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Matches 1 - 50 out of 116,011

Document Document Title
WO/2018/128052A1
This heat radiation device is provided with: a housing that can be sealed; a heating element disposed inside the housing and generating heat; a heat radiation part that radiates heat of the heating element inside the sealed housing; and ...  
WO/2018/128783A1
A method of cooling a rack of heat dissipating components comprises cooling air, and porting the cooled air into a volume in front of the rack from above the volume. The method further comprises moving the cooled air from the volume in f...  
WO/2018/128451A1
Disclosed is a resilient contact terminal having a structure that can be applied to various purposes. The contact terminal has: a base; a plurality of bridges of which one end is connected to the base, is spirally wound and extends in up...  
WO/2018/128083A1
The present invention provides a highly reliable stereo camera in which it is possible to prevent the heat generated by an image processing element from contributing to an increase in the temperature of an image sensor, even if the stere...  
WO/2018/128305A1
A portable communication device is provided. The portable communication device includes a battery, a printed circuit board including one or more circuit devices driven using power from the battery, and a bracket including a first area fo...  
WO/2018/127436A1
The disclosure relates to an attachment member (1) for interconnection of a first board (51) and a second board (52), wherein at least one of the boards (51, 52) is a circuitry board, the attachment member (1) comprising a base portion (...  
WO/2018/127978A1
A controller (1) of the present invention is provided with: an attachment member that is fixed to an object to be installed while a cable pull-out part provided on the object to be installed is exposed; and a housing that has a back surf...  
WO/2018/128856A1
Systems and methods for grounding power generation units with silicon carbide MOSFET power converters are provided. A power generation unit can include a power generator configured to generate multiphase alternating current power at a fi...  
WO/2018/123380A1
[Problem] To provide a heat dissipation component which is for a semiconductor element, which has a high thermal conductivity and a linear expansion coefficient close to that of a semiconductor element, and which is highly reliable and h...  
WO/2018/123370A1
Provided is a semiconductor device which has excellent heat dissipation properties and excellent electromagnetic wave suppressing effect. In order to solve the above-described problem, a semiconductor device 1 according to the present in...  
WO/2018/119839A1
A printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink (206) for circuit components (204) electrically and mechanically attached to the PCB is disclosed. The conducti...  
WO/2018/123119A1
This electronic device is provided with: a casing; an antenna element (21a); a heat source; a heat radiation part (16); a heat conduction part (15); a cooling fan; an exhaust port (40); and an exhaust duct (19). The casing has: a pair of...  
WO/2018/123387A1
A radiator (6) for a liquid cooling type cooling device comprises: a plurality of fin plates (14); and coupling members (15) that integrally couple all the fin plates (14). The fin plates (14) each comprise a longitudinally long rectangu...  
WO/2018/122336A1
A fluid-based cooling element (10) for cooling a heat generating element (202, 204) arranged on a printed circuit board (PCB) (200) comprises a fluid chamber (42) for receiving a cooling fluid, a movable body (22) being in fluidic contac...  
WO/2018/124599A1
Disclosed is a display apparatus including a display panel on which an image is displayed. The outdoor display apparatus may include a light source module including a light source configured to generate light, and disposed behind the dis...  
WO/2018/125125A1
A system-in-package apparatus includes a square wave lead frame that provides a recess for a first semiconductive device as well as a feature for a second device. The system-in-package apparatus includes a printed wiling board that is wr...  
WO/2018/120718A1
An air box (100), comprising: a housing (1) and a plurality of support members (2), the plurality of support members (2) being spaced apart from each other and openly disposed inside the housing (1), and each support member (2) comprisin...  
WO/2018/119925A1
A heat dissipation device for a terminal apparatus, the heat dissipation device comprising a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the phase change material so as to transfer the ...  
WO/2018/126216A2
A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a gr...  
WO/2018/124317A1
The present invention relates to a heat-radiating graphene sheet and a manufacturing method therefor, and more specifically, to a heat-radiating graphene sheet which is thin, has excellent durability, notably enhanced thermal conductivit...  
WO/2018/119736A1
An electronic governor (100), comprising: a shell and a circuit board (130) arranged in the shell. The circuit board (130) comprises an upper surface (130a) and a lower surface (130b) arranged on the back of the upper surface (130a) and ...  
WO/2018/124288A1
This power supply device (100-1) is provided with: a substrate (20) on which an electric component (25) is mounted; a chassis (10) which has a chassis surface (11) that faces one surface (20a) of the substrate (20); and an insulating fat...  
WO/2018/119859A1
A head-mounted display device (100) comprises a housing (1), a heating element (2), and a fan (3). An accommodating chamber (10) is formed in the housing. The housing comprises a top plate (11) and a bottom plate (12) that are disposed o...  
WO/2018/121533A1
The present invention relates to a heat sink comprising a substrate and multiple fins, wherein a base portion of the fins is connected to the substrate. A heat-receiving area, a descending pipe and an interval zone therebetween are forme...  
WO/2018/125974A1
Provided herein are various split heat sinks. In one approach, a heat sink apparatus includes a first heat sink coupled to a second heat sink, and a membrane coupled to a first side of the first heat sink and disposed between the first h...  
WO/2018/118927A1
An assembly for transferring RF signals from antenna contact pads on a printed circuit board includes a first printed circuit board, at least one conductive contact attached to the first printed circuit board, an RF connector attached to...  
WO/2018/116634A1
This optical module includes: a first base member; a second base member that is provided by being spatially separated from the first base member; a first laser, which is disposed on the first base member, and is configured so as to outpu...  
WO/2018/119203A1
A heat exchanger for an equipment cabinet may include an air-to-air heat exchanger having an outdoor air inlet and an outdoor air outlet for transferring heat from the equipment cabinet. The heat exchanger may include a water deflector, ...  
WO/2018/117534A1
The present invention relates to an apparatus for cooling a power device of a power conditioning system. To this end, in the present invention, the power device, an evaporation part butted to the power device, and a condensation part con...  
WO/2018/116606A1
This bus bar unit is provided with a plurality of bus bars, and a resin substrate that supports the bus bars. The bus bars are placed on the same surface of the resin substrate, and fixed to the resin substrate.  
WO/2018/118083A1
An example apparatus includes a bracket having a rack attachment member and a guard attachment member, and upper and lower engagement tabs that are coupled to the rack attachment member and have a stem portion and a head portion. The rac...  
WO/2018/117962A1
According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surfa...  
WO/2018/118036A1
In an example, a retainer may include a post to insertably engage with a post receptacle on a system board, and a hook hingeably attached to the post. The hook may be movable from a first position, lateral to a longitudinal axis of the p...  
WO/2018/115708A1
The invention concerns a protective belt (11) for an electronic power module, the protective belt (11) comprising: a closed frame (111) made of an electrically insulating material and defining a central opening (112) the edges (1111, 111...  
WO/2018/116942A1
This temperature conditioning unit includes a first temperature conditioning unit, a second temperature conditioning unit, and a blower (centrifugal blower). The first temperature conditioning unit includes a first housing, a first air p...  
WO/2018/115185A1
The invention relates to a security arrangement (10) adapted to improve heat dissipation from circuit board components (12, 14, 16, 18, 20) on a computer circuit board (22), wherein a plurality of said circuit components (12, 14, 16, 18,...  
WO/2018/117621A1
Disclosed herein is a display apparatus. The display apparatus includes a display panel, a display chassis configured to support the display panel, and a cover provided on a rear side of the display chassis. The cover includes a cover bo...  
WO/2018/114164A1
The invention relates to a holding frame (2) for attaching a printed circuit board (1) to a housing (6), the holding frame comprising the following: a support structure (3) for the printed circuit board (1); at least one press-in protrus...  
WO/2018/115725A1
The invention concerns a protective belt (100) for an electronic power module, a bearing face (120) of the protective belt (100) being intended to bear against a face of a substrate of the electronic power module, the bearing face (120) ...  
WO/2018/114284A1
The invention relates to a cover-securing means for a transmitter housing (1) of a field device in automation technology, wherein the transmitter housing (1) is closed by a screwed-on cover (2), comprising: a securing pin (3) having a sc...  
WO/2018/118325A1
Discussed generally herein are devices that include a switchable heat path. A device can include a device skin, a circuit board, a plurality of components on the circuit board, and a switchable heat path situated between the components a...  
WO/2018/117367A1
The present invention relates to a heat dissipation sheet and, more particularly, to a heat dissipation sheet including double insulation layers having a low hardness insulating heat dissipation layer and a high heat dissipating insulati...  
WO/2018/114829A1
The invention relates to a pump assembly having an electronics housing (16) which has an outer wall with at least one wall section (21) which is made from a first plastic material and on the inner side of which, which faces the interior ...  
WO/2018/118760A1
A data center may include a tape library rack module along with rack computer systems. The rack computer systems may be configured to provide computing capacity within a data center environment. In some embodiments, the tape library rack...  
WO/2018/116974A1
The purpose of the present invention is to provide a semiconductor device which has high electromagnetic shielding properties, while exhibiting good heat dissipation properties. A semiconductor device according to the present invention i...  
WO/2018/115374A1
The invention relates to a modular contactor arrangement (180) for use in a security-related application. The modular contactor arrangement (180) according to the invention has two contactor modules (10, 11), which can be arranged one be...  
WO/2018/108367A1
The invention relates to a cooling apparatus (1) comprising a metal and/or electrically conductive EMC enclosure (2) and a converter (E1) and also a plurality of electrically operated units (E2,..., En) within the EMC enclosure (2) which...  
WO/2018/107353A1
A device, apparatus and method for monitoring heat dissipation states of devices, comprising: a first air pressure sensor (11), a second air pressure sensor (12), and a processor (13); the first air pressure sensor (11) is provided at an...  
WO/2018/112302A1
A power module apparatus includes a power substrate, at least one power device electrically connected to the power substrate and a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to...  
WO/2018/110275A1
An electrical connection box 10 that comprises: a first circuit part 21 that has a first heat-generating component 11 mounted thereon; a second circuit part 22 that has a second heat-generating component 12 mounted thereon; a first heat-...  

Matches 1 - 50 out of 116,011