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Patent Searching and Data


Matches 1 - 50 out of 115,348

Document Document Title
WO/2018/071330A1
A fastener and method for mounting a connector to a panel, the fastener having an outer sleeve housing having a mount bushing portion and a locking portion with a collapsible end, and an inner pin member received in the outer sleeve hous...  
WO/2018/068286A1
An electrical cabinet device for mounting of a power apparatus comprises: an electrical cabinet body (199), a fixed beam (7) fixed in the electrical cabinet body (199), and an elastic clamping component connected to an inner end of the p...  
WO/2018/071027A1
An electronic desk includes at least two interactive panels hinged to a support structure. The interactive panels are hingably positionable in at least a horizontal and vertical position. The electronic desk further includes a computing ...  
WO/2018/070987A1
Examples disclosed herein relate to a rigid board with a pliable region. An example system can include a board including a cut to form a beam region of pliability in the board. An example system may include a component to be mounted on t...  
WO/2018/070182A1
This appliance temperature regulating apparatus capable of cooling an appliance (BP) of which temperature is to be regulated has an annular appliance fluid circuit (2) that is configured to include: an appliance heat exchanger (2a) that ...  
WO/2018/070310A1
This battery device (10) is provided with: a battery pack (13); a circuit board (2) for acquiring battery information pertaining to the battery pack, or for controlling charging and discharging of the battery pack; a switch device that i...  
WO/2018/068293A1
A circuit board device component having adjustable air supply rate, comprising a circuit board device (12), a hinge frame (9) fixedly provided at an extremity of the circuit board device (12), and a cooling plate device (2) connected to ...  
WO/2018/069174A1
The invention relates to a system comprising a carrier (2.1) and an electronics system (4) attached to the substrate (2.1) in a heat-transmitting manner, in particular a power electronics system (4), having a circuit board (4.1) and a pl...  
WO/2018/070192A1
An electronic device (100) comprising: electronic components (110, 120); a resin molded body (130) embedding and fixing therein the electronic components (110, 120); and a heat-transfer layer (150) having higher thermal conductivity than...  
WO/2018/069633A1
The invention relates to a computer cabinet comprising: at least one computer server (3), and at least one module (4, 5, 6) for the liquid cooling of said server (3), characterised in that the cabinet (1) comprises at least three liquid ...  
WO/2018/069634A1
The invention relates to a method for communication between a plurality of liquid cooling modules (4, 5, 6) of a system for cooling at least one computer server (3), characterised in that the cooling modules (4, 5, 6) communicate with ea...  
WO/2018/068217A1
Disclosed are an energy-saving electrical cabinet apparatus and a use method therefor. The apparatus comprises a fixed frame component (8) and a functional device carrier (9) pivotable relative to the fixed frame component (8). A functio...  
WO/2018/069476A1
A mounting assembly is disclosed which comprises an electronic component (1) mounted on a upper surface of a circuit board (5), comprising at least one electrical connector (2,3) and further comprising a thermal pad (7) provided on a low...  
WO/2018/069635A1
The invention relates to an IT server liquid cooling module comprising: a pump (101), a ventilator (117), a heat exchanger (102), at least two ventilation grids (105, 106, 107), a longitudinal, central, unobstructed space (109) located b...  
WO/2018/066206A1
This disclosure provides a machine temperature control device that uses a plurality of thermosiphon circuits with which the number of parts can be reduced and the efficiency of mounting on a vehicle and flexibility in mounting on the veh...  
WO/2018/067129A1
In some examples, an electronic device includes a first housing providing a sealed inner chamber, an electronic component inside the sealed inner chamber, a second housing externally of the first housing, the second housing comprising a ...  
WO/2018/067904A1
Systems, methods, and software are disclosed herein having enhanced modular carrier form factors. In an implementation, a network card apparatus comprises a network card assembly. The network card assembly comprises a network interface c...  
WO/2018/067104A1
Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on ...  
WO/2018/067179A1
In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one open...  
WO/2018/066311A1
[Problem] To provide a method for manufacturing a heat-dissipating unit simply and at low cost. [Solution] A method for manufacturing a heat-dissipating unit 12 comprises passing pins 17 through through-holes 16 in a first plate member 2...  
WO/2018/065189A1
The aim of the invention is to create an electrical device (1) for connecting to a high-voltage network, having a vessel (14), which is filled with an insulating fluid (30), an active part, which is arranged in the vessel (14) and which ...  
WO/2018/066593A1
This antenna apparatus is provided with: multiple circuit boards; an antenna element; and an electronic component. A plurality of the antenna elements are arranged along the surfaces of the multiple circuit boards. The electronic compone...  
WO/2018/065268A1
The invention relates to an arrangement, comprising a mold body (15), a spacer (20), and a printed circuit board (25), wherein at least one electrical connection (110, 115) connects the mold body to a conductor path (70, 75) of the print...  
WO/2018/066414A1
A copper alloy plate for a heat dissipation component, characterized in that: a phosphide including one or more of Fe, Ni, and Co is precipitated; the 0.2% proof stress is at least 100 MPa and the bend workability is excellent; the 0.2% ...  
WO/2018/066771A1
An IGBT module-cooling heat exchanger according to an embodiment includes: a plurality of tubes having at least one channel, through which refrigerant passes; a plate for accommodating the tubes therein; at least one first IGBT module ar...  
WO/2018/063664A1
Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation mem...  
WO/2018/060392A1
Aircraft comprising a fuselage (1) divided by a floor (2) into an o upper volume (3) and a lower volume (4) through which joists (5) extend that support the floor and delimit, along with the fuselage and the floor, two side chambers (6),...  
WO/2018/062645A1
The present invention relates to: a cooler capable of simplifying a structure, increasing heat exchange efficiency, and slimming a display device; and a display device using the same. A cooler structure applied to the display device uses...  
WO/2018/061712A1
The purpose of the present invention is to provide an electromagnetic wave absorbing heat transfer sheet which has excellent heat conductivity and electromagnetic wave absorbing properties. In order to solve the above-described problem, ...  
WO/2018/060605A1
The invention relates to a device (2) dedicated to heat treatment of an electric member (1) fitted to a motor vehicle, the device (2) comprising a Peltier-effect thermoelectric module (4) connected to one of the large faces (9, 10) of a ...  
WO/2018/061343A1
[Problem] To provide a substrate holding apparatus capable of improving the degree of freedom of design of an electric circuit board. [Solution] The substrate holding apparatus holds an electric circuit board between a first case and a s...  
WO/2018/060391A1
Electronic device comprising at least one electronic module comprising pins (151) intended to be inserted into blind metal-plated holes (152) of a printed circuit board (118), the printed circuit board (118) being covered with a first la...  
WO/2018/058746A1
Disclosed is a heat dissipation structure (10) used for heat dissipation of a heating means (13) on a circuit board (11). The heat dissipation structure (10) comprises a heat dissipation means (15), the heat dissipation means (15) can be...  
WO/2018/062007A1
A motor provided with: a shaft that rotates about a center axis extending in the vertical direction; a bearing for supporting the top end of the shaft; a metal heat sink for directly or indirectly holding the bearing; a substrate dispose...  
WO/2018/061193A1
A heat sink (100) is characterized in being provided with the following: a fin base (1); two first fins (21) having bases (2d) that are attached to a bottom surface (1a) of the fin base (1); second fins (22) having bases (2d) that are at...  
WO/2018/060390A1
The invention relates to a cooling module comprising a first air inlet, a second air inlet and an air-discharge vent, said module comprising two check valves, and each check valve being mounted in front of one of the inlets and arranged ...  
WO/2018/063648A1
A circuit board may include a connector having a circuit module latch that may include a latch frame and pivot-able ejector assembly coupled to the latch frame.  
WO/2018/058229A1
The utility model relates to structures for housing and fastening items, including in the field of communications and power distribution. An equipment fastening system, comprising two mounting panels (1) arranged opposite one another, is...  
WO/2018/058271A1
Disclosed are an electronic governor, a method for assembling an electronic governor and an unmanned aerial vehicle. The electronic governor (100) comprises a control circuit board (1), a box body, a cable (3) and sealing elements (4), w...  
WO/2018/060123A1
The invention relates to a light control console (01) for controlling a lighting system, wherein digital control commands are generated in the light control console (01), which digital control commands can be transferred to the lighting ...  
WO/2018/060222A1
A device (1) such as a lighting device, e.g. a luminaire, is disclosed that comprises an assembly of components including a first component (10) and a second component (20); and a fixing member (30) fixing the first component to the seco...  
WO/2018/060134A1
The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).  
WO/2018/059464A1
The present invention provides a housing of a user terminal, and a user terminal. The housing is provided with an insertion hole. The inner side of the housing is provided with a sealing member at the insertion hole. The sealing member i...  
WO/2018/063636A1
A handheld device may include a magnetic convection cooling system, which may include a fluid chamber that is in thermal communication with electronic circuitry of the handheld device. The fluid chamber may be closed and may contain a su...  
WO/2018/062255A1
This copper alloy sheet for a heat dissipation component is characterized in that: the copper alloy sheet for a heat dissipation component comprises 0.05-0.9% by mass of Co, and 0.01-0.25% by mass of P, the balance being Cu and inevitabl...  
WO/2018/060389A1
Electronic unit (100) comprising a housing (101) defining a receiving compartment (104) for an electronic module (124) along two opposite directions to each other of an insertion direction (P'), the compartment comprising electrical supp...  
WO/2018/062352A1
The present invention provides a heat dissipation sheet comprising fibrous carbon and a polymer, wherein: the fibrous carbon has an average effective fiber length of 5-120 μm, an average fiber diameter of 200-900 nm, and an average aspe...  
WO/2018/060374A1
An assembly comprising a first and a second circuit board interconnected via first and second connectors attached to the first and second circuit board, respectively, where a cooling structure is attached to the first and second circuit ...  
WO/2018/061351A1
A substrate unit provided with: a printed substrate (50); an electronic component (60) mounted on the printed substrate (50); heat dissipation members (20, 30); and a sheet member (35) sandwiched by the heat dissipation members (20, 30) ...  
WO/2018/061814A1
A power supply device comprises: a first power supply circuit; a first housing; a second power supply circuit; a second housing; a heat pipe; and a heatsink. The first housing contains the first power supply circuit, and the second housi...  

Matches 1 - 50 out of 115,348