Patent Searching and Data
What can SumoBrain do for you?
SumoBrain for the...


Matches 1 - 50 out of 246

Document Document Title
7442959
An electronic device includes a semiconductor chip storing an identification number of N-bits and an antenna coupled to the semiconductor chip that sends out the identification number of N-bits. In order to provide a secure and efficient...  
7429752
A semiconductor device includes a semiconductor substrate having at least one gap, extending under a portion of the semiconductor substrate. A gate stack is on the semiconductor substrate. A strain layer is formed in at least a portion o...  
7427779
The microstructure is designed for formation of a silicon and germanium on insulator substrate of Si 1-Xf Ge Xf type, with Xf comprised between a first value that is not zero and 1. The microstructure is formed by stacking of a silicon ...  
7427775
The mobility of carriers may be increased in strained channel epitaxial source/drain transistors. Doped silicon material may be blanket deposited after removing ion implanted source/drain regions. The blanket deposition forms amorphous f...  
7427773
A method for forming strained Si or SiGe on relaxed SiGe on insulator (SGOI) or a SiGe on Si heterostructure is described incorporating growing epitaxial Si 1−y Ge y layers on a semiconductor substrate, smoothing surfaces by Chemo-Mec...  
7417250
A method of manufacturing a semiconductor device includes providing a strained-silicon semiconductor layer over a silicon germanium layer, and partially removing a first portion of the strained-silicon layer. The strained-silicon layer i...  
7411214
Structure and methods of fabrication are disclosed for an enhanced FET devices in which dopant impurities are prevented from diffusing through the gate insulator. The structure comprises a Si:C, or SiGe:C, layer which is sandwiched betwe...  
7407421
A light source of the present invention includes: a semiconductor light emitting device which has a light emitting face and emits light from part of the light emitting face; a container which has a light transmitting window for transmitt...  
7385222
A method of forming a thin film transistor relative to a substrate includes, a) providing a thin film transistor layer of polycrystalline material on a substrate, the polycrystalline material comprising grain boundaries; b) providing a f...  
7365410
A method for forming a semiconductor structure including providing a semiconductor substrate, forming a metallic buffer layer over the semiconductor substrate, forming an amorphous semiconductor layer over the metallic buffer layer, and ...  
7365362
According to one aspect of the invention, there is provided a semiconductor device fabrication method comprising: forming a gate insulating film on a semiconductor substrate; forming a film containing a predetermined semiconductor...  
7361592
The method successively comprises production, on a substrate, of a stack of layers comprising at least one first layer made from germanium and silicon compound initially having a germanium concentration comprised between 10% and 50%. The...  
7335950
To provide a thin film transistor having a low OFF characteristic and to provide P-channel type and N-channel type thin film transistors where a difference in characteristics of the P-channel type and the N-channel type thin film transis...  
7317207
To provide TFT of improved low-temperature polycrystalline layer that has higher electron mobility and assures less fluctuation in manufacture in view of realizing a liquid-crystal display device having a large display area by utilizing ...  
7315065
A method for fabricating germanium-on-insulator (GOI) substrate materials, the GOI substrate materials produced by the method and various structures that can include at least the GOI substrate materials of the present invention are provi...  
7307282
The TFT has a channel-forming region formed of a crystalline semiconductor film obtained by heat-treating and crystallizing an amorphous semiconductor film containing silicon as a main component and germanium in an amount of not smaller ...  
7297978
After an amorphous semiconductor thin film is crystallized by utilizing a catalyst element, the catalyst element is removed by performing a heat treatment in an atmosphere containing a halogen element. A resulting crystalline semiconduct...  
7262431
A polycrystal thin film forming method comprising the step of forming a semiconductor thin film on a substrate 14 , and the step of flowing a heated gas to the semiconductor thin film while an energy beam 38 is being applied to the se...  
7259427
The present invention relates to a semiconductor device including a circuit composed of thin film transistors having a novel GOLD (Gate-Overlapped LDD (Lightly Doped Drain)) structure. The thin film transistor comprises a first gate elec...  
7235812
A method for achieving a substantially defect free SGOI substrate which includes a SiGe layer that has a high Ge content of greater than about 25 atomic % using a low temperature wafer bonding technique is described. The wafer bonding pr...  
7235811
A system and method are provided for reducing film surface protrusions in the fabrication of LILAC films. The method comprises: forming an amorphous film with a first thickness; annealing the film using a LILAC process, with beamlets hav...  
RE39640
A family of isostructural compounds have been prepared having the general formula A n Pb m Bi n O 2n+m . These compounds possess a NaCl lattice type structure as well as low thermal conductivity and controlled electrical conductivity. Fu...  
7217952
A technique for manufacturing TFTs having little dispersion in their electrical characteristics is provided. Contamination of a semiconductor film is reduced by performing oxidation processing having an organic matter removing effect, fo...  
7205586
A HDTMOS includes a Si substrate, a buried oxide film and a semiconductor layer. The semiconductor layer includes an upper Si film, an epitaxially grown Si buffer layer, an epitaxially grown SiGe film, and an epitaxially grown Si film. F...  
7199399
A thin film transistor includes a channel layer of a specific shape, a thermal gradient inducer body, a gate insulating film, a gate electrode and an interlayer insulating film, a source electrode and a drain electrode. The channel layer...  
7199303
An optical energy conversion apparatus 10 includes a first impurity doped semiconductor layer 5 , formed on a substrate, and which is of a semiconductor material admixed with a first impurity, an optically active layer 6 , formed on ...  
7196400
An object is to enhance the orientation ratio of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film while using as a substrate a less-heat-resistive material such as glass thereby providing a semic...  
7187057
Known techniques to improve metal-oxide-semiconductor field effect transistor (MOSFET) performance is to add a high stress dielectric layer to the MOSFET. The high stress dielectric layer introduces stress in the MOSFET that causes elect...  
7157349
A method of manufacturing a semiconductor device comprising a silicon body ( 1 ) having a surface ( 4 ) provided with field isolation regions ( 2 ) enclosing active regions ( 3 ). In this method, on the surface of the silicon body there ...  
7154118
A method of a bulk tri-gate transistor having stained enhanced mobility and its method of fabrication. The present invention is a nonplanar transistor having a strained enhanced mobility and its method of fabrication. The transistor has ...  
7145175
According to the invention, a plurality of semiconductor devices which are required to have conformance are formed from crystalline semiconductor films having uniform crystallinity on the same line, and a semiconductor circuit in which v...  
7141820
A structure including a compressively strained semiconductor layer, the compressively strained layer having a strain greater than or equal to 0.25%. A tensilely strained semiconductor layer may be formed over the compressively strained l...  
7138668
An aspect of the present invention provides a semiconductor device that includes a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type, having a different band gap from ...  
7115905
A semiconductor device has a SALICIDE structure with low leakage currents, while maintaining shallow source and drain regions. A method of manufacturing the semiconductor device includes forming source and drain regions in a first semico...  
7102153
A method for growing strained Si layer and relaxed SiGe layer with multiple Ge quantum dots (QDs) on a substrate is disclosed. The method can reduce threading dislocation density, decrease surface roughness of the strained silicon and fu...  
7084460
A method for fabricating germanium-on-insulator (GOI) substrate materials, the GOI substrate materials produced by the method and various structures that can include at least the GOI substrate materials of the present invention are provi...  
7081387
A multi-mesa FET structure with doped sidewalls for source/drain regions and methods for forming the same are disclosed. The exposure of the source and drain sidewalls during the manufacture enables uniform doping of the entire sidewalls...  
7034337
The orientation ratio of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film through heat treatment and irradiation of intense light such as laser light, ultraviolet rays, or infrared rays is enhanc...  
7026193
In a circuit including at least one thin film transistor formed on an insulating substrate, a region 105 to which metal elements that promote crystallinity are added is disposed apart from a semiconductor island region 101 that forms...  
7023018
The present invention provides, in one embodiment, a P-type Metal Oxide Semiconductor (PMOS) device ( 100 ). The device ( 100 ) comprises a tensile-strained silicon layer ( 105 ) located on a silicon-germanium substrate ( 110 ) and silic...  
7015507
Provided is a non-single-crystal germanium thin film transistor having a gate insulating film capable of reducing the interface state density between an active layer and the gate insulating film. This thin film transistor has an active l...  
7005676
There is here disclosed a semiconductor device manufacturing method comprising a step of forming an island region including a monocrystalline Si 1-x-y Ge x C y layer (1>x>0, 1>y≧0) and a peripheral region including an amorpho...  
6987072
A method for fabricating a semiconductor crystal that has a first step for forming a semiconductor crystal layer ( 202 ) that contains carbon atoms and at least one kind of Group IV element other than carbon on a substrate ( 201 ), a sec...  
6956235
The orientation of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film is improved and a TFT formed from this crystalline semiconductor film is provided. In a semiconductor device whose TFT is forme...  
6930326
According to the invention, a plurality of semiconductor devices which are required to have conformance are formed from crystalline semiconductor films having uniform crystallinity on the same line, and a semiconductor circuit in which v...  
6927419
A polycrystal thin film forming method comprising the step of forming a semiconductor thin film on a substrate 14 , and the step of flowing a heated gas to the semiconductor thin film while an energy beam 38 is being applied to the se...  
6927417
In a back-surface electrode type photoelectric conversion element having electrodes and semiconductor layers for collecting carriers disposed only on a back surface side of a semiconductor substrate, a semiconductor thin film that is lar...  
6921914
A process for producing monocrystalline semiconductor layers. In an exemplary embodiment, a graded Si 1-x Ge x (x increases from 0 to y) is deposited on a first silicon substrate, followed by deposition of a relaxed Si 1-y Ge y layer, ...  
6919269
A method for fabricating a semiconductor component includes: deposition of a polysilicon layer on a substrate, deposition of a precursor layer on the polysilicon layer, and deposition of a protective layer on the precursor layer. A cryst...  
6894310
The invention includes a method of forming semiconductor circuitry. A monocrystalline silicon substrate is provided, and a mask is formed which covers a first portion of the substrate and leaves a second portion uncovered. A trench is fo...  

Matches 1 - 50 out of 246