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7454305 |
A method for altering circuit characteristics to make them independent of processing parameters of devices within an integrated circuit is disclosed. A process parameter is measured by a kerf or on-chip built-in test on a selective set o...
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7454301 |
A jitter calculator engine that includes a core effects module, an input/output (I/O) module, and a phase lock loop (PLL) module is provided. The core effects module estimates core jitter caused by noise effects impacting a core clock ne...
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7453932 |
A testing apparatus for testing a device under test is provided, wherein the testing apparatus includes: a comparator for receiving a signal output from the device under test and converting the signal into a logic signal by comparing the...
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7453280 |
A method for testing a batch of semiconductor devices in wafer level is provided. The method includes the following steps: (a) obtaining a breakdown voltage of gate dielectric of each semiconductor device; (b) applying, to the gate diele...
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7453279 |
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available tes...
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7453272 |
A method is disclosed for measuring alignment of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias or misalignment. Bridging vertices on the polysilicon...
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7453260 |
The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test c...
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7452733 |
Semiconductor dice are electrically tested prior to final assembly. Dice failing the test are identified and not packaged. However, “good dice” (i.e., those dice that passed testing) in proximity to the failed dice frequently fail pr...
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7451053 |
An on die thermal sensor (ODTS) includes a thermal sensor for outputting a first comparing voltage by detecting a temperature of the semiconductor memory device; a comparing unit for outputting a trimming code by comparing the first comp...
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7449911 |
A method for testing integrated circuits includes forming a plurality of substantially identical first test structures, each comprising a first via structure connected to a first metal line, stress testing the plurality of first test str...
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7449910 |
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes ...
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7449909 |
A testing system or method compares read data from one or more dies in a semiconductor wafer with the original data written onto the one or more dies. The testing system includes one or more write registers connected to one or more dies ...
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7449902 |
A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more ...
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7447610 |
A method and system for reliability similarity of semiconductor devices. The method includes providing a first plurality of semiconductor devices, providing a second plurality of semiconductor devices, and determining a first reliability...
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7447606 |
A IC wafer is fabricated using a process of interest to have a plurality of FET devices with different channel lengths (Leff) form a plurality of channel length groups. The threshold voltage (VT) is measured of a statistical sample of th...
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7446554 |
A direct current measuring apparatus includes a voltage generating part generating a voltage to be applied to a load being a measuring object; a current limiting part limiting a current flowing in the load to a set value; and an output t...
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7446553 |
An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the sem...
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7446552 |
An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the sem...
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7446551 |
Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured ...
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7446277 |
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices ...
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7445945 |
The present invention provides a method and apparatus for dynamic adjustment of a sampling plan. The method includes accessing wafer electrical test data associated with at least one workpiece that has been processed by at least one proc...
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7443190 |
A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. T...
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7443189 |
The present teachings provide methods for detection of metal silicide defects in a microelectronic device. In an exemplary embodiment, a portion of a semiconductor substrate may be positioned in a field of view of an inspection tool. The...
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7443188 |
A system is provided for testing a logic device and an integrated circuit disposed within a semiconductor device package. The logic device may be configured to operate in at least a normal mode and a test mode. A terminal external to the...
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7443187 |
Techniques for on-chip detection of integrated circuit power supply noise are disclosed. By way of example, a technique for monitoring a power supply line in an integrated circuit includes the following steps/operations. A first signal a...
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7443186 |
A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linea...
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7443183 |
A test machine for testing a printed circuit board (PCB) ( 50 ) includes a base box ( 10 ), a top test device ( 70 ), a raising board ( 41 ), and a control system. The top test device is pivotably secured to the base box, for testing the...
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7443182 |
There is disclosed a coordinate transformation device for electrical signal connection used for a probe card applicable to narrow pitch pads, which particularly simplifies wiring from the terminal onto the inspection apparatus board and ...
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7443180 |
The invention is directed to an on-chip probing apparatus. In accordance with an embodiment of the present invention, the on-chip probing apparatus includes: a plurality of switches on a chip; a plurality of externally accessible probe p...
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7439754 |
An accelerated test for transistors included in inverter circuits of a semiconductor integrated circuit is to be improved in efficiency. Output terminals 30 A, 30 B of inverter circuits 11, 12 , each including a CMOS circuit, may be s...
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7439753 |
The present invention discloses an inverter test device and a method thereof, which provides a single-load environment or a multi-load test environment to test electrical performance of an inverter or inverters, including: unbalanced cur...
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7437271 |
A method and apparatus for testing semiconductors according to various aspects of the present invention comprises a test system comprising composite data analysis element configured to analyze data from more than one dataset. The test sy...
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7436222 |
A programmable after-package, on-chip reference voltage trim circuit for an integrated circuit having a plurality of programmable trim cells generating a programmed sequence. A converter is provided to convert the bit sequence into a tri...
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7436199 |
A stack-type semiconductor package socket may include: a first package connection portion for connection with leads of a lowermost package of a stack-type semiconductor package; a second package connection portion for connection between ...
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7436198 |
There are provided a test pattern of a semiconductor device and a test method using the same. The test pattern of the semiconductor device includes a conductive pattern disposed on a semiconductor substrate, and the conductive pattern in...
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7436197 |
In a test system for a semiconductor device, the device under test (DUT) is remotely located relative to the tester that generates the test vector signals. The tester and remotely located DUT are connected by a serial connection and each...
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7436168 |
According to one embodiment, a method of test error detection for a wafer having a plurality of rows of integrated circuit (IC) chips is provided. The method includes determining that a first number of IC chips that are indicated as fail...
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7433793 |
A modulated voltage signal modulated at a predetermined frequency f 0 is supplied to an integrated circuit under test to be tested set at an arbitrary stationary point, and an observation signal containing information on power supply cu...
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7432115 |
A test circuit and a method of monitoring a manufacturing process of a semiconductor integrated circuit using the test circuit are provided. The test circuit comprises elements to be tested; a selection circuit for sequentially selecting...
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7429868 |
A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semicondu...
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7429867 |
Various embodiments of the present invention describe circuits for and methods of detecting a defect in a component formed in a substrate of an integrated circuit. According to one embodiment, a circuit comprises a plurality of component...
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7429864 |
A first device has a surface and includes a plurality of at largest micrometer-scale geometry structures extending along its surface. The structures have a first portion and a second portion. A plurality of at largest micrometer-scale ge...
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7427870 |
The invention relates to a test system for testing connectable integrated circuits. A particular test system may have switching devices via which a respective assigned one of the integrated circuits can be connected to the supply unit, a...
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7427768 |
The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus fo...
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7425840 |
It is provided a semiconductor device with an ability to receive various test signals and check test results in spite of a limited number of pads. The semiconductor device includes a signal transferring unit for transferring a power sign...
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7425822 |
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available tes...
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7425457 |
In a method of irradiating an object with simulated solar radiation using a plurality of light sources, the object is irradiated with simulated solar radiation resulting from superimposed light rays from a plurality of light sources incl...
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7424417 |
A method and system are disclosed, in a simulation of a design of a digital integrated circuit chip, to limit a number of scan test clocks and chip ports used for testing the chip. Clock domains are identified within the design of the ch...
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7423446 |
A method for determining threshold voltage variation rapidly provides accurate threshold voltage distribution values for process verification and improvement. The method operates a characterization away including a circuit for imposing a...
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7423445 |
Trim codes are determined for semiconductor devices under test (DUTs), wherein the trim codes correspond to voltage or current reference value adjustments that cause the DUTs to generate desired voltage or current reference values. The t...
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