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JP7432354B2 |
The purpose of the present invention is to provide a heat treatment device capable of uniformly performing heat treatment on a substrate in a plane regardless of the amount of warpage of the substrate. The heat treatment device for perfo...
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JP2021097192A |
To provide a heat treatment device capable of uniformly performing heat treatment on a substrate in a plane regardless of the amount of warpage of the substrate.A heat treatment device that performs heat treatment on a substrate includes...
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JP6579873B2 |
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JP6231625B2 |
This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active ...
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JP2017054973A |
To provide a processing device capable of suppressing a steep rise in processing cost for a workpiece.A laser processing device 1 comprises: a chuck table 10 holding a workpiece W on a holding surface 10a; and laser processing means 20 p...
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JP2016213491A |
To obtain an excellent alignment accuracy and avoid a substrate from contamination at the time of bonding two substrates.A device of the present invention for bonding a first substrate to a second substrate, comprises a mounting device f...
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9470969 |
A support for an object, e.g., a semiconductor substrate, includes a main body having a surface configured and arranged to have a plurality of projections. Each of the projections has an associated electrostatic actuator for displacing a...
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9188879 |
According to one embodiment, a substrate holding apparatus includes a main unit and a plurality of first support units. The main unit has a major surface. The main unit has a plate configuration. The first support units are disposed on t...
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JP5634490B2 |
A support for an object, e.g., a semiconductor substrate, includes a main body having a surface configured and arranged to have a plurality of projections. Each of the projections has an associated electrostatic actuator for displacing a...
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20130222782 |
According to one embodiment, a substrate holding apparatus includes a main unit and a plurality of first support units. The main unit has a major surface. The main unit has a plate configuration. The first support units are disposed on t...
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JP2013135218A |
To provide a support in which measures are taken to improve flatness of an object such as a semiconductor substrate.The support for the object includes a main body having a surface having a plurality of projections. Each of the projectio...
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20130164688 |
A support for an object, e.g., a semiconductor substrate, includes a main body having a surface configured and arranged to have a plurality of projections. Each of the projections has an associated electrostatic actuator for displacing a...
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JP4921699B2 |
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JP4858636B2 |
The method involves forming a bed electrode (12) on the main surface (11a) of a semiconductor substrate (11) so that the bed electrode is electrically connected with a semiconductor element. A protective film (13) is formed for covering ...
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JP4826466B2 |
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JP2011097027A |
To provide a method and device for forming a metal electrode of a semiconductor device, reducing cost while meeting required accuracy of a cutting amount (within ±1 μm).Surface form data on a top surface portion is acquired to reduce a...
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JP2008140832A |
To provide a pin chuck type chuck table capable of uniformly cutting the height of a bump because the surface of a wafer can be held flatly in the wafer with its rear formed in a conical shape or an inverted conical shape by a backgrindi...
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JP2007081450A |
To subject a work to the proximity exposure of a pattern while supporting the work subjected to top-and-rear surface processing so that the work is not flawed.In an aligner, a supporting part 7 for supporting the periphery 6b of a plate-...
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JP2005259870A |
To prevent a leak of a liquid without causing a reduction of a measuring accuracy.There are provided a holder PH for holding a substrate P on a retaining face 34A, and a drive mechanism 70 for driving the substrate P in a direction subst...
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JP2005033204A |
To provide a method of projection exposure capable of projection exposure and a very high numerical aperture, and a system of projection exposure corresponding to the method.In a method for manufacturing a semiconductor device and other ...
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