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Matches 1 - 50 out of 463

Document Document Title
7473931
An improved device and method for mounting an avionic system is shown. The design provides varying locations of key components, which allows a single mounting system to be used with several varieties and configurations of aircraft within...  
7470938
In a nitride semiconductor light emitting device having patterns formed on the upper and lower surfaces of a substrate from which light is emitted in a flip chip bonding structure, the patterns are capable of changing light inclination a...  
7468528
A semiconductor light-emitting device is provided. The semiconductor light-emitting device includes a laminated semiconductor structure portion composed of at least a first conductivity type first cladding layer, an active layer and a se...  
7465960
In a submount main body ( 1 ) composed of a single crystal silicon, a mounting surface ( 4 ) on which a light-emitting device ( 11 ) is mounted is composed of a ( 100 )-oriented surface and the inner surface of a through hole ( 3 ) which...  
7460743
A diffusion and laser photoelectrically coupled integrated circuit signal line, wherein photoelectrically coupled pairs are formed on integrated circuit chips utilizing a diffusion light or a laser light emitted by LED or the photoelectr...  
7456434
A micro optical bench structure and a method of manufacturing a micro optical bench structure are provided. The micro optical bench structure includes: a lower substrate; an upper substrate which is bonded to the lower substrate, and has...  
7453092
A light emitting device having: a predetermined optical form that is provided on a surface of an LED element mounted on a base, the predetermined optical form being made to allow an increase in efficiency of taken out light from an insid...  
7449720
An epitaxial wafer for semiconductor light-emitting devices has an n-type substrate, on which are sequentially formed an n-type cladding layer, an active layer, a p-type cladding layer having Mg as a p-type dopant, and a p-type cap layer...  
7446293
An electro-optical element is provided including a light-emitting element part and a light-receiving element part, wherein an optical thickness d of the light-receiving element part satisfies the following condition:
7439547
A MEMS (micro electro mechanical system) apparatus is equipped with a light-emitting circuit, having a light-emitting device, to emit light; a light-receiving circuit having a series circuit of series-connected light-receiving devices th...  
7427804
A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/outp...  
7427782
A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt ad...  
7427522
In a short-wavelength laser module, long-term reliability is lost because of unnecessary gas deposited on the end face of its optical waveguide. A short-wavelength laser module has a package structure wherein a package lid used when the ...  
7423719
An optical diffusion film comprises a plurality of diffraction grating cells formed on a substrate, each cell comprising a plurality of curved gratings disposed in parallel with each other and containing the same profile. Such film can b...  
7423294
A semiconductor light-emitting device includes: a semiconductor light-emitting element including a first conductive type semiconductor layer, an active layer including a light-emitting region, and a second conductive type semiconductor l...  
7415185
A buried-waveguide light detecting element includes an n-type cladding layer on a Fe-InP substrate, a waveguide on a portion of the n-type cladding layer, and in which an n-type light guide layer, an i-light guide layer having a refracti...  
7397066
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor hav...  
7368754
The invention provides a semiconductor integrated circuit which allows a plurality of devices to be integrated compactly, that is, with high density; a signal transmitting device; an electro-optical device; and an electronic apparatus. A...  
7368179
The present invention provides a light emitting device comprising: a light output; a light source that produces light having a wavelengths of 530 nm or less; and a wavelength transformer located between the light source and the light out...  
7365366
A boron phosphide-based semiconductor light-emitting device, comprising: a crystalline substrate; a first semiconductor layer formed on said crystalline substrate, said first semiconductor layer including a light-emitting layer, serving ...  
7352007
An optical memory cell having a material layer associated with a pixel capable of emitting and receiving light. The material layer has phosphorescent material formed therein for storing data as light received from and emitted to the pixel.  
7351661
A semiconductor device having a trench isolation layer in a semiconductor substrate is provided, wherein the trench isolation layer includes a silicon nitride liner, a silicon oxide liner; and a buried layer, wherein the buried layer inc...  
7342258
An object of the present invention is to provide a semiconductor device using a cheap glass substrate, capable of corresponding to the increase of the amount of information and further, having a high performance and an integrated circuit...  
7342256
According to the present invention, a material having a light-shielding property is used for a bank layer surrounding the edge of a light-emitting element. Accordingly, light which is not reflected by an object to be read out can be prev...  
7335922
A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction ( 1 ) for emitting radiation and a second semiconductor layer construction ( 2 ) for receiving radiation, which are arranged...  
7335921
Lighting devices using feedback-enhanced luminescent devices are disclosed. A light emitting diode disposed between feedback elements (FE-LED) may be used as a light emitting element in the lighting devices. The light emitting element ma...  
7315016
An electric device includes at least one organic diode and a driver for driving the diode in at least a light sensing state. A pre-pulse generator is provided for applying one or more electrical pulses to the diode prior to drive the dio...  
7297932
An optoelectronic sensor for sensing wetting of a windshield includes a first circuit, and a radiation emitter and a radiation detector both arranged on the first circuit to emit radiation toward the windshield and to detect radiation re...  
7291921
A structure of a micro electro mechanical system and a manufacturing method are provided, the structure and manufacturing method is adapted for an optical interference display cell. The structure of the optical interference display cell ...  
7288794
An improved integrated optical device ( 5 a - 5 g ) is disclosed containing first and second devices ( 10 a - 10 g ; 15 a , 15 e ), optically coupled to each other and formed in first and second different material systems. One of the fir...  
7288788
A novel Active Pixel Sensor (APS) cell structure and method of manufacture. Particularly, an image sensor APS cell having a predoped transfer gate is formed that avoids the variations of V t as a result of subsequent manufacturing steps...  
7288753
An OLED display and photo-sensor is described, comprising: a substrate; a composite light sensor made up of a plurality of individual thin-film light sensitive elements located over the substrate and connected in parallel to provide a co...  
7276741
The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer ...  
7274039
A method of fabricating a substrate for an organic electroluminescent display device includes forming a first electrode on a substrate in a pixel region and a non-pixel region, the first electrode including a first conductive material, f...  
7268368
A semiconductor package and method for forming the same is disclosed herein. The semiconductor package includes a package support member, a pair of optoelectronic devices spaced from each other and coupled to the package support member, ...  
7268014
The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in...  
7265389
A method for fabricating a light emitting diode (LED) is provided. Successively forming a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer on an epitaxy substrate; forming a bonding...  
7264980
The present invention provides a method of mounting a light emitting element, in which a light emission point can be positioned at high accuracy with respect to the mounting member. A semiconductor laser element is placed on a matching s...  
7262445
In a charge transfer device which has many two-layered transfer electrodes, 8 L disposed along a charge transfer direction X above a transfer channel is driven with two-phase driving pulses supplied to the transfer electrodes of the sec...  
7256436
In a thin-film field-effect transistor having a MIS structure, the insulator layer is formed of cyanoethylated dihydroxypropyl pullulan. The TFT is prepared by applying a cyanoethylated dihydroxypropyl pullulan solution onto a gate elect...  
7256426
Provided are an electroluminescence (EL) device and corresponding method for forming a rare earth element-doped silicon (Si)/Si dioxide (SiO2) lattice structure. The method comprises: providing a substrate; DC sputtering a layer of amorp...  
7253443
An electronic device having a semiconductor circuit formed therein includes a semiconductor device in which the semiconductor circuit is formed; and a light emitting device, formed integrally with the semiconductor device, for emitting l...  
7250633
A gallium nitride-based light emitting device, and a method for manufacturing the same are disclosed. The light emitting device comprises an n-type GaN-based clad layer, an active layer, a p-type GaN-based clad layer and a p-side electro...  
7250632
An electronic device includes a radiation-emitting component, a radiation-responsive component, or a combination thereof. In one embodiment, the electronic device includes a substrate and a first structure overlying the substrate. The el...  
7242142
There is provided a polymer electroluminescent device, which comprises a transparent substrate, an anode, a polymer emitting layer, a polymer insulating nanolayer and a cathode. The polymer insulating nanolayer having the dielectric cons...  
7242027
There is provided a light emitting and image sensing device for a scene. The light emitting and image sensing device is formed in a semiconductor substrate and comprises a photoemitter means for illuminating the scene with light, and a p...  
7235804
A multichannel monolithic chip that has a number of photo-couplers provided on a single silicon substrate is mounted on an insulating substrate, a first cut groove is formed by dicing between a light-emitting element and a light-receivin...  
7230278
A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/outp...  
7228020
An optoelectronic arrangement having a surface-mountable semiconductor module having at least one optoelectronic transmitting and/or receiving unit, a housing, in which the optoelectronic transmitting and/or receiving unit is arranged, a...  
7227246
An apparatus comprises a first substrate and a second substrate. The first substrate includes an optoelectronic device and a matching circuit. The second substrate includes a driver circuit. A frequency response of the optoelectronic dev...  

Matches 1 - 50 out of 463