Title:
【発明の名称】多数の坦体素子が形成される帯状体又はパネルを形成する非導電性基板
Document Type and Number:
Japanese Patent JP2000505923
Kind Code:
A
Abstract:
A nonconductive substrate forms a strip or a panel on which a multiplicity of carrier elements is formed, in particular for installation in a chipcard. One side of the substrate is provided with conductive contact surfaces which lie within an outer contour line that determines the size of a carrier element. The other side of the substrate has conductor structures within the outer contour line which form at least contact fields for at least one coil to be contacted and for at least one semiconductor chip. The substrate has cut-outs outside each outer contour line, through which it is possible to access coil terminals of the semiconductor chip for testing purposes from the contact-surface side, as long as the carrier element is still in the strip or in the panel.
Inventors:
Stampka, Peter
Hoover, Michael
Shroud, Gerhard
Striegel, Peter
Mensch, Hans-Georg
Hoover, Michael
Shroud, Gerhard
Striegel, Peter
Mensch, Hans-Georg
Application Number:
JP52822798A
Publication Date:
May 16, 2000
Filing Date:
December 18, 1997
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
G06K19/07; G06K19/077; H05K1/18; H05K3/30; H05K1/02; H05K1/11; H05K3/00; (IPC1-7): G06K19/077; G06K19/07
Attorney, Agent or Firm:
Iwao Yamaguchi