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Class 228 :: METAL FUSION BONDING

Definition

This is a residual class for metal fusion bonding as defined in this definition.

For placement of a patent in this class, its claimed disclosure should meet the minimum requirements of the class definition, and should not extend beyond the boundaries indicated in Scope of the Class, below, and discussed in Lines With Other Classes and Within This Class.

Terms followed by an asterisk (*) in the definitions are defined in the Glossary, below.

This class provides for an apparatus for or a method of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of:

(a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or

(b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.

Additionally, this class provides for methods of joining a metal work part to a juxtaposed or engaged nonmetal work part wherein bonding there between is effected by intermingling of the molecules of the metal part with the nonmetal part; and for methods of joining juxtaposed or engaged nonmetal work parts when utilizing metallic cement.

SCOPE OF THE CLASSPlacement of an original patent into Class 228 may be made on the basis of a claim reciting means for or the step of applying to work portions energy in the form of:

(1) heat;

(2) pressure; and/or

(3) vibratory energy, provided that there is a teaching that a metal fusion bonded product is produced by the applied energy.

Also see Class 420, Alloys or Metallic Compositions.

LINES WITH OTHER CLASSESA patent claiming closing of a minute opening in a single workpiece (e.g., tipping) is proper subject matter for Class 228, in that the periphery of a single work opening is considered to constitute meeting faces of a single work part as required by the definition of this class. Coating of a work part which may, incidentally, cover small openings in the part is not considered to be proper subject matter for this class.

RELATIONSHIP TO CLASSES INVOLVING, PER SE, METAL FUSION BONDINGClasses Of Article MakingGenerally a patent claiming making of a particular article will be found in the appropriate class directed to making of that article except that a patent claiming performing a single fusion bonding operation is placed in this class (228). Fusion bonding combined with additional operations which are considered to be ancillary to the bonding (e.g., preheating, positioning for bonding, or pretinning) will also be found in this class (228).

Examples of such classes providing for the manufacture of particular articles may be found in References to Other Classes, below.

Because of the technology in the making of semiconductor and related devices, certain art terms used to designate operations specially recognized in that discipline are listed below which, when combined with fusion bonding, will cause placement of a patent in Class 29, Metal Working, and Class 438, Semiconductor Device Manufacturing: Process, particularly subclasses 26+, 51, 55, 64+, and 106+ for methods of packaging a semiconductor device and subclasses 455+ for laminating or bonding plural semiconductor substrates; see the search notes thereunder.

(1) Diffusion (not diffusion bonding)

(2) Assembling two semiconductors for an electrical function (Note that each semiconductor may be, for example, a player, an n layer, a chain of p or n layers or a laminated article of p and n layers).

(3) Shaping a metal layer to form a conductor.

(4) Cutting

(5) Assembling other than to bond (i.e., other than juxtapose)

(6) Bonding to create a junction

(7) DopingAlso see References to Other Classes, below, for specific search notes to the following:The Class Of WireworkingThe Class Of Metal CastingThe Class Of Electric Fusion BondingRELATIONSHIP TO COMBINATION CLASSESA patent claiming a combination of metal fusion bonding with a different operation, whether manufacturing or nonmanufacturing, is proper subject matter for Class 228, except as specifically noted in the search notes in References to Other Classes, below, relating to the following combination classes:The Class Of Package MakingThe Classes Including Post-fusion TreatmentRELATIONSHIP TO OTHER CLASSESThe Heating Classes:Placement of a patent claiming heating is in the appropriate heating class, even though the sole disclosed application of the heat is in the production of a metal fusion-bonded product of this class (228). In this connection, the term “heating” includes the usually accepted auxiliary means or step such as supporting or holding material to be heated, or causing or permitting relative movement between the material and the heating means.

But if, in addition to the above recited heating structure or step, a claim recites a means to further metal fusion bonding, placement is in this class (228). Examples of such claimed limitations are:

(a) moving or guiding one work part relative to another work part, into a position for mutual fusion bonding;

(b) forcing or urging one work portion against another work portion at the immediate zone of fusion; or

(c) moving or guiding flux or filler.

A claim to the combination of a Class 228 application (e.g., “soldering”) with supplying of heat to such applicator is considered to define heating, proper for one of the heating classes (see paragraph 4, below), even though details of the applicator are also recited, such as: (a.) its alloy composition or its shape; or

(b) adjusting such applicator relative to its support.“Means for supplying heat” may be, for example, nothing more elaborate or detailed than a claimed pair of terminals for connection of the applicator to an electrical circuit. See References to Other Classes, below, for examples of classes providing for heating.

The Work Handling Or Product Handling Classes:The placement of patents claiming handling work for, or product of, a metal fusion bonding operation, and also claiming fusion bonding is in this class (228) except where the fusion bonding is recited by name only, i.e., in terms that name but do not describe any characteristics of a metal fusion bonding operation. The so excepted patents are placed in appropriate classes related to material handling, per se. See References to Other Classes, below, for examples of classes providing for handling the work or product of a fusion bonding operation.

See References to Other Classes, below, for specific search notes to the following classes:The Classes Of CoatingThe Class Of Adhesive BondingThe Class Of Static Structures

Class 228 :: METAL FUSION BONDING

Definition

Subclasses List