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WO/2024/033153A1 |
The present invention relates to a sled (10, 70, 80, 84) for an orthogonal-direct, OD, chassis (90, 100), comprising: a frame (12); a plurality of connection elements (14) for establishing an OD connection with one or more other sleds of...
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WO/2024/034279A1 |
This heat dissipation device 1A comprises: a casing 100 which has a first inner surface 10a and a second inner surface 10b opposite one another in a thickness direction T and is provided with an internal space; a working medium 20 which ...
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WO/2024/031409A1 |
A vehicle-mounted display device (10) and a control method therefor. The vehicle-mounted display device (10) comprises a display main body (11) and a heating structure (12); the display main body (11) is provided with a bending area (11a...
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WO/2024/028146A1 |
The invention describes a technology for dissipating heat from an electrical circuit. According to one aspect, a device (100) comprises a heat sink (110) and at least one heat transfer module (120). The heat sink (110) has a heat sink ba...
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WO/2024/028065A1 |
The invention is about a refrigerant module for a thermal management system, comprising a first refrigerant distribution unit (RU-1), and a second refrigerant distribution unit (RU-2), each of the first and second refrigerant distributio...
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WO/2024/026980A1 |
Embodiments of the present application provide a heat dissipater module, comprising a heat dissipater and a fastener used for fixing the heat dissipater to a corresponding heating body. Slots are symmetrically formed on the outer surface...
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WO/2024/029008A1 |
An electronic control device (1) comprises: a housing (2) in which a circuit board (6) is sealed and accommodated; a first heat dissipation fin (21a) provided to the lower surface of the housing (2); a second heat dissipation fin (22a) p...
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WO/2024/027698A1 |
Provided in the embodiments of the present application is a foldable device. A first shell and a second shell of the device are rotationally connected by means of a rotating shaft mechanism; and a first cavity is formed between a flexibl...
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WO/2024/027303A1 |
The present application provides a heat dissipation device and an electronic apparatus, which are used for improving the efficiency of heat conduction between the heat dissipation device and a hard disk, thereby improving the heat dissip...
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WO/2024/027543A1 |
A cooling medium distribution device (120), a heat dissipation cabinet and a server system (100). The cooling medium distribution device (120) comprises: a first heat exchanger (121), a second heat exchanger (123), a liquid storage tank ...
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WO/2024/029311A1 |
This composite material is plate-shaped and has a first surface and a second surface that is a surface opposite to the first surface. The composite material comprises a plurality of first layers and at least one second layer. The first s...
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WO/2024/027984A1 |
The invention relates, inter alia, to a power module (1) having an AC connection side (2) and a DC connection side (3) opposite from the AC connection side (2), the power module (1) also comprising: - a printed circuit board (4), - at le...
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WO/2024/027261A1 |
Provided in the present application are a blind-mate connector and a liquid cooling device. The blind-mate connector is configured to be in insertion connection with an apparatus to be cooled. The blind-mate connector comprises a floatin...
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WO/2024/027778A1 |
Provided in the embodiments of the present application is an electronic device. In the electronic device, a metal structural member and a circuit board are stacked and spaced apart, a first conductive member being located between the cir...
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WO/2024/028082A1 |
A fan device consists of at least - an electric fan (10), - a printed circuit board (12), and - a fastening device (14). The fan (10) is fastened to the printed circuit board (12) and can be supplied with electric current by the printed ...
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WO/2024/028837A1 |
Embodiments of the present invention provide a heat dissipator module, comprising a heat dissipator and a fastener for fixing the heat dissipator to a corresponding heating element, wherein outer surfaces of side walls on two opposite si...
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WO/2024/021766A1 |
Disclosed are an ultrathin grounding heat dissipation assembly and a test base. The ultrathin grounding heat dissipation assembly comprises a metal grounding heat dissipation block (1). The metal grounding heat dissipation block (1) is p...
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WO/2024/025273A1 |
A heat sink structure according to the present invention comprises: a cover plate having one surface on which a printed circuit board provided with a heat generating element is mounted to receive heat from the heat generating element; an...
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WO/2024/021919A1 |
The present disclosure provides an electronic device module. The electronic device module comprises a module main body and at least one slide roller assembly. The module main body comprises at least one insertion guide portion having a g...
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WO/2024/024372A1 |
This semiconductor device comprises a first semiconductor element, a second semiconductor element, a support substrate, and an encapsulating resin, the semiconductor device further comprising a heat radiation member that is located on a ...
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WO/2024/024763A1 |
Provided is a heat sink with which it is possible to reduce pressure loss occurring when cooling air flows along a heat-dissipating fin while ensuring exceptional heat exchange performance in the heat-dissipating fin. A heat sink havin...
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WO/2024/022637A1 |
The invention relates to a cooling device (10) for a vehicle assembly (2) to be cooled, having at least two stiff outer shells (12), which each have a circumferential connecting region (12.1), and an expandable foil core (14) which has a...
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WO/2024/022606A1 |
The invention relates to a cooling system (1) for the liquid immersion cooling of electronic components (2), the cooling system comprising - a vessel (3), the interior of which can be filled with two-phase heat transfer fluid (4), in the...
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WO/2023/246335A9 |
The embodiments of the present application relate to the technical field of heat dissipation. Provided are a vapor chamber and an electronic apparatus. The heat dissipation capability of the vapor chamber can be improved. The vapor chamb...
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WO/2024/021794A1 |
The present application provides a circuit board, which comprises a circuit substrate, a heat conduction block and an electronic component electrically connected to the circuit substrate. A surface of the circuit substrate has an inwardl...
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WO/2024/025144A1 |
An electronic device according to one embodiment comprises: a first housing; a second housing which includes a front cover and a rear cover and which can slide with respect to the first housing; a flexible display sliding into the first ...
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WO/2024/024792A1 |
The present invention provides a drive unit comprising a motor 10, an inverter 20, a housing 30 that houses the motor 10 and the inverter 20, and a partition member 40 provided between the motor 10 and the inverter 20, the partition memb...
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WO/2024/025197A1 |
This wearable electronic device may comprise: a bracket; a printed circuit board at least partially facing a first surface of the bracket; an acoustic sensor structure arranged on a second surface of the bracket; a biometric sensor struc...
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WO/2024/022763A1 |
The invention relates to a method for producing a heat sink (1). In the method, a main body (3) is first of all produced with at least one main cooling channel (5, 7) which runs from a first outer surface (9) of the main body (3) to a se...
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WO/2024/023195A1 |
The invention relates to a current converter (IV), having: - a plurality of functional base modules (FB), which each form a half-bridge with a positive-voltage-side semiconductor switch (T1) and a negative-voltage-side semiconductor swit...
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WO/2024/022215A1 |
The present disclosure provides a data center cooling system, a computer room, and a method. The system has a first channel and a second channel, and comprises: a stacked structure located between the first channel and the second channel...
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WO/2024/025283A1 |
The present invention provides a DIN rail for securing electronic components, the DIN rail preventing electronic components from contacting a fluid containing moisture as a result of condensation occurring from a rapid environmental chan...
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WO/2024/021722A1 |
The present invention discloses a vapor chamber having two-phase flow circulation of different working fluids, comprising a first groove and a second groove which are staggeredly arranged in parallel, the first groove and the second groo...
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WO/2024/023316A1 |
The invention relates to a thermal management system (1, 1a, 1b, 41, 51, 61) comprising a fluid cooling circuit (2) comprising a cooling channel (3) in a thermal load (4), a cooling pump (5) arranged to circulate cooling fluid inside the...
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WO/2024/024143A1 |
The present invention includes: a rail (2) having an upper rail engagement portion (2b) and a lower rail engagement portion (2c) at both ends in a width direction; an electric device (1) in which an upper device engagement portion (6) an...
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WO/2024/021612A1 |
A fan set, a heat dissipation apparatus, and an electronic device. The fan set comprises at least two fans (1); the axes of the fans are parallel to each other; each fan comprises fan blades (12) and an air guide ring (11) spaced apart f...
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WO/2024/024712A1 |
Provided is a heat sink in which the thermal resistance when heat is transmitted from a heat-generating body to a heat-receiving part of a heat pipe is reduced, thereby making it possible to exhibit exceptional cooling characteristics ev...
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WO/2024/021719A1 |
The present application discloses a vapor chamber and an electronic device. The vapor chamber comprises a first cover plate and a second cover plate, the second cover plate is snap-fitted to the first cover plate to form a sealed cavity,...
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WO/2024/023751A1 |
Air conditioning unit (1) for a structure (B) defining a space (S) to be conditioned, the air conditioning unit (1) comprising a structure (2) comprising a lateral wall (2') and a pair of terminal walls (2'', 2''') connected together to ...
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WO/2024/024285A1 |
One aspect of the present invention is an electronic endoscope processor, the processor being provided with: a housing; a partitioning plate which partitions an internal space in the housing into a lower first space and an upper second s...
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WO/2024/025215A1 |
Provided are a heat sink and a manufacturing method thereof, wherein a heat sink body and a plurality of heat dissipation fins are each manufactured separately, and then the plurality of heat dissipation fins are fixed to the heat sink b...
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